- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 37/015 - Temperature control
Patent holdings for IPC class B24B 37/015
Total number of patents in this class: 207
10-year publication summary
|
6
|
11
|
15
|
19
|
27
|
27
|
30
|
18
|
25
|
18
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18792 |
58 |
| Ebara Corporation | 2176 |
51 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
23 |
| Samsung Electronics Co., Ltd. | 147131 |
9 |
| Shin-Etsu Handotai Co., Ltd. | 1283 |
8 |
| Globalwafers Co., Ltd. | 646 |
6 |
| Sumco Corporation | 1113 |
5 |
| Kioxia Corporation | 10334 |
5 |
| K.C. Tech Co., Ltd. | 82 |
4 |
| Illinois Tool Works Inc. | 11485 |
3 |
| Texas Instruments Incorporated | 19450 |
2 |
| Lapmaster International, LLC | 15 |
2 |
| Screen Holdings Co., Ltd. | 2844 |
2 |
| Agc, Inc. | 4895 |
2 |
| 3m Innovative Properties Company | 17813 |
1 |
| Samsung Display Co., Ltd. | 35017 |
1 |
| Texas Instruments Japan, Ltd. | 1656 |
1 |
| Tokyo Electron Limited | 12825 |
1 |
| Seagate Technology LLC | 3967 |
1 |
| STMicroelectronics S.r.l. | 3605 |
1 |
| Other owners | 21 |