- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
Patent holdings for IPC class H01L 23/52
Total number of patents in this class: 5144
10-year publication summary
|
333
|
340
|
295
|
274
|
265
|
163
|
127
|
100
|
67
|
26
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 45590 |
571 |
| Samsung Electronics Co., Ltd. | 148765 |
303 |
| Micron Technology, Inc. | 26461 |
178 |
| Renesas Electronics Corporation | 5939 |
141 |
| STATS ChipPAC Pte. Lte. | 1548 |
125 |
| Intel Corporation | 46455 |
123 |
| Infineon Technologies AG | 8277 |
122 |
| Panasonic Corporation | 19976 |
113 |
| International Business Machines Corporation | 61738 |
107 |
| GLOBALFOUNDRIES U.S. Inc. | 6417 |
102 |
| Texas Instruments Incorporated | 19484 |
83 |
| Kioxia Corporation | 10452 |
75 |
| SK Hynix Inc. | 11629 |
66 |
| Advanced Semiconductor Engineering, Inc. | 1673 |
57 |
| Qualcomm Incorporated | 87362 |
56 |
| Tokyo Electron Limited | 13083 |
52 |
| Tahoe Research, Ltd. | 2188 |
48 |
| Amkor Technology Singapore Holding Pte.ltd. | 500 |
47 |
| Rohm Co., Ltd. | 6544 |
42 |
| Invensas Corporation | 613 |
42 |
| Other owners | 2691 |