Taiwan Semiconductor Manufacturing Company, Ltd.

Taiwan, Province of China


 
Total IP 41,550
Total IP incl. subs 41,636 (+ 247 for subs)
Total IP Rank # 13
IP Activity Score 4.9/5.0    33,196
IP Activity Rank # 7
IP AS incl. subs 4.9/5.0    33,256
Stock Symbol
ISIN TW0002330008
Market Cap. 27.6T  (TWD)
Industry Semiconductors
Sector Technology
Dominant Nice Class Treatment of materials; recyclin...

Patents

Trademarks

41,427 41
8 11
17 0
46
 
Last Patent 2025 - Memory device and method for ope...
First Patent 1985 - Amplitude enhanced sampled clipp...
Last Trademark 2025 - NEXSYS
First Trademark 1994 - TSMC

Subsidiaries

3 subsidiaries with IP (244 patents, 3 trademarks)

1 subsidiaries without IP

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2025 G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
2024 Invention Gas mixing system for semiconductor fabrication. A gas mixing system for semiconductor fabricati...
Invention Semiconductor structure. A semiconductor structure includes a substrate, semiconductor layers, s...
Invention Semiconductor arrangement and method of making. A method of forming a semiconductor arrangement ...
Invention Oxide semiconductor transistor structure in 3-d device and methods for forming the same. A trans...
Invention Package structure. A memory device including a base semiconductor die, conductive terminals, mem...
Invention Method of fabricating package. A method of fabrication a package and a stencil structure are pro...
Invention Semiconductor package and methods of forming the same. A method of forming a semiconductor devic...
Invention Package and manufacturing method thereof. A package includes a first die and a second die. The f...
Invention Chip structure with etch stop layer. A chip structure is provided. The chip structure includes a...
Invention Self-aligned via formation using spacers. A method includes forming a first mandrel and a second...
Invention Gradient protection layer in mtj manufacturing. A method includes forming Magnetic Tunnel Juncti...
Invention Semiconductor memory devices with dielectric fin structures. A device includes a memory cell tha...
Invention Photonics package integration. An interconnect package integrates a photonic die, an electronic ...
Invention Source/drain feature separation structure. A method according to the present disclosure includes...
Invention Metal oxide composite as etch stop layer. A semiconductor device includes a substrate, a first c...
Invention Optical sensing device having inclined reflective surface. Disclosed are devices for optical sen...
Invention Method for forming finfet devices with a fin top hardmask. Aspects of the disclosure provide a m...
Invention Fin field-effect transistor device with low-dimensional material and method. A method includes: ...
Invention Plasma-damage-resistant interconnect structure and methods for manufacturing the same. A device ...
Invention Structures and process flow for integrated photonic-electric ic package by using polymer waveguid...
G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Semiconductors...
Invention Gate bar in isolation region of gate layout and method of fabrication thereof. Gate layouts and/...
Invention Carrier wafer debonding process and method. A method includes forming a first de-bond structure ...
Invention Sacrificial test pad. The present disclosure provides a redistribution structure that includes a...
Invention Memory devices having middle strap areas for routing power signals. One aspect of the present di...
Invention Forming isolation regions with low parasitic capacitance and reduced damage. A method includes f...
2023 Invention Lateral diffusion metal oxide semiconductor (ldmos) transistor and method of making. A lateral d...
Invention Memory device. A memory circuit includes a substrate with a front side and a back side opposite ...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package includes an inte...
Invention Die bonding tool with tiltable bond stage and methods for performing the same. Embodiments of th...
Invention Semiconductor device including contact isolation layer and method for manufacturing the same. A ...
Invention Image sensing system and method thereof. A method includes generating light pulses by an illumin...
Invention Semiconductor structure and method for forming the same. Semiconductor structures and methods fo...
Invention Doped regions for neutralizing electrons in diode structures. A diode is formed in an active reg...
Invention Structure and formation method of package with integrated chips and capacitor. A package structu...
Invention Semiconductor devices with gate extensions and methods of fabricating the same. A semiconductor ...
Invention Semiconductor structures with backside power delivery network. A semiconductor structure and a m...
Invention Pixel structure, cmos imaging sensor, and method for manufacturing the pixel structure. A pixel ...
Invention Isolation structures in semiconductor devices. A semiconductor device and a method of fabricatin...
Invention Insertion layer between channel and passivation for transistor. In some embodiments, the present...
Invention Memory device and method for operating the same. A method for forming a memory device is provide...
Invention Semiconductor capacitor for stacked pixel. Various embodiments of the present disclosure are dir...
Invention Semiconductor device and manufacturing method thereof. A semiconductor device includes a substra...
Invention Semiconductor structure and method for forming the same. A semiconductor structure includes a su...
Invention Pvd target structure and method for preparing the same. A PVD target structure is provided. The ...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package includes a chipl...
Invention Waveguide photodetector and method for forming the same. A waveguide photodetector includes a sl...
Invention Semiconductor device and method of forming the same. A method of forming a semiconductor device ...
Invention Semiconductor device and electrostatic discharge clamp circuit. The present disclosure provides ...
Invention Semiconductor device and manufacturing method thereof. A semiconductor device includes a MEOL st...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
G/S Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 G/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
G/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
G/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. Product resea...
G/S Custom manufacture and assembly of semiconductors, semiconductor devices, memory chips, semicondu...
2020 G/S Semiconductors, memory chips, wafers and integrated circuits. Custom manufacture of semiconductor...
G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...