- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/005 - Control means for lapping machines or devices
Patent holdings for IPC class B24B 37/005
Total number of patents in this class: 650
10-year publication summary
|
49
|
34
|
41
|
53
|
68
|
63
|
72
|
60
|
68
|
45
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2163 |
169 |
| Applied Materials, Inc. | 18501 |
153 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42389 |
62 |
| Sumco Corporation | 1120 |
25 |
| Shin-Etsu Handotai Co., Ltd. | 1286 |
15 |
| Samsung Electronics Co., Ltd. | 145025 |
13 |
| Tokyo Electron Limited | 12620 |
9 |
| Illinois Tool Works Inc. | 11450 |
7 |
| Seagate Technology LLC | 3972 |
7 |
| Fujikoshi Machinery Corp. | 54 |
7 |
| Disco Corporation | 1852 |
6 |
| Kioxia Corporation | 10286 |
6 |
| Axus Technology, LLC | 35 |
5 |
| Changxin Memory Technologies, Inc. | 4926 |
5 |
| Globalwafers Co., Ltd. | 633 |
4 |
| II-VI Delaware, Inc. | 1685 |
4 |
| K.C. Tech Co., Ltd. | 81 |
4 |
| Siltronic AG | 423 |
4 |
| Hangzhou Sizone Electronic Technology Inc. | 73 |
4 |
| DuPont Electronic Materials Holding, Inc. | 198 |
4 |
| Other owners | 137 |