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2025
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Invention
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Heterogeneous annealing method and device.
A method of integrating a first substrate having a fi... |
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2024
|
Invention
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Method and structures for low temperature device bonding.
Dies and/or wafers including conductiv... |
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Invention
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See-through led displays and methods related thereto. A display comprises a plurality of LEDs on ... |
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Invention
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See-through led displays and methods related thereto.
A display comprises a plurality of LEDs on... |
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Invention
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Electronic device cooling structures.
A cooling structure having a first side and a second side ... |
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Invention
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Stacked quantum dot sensors and methods of forming the same. A method of forming a stacked image ... |
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|
Invention
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Stacked quantum dot sensors and methods of forming the same.
A method of forming a stacked image... |
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|
Invention
|
Low temperature bonded structures.
Devices and techniques including process steps make use of re... |
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Invention
|
Quantum dot image sensor devices and methods of manufacturing the same. Conductive features of a ... |
|
|
Invention
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High efficiency quantum dot image sensors and methods of forming the same. An image sensor using ... |
|
|
Invention
|
Through substrate via structures and processes. Disclosed is a microelectronic structure includin... |
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|
Invention
|
Structures and methods for integrated cold plate in xpus and memory. A multi-component device pac... |
|
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Invention
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Bonded structures.
A bonded structure can include a first element having a first conductive inte... |
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Invention
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Diffusion barrier for interconnects.
Representative implementations of techniques and devices ar... |
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Invention
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Direct bonding methods and structures for dies. Disclosed herein are methods of forming a microel... |
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|
Invention
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Bonded optical devices.
A bonded optical device is disclosed. The bonded optical device can incl... |
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|
Invention
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Methods and structures employing metal oxide for direct metal bonding. A semiconductor element is... |
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|
Invention
|
Direct gang bonding methods and structures.
A bonded structure can comprise a first element and ... |
|
|
Invention
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Bonded structures with integrated passive component.
In various embodiments, a bonded structure ... |
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|
Invention
|
Processed stacked dies.
Representative implementations of techniques and methods include process... |
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Invention
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Microelectronic assembly from processed substrate.
Representative implementations of techniques,... |
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Invention
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Integrated device packages with integrated device die and dummy element.
In one embodiment, an i... |
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Invention
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Integrated circuits with capacitors.
A component comprises a substrate comprising a first side a... |
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Invention
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Integrated circuits with capacitors. A component comprises a substrate comprising a first side an... |
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Invention
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Hybrid bonding methods and device assemblies formed using the same. A first conductive feature of... |
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|
Invention
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Directly bonded optical components. An optical component can comprise a first optical element and... |
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|
Invention
|
Heavily doped semiconductor devices for power distribution. A device including a first integrated... |
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|
Invention
|
Methods and structures for low temperature hybrid bonding. A semiconductor element is provided wi... |
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|
Invention
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Embedded chiplets with backside power delivery network. An assembly may include a base element co... |
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Invention
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Structures and methods for bonding dies. Disclosed is a bonded structure including a substrate th... |
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|
Invention
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Chiplet-to-chiplet protocol switch. A bonded structure is disclosed. The bonded structure can inc... |
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|
Invention
|
Heavily doped semiconductor devices for power distribution.
A device including a first integrate... |
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|
Invention
|
Microelectronic assemblies.
Various embodiments of fanout packages are disclosed. A method of fo... |
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|
Invention
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Manifold designs for embedded liquid cooling in a package. A device package comprising a cooling ... |
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|
Invention
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Laterally unconfined structure.
Techniques are employed to mitigate the anchoring effects of cav... |
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|
Invention
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Conductive materials for direct bonding. A structure includes a first substrate including a first... |
|
2023
|
Invention
|
Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same... |
|
|
Invention
|
High efficiency quantum dot image sensors and methods of forming the same.
An image sensor using... |
|
|
Invention
|
Quantum dot image sensor devices and methods of manufacturing the same.
Conductive features of a... |
|
|
Invention
|
Through substrate via structures and processes.
Disclosed is a microelectronic structure includi... |
|
|
Invention
|
Integrated cooling assemblies including signal redistribution and methods of manufacturing the sa... |
|
|
Invention
|
Direct bonding methods and structures for dies.
Disclosed herein are methods of forming a microe... |
|
|
Invention
|
Methods and structures employing metal oxide for direct metal bonding.
A semiconductor element i... |
|
|
Invention
|
Apparatus for separating singulated die from substrate dicing tape and methods of using the same.... |
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Invention
|
Direct hybrid bond pad having tapered sidewall.
An element, a bonded structure that includes the... |
