- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/784 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being a semiconductor body
Patent holdings for IPC class H01L 21/784
Total number of patents in this class: 139
10-year publication summary
7
|
13
|
5
|
15
|
9
|
7
|
8
|
19
|
12
|
3
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 42704 |
20 |
Infineon Technologies AG | 8221 |
8 |
Toshiba Corporation | 12336 |
6 |
Texas Instruments Incorporated | 19470 |
6 |
Denso Corporation | 24282 |
6 |
Toshiba Electronic Devices & Storage Corporation | 1966 |
6 |
Toyota Motor Corporation | 32116 |
5 |
Semiconductor Components Industries, L.L.C. | 5251 |
5 |
MIRISE Technologies Corporation | 298 |
5 |
Infineon Technologies Austria AG | 2145 |
4 |
United Microelectronics Corp. | 4268 |
4 |
Samsung Electronics Co., Ltd. | 146092 |
3 |
Intel Corporation | 46962 |
3 |
Rohm Co., Ltd. | 6450 |
3 |
Hamamatsu Photonics K.K. | 4417 |
3 |
Disco Corporation | 1858 |
3 |
STATS ChipPAC Pte. Lte. | 1553 |
3 |
Xintec Inc. | 272 |
3 |
Murata Manufacturing Co., Ltd. | 24526 |
2 |
Epistar Corporation | 1489 |
2 |
Other owners | 39 |