Taiwan Semiconductor Manufacturing Company, Ltd.

Taiwan, Province of China


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Total IP 42,636
Total IP incl. subs 42,721 (+ 259 for subs)
Total IP Rank # 11
IP Activity Score 4.9/5.0    34,089
IP Activity Rank # 7
IP AS incl. subs 4.9/5.0    34,148
Stock Symbol
ISIN TW0002330008
Market Cap. 27.6T  (TWD)
Industry Semiconductors
Sector Technology
Dominant Nice Class Treatment of materials; recyclin...

Patents

Trademarks

42,495 47
8 17
17 0
52
 
Last Patent 2025 - Fabrication of a polishing pad f...
First Patent 1985 - Amplitude enhanced sampled clipp...
Last Trademark 2025 - TSMC COMPACT
First Trademark 1994 - TSMC

Subsidiaries

3 subsidiaries with IP (256 patents, 3 trademarks)

1 subsidiaries without IP

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2025 G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Semiconductors...
Invention Different via configurations for different via interface requirements. Vias, along with methods ...
Invention Semiconductor process technology assessment. A method of process technology assessment is provid...
Invention Metal layer protection during wet etching. Disclosed is a method of fabricating a contact in a s...
Invention Ic logic device manufacturing method. An IC device manufacturing method includes forming first a...
Invention Overdrive i/o esd protection network. Systems and methods are provided for an electronic device ...
Invention Systems and methods for providing a dynamic high voltage circuit design workflow. Systems and me...
Invention Gate stack treatment. The present disclosure describes a method for forming gate stack layers wi...
Invention Pre-charging bit lines through charge-sharing. In one embodiment, a static random access memory ...
Invention Semiconductor package. A semiconductor package provided herein includes a first semiconductor di...
Invention Three-dimensional memory device. A method for forming a memory device includes: forming a first ...
Invention Semiconductor structure with heating element. A semiconductor structure includes a semiconductor...
Invention Methods of forming semiconductor device structures. Methods of forming a semiconductor device st...
Invention Memory device and manufacturing thereof. Embodiments of the present disclosure relates to an int...
Invention Semiconductor device having a heat dissipation structure connected chip package. A semiconductor...
Invention Integrated circuit with constrained metal line arrangement and method of making. A method of mak...
Invention Techniques for wafer stack processing. The present disclosure, in some embodiments, relates to m...
Invention Memory device with improved performance. The present disclosure relates to a device. The device ...
Invention Fabrication of a polishing pad for chemical mechanical polishing. A method disclosed herein incl...
Invention Low warpage high density trench capacitor. A capacitor structure and method of forming the capac...
Invention Semiconductor device with self-aligned vias. A method of forming a semiconductor device includes...
Invention Alignment mark and method. A device includes a diffraction-based overlay (DBO) mark having an up...
Invention Gate resistance improvement and method thereof. The present disclosure describes structure and m...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
2024 G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
Invention Memory circuit and method of operating the same. A memory circuit includes a first memory cell a...
Invention Reduced power consumption compute-in-memory system, method of operating same. A compute-in-memor...
Invention Bonded device structures with improved stress distribution and reduced cracking and methods of ma...
Invention Semiconductor package structure with interposer dies. In an embodiment, a semiconductor device m...
Invention Circuit and method employing temporal multiplexing to perform a mac operation. Various embodimen...
Invention Backside power scheme with front-side power input. A method includes forming integrated circuit ...
Invention Memory device, method of manufacturing, and integrated circuit device. A memory device includes ...
Invention 3d memory array archetecture and method of fabricating the same. A memory device includes a plur...
Invention Semiconductor assembly for providing an enhanced memory bandwidth and methods for forming the sam...
Invention Optical connector unit for a photonic assembly and methods for forming the same. A passive optic...
Invention Oxide semiconductor ferroelectric field effect transistor. Oxide semiconductor ferroelectric fie...
Invention Semiconductor structure including cmos image sensors and logic transistors and method for manufac...
Invention Anti-slip compositions and components for semiconductor wafer handling systems. Anti-slip compon...
Invention Chemical stop structures for mems devices. In a micro-electromechanical system (MEMS) structure,...
Invention Semiconductor die and wafer bonding crack detector structures and methods of forming same. A sem...
Invention Structure and formation method of semiconductor device with photo-sensing structure. A semicondu...
Invention Micro-electromechanical microphones and methods of forming the same. An approximate S-shape is f...
Invention Semiconductor structure and method for manufacturing the same. A semiconductor structure include...
Invention Integrated circuit structure and method for fabricating the same. An integrated circuit (IC) str...
Invention Semiconductor device and manufacturing method thereof. A semiconductor device and a manufacturin...
Invention Heat dissipation component with anisotropic heat conduction and method of fabricating the same an...
Invention Isolation structures and methods of forming the same. Using a same hardmask layer during formati...
Invention Wet process air abatement system and method. A method includes: processing a wafer by a wet benc...
Invention Pellicle for euv applications. A pellicle membrane is formed from a core layer and two capping l...
Invention Semiconductor package and method of forming the same. A method of forming a semiconductor packag...
Invention Memory device and method for operating memory device. A memory device is provided. The memory de...
Invention Thin film resistor and methods of forming the same. Some implementations described herein includ...
Invention Ferroelectric non-volatile memory and methods of formation. A multiple-layer hydrogen barrier st...
2023 G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
G/S Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 G/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
G/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
G/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...