- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/18 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
Patent holdings for IPC class H01L 21/18
Total number of patents in this class: 803
10-year publication summary
|
49
|
62
|
69
|
58
|
60
|
42
|
51
|
62
|
58
|
48
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Soitec | 1036 |
89 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10964 |
55 |
| EV Group E. Thallner GmbH | 407 |
47 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44282 |
40 |
| Tokyo Electron Limited | 13013 |
34 |
| Samsung Electronics Co., Ltd. | 148173 |
17 |
| International Business Machines Corporation | 61621 |
17 |
| Infineon Technologies AG | 8266 |
15 |
| Intel Corporation | 46937 |
13 |
| Kioxia Corporation | 10440 |
13 |
| Micron Technology, Inc. | 26317 |
11 |
| Tokyo Electron U.S. Holdings, Inc | 800 |
11 |
| Applied Materials, Inc. | 19031 |
10 |
| S.O.I.Tec Silicon on Insulator Technologies | 219 |
10 |
| Invensas Bonding Technologies, Inc. | 136 |
10 |
| Nikon Corporation | 7297 |
9 |
| Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. | 200 |
9 |
| Adeia Semiconductor Bonding Technologies Inc. | 389 |
9 |
| Frontgrade Colorado Springs LLC | 49 |
8 |
| Massachusetts Institute of Technology | 10127 |
7 |
| Other owners | 369 |