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2025
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Invention
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Semiconductor structure.
A semiconductor device includes a source via having a body portion and ... |
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Invention
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Method of manufacturing semiconductor package.
A method of manufacturing a semiconductor package... |
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Invention
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Multilevel memory device and method.
An IC device includes first and second terminals that recei... |
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Invention
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High dynamic-range (hdr) pixel circuit, color-image sensor package structure, and method for oper... |
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Invention
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Failsafe circuit, device, and method.
A circuit includes a reference node configured to carry a ... |
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Invention
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Semiconductor structure and method of manufacturing the same.
A method includes: receiving a sub... |
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Invention
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Resistive random access memory device.
A RRAM device is provided. The RRAM device includes: a bo... |
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G/S
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Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a... |
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Invention
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Chiplets 3d soic system integration and fabrication methods.
A method includes forming integrate... |
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Invention
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Semiconductor package and method of manufacturing the same.
The present disclosure describes a s... |
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G/S
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Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear... |
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Invention
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Apparatus and method for improved electron multi-beam inspection.
A method of performing an elec... |
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2024
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Invention
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Semiconductor devices and methods for fabrication thereof.
Embodiments of the present disclosure... |
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Invention
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Thermal structures for semiconductor packages.
A method includes forming a package component, in... |
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Invention
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Double beam themoreflectance spectroscopy (dbtrs) for conductive area inspection.
A method and s... |
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Invention
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Integrated circuit, system and method of forming the same.
An integrated circuit includes a firs... |
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Invention
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Circuit and method for interconnect test.
A circuit includes a first die including first and sec... |
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G/S
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Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i... |
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Invention
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Bonded die structures with improved bonding and methods of forming the same.
Bonded die structur... |
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Invention
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Insulation feature-based transient voltage suppressor devices.
Semiconductor devices with insula... |
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Invention
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Optical devices and methods of manufacture.
Optical devices and methods of manufacture are prese... |
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Invention
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Semiconductor device and methods of forming same.
In an embodiment, a method includes forming a ... |
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Invention
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Semiconductor device and method of forming thereof.
A method of forming a semiconductor device i... |
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Invention
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Semiconductor device and method.
In an embodiment, a method may include forming a multi-layer st... |
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Invention
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Cooling system for computer system components and methds of operating the same.
A method of cool... |
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Invention
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Backside devices.
Device structures and methods of forming the same are provided. A device struc... |
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Invention
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Metal-insulator-metal capacitor structure, integrated circuit, and method for forming metal-insul... |
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Invention
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Hybrid nanostructure device and methods of forming the same.
A device includes a first semicondu... |
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Invention
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Squared sheet gate-all-around transistors with non-uniform gate insulators.
One aspect of the pr... |
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Invention
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Semiconductor device and method of manufacturing the same.
A semiconductor device and a method o... |
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Invention
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Capacitor structures and methods of formation.
One or more trench capacitor structures are inclu... |
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Invention
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Semiconductor devices having improved current/voltage characteristics and methods of forming the ... |
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Invention
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Test structures for semiconductor wafers.
A testing structure for a semiconductor wafer substrat... |
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Invention
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Semiconductor device and method.
A semiconductor device and the method of forming the same are p... |
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Invention
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Semiconductor structure for silicon photonics and method for manufacturing the same.
A semicondu... |
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Invention
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Gate-all-around transistors with reduced parasitic capacitance.
A semiconductor structure and a ... |
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Invention
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Semiconductor device with self-aligned contact via and method for manufacturing the same.
A meth... |
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Invention
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Airflow adjust system for workpiece tool and method of operating the same.
A workpiece processin... |
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Invention
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Semiconductor structure, semiconductor device, and method of manufacturing semiconductor structur... |
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Invention
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Semiconductor device and manufacturing method thereof.
The present disclosure provides a semicon... |
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Invention
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Memory device and operating method thereof.
A memory device is provided, including a memory arra... |
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Invention
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Image sensor.
A pixel of an image sensor includes a single photon avalanche detector (SPAD) and ... |
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Invention
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Semiconductor processing tool cluster with reduced interference between tools.
A semiconductor p... |
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Invention
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Resistive random access memory and manufacturing method thereof.
A method of manufacturing a res... |
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Invention
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Cooling systems for computer system components and methods of operating the same.
An embodiment ... |
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Invention
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Semiconductor device and manufacturing method thereof.
A method includes forming a plurality of ... |
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Invention
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Transistor spacer structures and methods of forming.
A method of forming a semiconductor device ... |
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Invention
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Methods for forming semiconductor device having nanosheet transistor.
Various embodiments of the... |
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Invention
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Image sensing structure and manufacturing method thereof.
The present disclosure provides a meth... |
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Invention
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Bonding apparatus and method of bonding semioconductor chips.
A bonding apparatus includes a chu... |
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Invention
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Reflective mask and fabricating method thereof.
The prevent disclosure provides a reflective mas... |
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2023
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G/S
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Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. |
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G/S
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Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon... |
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G/S
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Custom manufacture of semiconductors, memory chips, wafers and integrated circuits |
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2022
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G/S
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Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s... |
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G/S
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Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device... |
