- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Patent holdings for IPC class B24B 53/017
Total number of patents in this class: 548
10-year publication summary
|
29
|
51
|
44
|
46
|
40
|
50
|
56
|
53
|
80
|
15
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20145 |
90 |
| Ebara Corporation | 2278 |
84 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47734 |
83 |
| Samsung Electronics Co., Ltd. | 155224 |
28 |
| 3m Innovative Properties Company | 17491 |
15 |
| Kinik Company | 29 |
14 |
| Entegris, Inc. | 1990 |
12 |
| Shin-Etsu Handotai Co., Ltd. | 1305 |
11 |
| Hangzhou Sizone Electronic Technology Inc. | 82 |
9 |
| Ehwa Diamond Industrial Co., Ltd. | 59 |
7 |
| Sumco Corporation | 1114 |
7 |
| Saesol Diamond Ind. Co., Ltd. | 11 |
7 |
| Kioxia Corporation | 10727 |
7 |
| DuPont Electronic Materials Holding, Inc. | 206 |
7 |
| Tokyo Electron Limited | 13617 |
6 |
| Seagate Technology LLC | 3975 |
6 |
| Disco Corporation | 1945 |
6 |
| Enpulse Co., Ltd. | 79 |
6 |
| Fujikoshi Machinery Corp. | 54 |
4 |
| Globalwafers Co., Ltd. | 726 |
4 |
| Other owners | 135 |