- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 5794
10-year publication summary
622
|
687
|
604
|
561
|
585
|
568
|
443
|
386
|
343
|
244
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 43015 |
689 |
Disco Corporation | 1868 |
501 |
Semiconductor Components Industries, L.L.C. | 5259 |
229 |
Infineon Technologies AG | 8235 |
223 |
Samsung Electronics Co., Ltd. | 147003 |
194 |
Micron Technology, Inc. | 26251 |
170 |
Texas Instruments Incorporated | 19456 |
164 |
Applied Materials, Inc. | 18759 |
158 |
Intel Corporation | 47051 |
82 |
Panasonic Intellectual Property Management Co., Ltd. | 31598 |
67 |
Renesas Electronics Corporation | 6001 |
56 |
Kioxia Corporation | 10323 |
56 |
STATS ChipPAC Pte. Lte. | 1558 |
52 |
NXP USA, Inc. | 4306 |
47 |
Hamamatsu Photonics K.K. | 4426 |
45 |
Plasma-therm, LLC | 83 |
45 |
Advanced Semiconductor Engineering, Inc. | 1660 |
44 |
Infineon Technologies Austria AG | 2156 |
41 |
Mitsubishi Electric Corporation | 46249 |
40 |
Rohm Co., Ltd. | 6468 |
39 |
Other owners | 2852 |