- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 101/40 - Semiconductor devices
Patent holdings for IPC class B23K 101/40
Total number of patents in this class: 940
10-year publication summary
|
63
|
99
|
89
|
101
|
65
|
99
|
82
|
56
|
73
|
97
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1906 |
121 |
| Hamamatsu Photonics K.K. | 4506 |
41 |
| Samsung Electronics Co., Ltd. | 149362 |
30 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46224 |
27 |
| Kulicke and Soffa Industries, Inc. | 317 |
20 |
| Senju Metal Industry Co., Ltd. | 689 |
18 |
| Shinkawa Ltd. | 419 |
17 |
| Siltectra GmbH | 88 |
17 |
| Jsw Aktina System, Co., Ltd. | 75 |
16 |
| Samsung Display Co., Ltd. | 36421 |
14 |
| Applied Materials, Inc. | 19327 |
14 |
| Fuji Electric Co., Ltd. | 5277 |
12 |
| Nichia Corporation | 3774 |
12 |
| Micron Technology, Inc. | 26638 |
11 |
| Tokyo Electron Limited | 13169 |
10 |
| Mitsubishi Electric Corporation | 47014 |
9 |
| Nippon Micrometal Corporation | 153 |
9 |
| Kioxia Corporation | 10461 |
9 |
| Wolfspeed, Inc. | 775 |
9 |
| International Business Machines Corporation | 61759 |
8 |
| Other owners | 516 |