• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/784 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being a semiconductor body

Patent holdings for IPC class H01L 21/784

Total number of patents in this class: 139

10-year publication summary

7
13
5
15
9
7
8
19
12
3
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
42704
20
Infineon Technologies AG
8221
8
Toshiba Corporation
12336
6
Texas Instruments Incorporated
19470
6
Denso Corporation
24282
6
Toshiba Electronic Devices & Storage Corporation
1966
6
Toyota Motor Corporation
32116
5
Semiconductor Components Industries, L.L.C.
5251
5
MIRISE Technologies Corporation
298
5
Infineon Technologies Austria AG
2145
4
United Microelectronics Corp.
4268
4
Samsung Electronics Co., Ltd.
146092
3
Intel Corporation
46962
3
Rohm Co., Ltd.
6450
3
Hamamatsu Photonics K.K.
4417
3
Disco Corporation
1858
3
STATS ChipPAC Pte. Lte.
1553
3
Xintec Inc.
272
3
Murata Manufacturing Co., Ltd.
24526
2
Epistar Corporation
1489
2
Other owners 39