- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Patent holdings for IPC class H01L 21/78
Total number of patents in this class: 6066
10-year publication summary
|
687
|
604
|
561
|
585
|
570
|
447
|
401
|
348
|
377
|
114
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47211 |
734 |
| Disco Corporation | 1929 |
515 |
| Semiconductor Components Industries, L.L.C. | 5262 |
237 |
| Infineon Technologies AG | 8383 |
228 |
| Samsung Electronics Co., Ltd. | 153573 |
211 |
| Micron Technology, Inc. | 27266 |
178 |
| Texas Instruments Incorporated | 19615 |
176 |
| Applied Materials, Inc. | 19999 |
160 |
| Intel Corporation | 46638 |
78 |
| Panasonic Intellectual Property Management Co., Ltd. | 33462 |
70 |
| Renesas Electronics Corporation | 5871 |
58 |
| Kioxia Corporation | 10706 |
55 |
| NXP USA, Inc. | 4421 |
49 |
| Hamamatsu Photonics K.K. | 4595 |
48 |
| Plasma-therm, LLC | 82 |
45 |
| Advanced Semiconductor Engineering, Inc. | 1701 |
44 |
| Infineon Technologies Austria AG | 2291 |
43 |
| Mitsubishi Electric Corporation | 47556 |
41 |
| Rohm Co., Ltd. | 6740 |
40 |
| Xintec Inc. | 276 |
40 |
| Other owners | 3016 |