- All sections
- C - Chemistrymetallurgy
- C23C - Coating metallic materialcoating material with metallic materialsurface treatment of metallic material by diffusion into the surface, by chemical conversion or substitutioncoating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 16/30 - Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
Patent holdings for IPC class C23C 16/30
Total number of patents in this class: 1839
10-year publication summary
|
124
|
117
|
159
|
144
|
136
|
174
|
177
|
132
|
110
|
119
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 19327 |
149 |
| ASM IP Holding B.V. | 2169 |
101 |
| Kokusai Electric Corporation | 2108 |
91 |
| Tokyo Electron Limited | 13169 |
58 |
| Versum Materials US, LLC | 655 |
52 |
| Sumitomo Electric Hardmetal Corp. | 1049 |
43 |
| L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude | 4011 |
39 |
| Lam Research Corporation | 5385 |
36 |
| Kyocera Corporation | 14102 |
31 |
| Aixtron SE | 323 |
31 |
| Entegris, Inc. | 1920 |
22 |
| Mitsubishi Materials Corporation | 2472 |
22 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46224 |
20 |
| Samsung Electronics Co., Ltd. | 149362 |
19 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10954 |
19 |
| Corning Incorporated | 10389 |
16 |
| Kennametal Inc. | 1373 |
16 |
| Shin-Etsu Chemical Co., Ltd. | 5807 |
12 |
| American Air Liquide, Inc. | 260 |
12 |
| Tungaloy Corporation | 521 |
11 |
| Other owners | 1039 |