- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
Patent holdings for IPC class H01L 23/532
Total number of patents in this class: 8788
10-year publication summary
|
918
|
937
|
918
|
902
|
772
|
762
|
788
|
717
|
706
|
21
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46344 |
2112 |
| Samsung Electronics Co., Ltd. | 150129 |
626 |
| International Business Machines Corporation | 61843 |
625 |
| Intel Corporation | 46508 |
410 |
| Micron Technology, Inc. | 26743 |
289 |
| Nanya Technology Corporation | 2701 |
279 |
| GLOBALFOUNDRIES U.S. Inc. | 6415 |
219 |
| Applied Materials, Inc. | 19431 |
195 |
| Kioxia Corporation | 10489 |
178 |
| United Microelectronics Corp. | 4342 |
143 |
| Tokyo Electron Limited | 13235 |
128 |
| Texas Instruments Incorporated | 19516 |
118 |
| Renesas Electronics Corporation | 5916 |
112 |
| SK Hynix Inc. | 11762 |
106 |
| Infineon Technologies AG | 8291 |
98 |
| Sandisk Technologies Inc. | 5154 |
88 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1747 |
84 |
| Rohm Co., Ltd. | 6609 |
78 |
| Adeia Semiconductor Solutions LLC | 293 |
78 |
| Changxin Memory Technologies, Inc. | 4926 |
73 |
| Other owners | 2749 |