- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 101/40 - Semiconductor devices
Patent holdings for IPC class B23K 101/40
Total number of patents in this class: 1025
10-year publication summary
|
99
|
89
|
101
|
66
|
102
|
87
|
63
|
81
|
100
|
57
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1945 |
140 |
| Samsung Electronics Co., Ltd. | 155224 |
40 |
| Hamamatsu Photonics K.K. | 4620 |
40 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47734 |
28 |
| Kulicke and Soffa Industries, Inc. | 332 |
21 |
| Senju Metal Industry Co., Ltd. | 683 |
19 |
| Siltectra GmbH | 90 |
19 |
| Shinkawa Ltd. | 414 |
17 |
| Jsw Aktina System, Co., Ltd. | 82 |
16 |
| Samsung Display Co., Ltd. | 38092 |
15 |
| Applied Materials, Inc. | 20145 |
14 |
| Tokyo Electron Limited | 13617 |
13 |
| Nichia Corporation | 3841 |
13 |
| Fuji Electric Co., Ltd. | 5422 |
12 |
| Micron Technology, Inc. | 27384 |
11 |
| EO Technics Co., Ltd. | 114 |
11 |
| Kioxia Corporation | 10727 |
10 |
| Wolfspeed, Inc. | 885 |
10 |
| International Business Machines Corporation | 62325 |
9 |
| Mitsubishi Electric Corporation | 47722 |
9 |
| Other owners | 558 |