- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
Patent holdings for IPC class B23K 26/0622
Total number of patents in this class: 1905
10-year publication summary
|
156
|
169
|
189
|
186
|
211
|
233
|
190
|
163
|
161
|
46
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1934 |
79 |
| TRUMPF Laser- und Systemtechnik GmbH | 526 |
77 |
| Corning Incorporated | 10421 |
69 |
| SCHOTT AG | 1735 |
44 |
| Hamamatsu Photonics K.K. | 4613 |
31 |
| Applied Materials, Inc. | 20085 |
29 |
| Samsung Display Co., Ltd. | 37960 |
27 |
| Lawrence Livermore National Security, LLC | 1961 |
24 |
| Electro Scientific Industries, Inc. | 360 |
20 |
| Centre National de La Recherche Scientifique | 10886 |
18 |
| 4JET Microtech GmbH | 53 |
18 |
| Siltectra GmbH | 90 |
17 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6116 |
17 |
| IPG Photonics Corporation | 579 |
16 |
| Gigaphoton Inc. | 1308 |
15 |
| Robert Bosch GmbH | 43646 |
13 |
| Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. | 5180 |
13 |
| TRUMPF Laser GmbH | 158 |
13 |
| Coherent, Inc. | 300 |
12 |
| Panasonic Intellectual Property Management Co., Ltd. | 33634 |
11 |
| Other owners | 1342 |