Namics Corporation

Japon


 
Quantité totale PI 431
Quantité totale incluant filiales 437 (+ 6 pour les filiales)
Rang # Quantité totale PI 2 996
Note d'activité PI 3,2/5.0    270
Rang # Activité PI 2 643
Classe Nice dominante Produits en caoutchouc ou en mat...

Brevets

Marques

101 17
0 3
293 11
6
 
Dernier brevet 2025 - Resin composition and curable re...
Premier brevet 1996 - Conductive adhesive and circuit ...
Dernière marque 2021 - KINOMEC
Première marque 1998 - NAMICS

Filiales

1 subsidiaries with IP (6 patents, 0 trademarks)

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Resin composition, cured product, adhesive composition, and optical fiber array. The present inve...
Invention Resin composition, cured product, and optical fiber array. Provided is a resin composition for an...
Invention Resin composition, cured product, and optical fiber array. This invention provides a resin compos...
Invention Optical fiber array, optical waveguide module, method for reducing refractive index of adhesive l...
Invention Method for producing hybrid quantum dot, hybrid quantum dot, energy storage device, energy genera...
Invention Photocurable resin composition, adhesive, sealing material, coating agent, cured product, semicon...
Invention Liquid epoxy resin composition for use as mold underfill material for tsv. An object of the pres...
Invention Epoxy resin composition, adhesive agent, sealing material, cured article, semiconductor device, a...
Invention Epoxy resin composition, adhesive, sealing material, cured product, semiconductor device, and ele...
Invention Electrically conductive paste, use of electrically conductive paste, solar cell, and method for p...
Invention Novel acrylamide, composition containing same, curable composition, adhesive, sealing material, c...
Invention Metal member. The purpose of the present invention is to provide a novel metal member. A metal me...
Invention Metal member. The objective of the present invention is to provide a novel metal member. A metal ...
Invention Liquid compression molding material, electronic component, semiconductor device, and method for m...
Invention Liquid compression molding material, electronic component, and semiconductor device. The present ...
Invention Semiconductor device and resin composition. Provided are: a semiconductor device comprising an in...
Invention Resin composition, and inter-layer insulating adhesive film, laminated circuit board, electronic ...
2023 Invention Electrically conductive paste, solar cell and method for producing solar cell. The present invent...
Invention Resin composition, adhesive, sealing material, die attachment material, cured product and electro...
Invention Insulative resin composition, cured product of same, and electronic component. The present invent...
Invention Resin composition, adhesive, sealing material, cured product, semiconductor device, and electroni...
Invention Epoxy resin composition, electronic component, semiconductor device, and semiconductor device man...
Invention Resin composition, cured product, camera module, and electronic device. The purpose of the presen...
Invention Electroconductive paste, electrode, electronic component, and electronic appliance. An electrocon...
Invention Conductive composition, sintered compact thereof, laminated structure, electronic part, and semic...
Invention Solar cell. Provided is a highly efficient crystalline silicon solar cell which has a high open-c...
Invention Resin composition, cured product of resin composition, semiconductor device, and electronic compo...
Invention Curable resin composition, adhesive, sealing material, cured product, semiconductor apparatus, an...
Invention Curable resin composition, adhesive, sealing material, cured product, semiconductor device, and e...
Invention Epoxy resin composition, cured product, and semiconductor device. Provided are: an epoxy resin co...
Invention Epoxy resin composition, electronic component mounting structure, and method for producing electr...
Invention Conductive paste, electrode, electronic component, and electronic device. Provided is a conductiv...
Invention Resin composition, adhesive film, bonding sheet for interlayer adhesion, and resin composition fo...
Invention Epoxy resin composition, semiconductor device, and method for producing semiconductor device. Pro...
Invention Epoxy resin composition, semiconductor device, and method for producing semiconductor device. The...
Invention Conductive paste, electrode, electronic component, and electronic device. This conductive paste c...
Invention Resin composition and curable resin composition using the same. A resin composition includes (A)...
2022 Invention Resin composition, adhesive, sealant, cured product, semiconductor device and electronic componen...
Invention Resin composition, adhesive, sealant, cured product and semiconductor device. The object of the p...
Invention Resin composition, semiconductor device, and method for producing semiconductor device. Provided...
Invention Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor d...
Invention Epoxy resin composition, semiconductor device, and method of producing semiconductor device. To ...
Invention Method for manufacturing laminate. The present invention is directed to provide novel methods fo...
Invention Resin composition, electrically conductive adhesive, cured object, and semiconductor device. The...
Invention Conductive composition, conductive paste, electric circuit, flexible electric circuit body and me...
2021 Invention Alumina composite sol composition, method for producing the same, and method for producing an alu...
P/S Chemicals; industrial chemicals; soldering pastes (chemicals); chemicals in paste form used in m...
P/S Industrial chemicals; chemicals in paste form used in manufacturing electronic circuits; chemical...
Invention Laminate for wiring board. The present invention is directed to provide novel laminates for wiri...
2012 P/S Chemicals for use in the copper industry, namely, surface preparation agents for copper foil [us...
P/S Surface preparation agents for copper foil used for manufacturing copper clad laminates; surface...
P/S Chemicals; chemicals (industrial); adhesives for industrial purposes; conductive adhesives for i...
2011 P/S Electric conductors, namely, conductive pastes for industrial purposes; electric conductors, name...
P/S Chemicals for use in industry; industrial chemicals; adhesives for industrial purposes; industria...
P/S Insulating liquid sealants, namely underfill sealants, encapsulant sealants, chip resistor protec...
P/S Chemicals; chemicals (industrial); adhesives for industrial purposes; conductive pastes for indus...
2005 P/S Adhesives for semiconductors; adhesives, other than for stationery or household purposes Electric...
P/S Adhesives for semiconductors; adhesives (not for stationery or household purposes). Conductive t...
P/S Conductive pastes for use with electronic components. Conductive paste for use with electronic co...
P/S Conductive pastes for use with electronic components. Conductive films, tapes and sheets, namely,...
P/S Conductive pastes for use in the manufacture of electronic components, namely, chip resisters, ch...
P/S Conductive pastes.
P/S Conductive pastes for use in the electrodes and circuits of various electronic parts and the inte...
P/S Conductive substances (chemicals); conductive materials (chemicals); chemical preparations having...
2004 P/S Paints for use in protecting the surfaces of electric and electronic parts
P/S Paints [ Precious metals ]
P/S Paints. Electrical insulating materials.
P/S Electrical insulating materials
P/S Paints Electrical insulating materials
P/S Paints. Precious metals.
2001 P/S Insulating paints for use in the manufacture of electrical components; insulating and protective ...
P/S Insulating paints; insulating and protective coating for semi-conductor; wire insulating tube; el...
2000 P/S EPOXY COMPOUNDS FOR UNDERFILLING AND/OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; EPOXY [ AND ...
P/S Electric insulating materials.
1998 P/S ADHESIVES AND CONDUCTIVE PASTES AND POWDERS FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVIC...
P/S Paints, pastes and powders for industrial purposes, especially epoxy/phenolic resin coating mater...