- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
Patent holdings for IPC class B24B 37/04
Total number of patents in this class: 1529
10-year publication summary
|
101
|
107
|
116
|
144
|
124
|
127
|
103
|
111
|
131
|
72
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18530 |
189 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42461 |
134 |
| Ebara Corporation | 2165 |
134 |
| Fujimi Incorporated | 740 |
74 |
| Resonac Corporation | 2769 |
49 |
| CMC Materials LLC | 246 |
45 |
| Sumco Corporation | 1119 |
33 |
| Samsung Electronics Co., Ltd. | 145416 |
32 |
| Shin-Etsu Handotai Co., Ltd. | 1285 |
32 |
| 3m Innovative Properties Company | 17857 |
27 |
| DuPont Electronic Materials Holding, Inc. | 200 |
25 |
| Seagate Technology LLC | 3971 |
23 |
| Versum Materials US, LLC | 641 |
23 |
| Disco Corporation | 1852 |
18 |
| Kioxia Corporation | 10285 |
16 |
| Hitachi Chemical Company, Ltd. | 2354 |
15 |
| Asahi Glass Company, Limited | 2799 |
13 |
| Cabot Microelectronics Corporation | 198 |
13 |
| Siltronic AG | 423 |
13 |
| Tokyo Electron Limited | 12645 |
12 |
| Other owners | 609 |