- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 21/56
Total number of patents in this class: 15460
10-year publication summary
|
1288
|
1427
|
1440
|
1445
|
1571
|
1421
|
1283
|
1266
|
1443
|
915
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43854 |
3223 |
| Samsung Electronics Co., Ltd. | 147983 |
724 |
| Intel Corporation | 47239 |
544 |
| Texas Instruments Incorporated | 19456 |
497 |
| Infineon Technologies AG | 8257 |
438 |
| STATS ChipPAC Pte. Lte. | 1553 |
428 |
| Advanced Semiconductor Engineering, Inc. | 1670 |
379 |
| Micron Technology, Inc. | 26255 |
291 |
| Amkor Technology Singapore Holding Pte. Ltd | 421 |
245 |
| Siliconware Precision Industries Co., Ltd. | 610 |
233 |
| Semiconductor Components Industries, L.L.C. | 5275 |
223 |
| NXP USA, Inc. | 4318 |
188 |
| Mitsubishi Electric Corporation | 46590 |
177 |
| Rohm Co., Ltd. | 6511 |
166 |
| Qualcomm Incorporated | 86867 |
155 |
| Renesas Electronics Corporation | 5969 |
154 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 361 |
127 |
| Murata Manufacturing Co., Ltd. | 24829 |
122 |
| Amkor Technology Singapore Holding Pte.ltd. | 504 |
118 |
| International Business Machines Corporation | 61596 |
117 |
| Other owners | 6911 |