Disco Corporation

Japan


Create a watch for Disco Corporation
Total IP 1,885
Total IP incl. subs 1,899 (+ 14 for subs)
Total IP Rank # 706
IP Activity Score 3.8/5.0    1,246
IP Activity Rank # 585
IP AS incl. subs 3.5/5.0    1,249
Stock Symbol
ISIN JP3548600000
Market Cap. 1225431055450.0  (JPY)
Industry Semiconductor Equipment & Materials
Sector Technology
Dominant Nice Class Machines and machine tools

Patents

Trademarks

1,791 37
1 3
25 22
6
 
Last Patent 2025 - Vitrified bond grindstone
First Patent 1997 - Cutting wheel
Last Trademark 2025 - ORIMIRROR
First Trademark 1988 - DISCO

Subsidiaries

1 subsidiaries with IP (4 patents, 10 trademarks)

1 subsidiaries without IP

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2025 Invention Vitrified bond grindstone. A vitrified bond grindstone includes abrasive grains and a bonding ma...
Invention Method of processing monocrystalline silicon wafer. A monocrystalline silicon wafer fabricated s...
Invention Method for manufacturing packaged device chips. A method for manufacturing packaged device chips...
Invention Cutting tool and method for manufacturing cutting tool. Provided are a cutting tool with which it...
Invention Method for processing wafer and processing apparatus. A method for processing a wafer into a pre...
Invention Wafer cleaning apparatus, processing apparatus, and processing method. A wafer cleaning apparatu...
Invention Sheet fixing apparatus and method of manufacturing combination of workpiece and sheet fixed there...
Invention Method of grinding composite wafer and method of grinding chip-on-wafer package. A method of gri...
Invention Protective component formation apparatus, protective component formation method, and method of ma...
G/S Metalworking machines and tools; loading-unloading machines and apparatus; semiconductor manufact...
G/S Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer proces...
G/S Semiconductor testing apparatus; apparatus for testing semiconductor wafers; apparatus for testin...
G/S Metalworking machines and tools; loading-unloading machines and apparatus; semiconductor manufac...
G/S Semiconductor testing apparatus; apparatus for testing semiconductor wafers; apparatus for testi...
G/S Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer proce...
Invention Laser processing apparatus. The processing apparatus includes a holding means that holds a wafer...
Invention Method of processing wafer. A method of processing a wafer for solving problems where a chamfere...
Invention Laser processing apparatus, workpiece chamfering method, and wafer manufacturing method. A laser...
Invention Protective layer forming method and workpiece processing method. A new technique for removing wa...
Invention Cutting method and manufacturing method for chip. A cutting method for cutting a workpiece is pr...
Invention Protective member forming apparatus and method for forming a protective member. A protective mem...
Invention Method for grinding plate-formed workpiece and grinding apparatus. A method for grinding a plate...
Invention Wafer processing method and cutting apparatus. A wafer processing method is a method for annular...
Invention Detection method and processing apparatus. There is provided a detection method for detecting a ...
Invention Sheet processing method, chip manufacturing method, and substrate manufacturing method. A sheet ...
Invention Method for manufacturing gallium nitride substrate. A method for manufacturing a gallium nitride...
Invention Frame unit forming method, frame unit forming apparatus, and method of forming device chips. A f...
Invention Wafer processing method and wafer processing apparatus. A wafer processing method includes: hold...
Invention Bonded wafer processing method. A processing method for a bonded wafer includes forming, in an o...
Invention Processing method and computer-readable storage medium. A processing method is a method of proce...
Invention Processing method. A processing method includes forming a recess circumferentially along a suppo...
Invention Processing apparatus and wafer processing method. A processing apparatus includes a cassette sta...
Invention Laser processing apparatus and laser processing method. A laser processing apparatus includes: a...
Invention Method for forming a holder surface, and grinding apparatus. A method for forming a holder surfa...
Invention Cleaning apparatus and cleaning method. A cleaning apparatus including a cleaning unit configure...
Invention Workpiece processing preparation method and processing method. A workpiece processing preparatio...
Invention Processing apparatus and polishing surface shaping method. A processing apparatus includes a chu...
Invention Processing device and processing method. A processing device for processing a workpiece includes...
Invention Substrate manufacturing method. A substrate manufacturing method includes applying a laser beam ...
Invention Chuck table and half-cutting method. A chuck table is configured to suction and hold a plate-sha...
Invention Dividing method of wafer. A dividing method of a wafer includes cutting a front surface of the w...
Invention Substrate manufacturing method. A substrate manufacturing method includes peel-off layer forming...
Invention Polishing apparatus, and method for polishing sic wafers. A polishing apparatus for polishing Si...
Invention Peeling apparatus and peeling method. A peeling apparatus to peel a protective member from a fir...
Invention Cleaning apparatus, processing system, and cleaning method. A cleaning apparatus comprises a fir...
Invention Device chip manufacturing method and workpiece processing apparatus. A device chip manufacturing...
Invention Chuck table, grinding apparatus, and workpiece grinding method. A chuck table used while grindin...
Invention Workpiece processing method and processing apparatus. A workpiece processing method includes hol...
Invention Method of processing wafer. A method of processing a wafer that is bonded as a first wafer to a ...
Invention Grinding apparatus, method of grinding workpiece, and method of manufacturing substrate. There i...
Invention Method for processing workpiece. A method is for processing a workpiece obtained by bonding one ...
Invention Method for manufacturing molded article. A method for manufacturing a molded article having a de...
2024 Invention Workpiece processing method. A workpiece processing method includes: a first trimming step of cu...
Invention Inspecting unit. An inspecting unit for use in a laser processing apparatus includes a camera co...
Invention Method of processing wafer. A method of processing a wafer having a first wafer bonded to a seco...
G/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Proces...
G/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers; gri...
G/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers.
G/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Polish...
G/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Dividi...
G/S Semiconductor manufacturing machines Apparatus for checking semiconductors, namely, technical che...
G/S Semiconductor manufacturing machines. Apparatus for checking semiconductors; semiconductor testin...
2023 G/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines
G/S Metalworking machines and tools; semiconductor manufacturing machines.
G/S Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or w...
G/S Cemented carbide cutting tools; metalworking machines and tools, namely, cutting machines for met...
G/S Cemented carbide cutting tools; other metalworking machines and tools.
G/S Metalworking machines and tools; semiconductor manufacturing machines. Processing of semiconduct...
G/S Semi-conductor wafers; semi-conductor substrates; compound semi-conductor substrates.
G/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines and sy...
G/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Software for ...
G/S Auxiliary chemical fluids containing organic acid and oxidizing agent for use in cutting; indust...
2022 G/S Chemical agents, namely, water-soluble chemical additives for reducing contamination during dicin...
G/S Chemical agents; industrial chemicals.
G/S Dressing tools for diamond blades.
2021 G/S Machine part, namely, dressing apparatus for diamond blades
G/S Dressing apparatus for diamond blades.
G/S Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalwork...
G/S Power-operated semiconductor grinder
2020 G/S Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines...
G/S Semiconductor manufacturing machines and systems; metalworking machines and tools; loading-unloa...
G/S Metalworking machines and tools; semiconductor manufacturing machines and systems comprised of se...
G/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers
G/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers; other c...
G/S Liquid chemical agents for use as a protective film on surfaces of semiconductor wafers; other ch...
2019 G/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Semiconductor ...
2018 G/S Sheets applicable to surfaces of semiconductor wafers to protect an applied-to surface while anot...