- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 9/06 - Machines or devices designed for grinding edges or bevels on work or for removing burrsAccessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
Patent holdings for IPC class B24B 9/06
Total number of patents in this class: 184
10-year publication summary
15
|
20
|
15
|
17
|
17
|
12
|
12
|
8
|
9
|
7
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Ebara Corporation | 2169 |
46 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 42704 |
8 |
Disco Corporation | 1858 |
8 |
Corning Incorporated | 10259 |
7 |
Sumco Corporation | 1115 |
6 |
Shin-Etsu Handotai Co., Ltd. | 1284 |
5 |
Ancora S.p.A. | 26 |
5 |
Sumitomo Electric Industries, Ltd. | 15483 |
4 |
Shin-Etsu Chemical Co., Ltd. | 5658 |
4 |
Elettromeccanica Bovone S.r.l. | 8 |
3 |
Soltek S.r.l. | 6 |
3 |
Keda Industrial Group Co., Ltd. | 56 |
3 |
Samsung Electronics Co., Ltd. | 146092 |
2 |
3m Innovative Properties Company | 17833 |
2 |
Tokyo Electron Limited | 12712 |
2 |
Seagate Technology LLC | 3966 |
2 |
Globalwafers Co., Ltd. | 640 |
2 |
Lapmaster International, LLC | 15 |
2 |
Meere Company Inc. | 49 |
2 |
Okamoto Machine Tool Works, Ltd. | 16 |
2 |
Other owners | 66 |