- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Patent holdings for IPC class H01L 21/683
Total number of patents in this class: 14147
10-year publication summary
992
|
1124
|
1353
|
1445
|
1460
|
1333
|
1214
|
1084
|
1180
|
960
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Applied Materials, Inc. | 18861 |
1328 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
1291 |
Tokyo Electron Limited | 12877 |
874 |
Samsung Electronics Co., Ltd. | 147501 |
445 |
Disco Corporation | 1869 |
429 |
Lam Research Corporation | 5309 |
427 |
NGK Insulators, Ltd. | 5016 |
300 |
Intel Corporation | 47143 |
172 |
Lintec Corporation | 1968 |
161 |
Kyocera Corporation | 13909 |
150 |
Sumitomo Osaka Cement Co., Ltd. | 854 |
148 |
ASML Netherlands B.V. | 7434 |
139 |
Infineon Technologies AG | 8250 |
138 |
Micron Technology, Inc. | 26183 |
129 |
Shinko Electric Industries Co., Ltd. | 1213 |
104 |
Semiconductor Components Industries, L.L.C. | 5269 |
103 |
Toto Ltd. | 1208 |
102 |
Advanced Semiconductor Engineering, Inc. | 1664 |
97 |
STATS ChipPAC Pte. Lte. | 1553 |
97 |
Semes Co., Ltd. | 1516 |
91 |
Other owners | 7422 |