STATS ChipPAC Pte. Lte.

Singapore

Create a watch for STATS ChipPAC Pte. Lte.
Total IP 974
Total IP Rank # 1,445
IP Activity Score 3.3/5.0    328
IP Activity Rank # 2,214
Parent Entity JCET-SC (Singapore) Pte. Ltd

Patents

Trademarks

974 0
0 0
0 0
0
 
Last Patent 2026 - Semiconductor device and method ...
First Patent 1998 - Method of forming extended lead ...

Latest Inventions, Goods, Services

2026 Invention Semiconductor device and method of forming channels in encapsulant to reduce warpage in reconstit...
Invention Semiconductor device and method of making a semiconductor package with graphene for die attach. ...
Invention Method for making semiconductor packages. The present application relates to a method for making...
Invention Semiconductor device and method of forming high crystal quality magnetic layer for shielding of l...
Invention Methods for making semiconductor devices. A method for making semiconductor devices includes: at...
Invention Semiconductor device and method of partial shielding with embedded graphene core shells. A semic...
Invention Semiconductor device and method of forming inverted ewlb package with vertical e-bar structure. ...
Invention Semiconductor device and method for making the same. A method for making a semiconductor device ...
Invention Semiconductor device and method of making a semiconductor package with graphene-coated interconne...
Invention Method for making semiconductor device. A method for making a semiconductor device is provided. ...
Invention Selective stencil mask and a stencil printing method. A selective stencil mask and a stencil pri...
Invention Semiconductor device and method of forming module-in-package structure using redistribution layer...
Invention Semiconductor device and method of forming graphene core shell embedded within shielding layer. ...
Invention Semiconductor device and method of forming dummy vias in wlp. A semiconductor device has a semic...
2025 Invention Method for forming stencil mask. A method for forming a stencil mask is provided. The method inc...
Invention Semiconductor device and methods of making and using thermally advanced semiconductor packages. ...
Invention Semiconductor device and method of forming double-sided rectifying antenna on power module. A se...
Invention Semiconductor device and method of making an interconnect bridge with integrated passive devices....
Invention Semiconductor package assembly with direct water cooling system. A semiconductor package assembl...
Invention Method for forming an interconnect device and a method for forming a semiconductor package assemb...
Invention Semiconductor device and method of forming embedded magnetic shielding. A semiconductor device h...
Invention Semiconductor device and method of stacking hybrid substrates with embedded electric components. ...
Invention Semiconductor device and method of forming sip module absent substrate. A semiconductor device h...
Invention Semiconductor device and method for reducing metal burrs using laser grooving. A semiconductor d...
Invention Semiconductor device and method of forming selective emi shielding with slotted substrate. A sem...
Invention Semiconductor device and method of forming emi shielding material in two-step process to avoid co...
Invention Semiconductor package and method for making the same. A method for making semiconductor package,...
Invention Semiconductor device and method for partial emi shielding. A semiconductor device includes a sub...
Invention Method for grinding a wafer. A method for grinding a wafer is provided. The method comprises: pr...
Invention Semiconductor package assmebly and method for forming the same. A semiconductor package assembly...
Invention Method and an apparatus for forming an electronic device. A method and an apparatus for forming ...
Invention Laser assisted bonding device and method for large area bonding. A laser assisted bonding device...
Invention Semiconductor package assembly with dual heat sink plates. A semiconductor package assembly comp...
Invention Bonding apparatus and a bonding method. A bonding apparatus and a bonding method are provided. T...
Invention Semiconductor device and method of making using a die and pillar first approach. A semiconductor...
Invention Semiconductor device and method of forming fan-out wafer level cpo with through mold conductive v...
Invention Semiconductor device and method of forming fan-out wafer level cpo with through silicon conductiv...
Invention Semiconductor device and method of forming stacked encapsulated conductive pillar layers as verti...
Invention Semiconductor device and method of making a solder wall for photonics protection. A semiconducto...
Invention Semiconductor device and method of making using ultraviolet light for photonics protection. A se...
Invention Semiconductor device and method of controlling underfill overflow. A semiconductor device has a ...
Invention Semiconductor device and method of forming semiconductor die with less back surface scratching. ...
Invention Semiconductor manufacturing system and method to improve wafer reconstitution and reduce wafer th...
2024 Invention Semiconductor device and method of forming openings in blank area to reduce wafer warpage. A sem...
Invention Semiconductor device and method using an emi-absorbing metal bar. A semiconductor device has a s...
Invention Semiconductor device and method of making a peripheral wall structure in fan-out redistribution l...
Invention Semiconductor device and method of making a chip-scale package. A semiconductor device has a sem...
Invention Semiconductor device and method of making a fan-out quilt package. A semiconductor device has a ...
Invention Semiconductor device and method of making a double-sided co-packaged optics module. A semiconduc...
Invention Semiconductor device and method of forming heat spreader with surface plasma treatment for fcbga-...