Taiwan Semiconductor Manufacturing Company, Ltd.

Taïwan, Province de Chine


 
Quantité totale PI 40 787
Quantité totale incluant filiales 40 874 (+ 235 pour les filiales)
Rang # Quantité totale PI 13
Note d'activité PI 4,9/5.0    32 736
Rang # Activité PI 7
Activité incl filiales 4,9/5.0    32 797
Symbole boursier
ISIN TW0002330008
Capitalisation 27.6T  (TWD)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

40 662 41
10 11
17 0
46
 
Dernier brevet 2025 - Die bonding tool with movable co...
Premier brevet 1985 - Amplitude enhanced sampled clipp...
Dernière marque 2025 - NEXSYS
Première marque 1994 - TSMC

Filiales

3 subsidiaries with IP (232 patents, 3 trademarks)

1 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
2024 Invention Integrated circuit structure. An integrated circuit structure includes a semiconductor substrate...
Invention Method of fabricating semiconductor device. A method includes forming a dummy gate over a substr...
Invention Semiconductor structure. A semiconductor structure includes a substrate, an isolation structure ...
Invention Forming large chips through stitching. A method includes performing a first light-exposure and a...
Invention Semiconductor structure and manufacturing method thereof. A method includes: receiving a composi...
Invention Integrated circuit with conductive via formation on self-aligned gate metal cut. An integrated c...
Invention Integrated circuit including spacer structure for transistors. An integrated circuit includes a ...
Invention Extreme ultraviolet light reflective structure including nano-lattice and manufacturing method th...
Invention Semiconductor processing tool and methods of operation. Some implementations described herein in...
Invention Package structure including ipd and method of forming the same. A device includes a first die, a...
Invention Integrated circuit device and system. An integrated circuit (IC) device includes an interlayer d...
Invention Ferroelectric memory device and method of forming the same. A device includes a multi-layer stac...
Invention Semiconductor device structure with metal gate stack. A semiconductor device structure includes ...
Invention Capacitor formed with high resistance layer and method of manufacturing same. A method is provid...
Invention Semiconductor package with high density of through-silicon vias (tsv). A semiconductor package i...
Invention Semiconductor device and methods of forming the same. A semiconductor device includes a first ch...
Invention Multi-layer waveguide optical coupler. An optical coupler includes: a plurality of waveguide cor...
Invention Integrated circuit device, integrated circuit layout and system for generating integrated circuit...
P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Semiconductors...
Invention Method and system to balance ground bounce. A memory cell includes a write port and a read port....
Invention Package structure and method for fabricating the same. A package structure including a first sub...
Invention Semiconductor structures and methods of forming the same. Semiconductor structures and methods a...
Invention Capacitor structure and methods of forming the same. A capacitor structure and methods of formin...
2023 Invention Semiconductor device, semiconductor package and manufacturing method thereof. A semiconductor de...
Invention Metal-insulator-metal device with high-k layer capping structure. A metal-insulator-metal (MIM) ...
Invention Memory device. A memory device includes a first static random-access memory (SRAM) array having ...
Invention Integrated circuit device and manufacturing method thereof. An integrated circuit device include...
Invention Semiconductor device and method of manufacturing the same. The present disclosure provides a sem...
Invention Method for gap filling with selectively formed seed layer and heteroepitaxial cap layer. Embodim...
Invention Optical devices and methods of manufacture. Optical devices and methods of manufacture are prese...
Invention Photonic package and method for forming the same. A method of forming a semiconductor package is...
Invention Source/drain regions in complementary field effect transistors and methods of forming the same. ...
Invention Shelf status determination. A method is provided. The method includes performing a first stockin...
Invention Semiconductor device. A semiconductor device includes circuit cells having transistors. Each of ...
Invention Molding apparatus and device formed by molding apparatus. A molding apparatus includes a mold ch...
Invention Photonic structure and methods of manufacturing. Some implementations described herein provide a...
Invention Semiconductor device and method for forming the same. A semiconductor device includes a substrat...
Invention Bonding system and method. Disclosed are a bonding system and a bonding method. In one embodimen...
Invention Semiconductor device including an alignment mark and methods of formation. Implementations descr...
Invention Ternary content-addressable memory cells and methods for forming the same. A four transistor ter...
Invention Die bonding tool with movable component for improved die protrusion control and methods for using...
Invention Semiconductor structure and method for forming the same. A semiconductor structure includes a su...
Invention Semiconductor structure including lines of different height. A method for manufacturing a semico...
Invention Integrated load port first aid platform. A system is provided. The system includes: a semiconduc...
Invention Overdrive i/o esd protection network. Systems and methods are provided for an electronic device ...
Invention Semiconductor structure having low-resistance via contact. Semiconductor structures having low r...
Invention Systems for visible wavelength measurement of overlay of wafer-on-wafer bonding and methods of fo...
Invention Forming a cavity in a redistribution layer of an ic package to reduce overspreading of underfill ...
Invention Test structure and integrated circuit test using same. In a method of fabricating at least one I...
Invention Optical device structure and method for forming the same. A method for forming an optical device...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; electronic machines; tel...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
P/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. Product resea...
P/S Custom manufacture and assembly of semiconductors, semiconductor devices, memory chips, semicondu...
2020 P/S Semiconductors, memory chips, wafers and integrated circuits. Custom manufacture of semiconductor...
P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...