Disco Corporation

Japan


Create a watch for Disco Corporation
Total IP 1,954
Total IP incl. subs 1,969 (+ 15 for subs)
Total IP Rank # 703
IP Activity Score 3.8/5.0    1,169
IP Activity Rank # 626
IP AS incl. subs 3.5/5.0    1,175
Stock Symbol
ISIN JP3548600000
Market Cap. 1225431055450.0  (JPY)
Industry Semiconductor Equipment & Materials
Sector Technology
Dominant Nice Class Machines and machine tools

Patents

Trademarks

1,858 37
1 3
25 24
6
 
Last Patent 2026 - Substrate manufacturing method a...
First Patent 1997 - Cutting wheel
Last Trademark 2026 - DualKey Resin
First Trademark 1988 - DISCO

Subsidiaries

1 subsidiaries with IP (5 patents, 10 trademarks)

1 subsidiaries without IP

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2026 G/S Liquid chemicals for forming protective films on the surface of semiconductor wafers; chemicals ...
Invention Substrate processing method, processed substrate manufacturing method, and chip manufacturing met...
2025 Invention Chip production method and cutting device. A chip production method by dividing a substrate havi...
Invention Wafer manufacturing apparatus. A wafer manufacturing apparatus includes an ingot grinding unit f...
Invention Wafer processing apparatus and wafer processing method. A wafer processing apparatus for perform...
Invention Substrate manufacturing method and laser processing method. A substrate manufacturing method inc...
Invention Method of manufacturing chip and dividing device. A method of manufacturing a chip by dividing a...
Invention Processing apparatus and method for manufacturing a wafer. A processing apparatus includes a chu...
Invention Processing method, processing device, and substrate manufacturing method. A processing method in...
Invention Laser processing apparatus and laser processing method. A laser processing apparatus configured ...
Invention Wafer processing apparatus and wafer processing method. A wafer processing apparatus includes a ...
Invention Wafer-processing sheet and method for manufacturing a semiconductor device. A wafer-processing s...
Invention Method for manufacturing wiring board, and wiring board. A novel technique is provided for reduc...
Invention Method for processing a workpiece. A method for processing a workpiece, in which a first workpie...
Invention Method for processing a bonded wafer. A method for processing a bonded wafer including a first w...
Invention Method for processing a wafer and method for dividing a wafer. A method for processing a wafer, ...
Invention Substrate manufacturing method and substrate. A substrate manufacturing method includes: chamfer...
Invention Wafer processing method. A wafer processing method for processing a bonded wafer in which a firs...
Invention Processing method, processing device, and wafer manufacturing method. A method includes: holding...
Invention Polishing apparatus and method of polishing workpiece. A polishing apparatus includes: a chuck t...
Invention Sheet fixing method. A sheet fixing method for fixing a sheet to one surface of an adher...
Invention Substrate manufacturing method. A method of manufacturing a substrate from an ingot having a cyl...
Invention Laser processing method and manufacturing method for chips. Provided is a laser processing metho...
Invention Semiconductor processing grindstone, semiconductor processing tool, processing method, and manufa...
Invention Transfer device, transfer method, and processing method. A transfer device includes: a cassette ...
Invention Laminated sheet, method for manufacturing laminated sheet, method for processing workpiece, and m...
Invention Method of manufacturing wafer and wafer manufacturing system. A method of manufacturing a wafer...
Invention Laser processing apparatus and laser processing method. A laser processing apparatus includes a ...
Invention Method of processing wafer and method of manufacturing processed wafer. A method of processing ...
Invention Processing method of chuck table, manufacturing method of processed chuck table, processing metho...
Invention Wafer processing method and grinding apparatus. A wafer processing method includes forming a rin...
Invention Chuck table and method for grinding wafer. A chuck table holds a wafer having an off-cut angle b...
Invention Chip production method. A chip production method in which a workpiece having a plurality of plan...
Invention Wafer processing method. A wafer processing method for removing a chamfered portion of a first w...
Invention Method and apparatus for cleaning wafer. Provided is a method for cleaning a wafer that enables ...
Invention Cutting method for workpiece. The cutting method for a workpiece includes cutting an outer circu...
Invention Grinding method and ground wafer manufacturing method. A method for grinding a workpiece with a ...
Invention Wafer production method. A wafer production method for producing, from a workpiece being a nitri...
Invention Wafer grinding apparatus and wafer grinding method. A grinding apparatus for grinding a wafer in...
Invention Peeling method, wafer production method, and bonded wafer. A peeling method of the present inve...
Invention Manufacturing method. A method is of manufacturing a plurality of devices by dividing a device w...
Invention Thinned substrate manufacturing method. A manufacturing method of manufacturing a second substra...
Invention Thinned substrate manufacturing method. A manufacturing method of a second substrate by separati...
Invention Processing method for wafer. A processing method for a bonded wafer in which a first wafer and a...
Invention Polishing surface dressing method and method of manufacturing substrate. A polishing surface dre...
Invention Tape mounter, processing apparatus, and method for processing workpieces. A tape mounter configu...
Invention Grinding apparatus, grinding method, and diamond substrate generation method. A grinding apparat...
Invention Bonding apparatus and bonding method. A bonding apparatus includes: a first holder configured to...
Invention Processing method, chip manufacturing method, and dressing member. A processing method includes:...
Invention Processing method. A processing method is for a wafer including a first surface and a second sur...
Invention Laser processing machine and laser processing method. A laser processing machine for processing ...
G/S Metalworking machines and machine tools; loading-unloading machines and apparatus, namely, semico...
G/S Semiconductor testing apparatus; apparatus for testing semiconductor wafers​​​​​​​; apparatus for...
G/S Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer proces...
G/S Metalworking machines and tools; loading-unloading machines and apparatus; semiconductor manufac...
G/S Semiconductor testing apparatus; apparatus for testing semiconductor wafers; apparatus for testi...
G/S Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer proce...
2024 G/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Proces...
G/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers; gri...
G/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers.
G/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Polish...
G/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Semi-c...
G/S Semiconductor manufacturing machines Apparatus for checking semiconductors, namely, technical che...
G/S Semiconductor manufacturing machines. Apparatus for checking semiconductors; semiconductor testin...
2023 G/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines
G/S Metalworking machines and tools; semiconductor manufacturing machines.
G/S Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or w...
G/S Cemented carbide cutting tools; metalworking machines and tools, namely, cutting machines for met...
G/S Cemented carbide cutting tools; other metalworking machines and tools.
G/S Metalworking machines and tools; semiconductor manufacturing machines. Processing of semiconduct...
G/S Semi-conductor wafers; semi-conductor substrates; compound semi-conductor substrates.
G/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines and sy...
G/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Software for ...
G/S Auxiliary chemical fluids containing organic acid and oxidizing agent for use in cutting; indust...
2022 G/S Chemical agents, namely, water-soluble chemical additives for reducing contamination during dicin...
G/S Chemical agents; industrial chemicals.
G/S Dressing tools for diamond blades.
2021 G/S Machine part, namely, dressing apparatus for diamond blades
G/S Dressing apparatus for diamond blades.
G/S Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalwork...
G/S Power-operated semiconductor grinder
2020 G/S Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines...
G/S Semiconductor manufacturing machines and systems; metalworking machines and tools; loading-unloa...
G/S Metalworking machines and tools; semiconductor manufacturing machines and systems comprised of se...
G/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers
G/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers; other c...
G/S Liquid chemical agents for use as a protective film on surfaces of semiconductor wafers; other ch...
2019 G/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Semiconductor ...