Taiwan Semiconductor Manufacturing Company, Ltd.

Taïwan, Province de Chine


Commandez votre montre hebdomadaire Taiwan Semiconductor Manufacturing Company, Ltd.
Quantité totale PI 47 857
Quantité totale incluant filiales 47 956 (+ 304 pour les filiales)
Rang # Quantité totale PI 8
Note d'activité PI 4,9/5.0    36 012
Rang # Activité PI 6
Activité incl filiales 4,9/5.0    36 073
Symbole boursier
ISIN TW0002330008
Capitalisation 27.6T  (TWD)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

47 710 49
8 19
17 0
54
 
Dernier brevet 2026 - Bonding structures for semicondu...
Premier brevet 1985 - Amplitude enhanced sampled clipp...
Dernière marque 2025 - TSMC-COPOS
Première marque 1994 - TSMC

Filiales

3 subsidiaries with IP (301 patents, 3 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2026 Invention Generating high dynamic voltage boost. Devices, systems, and methods are provided for generating...
Invention Vertically arranged semiconductor pixel sensor. A pixel sensor may include a vertically arranged...
Invention Under-floor charging station. An under-floor charging station can be mounted under a floor such ...
Invention Semiconductor structure, semiconductor assembly and method for manufacturing the same. A semicon...
Invention Schottky diode. A Schottky diode includes a substrate, a first drift region in the substrate, a ...
Invention Method for forming multilayer gate isolation structure. A method of forming a semiconductor devi...
Invention Magnetic tunnel junction (mtj) element and its fabrication process. A magnetic tunnel junction (...
Invention Low-leakage esd protection circuit and operating method thereof. A semiconductor device is provi...
Invention Different isolation liners for different type finfets and associated isolation feature fabricatio...
Invention Semiconductor devices and methods of fabrication thereof. Embodiments of the present disclosure ...
Invention Semiconductor device with air gap and method for manufacturing the same. A method for manufactur...
Invention Semiconductor devices with backside via and methods thereof. A semiconductor structure and a met...
Invention Source/drain contact landing. A semiconductor structure according to the present disclosure incl...
Invention Voltage reference circuit and power supply circuit based on same. An integrated circuit includes...
Invention Method of manufacturing semiconductor device. A method of manufacturing semiconductor device is ...
Invention Bonding structures for semiconductor devices and methods of forming the same. An embodiment meth...
Invention Gate isolation structures. An IC structure and a method of forming the same are provided. In an ...
Invention Three dimensional mim capacitor having a comb structure and methods of making the same. Metal-in...
Invention Semiconductor device structure and methods of forming the same. Embodiments of the present discl...
Invention Interconnect strucutre with protective etch-stop. In some embodiments, the present disclosure re...
Invention Capacitor and method for forming the same. An integrated circuit structure includes a substrate,...
Invention Inter-poly connection for parasitic capacitor and die size improvement. The present disclosure r...
Invention Liner-free conductive structures. The present disclosure describes a method for forming liner-fr...
Invention Semiconductor device structure and methods of forming the same. A semiconductor device structure...
Invention Conductive feature formation and structure. Generally, the present disclosure provides example e...
Invention Semiconductor device. A semiconductor device and a method of fabricating a semiconductor device ...
Invention Method for mask data synthesis with wafer target adjustment. A method for manufacturing a lithog...
Invention Top electrode via with low contact resistance. The present disclosure, in some embodiments, rela...
Invention Package assembly including liquid alloy thermal interface material (tim) and seal ring around the...
2025 P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
Invention Isolation structure for stacked multi-gate device. Semiconductor structures and methods of formi...
Invention Semiconductor package and method of forming the same. During a bonding process for forming a sem...
Invention Capacitor structure and manufacturing method thereof. A method includes forming a first electrod...
Invention Integrated circuit package and method of forming the same. In an embodiment, a method includes f...
Invention Method of and system for generating layout diagram of integrated circuit device having transistor...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
Invention Memory with bundle-wide access lines, method of reading from the same and method of manufacturing...
2024 Invention Semiconductor package and method of fabricating the same. A semiconductor package provided herei...
Invention Liquid chemical supply system having magnetic particle removal and related methods. A method is ...
Invention Optical devices and methods of manufacture. Devices and methods of manufacture and use of a fibe...
Invention Semiconductor testing apparatus and semiconductor testing method. A semiconductor testing appara...
Invention Integrated capacitor for semiconductor device. Some embodiments relate to an integrated device, ...
Invention Semiconductor device and method of manufacturing the same. Some embodiments relate to an integra...
Invention Metal gate metal-insulator-metal (mim) capacitor with air spacer and method for fabricating the s...
Invention Interposer with enhanced electrical isolation and methods for forming the same. A semiconductor ...
Invention Image sensor pixel with pixel isolation. An image sensor pixel includes a light sensor disposed ...
Invention Structures and methods for forming structures with inner spacers. Provided are semiconductor str...
Invention Optical devices and methods of manufacture. Methods of manufacturing optical devices and the opt...
Invention Uniform oxide layers. Provided are metal oxide layers and methods and systems for forming metal ...
Invention Semiconductor package and formation method thereof. A semiconductor package and a formation meth...
Invention Semiconductor structure and method for forming the same. A semiconductor structure includes a st...
Invention Methods for manufacturing semiconductor plug structure and semiconductor structure having the sem...
P/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
2023 P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
P/S Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon...
P/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 P/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
P/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...