- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Patent holdings for IPC class B24B 53/017
Total number of patents in this class: 556
10-year publication summary
|
29
|
51
|
44
|
46
|
40
|
50
|
57
|
53
|
80
|
22
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20438 |
92 |
| Ebara Corporation | 2335 |
86 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48490 |
83 |
| Samsung Electronics Co., Ltd. | 158156 |
31 |
| 3m Innovative Properties Company | 17484 |
16 |
| Kinik Company | 28 |
14 |
| Entegris, Inc. | 2009 |
12 |
| Shin-Etsu Handotai Co., Ltd. | 1309 |
11 |
| Hangzhou Sizone Electronic Technology Inc. | 83 |
9 |
| Ehwa Diamond Industrial Co., Ltd. | 57 |
7 |
| Sumco Corporation | 1107 |
7 |
| Saesol Diamond Ind. Co., Ltd. | 11 |
7 |
| Kioxia Corporation | 10840 |
7 |
| DuPont Electronic Materials Holding, Inc. | 201 |
7 |
| Tokyo Electron Limited | 13843 |
6 |
| Seagate Technology LLC | 3959 |
6 |
| Disco Corporation | 1958 |
6 |
| Enpulse Co., Ltd. | 79 |
6 |
| Fujikoshi Machinery Corp. | 54 |
4 |
| Globalwafers Co., Ltd. | 730 |
4 |
| Other owners | 135 |