- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/27 - Work carriers
Patent holdings for IPC class B24B 37/27
Total number of patents in this class: 91
10-year publication summary
|
11
|
6
|
8
|
7
|
14
|
5
|
8
|
10
|
10
|
6
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18334 |
19 |
| Velasa Sports, Inc. | 59 |
8 |
| Disco Corporation | 1846 |
5 |
| Shin-Etsu Handotai Co., Ltd. | 1291 |
5 |
| NV Bekaert SA | 756 |
4 |
| Samsung Electronics Co., Ltd. | 143303 |
3 |
| Illinois Tool Works Inc. | 11370 |
3 |
| Axus Technology, LLC | 33 |
3 |
| Hangzhou Sizone Electronic Technology Inc. | 67 |
3 |
| Tokyo Electron Limited | 12452 |
2 |
| Tsinghua University | 5813 |
2 |
| Ebara Corporation | 2127 |
2 |
| Hwatsing Technology Co., Ltd. | 27 |
2 |
| PR Hoffman Machine Products, Inc. | 4 |
2 |
| SEIKOH Giken Co., Ltd. | 102 |
2 |
| Zhejiang Normal University | 93 |
2 |
| Samsung Display Co., Ltd. | 34061 |
1 |
| Infineon Technologies AG | 8182 |
1 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 41903 |
1 |
| Huawei Technologies Co., Ltd. | 110249 |
1 |
| Other owners | 20 |