- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/321 - After-treatment
Patent holdings for IPC class H01L 21/321
Total number of patents in this class: 2612
10-year publication summary
|
275
|
248
|
273
|
334
|
355
|
278
|
177
|
168
|
156
|
140
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43628 |
574 |
| Applied Materials, Inc. | 18932 |
210 |
| International Business Machines Corporation | 61537 |
96 |
| Samsung Electronics Co., Ltd. | 147787 |
89 |
| CMC Materials LLC | 249 |
67 |
| GLOBALFOUNDRIES U.S. Inc. | 6413 |
64 |
| United Microelectronics Corp. | 4251 |
61 |
| Tokyo Electron Limited | 12979 |
60 |
| Fujimi Incorporated | 759 |
59 |
| Versum Materials US, LLC | 650 |
51 |
| BASF SE | 21017 |
44 |
| FUJIFILM Electronic Materials U.S.A., Inc. | 333 |
41 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1754 |
38 |
| Micron Technology, Inc. | 26235 |
35 |
| Intel Corporation | 47221 |
32 |
| Lam Research Corporation | 5311 |
32 |
| DuPont Electronic Materials Holding, Inc. | 210 |
32 |
| Resonac Corporation | 2917 |
29 |
| Kioxia Corporation | 10445 |
27 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1033 |
25 |
| Other owners | 946 |