- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 5852
10-year publication summary
621
|
687
|
604
|
561
|
585
|
568
|
443
|
390
|
343
|
295
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 44095 |
700 |
Disco Corporation | 1876 |
501 |
Semiconductor Components Industries, L.L.C. | 5283 |
232 |
Infineon Technologies AG | 8265 |
223 |
Samsung Electronics Co., Ltd. | 148077 |
196 |
Micron Technology, Inc. | 26279 |
170 |
Texas Instruments Incorporated | 19450 |
166 |
Applied Materials, Inc. | 19005 |
158 |
Intel Corporation | 46921 |
82 |
Panasonic Intellectual Property Management Co., Ltd. | 32095 |
67 |
Renesas Electronics Corporation | 5964 |
57 |
Kioxia Corporation | 10441 |
55 |
STATS ChipPAC Pte. Lte. | 1551 |
52 |
NXP USA, Inc. | 4323 |
47 |
Hamamatsu Photonics K.K. | 4462 |
46 |
Plasma-therm, LLC | 82 |
45 |
Advanced Semiconductor Engineering, Inc. | 1672 |
44 |
Infineon Technologies Austria AG | 2192 |
41 |
Mitsubishi Electric Corporation | 46618 |
40 |
Xintec Inc. | 274 |
40 |
Other owners | 2890 |