• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/18 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials

Patent holdings for IPC class H01L 21/18

Total number of patents in this class: 803

10-year publication summary

49
62
69
58
60
42
51
62
58
48
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Soitec
1036
89
Commissariat à l'énergie atomique et aux energies alternatives
10964
55
EV Group E. Thallner GmbH
407
47
Taiwan Semiconductor Manufacturing Company, Ltd.
44282
40
Tokyo Electron Limited
13013
34
Samsung Electronics Co., Ltd.
148173
17
International Business Machines Corporation
61621
17
Infineon Technologies AG
8266
15
Intel Corporation
46937
13
Kioxia Corporation
10440
13
Micron Technology, Inc.
26317
11
Tokyo Electron U.S. Holdings, Inc
800
11
Applied Materials, Inc.
19031
10
S.O.I.Tec Silicon on Insulator Technologies
219
10
Invensas Bonding Technologies, Inc.
136
10
Nikon Corporation
7297
9
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
200
9
Adeia Semiconductor Bonding Technologies Inc.
389
9
Frontgrade Colorado Springs LLC
49
8
Massachusetts Institute of Technology
10127
7
Other owners 369