- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
Patent holdings for IPC class H01L 21/768
Total number of patents in this class: 27113
10-year publication summary
|
2219
|
2369
|
2532
|
2610
|
2727
|
2407
|
2381
|
2218
|
2121
|
1862
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
6448 |
| International Business Machines Corporation | 61721 |
1446 |
| Samsung Electronics Co., Ltd. | 149087 |
1410 |
| Applied Materials, Inc. | 19248 |
1059 |
| Intel Corporation | 46460 |
943 |
| Micron Technology, Inc. | 26558 |
874 |
| Tokyo Electron Limited | 13136 |
688 |
| GLOBALFOUNDRIES U.S. Inc. | 6418 |
648 |
| Nanya Technology Corporation | 2660 |
490 |
| United Microelectronics Corp. | 4307 |
444 |
| Changxin Memory Technologies, Inc. | 4928 |
416 |
| Kioxia Corporation | 10452 |
398 |
| SK Hynix Inc. | 11676 |
390 |
| Sony Semiconductor Solutions Corporation | 10823 |
355 |
| Lam Research Corporation | 5372 |
343 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1750 |
274 |
| Sandisk Technologies Inc. | 5030 |
257 |
| Yangtze Memory Technologies Co., Ltd. | 2956 |
256 |
| Qualcomm Incorporated | 87585 |
252 |
| Texas Instruments Incorporated | 19495 |
213 |
| Other owners | 9509 |