- All sections
- C - Chemistrymetallurgy
- C25D - Processes for the electrolytic or electrophoretic production of coatingselectroformingjoining workpieces by electrolysisapparatus therefor
- C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
Patent holdings for IPC class C25D 3/38
Total number of patents in this class: 1381
10-year publication summary
|
116
|
121
|
128
|
110
|
109
|
111
|
130
|
137
|
94
|
25
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Atotech Deutschland GmbH | 528 |
56 |
| BASF SE | 21165 |
55 |
| DuPont Electronic Materials International, LLC | 423 |
48 |
| JX Nippon Mining & Metals Corporation | 1463 |
46 |
| Lam Research Corporation | 5560 |
44 |
| MacDermid Enthone Inc. | 246 |
42 |
| SK Nexilis Co., Ltd. | 86 |
41 |
| Applied Materials, Inc. | 20145 |
24 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47734 |
24 |
| Novellus Systems, Inc. | 458 |
21 |
| Chang Chun Petrochemical Co., Ltd. | 120 |
20 |
| Lotte Energy Materials Corporation | 56 |
17 |
| Suzhou Shinhao Materials LLC | 14 |
14 |
| Atotech Deutschland GmbH & Co. KG | 387 |
14 |
| Toyota Motor Corporation | 34999 |
12 |
| Ebara Corporation | 2278 |
12 |
| The Furukawa Electric Co., Ltd. | 3700 |
12 |
| C. Uyemura & Co., Ltd. | 162 |
12 |
| Mitsubishi Materials Corporation | 2465 |
12 |
| Jcu Corporation | 104 |
11 |
| Other owners | 844 |