Produits et services

Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing and gluing of semiconductor material surfaces all of the above being part of custom manufacture; treatment of semiconductor substrates for microelectronics, optoelectronics, microsystems, radio frequency (RF) or power components, photonics; treatment of materials in the nature of semiconductor wafers and semiconductors; polishing semiconductor wafers; transferring a layer of materials, semiconductors or components to any media being part of custom manufacturing; treatment of materials, namely, ion implantation in materials; treatment of materials, namely, deposing layers of materials, especially Chemical Vapor Deposition or Physical Vapor Deposition of thin layers; treatment of materials, namely, custom manufacturing by sublimation, such as manufacturing by Physical Vapor Transport; treatment of materials, namely, growth of material layers, especially in epitaxy; treatment of materials, namely, manufacturing by powder sintering processes Multi-layer substrates being a layered semiconductor; multilayer substrates consisting of semiconductor being a layered semiconductor for optoelectronics, microelectronics, photonics, integrated circuits, radio frequency (RF) or power electronic components, for transistors, thyristors and diodes, for microsystems, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes Testing semiconductor materials; research and development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; research and development of new products in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of sublimation manufacturing such as Physical Vapor Transport, in the field of powder sintering process manufacturing; engineering and engineering services in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering electric radio frequency currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; engineering and engineering services in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition in the field of sublimation manufacturing such as Physical Vapor Transport, in the field of powder sintering process manufacturing; technical assistance and support services, namely, technical engineering advice for the development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; technical assistance and support services, namely, technical engineering advice for the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material layer transfer, semiconductors or components on all media, in the field of ion implantation in materials, in the field of layer deposition of materials, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of sublimation manufacturing such as being Physical Vapor Transport, in the field of powder sintering process manufacturing

Produits et services

Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, semiconductor chips, integrated circuits, transistors, capacitors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories; semi-conductor wafers; semi-conductors; silicon wafers and semiconductors for integrated circuits and derived activities; semiconductor wafers for [ light-emitting diodes, ] radio frequency (RF) components and for power components; substrates for micro-electronics, opto-electronics, micro-engineering, [ light-emitting diodes, ] micro-systems, [ photovoltaics, ] integrated optical guides, sensors, integrated circuits, radio frequency (RF) and power components, namely, semiconductor chips, integrated circuits, transistors, capacitors, cable connectors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser annealing, oxidation, implantation for layer exfoliation, grinding, chemical and physical layer deposition in the nature of electrophoretic coating services, epitaxy, and bonding of material for layer transfer; Treatment of substrates by means of glass substrate polishing, grinding, chemical treatment of surface to remove particles and/or contaminants, laser irradiation, plasma treatment in the nature of applying plasma finishes, amorphization, re-crystallization, etching, chemical etching, plasma etching, carbonization, smoothing by means of plasma, heat treatment, plasma activation to hydrophilize surfaces, and hydrophilization for micro-electronics, opto-electronics, piezoelectric, [ photovoltaics, ] microsystems and radio frequency (RF) components; treatment of semiconductor wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of semiconductor wafers, transfer of layer by exfoliation; treatment of silicon wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of silicon wafers and semiconductors, transfer of layer by exfoliation Scientific, technological, technical and industrial research in the field of material science for micro-electronics, opto-electronics, piezo electronics and micro-engineering, [ photovoltaics, ] microsystems and radio frequency (RF) components provided by engineers; testing of materials; laboratory work for others, namely, materials testing and scientific research and development; research and development of new products for others; scientific research and development in the field of wafers and semiconductors for opto-electronic and piezo electronics components, [ photovoltaics, ] radio frequency (RF) components, power components, micro-engineering, and micro-systems; scientific research and development in the field of silicon wafers and semiconductors for integrated circuits and derived activities; scientific research and development in the field of the transfer of micro-electronic circuits or micro-systems on all media; engineering and engineering services in the field of semiconductor wafers and semiconductors for micro-electronic, opto-electronic, piezo-electronic radio frequency (RF), micro-mechanical, [ photovoltaic components, ] memories, power components; engineering and engineering services in the field of silicon wafers and semiconductors for integrated circuits and derived activities and the transfer of micro-electronic or opto-electronic circuits or micro-systems on all types of media; research for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, memories, diodes, photodiodes, [ light-emitting diodes, ] photodiode detectors, radio frequency (RF) components and micro-systems; assistance and technical support, namely, technical advice in the field of development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, diodes, photodiodes, [ light-emitting diodes, ] photodiode detectors, radio frequency (RF) components and micro-systems

