- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/013 - Devices or means for detecting lapping completion
Patent holdings for IPC class B24B 37/013
Total number of patents in this class: 455
10-year publication summary
|
27
|
26
|
32
|
60
|
33
|
35
|
43
|
35
|
41
|
30
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18792 |
151 |
| Ebara Corporation | 2176 |
123 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
32 |
| Sumco Corporation | 1113 |
16 |
| Kioxia Corporation | 10334 |
10 |
| Shin-Etsu Handotai Co., Ltd. | 1283 |
9 |
| Fujibo Holdings, Inc. | 103 |
8 |
| Toyo Tire & Rubber Co., Ltd. | 538 |
8 |
| DDP Specialty Electronic Materials US, LLC | 838 |
7 |
| Samsung Electronics Co., Ltd. | 147131 |
6 |
| Seagate Technology LLC | 3967 |
6 |
| Disco Corporation | 1867 |
5 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 72 |
4 |
| Micron Technology, Inc. | 26138 |
3 |
| Tokyo Electron Limited | 12825 |
3 |
| Headway Technologies, Inc. | 691 |
3 |
| Bruker Nano, Inc. | 343 |
3 |
| SK Siltron Co., Ltd. | 164 |
3 |
| DuPont Electronic Materials Holding, Inc. | 210 |
3 |
| Beijing TSD Semiconductor Co., Ltd. | 5 |
3 |
| Other owners | 49 |