- All sections
- H - Electricity
- H10D - Inorganic electric semiconductor devices
- H10D 88/00 - Three-dimensional [3D] integrated devices
Patent holdings for IPC class H10D 88/00
Total number of patents in this class: 92
10-year publication summary
|
0
|
0
|
0
|
0
|
1
|
0
|
5
|
18
|
15
|
47
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42461 |
13 |
| International Business Machines Corporation | 61207 |
12 |
| Tokyo Electron Limited | 12645 |
7 |
| Samsung Electronics Co., Ltd. | 145416 |
6 |
| Micron Technology, Inc. | 26231 |
6 |
| Semiconductor Energy Laboratory Co., Ltd. | 11377 |
6 |
| Monolithic 3D Inc. | 308 |
4 |
| Soitec | 1011 |
4 |
| IBM United Kingdom Limited | 4365 |
3 |
| IBM Israel-science and Technology Ltd | 144 |
3 |
| Qualcomm Incorporated | 84971 |
2 |
| Intel Corporation | 46949 |
2 |
| Ebara Corporation | 2165 |
2 |
| IQE plc. | 114 |
2 |
| Kioxia Corporation | 10285 |
2 |
| Adeia Semiconductor Inc. | 60 |
2 |
| Adeia Semiconductor Bonding Technologies Inc. | 335 |
2 |
| Applied Materials, Inc. | 18530 |
1 |
| Murata Manufacturing Co., Ltd. | 24465 |
1 |
| Sandisk Technologies Inc. | 4790 |
1 |
| Other owners | 11 |