Produits et services

Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activities; blank [ magnetic, ] optical and digital [ and electronic ] recording media; semiconductor wafers; semiconductors; silicon and semiconductor wafers for printed circuits, [ integrated circuits and derived activities; ] components for microelectronics, micromechanics and optoelectronics, namely, silicon wafers and semiconductors for printed circuits and integrated circuits; semiconductor wafers for light-emitting diodes, radiofrequency (RF) components and power components; substrates for microelectronics, optoelectronics and micromechanics, for flat screens, light-emitting diodes, integrated optical guides, sensors, integrated circuit cards being smart cards, radiofrequency (RF) and power components, namely, electro-optical film or semiconductor substrates for use in the manufacture of flat panel displays, integrated optical wave guides, and sensors [ integrated circuit cards and smart cards and magnetic identity cards; transistors, microelectronic circuits, Microsystems comprising micronetworks for use in the design of integrated circuits; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; lasers, not for medical purposes; diodes, photodiodes, light-emitting diodes, laser diodes, high performance semiconductor laser diodes, photodiode detectors, optical conductors in the nature of waveguide conductors, photocouplers, optical sensors, light-emitting diode units; light gathering apparatus and devices combined with solar cells for producing electricity, namely, photovoltaic cells and solar collector sold as a unit; light gathering apparatus and devices combined with solar cells for producing energy, namely, photovoltaic cells and solar collector sold as a unit; solar cells for producing electricity; solar cell modules for producing electricity; solar energy installations being solar panels for producing electricity; solar cells; solar cells for household use; solar cells for industrial use; photovoltaic cells and modules for producing electricity as well as installations consisting thereof, namely, solar modules for production of electricity, solar thermal and electric receivers, tracking mechanisms and concentrating optics and control algorithms; inverters for photovoltaic applications ] [ Lighting apparatus, namely, lighting installations; lighting fixtures and electric lamps; lighting equipment in the nature of lamps and lighting systems comprising lamps and lighting sources in the nature of LED light bulbs; lighting equipment and systems made with light-emiting diodes in the nature of LED lighting fixtures for indoor and outdoor lighting applications and systems made with light-emitting diodes comprising LED modules, power supplies and wiring; LED lamps and LED floor lamps and structural parts thereof; lighting systems made with light-emitting diodes comprising LED modules, power supplies and wiring and lighting installations made with light-emitting diodes and structural parts thereof made with light-emiting diodes ] [ Installation and repair of electric power stations ] [ Distribution of electricity ] Treatment of materials, namely, mechanical, chemical and physical treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits and machining and gluing of material surfaces; treatment of substrates for microelectronics and optoelectronics, photovoltaics and micromechanics and all derived activities; treating semiconductor wafers and semiconductors; burnishing by abrasion of semiconductor wafers; applying finishes to semiconductors, namely, transfer of layers of materials, semiconductors or components on any media; treating silicon wafers and semiconductor wafers; [ magnetization of semiconductor materials substrates and silicon wafers; ] burnishing by abrasion of silicon wafers and semiconductor wafers; applying finishes to silicon and semiconductors, namely, transfer of layers of silicon, semiconductors or components on all media [ production of solar power ] Scientific, technological, technical and industrial research provided by engineers in the field of microelectronics; testing of materials; laboratory work for others, namely, testing of materials and research and development in the field of microelectronics; research and development for others in the field of microelectronics; research and development of new products for others; research and development of new products in the field of wafers and semiconductors for optoelectronic components, radiofrequency (RF) components, power components and derived activities; research and development of new products in the field of silicon wafers and semiconductors for integrated circuits and derived activities; research and development of new products in the field of transferring microelectronic circuits or microsystems on all media and derived activities; engineering services and engineering work in the field of semiconductor wafers and semiconductors for optoelectronic, radiofrequency (RF) and power components and derived activities; engineering and engineering appraisals in the field of silicon wafers and semiconductors for integrated circuits and derived activities and the transfer of microelectronic circuits or microsystems on all media and derived activities; research for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, transistors, diodes, photodiodes, light-emitting diodes and photodiode detectors; technical support and assistance services, namely, technological advice for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, transistors, diodes, photodiodes, light-emitting diodes and photodiode detectors [ developing photovoltaic applications; developing photovoltaic systems and units; developing solar power stations; design and development of lighting apparatus ]

