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2026
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Invention
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Vertical fin-based field effect transistor (finfet) with varying conductivity regions.
A semicon... |
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Invention
|
Sensor array module for an advanced driver assistance system.
A smart ultrasonic integrated-circ... |
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Invention
|
Switching oscillation reduction for power semiconductor device modules.
In a general aspect, a h... |
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Invention
|
Current sharing mismatch reduction in power semiconductor device modules.
In a general aspect, a... |
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Invention
|
Power transistors with resonant clamping circuits.
In a general aspect, a circuit includes a met... |
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2025
|
P/S
|
Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, image sensors,... |
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Invention
|
Kelvin scheme package.
Implementations of semiconductor packages may include a plurality of semi... |
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Invention
|
Power module.
A method includes attaching a power electronic substrate to a bottom of a frame. T... |
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|
Invention
|
Package method for paralleling power semiconductor devices.
Specific implementations of semicond... |
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Invention
|
Heat disspation device having dual-coupled fin.
In a general aspect, a heat dissipation device i... |
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Invention
|
Mosfet with monolithically integrated current sense.
A MOSFET device is disclosed. The MOSFET de... |
|
|
Invention
|
Double well bipolar junction transistor for esd and surge protection.
An ESD protection device i... |
|
|
Invention
|
Bi-directional esd and surge protection device.
An ESD protection device is disclosed. The ESD p... |
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|
Invention
|
Accelerator for selective weights and input processing in neural networks.
According to an aspec... |
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Invention
|
Neural network accelerator using weights in an integer-exponent format.
According to an aspect, ... |
|
|
Invention
|
System and method for slow-leg control in totem pole power factor correction converter.
Totem po... |
|
|
Invention
|
Leveling control for semiconductor device package attachment. In a general aspect, a semiconducto... |
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|
Invention
|
Embedded semiconductor device packages and methods of manufacture. A method (300) includes formin... |
|
|
Invention
|
Embedded semiconductor device packages and methods of manufacture. A semiconductor device package... |
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|
Invention
|
Semiconductor device module with stacked interconnections and methods of manufacture. In a genera... |
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|
Invention
|
Immersion cooling of embedded electronic components. Electronic assemblies that perform immersion... |
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Invention
|
Input resistance for compact packaging of semiconductor dies. Apparatuses using on-pad input resi... |
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|
Invention
|
Hybrid-material leads for solderless coupling of an electronic component. Hybrid-material leads f... |
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|
Invention
|
Substrates and related methods.
Implementations of a substrate may include an electrically insul... |
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|
Invention
|
Concealed gate terminal semiconductor packages and related methods.
Semiconductor packages may i... |
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|
Invention
|
Direct bonded metal (dbm) and connection technology. Described implementations provide an apparat... |
|
|
Invention
|
Average current regulation for dc-dc power converters. A DC-DC converter circuit is disclosed. Th... |
|
|
Invention
|
Light detection and ranging devices with reconfigurable microcells.
A light detection and rangin... |
|
|
Invention
|
Automated mutli-modal sensing synchronization.
Systems, devices, and methods are described to sy... |
|
2024
|
Invention
|
Panel level packaging for modular embedded devices.
A semiconductor device package includes a fi... |
|
|
Invention
|
Embedded semiconductor device packages and methods of manufacture.
In a general aspect, a method... |
|
|
Invention
|
Embedded semiconductor device packages and methods of manufacture.
In a general aspect, a semico... |
|
|
Invention
|
Chip scale packaging with double-sided plating for embedded devices.
A semiconductor device pack... |
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|
Invention
|
Trench isolation for spad-based semiconductor device.
A semiconductor device is disclosed. The s... |
|
|
Invention
|
Image sensor with in-pixel histogramming.
Imaging circuitry is provided that includes an array o... |
|
|
Invention
|
Leveling control for semiconductor device package attachment.
In a general aspect, a semiconduct... |
|
|
Invention
|
Immersion cooling of embedded electronic components.
Electronic assemblies that perform immersio... |
|
|
Invention
|
Semiconductor device module with stacked interconnections and methods of manufacture.
In a gener... |
|
|
Invention
|
Simplified thermal model for electronic fuse.
A method for controlling an electronic fuse (“eFus... |
|
|
Invention
|
Current mirror readout for silicon photomultiplier.
