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2023
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Invention
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Method for producing a detachment region in a solid-state body.
A method for producing a detachm... |
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Invention
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Method for separating wafers from donor substrates. A method for separating wafers from donor sub... |
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Invention
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Method for producing a layer of solid material.
A method for producing a layer of solid material... |
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2022
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Invention
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Method for separating a solid body. A method for separating a solid body includes: providing a fi... |
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2021
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Invention
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Method for separating a solid-state layer from a solid-state material.
A method for separating a... |
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Invention
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Method for producing a layer of solid material. A method for producing a layer of solid material ... |
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Invention
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Method for forming a crack in an edge region of a donor substrate. A method for separating a soli... |
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Invention
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Solid body and multi-component arrangement. A solid body is disclosed. The solid body includes: a... |
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Invention
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Method for producing a detachment area in a solid body. A method for producing a detachment area ... |
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2020
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Invention
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Method of treating a solid layer bonded to a carrier substrate. A method for treating a solid lay... |
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Invention
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Method of modifying a solid using laser light. The invention relates to a method for creating a d... |
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Invention
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Wafer production method. A method for producing a layer of solid material includes: providing a s... |
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Invention
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Method of producing stresses in a semiconductor wafer. A method of splitting a semiconductor wafe... |
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2019
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Invention
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Splitting of a solid using conversion of material. The invention relates to a method for creating... |
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Invention
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Method for separating thin layers of solid material from a solid body. Providing a solid body to ... |
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Invention
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Method for modifying substrates based on crystal lattice dislocation density. A method includes: ... |
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Invention
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Method for separating solid body layers from composite structures made of sic and a metallic coat... |
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Invention
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Combined wafer production method with laser treatment and temperature-induced stresses. A method ... |
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Invention
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Method for guiding a crack in the peripheral region of a donor substrate. The present invention r... |
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Invention
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Method for producing short subcritical cracks in solid bodies.
The invention relates to a method... |
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Invention
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Method for producing short subcritical cracks in solid bodies. The invention relates to a method ... |
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Invention
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Method and device for the production of wafers with a pre-defined break initiation point. The pre... |
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2018
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Invention
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Combined production mehtod for separating a number of thin layers of solid material from a thick ... |
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Invention
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Method for thinning solid-body layers provided with components. According to claim 1, the inventi... |
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Invention
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Device and method for applying pressure to stress-producing layers for improved guidance of a sep... |
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Invention
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Production facility for separating wafers from donor substrates. The invention relates to a produ... |
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Invention
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Method for reducing the thickness of solid-state layers provided with components. The invention r... |
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Invention
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Method for producing wafers with modification lines of defined orientation. The present invention... |
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2017
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Invention
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Method for thinning solid body layers provided with components. wherein the modifications for for... |
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Invention
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Method for improving the surface quality of a surface resulting from a crack propagation. The inv... |
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Invention
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Method for thinning solid body layers provided with components. The present invention relates to ... |
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Invention
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Laser conditioning of solid bodies using prior knowledge from previous machining steps. The prese... |
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Invention
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Polymer hybrid material for use in a splitting method. A polymer hybrid material, a film comprisi... |
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Invention
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Combined laser treatment of a solid body to be split. A method for producing a solid body layer h... |
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2016
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Invention
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Method and device for producing planar modifications in solid bodies. A method for creating modif... |
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Invention
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Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam.... |
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Invention
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Method for the material-saving production of wafers and processing of wafers. The invention relat... |
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Invention
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Apparatus and method for continuous treatment of a solid body by means of laser beam.
The invent... |
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2015
|
Invention
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Splitting of a solid using conversion of material.
A method for creating a detachment zone in a ... |
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Invention
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Splitting of a solid using conversion of material. A method for creating a detachment zone in a s... |
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Invention
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Splitting method and use of a material in a splitting method. The overall yield of a splitting me... |
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Invention
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Combined wafer production method with a multi-component receiving layer. The present invention re... |
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2014
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G/S
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[ Chemicals used in industry and science other than for medical or veterinary purposes; chemicals... |
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G/S
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Chemicals used in industry and science (other than for
medical or veterinary purposes); chemical... |