Produits et services

[ Silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, for flat screens, for integrated optical wave guides, for sensors, for imaging devices, and for micro-machining; semiconductor wafers for micro-electronics, for flat screens, for integrated optical wave guides for sensors, for imaging devices, and for micro-machining; silicon wafers, silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, opto-electronics, photovoltaics and micro-mechanical engineering ] Processing of base materials for microelectronics, optoelectronics, photovoltaics and micromechanics and all derived activities, namely, silicon wafer bonding treatment, silicon wafer thinning treatment, silicon wafer edge removal treatment, silicon wafer etching treatment and integrated circuits etching treatment of semiconductor silicon wafers for micro-electronics, opto-electronics, photovoltaics and micro-mechanical engineering; processing of wafers of microelectronic components through bonding, for stacked microelectronic structures, namely, treatment of components of silicon wafers for micro-electronics by bonding in order to form stacked micro-electronics structures [ Research and development of new products for others; research for others in the field of microelectronics; ] engineering services; technical consulting in the field of microelectronics; material testing; [ laboratory research in the field of micro-electronics ]

Produits et services

[ NON-METALLIC SILICON SUBSTRATES SOLD IN INGOTS OR SLICES FOR THE MANUFACTURE OF SEMICONDUCTORS, INTEGRATED CIRCUITS, AND SENSORS ] SILICON WAFERS; SEMICONDUCTORS; SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; COMPONENTS FOR MICROELECTRONIC PURPOSES AND MICRO-MECHANIC PURPOSES, NAMELY, SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; MATERIAL SUBSTRATES FOR MICROELECTRONICS AND MICRO-MECHANICS, NAMELY, ELECTRO-OPTICAL FILM OR SEMICONDUCTORS SUBSTRATES FOR USE IN THE MANUFACTURE OF FLAT PANEL DISPLAYS, INTEGRATED OPTICAL WAVE GUIDES, SENSORS, INTEGRATED CIRCUITS CARDS AND SMART CARDS AND MAGNETIC IDENTITY CARDS; CONDUCTOR SILICON WAFERS FOR MICRO-MACHINING APPLICATIONS SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, ION IMPLANTATION, CHEMICAL TREATMENT, SPLITTING AND ALL TREATMENT USED IN THE SEMICONDUCTOR INDUSTRY SCIENTIFIC, TECHNOLOGICAL, TECHNICAL AND INDUSTRIAL RESEARCH IN THE FIELD OF MICROELECTRONICS; MATERIAL TESTING SERVICES FOR OTHERS LABORATORY RESEARCH IN THE FIELD OF MICROELECTRONICS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS; ENGINEERING AND SURVEYING IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS

Produits et services

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF MECHANICAL, PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, IONS, IMPLANTATION, CHEMICAL TREATMENT, CHEMICAL-MECHANICAL-POLISHING TREATMENT AND ALL TREATMENTS USED IN THE SEMICONDUCTOR INDUSTRY

Produits et services

[ SCIENTIFIC, LABORATORY AND INDUSTRIAL RESEARCH SERVICES, CONSULTING SERVICES, ] ENGINEERING SERVICES, [ EVALUATION AND TESTING SERVICES, ] ALL IN THE FIELDS OF MANUFACTURE OF INTEGRATED CIRCUITS AND SILICON WAFERS AND MICROELECTRONICS COMPONENTS USED FOR THE MANUFACTURE OF INTEGRATED CIRCUITS