- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/469 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layers
Patent holdings for IPC class H01L 21/469
Total number of patents in this class: 670
10-year publication summary
|
38
|
19
|
16
|
10
|
10
|
7
|
3
|
8
|
1
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Tokyo Electron Limited | 12751 |
49 |
| Applied Materials, Inc. | 18706 |
46 |
| Kokusai Electric Corporation | 2023 |
41 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42863 |
34 |
| Micron Technology, Inc. | 26256 |
31 |
| Samsung Electronics Co., Ltd. | 146534 |
28 |
| Novellus Systems, Inc. | 481 |
21 |
| Texas Instruments Incorporated | 19448 |
18 |
| Semiconductor Energy Laboratory Co., Ltd. | 11416 |
15 |
| ASM IP Holding B.V. | 2080 |
15 |
| GLOBALFOUNDRIES U.S. Inc. | 6430 |
12 |
| Kioxia Corporation | 10301 |
11 |
| Samsung Display Co., Ltd. | 34842 |
10 |
| United Microelectronics Corp. | 4230 |
10 |
| Lam Research Corporation | 5259 |
10 |
| ASM Japan K.K. | 85 |
10 |
| International Business Machines Corporation | 61287 |
9 |
| Intermolecular, Inc. | 287 |
9 |
| Advanced Micro Devices, Inc. | 5684 |
7 |
| Renesas Electronics Corporation | 6006 |
6 |
| Other owners | 278 |