- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
Patent holdings for IPC class H01L 23/532
Total number of patents in this class: 8734
10-year publication summary
|
862
|
918
|
937
|
918
|
902
|
772
|
762
|
786
|
715
|
677
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
2108 |
| International Business Machines Corporation | 61721 |
620 |
| Samsung Electronics Co., Ltd. | 149087 |
618 |
| Intel Corporation | 46460 |
406 |
| Micron Technology, Inc. | 26558 |
283 |
| Nanya Technology Corporation | 2660 |
273 |
| GLOBALFOUNDRIES U.S. Inc. | 6418 |
219 |
| Applied Materials, Inc. | 19248 |
193 |
| Kioxia Corporation | 10452 |
178 |
| United Microelectronics Corp. | 4307 |
140 |
| Tokyo Electron Limited | 13136 |
126 |
| Texas Instruments Incorporated | 19495 |
117 |
| Renesas Electronics Corporation | 5928 |
112 |
| SK Hynix Inc. | 11676 |
105 |
| Infineon Technologies AG | 8287 |
97 |
| Sandisk Technologies Inc. | 5030 |
85 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1750 |
84 |
| Rohm Co., Ltd. | 6560 |
78 |
| Adeia Semiconductor Solutions LLC | 292 |
78 |
| Changxin Memory Technologies, Inc. | 4928 |
73 |
| Other owners | 2741 |