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2025
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Invention
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Method for fabricating a strained semiconductor-on-insulator substrate.
A method for fabricating... |
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Invention
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Method for manufacturing a semiconductor-on-insulator substrate.
A method for fabricating a semi... |
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2024
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Invention
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Elastic-wave device. The present invention relates to an elastic-wave device, in particular a she... |
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Invention
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Elastic wave device. The present invention relates to an elastic wave device, in particular a she... |
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Invention
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Elastic-wave device with partially buried interdigitated comb electrodes. The present invention r... |
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Invention
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Method for direct bonding between two substrates. The invention relates to a method for direct bo... |
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Invention
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Method for directly bonding two substrates. The invention relates to a method for directly bondin... |
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Invention
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Manufacturing of a donor substrate for the manufacture of a poi structure. The present invention ... |
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Invention
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Refreshing of a donor substrate for the manufacture of a poi structure. The present invention rel... |
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Invention
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Manufacturing of a poi structure with a highly uniform piezoelectric layer. The present invention... |
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Invention
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Method for manufacturing a substrate comprising a plurality of tiles. The invention relates to a ... |
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Invention
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Chip transfer method. The invention relates to a method for transferring chips onto a receiver su... |
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Invention
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Method for producing a substrate comprising a plurality of blocks. The invention relates to a met... |
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Invention
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Base structure for quantum devices and manufacturing method. The invention relates to a structure... |
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Invention
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Carrier provided with a bragg mirror, intended for transfer of a layer by laser splitting. Disclo... |
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Invention
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Superlattice obtained by layer transfer, structure and production method. CarCarDonDon) respectiv... |
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Invention
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Method for fabricating double superlattices obtained by layer transfer. CarDonDon) a second super... |
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Invention
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Double superlattices obtained by layer transfer, structure and production method. CarDonDonDon) a... |
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Invention
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Method for producing a soi structure, in particular suitable for photonic applications, and carri... |
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Invention
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Carrier comprising a layer for trapping electrical charges for a composite substrate. The inventi... |
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Invention
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Method for manufacturing a homoepitaxial silicon carbide layer, making it possible to limit the f... |
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Invention
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Method for controlling the quality of a composite structure comprising a thin c-sic layer, and co... |
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Invention
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Process for fabricating a composite structure including a grading step. The invention relates to ... |
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Invention
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Substrate and production method therefor for producing a wide-bandgap bidirectional switch. The i... |
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Invention
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Method for thinning the surface layer of an soi substrate. moynuumoynuuu) are determined, prior t... |
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Invention
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Carrier comprising a layer for trapping electrical charges for a composite substrate and method f... |
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2023
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Invention
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Method for assembling two substrates by molecular adhesion and structure obtained by such a metho... |
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Invention
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Substrate for electronic device.
A substrate for a power or radiofrequency electronic device inc... |
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Invention
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Method for producing a structure comprising at least two chips on a substrate.
A method for manu... |
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Invention
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Piezoelectric-on-insulator (poi) substrate and method for producing a piezoelectric-on-insulator ... |
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Invention
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Substrate comprising vias and associated manufacturing methods.
A substrate is provided, includi... |
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Invention
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Method for transferring a thin film onto a support substrate.
A method for transferring a thin f... |
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Invention
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Method for producing a semiconductor-on-insulator multilayer structure.
A method for producing a... |
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Invention
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Method for correcting the thickness of a piezoelectric layer.
A method for correcting the thickn... |
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Invention
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Method for monitoring embrittlement of an interface between a substrate and layer and a device en... |
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Invention
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Composite structure and manufacturing method thereof.
A method of manufacturing a composite stru... |
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Invention
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Process for fabricating a double semiconductor-on-insulator structure.
A method is used to fabri... |
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Invention
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Process for fabricating a double semiconductor-on-insulator structure.
A method for fabricating ... |
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Invention
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Method for manufacturing a non-deformable p-sic wafer.
A method of manufacturing a polycrystalli... |
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Invention
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Method for producing a donor substrate for transferring a piezoelectric layer, and method for tra... |
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2022
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Invention
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Method for transferring a thin film onto a support substrate.
The invention relates to a method ... |
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Invention
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Method for manufacturing a 3d circuit with shared recrystallisation and dopant activation steps. ... |
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P/S
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Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing... |
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P/S
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Multi-layer substrates consisting of semiconductors;
multi-layer substrates consisting of semico... |
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2018
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P/S
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Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, ... |
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2016
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P/S
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Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser a... |
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P/S
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Semiconductor substrates for opto-electronics, for
micro-electronics, micro-engineering and deri... |
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2014
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P/S
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Apparatus and instruments for conducting, switching, transforming, accumulating, adjusting or con... |
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P/S
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Magnetic, optical, digital and electronic recording media;
semi-conductor wafers; semi-conductor... |
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2011
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P/S
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Semiconductor substrates for optoelectronics,
microelectronics, micromechanics and derived activ... |
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P/S
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Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activi... |
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2009
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P/S
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Components for microelectronic devices, flat screens,
integrated optical waveguides, sensors, im... |
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P/S
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[ Silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, f... |
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2007
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P/S
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Components for microelectronics, optoelectronics,
micro-engineering, for flat panel displays, fo... |
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2005
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P/S
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Components for micro-electronics, for flat screens, for integrated optical guides, for sensors, f... |
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2002
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P/S
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Silicon and semiconductor substrates for use in
microelectronics, micromechanics and derived act... |
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P/S
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Substrats de silicium et de semi-conducteurs pour la micro-électronique, pour la micro-mécanique ... |
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P/S
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[ NON-METALLIC SILICON SUBSTRATES SOLD IN INGOTS OR SLICES FOR THE MANUFACTURE OF SEMICONDUCTORS,... |
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P/S
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Silicon and semiconductor substrates for microelectronics, micromechanics, and activities derived... |
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1999
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P/S
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SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUF... |
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P/S
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[ SCIENTIFIC, LABORATORY AND INDUSTRIAL RESEARCH SERVICES, CONSULTING SERVICES, ] ENGINEERING SER... |
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1998
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P/S
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Composants pour la micro-électronique, pour les écrans
plats, pour les guides optiques intégrés,... |
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1997
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P/S
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Devices and components for microelectronics, namely microelectronic semiconductor components, opt... |
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P/S
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Substrates of materials for microelectronics, flat screens,
integrated optical guides, sensors a... |
