- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
Patent holdings for IPC class H01L 21/285
Total number of patents in this class: 5583
10-year publication summary
|
457
|
529
|
614
|
588
|
477
|
453
|
371
|
393
|
341
|
82
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47319 |
1006 |
| Applied Materials, Inc. | 20036 |
562 |
| Tokyo Electron Limited | 13523 |
330 |
| Samsung Electronics Co., Ltd. | 153845 |
197 |
| International Business Machines Corporation | 62220 |
182 |
| Lam Research Corporation | 5528 |
173 |
| Intel Corporation | 46680 |
144 |
| ASM IP Holding B.V. | 2291 |
138 |
| GLOBALFOUNDRIES U.S. Inc. | 6396 |
130 |
| Kokusai Electric Corporation | 2191 |
119 |
| ULVAC, Inc. | 1361 |
85 |
| United Microelectronics Corp. | 4450 |
64 |
| Micron Technology, Inc. | 27285 |
60 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1743 |
55 |
| Texas Instruments Incorporated | 19631 |
49 |
| JX Nippon Mining & Metals Corporation | 1466 |
44 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1033 |
43 |
| Renesas Electronics Corporation | 5866 |
41 |
| SK Hynix Inc. | 12154 |
38 |
| Tanaka Kikinzoku Kogyo K.K. | 574 |
36 |
| Other owners | 2087 |