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2026
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Invention
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Breakdown voltage improvement in vertical trench-gate devices.
In a general aspect, a vertical t... |
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Invention
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Power module package with molded via and dual side press-fit pin.
A module includes an assembly ... |
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Invention
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Clips for semiconductor package and related methods.
Implementations of a clip may include a fir... |
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Invention
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Sintering film frames and related methods.
Implementations of a sintering film frame may include... |
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Invention
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Discrete dual pads for a circuit.
Implementations of high-power semiconductor device modules are... |
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Invention
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Semiconductor device package assemblies having a pre-applied thermally conductive adhesive.
In a... |
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Invention
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High-speed imager circuit.
A high dynamic range (HDR) imaging system is disclosed in which the s... |
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Invention
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Leadframe mounting with lead insertion for lead wall bonding.
A semiconductor device package may... |
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Invention
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High speed dynamic compartor.
A comparator is disclosed. The comparator includes an amplifier ci... |
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Invention
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Ultra-low latency nfmi communication protocol.
Audio communication methods, devices, and systems... |
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Invention
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Asymmetric common source inductances to reduce turn-off overvoltage in mosfets.
A circuit includ... |
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Invention
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Trench-implemented poly diodes and resistors.
In a general aspect, a semiconductor device can in... |
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Invention
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Single switch direct cooling assemblies and related method.
Implementations of a dual sided cool... |
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Invention
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Power module package with stacked direct bonded metal substrates.
A package includes a first dir... |
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Invention
|
System and method for communicating driver readiness to a controller.
A switching regulator is d... |
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Invention
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Methods for fabricating vertical semiconductor device with robust gate region and edge terminatio... |
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Invention
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Five-level operation of three-phase matrix dual active bridge.
A power converter includes an H-b... |
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Invention
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Four-leg matrix dual active bridge converter.
A power converter includes a transformer, an H-bri... |
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Invention
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Two-phase operation of three-phase matrix dual active bridge.
A power converter includes a trans... |
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Invention
|
Power converter, controller, and method with overcurrent protection.
An illustrative controller ... |
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Invention
|
Trench mosfets with angled trench.
A trench MOSFET is disclosed. The trench MOSFET includes a si... |
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Invention
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System with zero overvoltage switching.
A switch system includes (i) high-side and low-side tran... |
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Invention
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Adaptive gain comparator for image sensors.
Systems, devices, and methods are described for anal... |
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Invention
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Image sensors with vertical transfer gates.
An image sensor pixel may include one or more step s... |
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Invention
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Image sensor with double metal-insulator-metal capacitor.
Double metal-insulator-metal (MIM) cap... |
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2025
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G/S
|
Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, electronic sen... |
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Invention
|
Heat exchangers for semiconductor device assemblies.
A power electronics assembly may include a ... |
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Invention
|
Torque sensor, sensing method, and stator with reduced crosstalk.
An illustrative stator include... |
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Invention
|
Direct drive cascoded switching circuit.
A cascoded switch system includes a JFET, a MOSFET, and... |
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Invention
|
Balanced monotonic successive approximation adc.
One illustrative n-bit balanced monotonic SAR A... |
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Invention
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Irregular direct bonded metal (dbm) and connection substrate. Described implementations provide a... |
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Invention
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Transistor with asymmetric gate resistance scheme.
A switch circuit is disclosed. The switch cir... |
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Invention
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Semiconductor device module with modular pin assembly and methods of manufacture.
A semiconducto... |
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Invention
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Wirebonding systems and related methods.
Implementations of a method of wirebonding may include ... |
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Invention
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Semiconductor device packages with reduced form factor.
In a general aspect, a semiconductor dev... |
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Invention
|
Combined via and solder bump for three-dimensional integration of an infrared detector.
An infra... |
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Invention
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Outer bending leadframe technology.
Described implementations provide an apparatus that includes... |
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Invention
|
Hybrid bond die seal and crack stop structures.
A semiconductor device is disclosed. The semicon... |
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Invention
|
Transistor with active area under gate runner.
