- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/10 - Lapping machines or devicesAccessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
Patent holdings for IPC class B24B 37/10
Total number of patents in this class: 481
10-year publication summary
|
28
|
34
|
58
|
48
|
38
|
50
|
47
|
44
|
42
|
31
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2163 |
106 |
| Applied Materials, Inc. | 18501 |
97 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42389 |
51 |
| Sumco Corporation | 1120 |
16 |
| Samsung Electronics Co., Ltd. | 145025 |
14 |
| Disco Corporation | 1852 |
11 |
| Tokyo Electron Limited | 12620 |
10 |
| Kioxia Corporation | 10286 |
9 |
| Shin-Etsu Handotai Co., Ltd. | 1286 |
8 |
| Fujikoshi Machinery Corp. | 54 |
6 |
| Hangzhou Sizone Electronic Technology Inc. | 73 |
6 |
| Illinois Tool Works Inc. | 11450 |
4 |
| Sumitomo Electric Industries, Ltd. | 15414 |
4 |
| II-VI Delaware, Inc. | 1685 |
4 |
| Seagate Technology LLC | 3972 |
3 |
| Axus Technology, LLC | 35 |
3 |
| Bruker Nano, Inc. | 337 |
3 |
| Hwatsing Technology Co., Ltd. | 27 |
3 |
| JX Nippon Mining & Metals Corporation | 1490 |
3 |
| Siltronic AG | 423 |
3 |
| Other owners | 117 |