A silicon photomultiplier (SiPM) is disclose... |
|
|
Invention
|
Wafer level packaging systems and related methods.
An image sensor package may include an optica... |
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|
Invention
|
Adaptive power reduction readout for overflow pixel sensors.
Systems, devices, and methods are d... |
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|
Invention
|
Hybrid bonded substrates and related methods.
Implementations of an image sensor package may inc... |
|
|
Invention
|
Input resistance for compact packaging of semiconductor dies.
Apparatuses using on-pad input res... |
|
|
Invention
|
Gain offset compensation for image signal readout.
An imaging system may include an image sensor... |
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|
Invention
|
Image sensors with photodiodes and isolation structures.
An image sensor device may include a se... |
|
|
Invention
|
Power module with reliability features.
A device may include a substrate. A device may include a... |
|
|
Invention
|
Hybrid-material leads for solderless coupling of an electronic component.
Hybrid-material leads ... |
|
|
Invention
|
Image sensors with low noise readout.
Imaging circuitry is provided that includes a column of im... |
|
|
Invention
|
Direct bonded metal (dbm) and connection technology.
Described implementations provide an appara... |
|
|
Invention
|
Insulated gate bipolar transistor design and methods.
An insulated gate bipolar transistor inclu... |
|
2021
|
P/S
|
Semiconductors, integrated circuits, microchips,
microprocessors, sensors, semiconductor packagi... |
|
2015
|
P/S
|
Semiconductors and integrated circuits. |
|
|
P/S
|
Semiconductor devices and integrated circuits. |
|
|
P/S
|
Semiconductor devices and integrated circuits |
|
2014
|
P/S
|
Semiconductor devices. Foundry services, namely, custom manufacture and assembly of semiconductor... |
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|
P/S
|
Semiconductor devices |
|
2008
|
P/S
|
Reference designs in the field of technical design of low-power products, namely computer boards,... |
|
|
P/S
|
Printed reference designs related to the technical design of
low-power products, namely, compute... |
|
|
P/S
|
Printed reference designs related to the technical design of
low-power products, namely computer... |
|
|
P/S
|
Cameras; photographic and optical sensors for cameras,
digital cameras, cellular phones and vide... |
|
|
P/S
|
Printed reference designs related to the technical design of low-power products, namely, computer... |
|
|
P/S
|
Image and optical sensors for use in cameras, digital cameras, cell telephones, mobile telephones... |
|
2006
|
P/S
|
Integrated circuits. |
|
|
P/S
|
Integrated circuits |
|
|
P/S
|
Design of low-power products, namely computers,
semiconductors, microprocessors, power supplies,... |
|
|
P/S
|
Design of low-power products, namely, computers, semiconductors, microprocessors, power supplies,... |
|
|
P/S
|
semiconductor devices |
|
2001
|
P/S
|
Semiconductors |
|
2000
|
P/S
|
Semiconductors and parts therefor. Assembly of semiconductors for others; manufacture of semicond... |
|
|
P/S
|
Semiconductors and parts therefor Assembly of semiconductors for others; manufacture of semicondu... |
|
|
P/S
|
Semiconductors and parts therefor [ Assembly of semiconductors for others; manufacture of semicon... |
|
|
P/S
|
SEMICONDUCTORS, INTEGRATED CIRCUITS, TRANSISTORS FOR AUTOMOBILE STARTERS AND ALTERNATORS, IGBTS, ... |
|
|
P/S
|
transistors, namely metal-oxide silicon field effect transistors |
|
1999
|
P/S
|
Assembly of semiconductors for others; manufacture of semiconductors to the specifications of oth... |
|
|
P/S
|
[ Semiconductors and parts therefor ] Assembly of semiconductors for others, and manufacture of s... |
|
|
P/S
|
Assembly of semiconductors for others; and manufacture of semiconductors to the specifications of... |
|
|
P/S
|
Semiconductors and parts therefor |
|
|
P/S
|
Semiconductors and parts therefore. Assembly of semiconductors for others, and manufacture of sem... |
|
|
P/S
|
Semiconductors and parts therefor, in Class 9. Storage and inventory of semiconductors and parts ... |
|
|
P/S
|
Semiconductors and parts therefore |
|
|
P/S
|
Assembly of semiconductors for others, and manufacture of semiconductors to the specifications of... |