A transistor is disclosed. The transistor include... |
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Invention
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Semiconductor die-stack having sealed edges.
Three-dimensional integration of devices, such as i... |
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Invention
|
Heat sink with integrated vapor chamber for semiconductor device assemblies.
Heat sinks for powe... |
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Invention
|
Reflow jig designs and related methods.
Implementations of a jig may include at least one pocket... |
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|
Invention
|
Structures and methods for self-aligned gate-drain overlap trench mosfets.
A self-aligned gate-d... |
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Invention
|
Semiconductor device metallization structure for reliability and robustness.
A semiconductor dev... |
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Invention
|
Low power phase detection.
Methods, devices, and systems employing low power digital signal phas... |
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Invention
|
Image sensor with in-package noise-decoupling.
An image sensor includes a noise-decoupling devic... |
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Invention
|
Pin for transfer molded semiconductor device package.
An apparatus includes a base, a tip, and a... |
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Invention
|
Input offset compensation for a comparator circuit. A comparator circuit is disclosed. The compar... |
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|
Invention
|
Average current regulation for dc-dc power converters.
A DC-DC converter circuit is disclosed. T... |
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2021
|
G/S
|
Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, image sensors,... |
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G/S
|
Semiconductors, integrated circuits, microchips,
microprocessors, sensors, semiconductor packagi... |
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2015
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G/S
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Semiconductors and integrated circuits. |
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G/S
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Semiconductor devices and integrated circuits. |
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G/S
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Semiconductor devices and integrated circuits |
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2014
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G/S
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Semiconductor devices. Foundry services, namely, custom manufacture and assembly of semiconductor... |
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G/S
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Semiconductor devices |
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2008
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G/S
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Reference designs in the field of technical design of low-power products, namely computer boards,... |
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G/S
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Printed reference designs related to the technical design of
low-power products, namely computer... |
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G/S
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Printed reference designs related to the technical design of
low-power products, namely, compute... |
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G/S
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Cameras; photographic and optical sensors for cameras,
digital cameras, cellular phones and vide... |
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G/S
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Printed reference designs related to the technical design of low-power products, namely, computer... |
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G/S
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Image and optical sensors for use in cameras, digital cameras, cell telephones, mobile telephones... |
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2006
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G/S
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Integrated circuits. |
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G/S
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Integrated circuits |
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|
G/S
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Design of low-power products, namely computers,
semiconductors, microprocessors, power supplies,... |
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G/S
|
Design of low-power products, namely, computers, semiconductors, microprocessors, power supplies,... |
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|
G/S
|
semiconductor devices |
|
2001
|
G/S
|
Semiconductors |
|
2000
|
G/S
|
Semiconductors and parts therefor. Assembly of semiconductors for others; manufacture of semicond... |
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|
G/S
|
Semiconductors and parts therefor Assembly of semiconductors for others; manufacture of semicondu... |
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|
G/S
|
Semiconductors and parts therefor [ Assembly of semiconductors for others; manufacture of semicon... |
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|
G/S
|
SEMICONDUCTORS, INTEGRATED CIRCUITS, TRANSISTORS FOR AUTOMOBILE STARTERS AND ALTERNATORS, IGBTS, ... |
|
|
G/S
|
transistors, namely metal-oxide silicon field effect transistors |
|
1999
|
G/S
|
Assembly of semiconductors for others; manufacture of semiconductors to the specifications of oth... |
|
|
G/S
|
[ Semiconductors and parts therefor ] Assembly of semiconductors for others, and manufacture of s... |
|
|
G/S
|
Assembly of semiconductors for others; and manufacture of semiconductors to the specifications of... |
|
|
G/S
|
Semiconductors and parts therefor |
|
|
G/S
|
Semiconductors and parts therefore. Assembly of semiconductors for others, and manufacture of sem... |
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|
G/S
|
Semiconductors and parts therefor, in Class 9. Storage and inventory of semiconductors and parts ... |
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|
G/S
|
Semiconductors and parts therefore |
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|
G/S
|
Assembly of semiconductors for others, and manufacture of semiconductors to the specifications of... |
