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2026
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Invention
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Semiconductor package and method for forming the same.
A semiconductor package and a method for ... |
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Invention
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Electronic device and a method for making the same.
An electronic device and a method for formin... |
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Invention
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Thermal compression bonding method and a compression head for performing such method.
Provided i... |
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2025
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Invention
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Semiconductor device and method for forming the same.
A semiconductor device and a method for fo... |
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Invention
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Laser compression bonding device and method.
A laser compression bonding method comprises: placi... |
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Invention
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Semiconductor package assembly with a water cooling system.
A semiconductor package assembly, co... |
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Invention
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Semiconductor package and a method for forming the same.
A method for forming a semiconductor pa... |
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Invention
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Laser compression bonding device.
A laser compression bonding device comprises: a carrier for pl... |
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Invention
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Bonding apparatus and a bonding method implemented by the same.
A bonding apparatus and a bondin... |
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Invention
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Semiconductor device and method of making a vertical rigid-flex co-packaged optics module.
A sem... |
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Invention
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Semiconductor device and method of making a rigid-flex co-packaged optics module with housing.
A... |
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Invention
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Semiconductor device and method of making ipd structure on glass substrate.
A semiconductor devi... |
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Invention
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Semiconductor device and method of making high profile and heavy modules.
A semiconductor device... |
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Invention
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Semiconductor device and method of making a molded interposer with an embedded bridge module.
A ... |
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2024
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Invention
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Semiconductor package and method of manufacturing the same.
A semiconductor package and a method... |
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Invention
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Semiconductor device and method of forming power ic as pmic with magnetic core.
A semiconductor ... |
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Invention
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Semiconductor devices and methods of making bridge modules and chiplet structures having the brid... |
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G/S
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Custom assembly and custom manufacture of electrical and
electronic components, electrical semi-... |
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Invention
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Semiconductor package.
A semiconductor package that includes an upper package including a first ... |
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Invention
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Semiconductor package including a stiffener.
A semiconductor package including a first redistrib... |
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G/S
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Custom assembly and custom manufacture of electrical and electronic components, electrical semi-c... |
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Invention
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Semiconductor device with partial emi shielding removal using laser ablation. A semiconductor dev... |
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2023
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Invention
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Semiconductor device and method of forming semiconductor package with rf antenna interposer havin... |
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Invention
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Semiconductor device and method of forming a slot in emi shielding with improved removal depth. A... |
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Invention
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Semiconductor device and method of forming hybrid tim layers. A semiconductor device has an elect... |
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Invention
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Semiconductor device and method of integrating rf antenna interposer with semiconductor package. ... |
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Invention
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Semiconductor device and method of forming discrete antenna modules. A semiconductor device has a... |
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Invention
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Semiconductor device and method of controlling warpage during lab. A semiconductor device has a s... |
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Invention
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Method and device for reducing metal burrs when sawing semiconductor packages. A semiconductor de... |
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Invention
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Thermally enhanced fcbga package. A semiconductor device has a heat spreader with an opening form... |
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Invention
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Selective emi shielding using preformed mask. A semiconductor package has a substrate, a first co... |
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Invention
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Selective emi shielding using preformed mask with fang design. A semiconductor device has a semic... |
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Invention
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Laser-based redistribution and multi-stacked packages. A semiconductor device has a first package... |
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Invention
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Molded laser package with electromagnetic interference shield and method of making. A semiconduct... |
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Invention
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Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip m... |
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2022
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Invention
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Semiconductor device and method for advanced thermal dissipation. A semiconductor device has a su... |
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Invention
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Semiconductor device and method using an emi-absorbing metal bar. A semiconductor device has a su... |
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Invention
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Semiconductor device and method using tape attachment. A semiconductor device has a first semicon... |
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Invention
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Semiconductor device with compartment shield formed from metal bars and manufacturing method ther... |
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2021
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Invention
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Semiconductor manufacturing equipment and method of providing support base with filling material ... |
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Invention
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Antenna-in-package devices and methods of making. A semiconductor device has a PCB with an antenn... |
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Invention
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Semiconductor device and method of making a photonic semiconductor package. A semiconductor devic... |
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Invention
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Package with compartmentalized lid for heat spreader and emi shield. A semiconductor device has a... |
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Invention
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Package with windowed heat spreader. A semiconductor device has a substrate and a first semicondu... |
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Invention
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Double-sided partial molded sip module. A semiconductor device has a substrate and a first compon... |
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Invention
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Compartment shielding with metal frame and cap. A semiconductor device has a substrate and a firs... |
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Invention
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Semiconductor device and method of stacking devices using support frame. A semiconductor device h... |
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2011
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G/S
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assembly and custom manufacture of electrical and electronic components, electrical semi-conducto... |
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2008
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G/S
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Assembly and custom manufacture of electrical and electronic components, electrical semi-conducto... |
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G/S
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Manufacturing and assembly for others of packaging for integrated circuits. Engineering, design a... |
