- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
Patent holdings for IPC class H01L 21/50
Total number of patents in this class: 2124
10-year publication summary
|
136
|
101
|
105
|
105
|
123
|
136
|
127
|
110
|
121
|
56
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42945 |
147 |
| STATS ChipPAC Pte. Lte. | 1554 |
94 |
| Texas Instruments Incorporated | 19443 |
75 |
| Intel Corporation | 47033 |
73 |
| Micron Technology, Inc. | 26264 |
70 |
| Infineon Technologies AG | 8224 |
64 |
| Samsung Electronics Co., Ltd. | 146811 |
45 |
| Advanced Semiconductor Engineering, Inc. | 1657 |
44 |
| International Business Machines Corporation | 61305 |
35 |
| Renesas Electronics Corporation | 6006 |
29 |
| Mitsubishi Electric Corporation | 46197 |
21 |
| Semiconductor Components Industries, L.L.C. | 5255 |
21 |
| SJ Semiconductor (Jiangyin) Corporation | 147 |
21 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 362 |
20 |
| Texas Instruments Japan, Ltd. | 1656 |
18 |
| Kioxia Corporation | 10314 |
18 |
| Applied Materials, Inc. | 18746 |
17 |
| Shinko Electric Industries Co., Ltd. | 1209 |
17 |
| Huawei Technologies Co., Ltd. | 113064 |
15 |
| Shenzhen Xinguodu Technology Co., Ltd. | 2229 |
14 |
| Other owners | 1266 |