Soitec

France


 
Quantité totale PI 1 001
Quantité totale incluant filiales 1 001 (+ 0 pour les filiales)
Rang # Quantité totale PI 1 342
Note d'activité PI 3,5/5.0    608
Rang # Activité PI 1 191
Symbole boursier
ISIN FR0013227113
Capitalisation 2.4B  (EUR)
Industrie Semiconductor Equipment & Materials
Secteur Technology
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

554 7
2 4
421 9
4
 
Dernier brevet 2025 - Piezoelectric-on-insulator (poi)...
Premier brevet 1995 - Semi-insulating wafer
Dernière marque 2022 - SMARTSIC
Première marque 1997 - SMARTCUT

Filiales

1 subsidiaries with IP (0 patents, 0 trademarks)

3 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 Invention Method for manufacturing a semiconductor-on-insulator substrate. A method for fabricating a semi...
2024 Invention Manufacturing of a donor substrate for the manufacture of a poi structure. The present invention ...
Invention Manufacturing of a poi structure with a highly uniform piezoelectric layer. The present invention...
Invention Refreshing of a donor substrate for the manufacture of a poi structure. The present invention rel...
Invention Method for manufacturing a substrate comprising a plurality of tiles. The invention relates to a ...
Invention Chip transfer method. The invention relates to a method for transferring chips onto a receiver su...
Invention Method for producing a substrate comprising a plurality of blocks. The invention relates to a met...
Invention Base structure for quantum devices and manufacturing method. The invention relates to a structure...
Invention Device architectures with tensile and compressive strained substrates. A method of preparing a s...
Invention Carrier provided with a bragg mirror, intended for transfer of a layer by laser splitting. Disclo...
Invention Superlattice obtained by layer transfer, structure and production method. CarCarDonDon) respectiv...
Invention Method for fabricating double superlattices obtained by layer transfer. CarDonDon) a second super...
Invention Double superlattices obtained by layer transfer, structure and production method. CarDonDonDon) a...
Invention Method for producing a soi structure, in particular suitable for photonic applications, and carri...
Invention Method for manufacturing a homoepitaxial silicon carbide layer, making it possible to limit the f...
Invention Method for controlling the quality of a composite structure comprising a thin c-sic layer, and co...
Invention Process for fabricating a composite structure including a grading step. The invention relates to ...
Invention Front-side-type image sensor. The invention relates to a front-side imager comprising in success...
Invention Substrate and production method therefor for producing a wide-bandgap bidirectional switch. The i...
Invention Surface elastic wave filter with resonant cavities. A surface elastic wave filter has resonant c...
Invention Method for transferring a piezoelectric layer onto a support substrate. A method for transferrin...
Invention Method for thinning the surface layer of an soi substrate. moynuumoynuuu) are determined, prior t...
Invention Elastic wave device. The present invention relates to an elastic wave device comprising a piezoel...
Invention Carrier comprising a layer for trapping electrical charges for a composite substrate and method f...
Invention Method for treating a silicon carbide substrate. TTFF) of formation of the carbon layer.
Invention Semiconductor structure based on silicon carbide for power applications and associated fabricatio...
Invention Method for transferring blocks from a donor substrate onto a receiver substrate by implanting ion...
Invention Method for manufacturing a diamond substrate or a iii-v material substrate for microelectronic ap...
Invention Detachable semiconductor substrate made of polycrystalline silicon carbide. The present disclosur...
Invention Gate all around semiconductor structure and its method of preparation. The invention relates to a...
Invention Process for transferring a thin layer to a carrier substrate. The invention relates to a process ...
Invention Method for producing a composite structure for microelectronics, optics or optoelectronics. The p...
2023 Invention Piezoelectric-on-insulator (poi) substrate and method for producing a piezoelectric-on-insulator ...
Invention Method for transferring a thin film onto a support substrate. A method for transferring a thin f...
Invention Method for producing a semiconductor-on-insulator multilayer structure. A method for producing a...
Invention Method for correcting the thickness of a piezoelectric layer. A method for correcting the thickn...
Invention Method for monitoring embrittlement of an interface between a substrate and layer and a device en...
Invention Composite structure and manufacturing method thereof. A method of manufacturing a composite stru...
Invention Process for fabricating a double semiconductor-on-insulator structure. A method is used to fabri...
Invention Process for fabricating a double semiconductor-on-insulator structure. A method for fabricating ...
Invention Method for manufacturing a non-deformable p-sic wafer. A method of manufacturing a polycrystalli...
Invention Method for producing a structure comprising at least two tiles on a substrate. A method of manuf...
Invention Method for producing a donor substrate for transferring a piezoelectric layer, and method for tra...
2022 Invention Method for fabricating a donor substrate. A method for fabricating a donor substrate comprises t...
Invention Method for transferring a thin film onto a support substrate. The invention relates to a method ...
Invention Method for manufacturing disassemblable substrates. A method for manufacturing disassemblable su...
Invention Process for the manufacture of a semiconductor structure comprising a polycrystalline silicon car...
Invention Group iii-nitride semiconductor structure on silicon-on-insulator and method of growing thereof. ...
P/S Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing...
P/S Multi-layer substrates consisting of semiconductors; multi-layer substrates consisting of semico...
2018 P/S Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, ...
2016 P/S Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser a...
P/S Semiconductor substrates for opto-electronics, for micro-electronics, micro-engineering and deri...
2014 P/S Apparatus and instruments for conducting, switching, transforming, accumulating, adjusting or con...
P/S Magnetic, optical, digital and electronic recording media; semi-conductor wafers; semi-conductor...
2011 P/S Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activ...
P/S Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activi...
2009 P/S Components for microelectronic devices, flat screens, integrated optical waveguides, sensors, im...
P/S [ Silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, f...
2007 P/S Components for microelectronics, optoelectronics, micro-engineering, for flat panel displays, fo...
2005 P/S Components for micro-electronics, for flat screens, for integrated optical guides, for sensors, f...
2002 P/S Silicon and semiconductor substrates for use in microelectronics, micromechanics and derived act...
P/S Substrats de silicium et de semi-conducteurs pour la micro-électronique, pour la micro-mécanique ...
P/S [ NON-METALLIC SILICON SUBSTRATES SOLD IN INGOTS OR SLICES FOR THE MANUFACTURE OF SEMICONDUCTORS,...
P/S Silicon and semiconductor substrates for microelectronics, micromechanics, and activities derived...
1999 P/S SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUF...
P/S [ SCIENTIFIC, LABORATORY AND INDUSTRIAL RESEARCH SERVICES, CONSULTING SERVICES, ] ENGINEERING SER...
1998 P/S Composants pour la micro-électronique, pour les écrans plats, pour les guides optiques intégrés,...
1997 P/S Devices and components for microelectronics, namely microelectronic semiconductor components, opt...
P/S Substrates of materials for microelectronics, flat screens, integrated optical guides, sensors a...