Namics Corporation

Japon


Commandez votre montre hebdomadaire Namics Corporation
Quantité totale PI 449
Quantité totale incluant filiales 455 (+ 6 pour les filiales)
Rang # Quantité totale PI 2 924
Note d'activité PI 3,2/5.0    282
Rang # Activité PI 2 509
Classe Nice dominante Produits en caoutchouc ou en mat...

Brevets

Marques

102 17
0 3
310 11
6
 
Dernier brevet 2025 - Conductive paste and solar cell
Premier brevet 1996 - Conductive adhesive and circuit ...
Dernière marque 2021 - KINOMEC
Première marque 1998 - NAMICS

Filiales

1 subsidiaries with IP (6 patents, 0 trademarks)

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 Invention Conductive paste and solar cell. The present invention provides a conductive paste capable of for...
Invention Insulating composition. R120R120 obtained by measuring solid content in the insulating compositio...
Invention Resin composition, adhesive agent, sealing material, cured product, semiconductor device, and ele...
Invention Resin composition, adhesive, sealing material, cured product, semiconductor device, and electroni...
Invention Thermal latent polymerization initiator, resin composition containing same, adhesive, sealing mat...
Invention Film for adhesive layer, wiring board, multilayer wiring board, and semiconductor device. Provide...
Invention Thermosetting insulating film and multilayer insulating sheet. The present invention provides: a ...
Invention Conductive paste, conductor, contact sensor, and electronic component. 11) of a shape when an ele...
2024 Invention Conductive paste, conductive film, ceramic circuit substrate, and electronic component. Provided ...
Invention Curable resin composition and method for producing same, adhesive, sealing material, cured produc...
Invention Epoxy resin composition, cured product, and semiconductor device. The present invention provides ...
Invention Copper member. A copper member, comprising a copper material and a protrusion formed on the surfa...
Invention Conductive paste and multilayer ceramic electronic component comprising external electrode formed...
Invention Method for manufacturing semiconductor device, and sealed body. CSCSCSS: the radius of the suppor...
Invention Resin composition, cured product, adhesive composition, and optical fiber array. The present inve...
Invention Resin composition, cured product, and optical fiber array. Provided is a resin composition for an...
Invention Resin composition, cured product, and optical fiber array. This invention provides a resin compos...
Invention Optical fiber array, optical waveguide module, method for reducing refractive index of adhesive l...
Invention Multilayer sheet and method for producing laminate. This invention prevents the occurrence of pee...
Invention Adhesive film, semiconductor device, and method for manufacturing semiconductor device. This inve...
Invention Method for producing hybrid quantum dot, hybrid quantum dot, energy storage device, energy genera...
Invention Photocurable resin composition, adhesive, sealing material, coating agent, cured product, semicon...
Invention Liquid epoxy resin composition for use as mold underfill material for tsv. An object of the pres...
Invention Epoxy resin composition, adhesive agent, sealing material, cured article, semiconductor device, a...
Invention Epoxy resin composition, adhesive, sealing material, cured product, semiconductor device, and ele...
Invention Electrically conductive paste, use of electrically conductive paste, solar cell, and method for p...
Invention Novel acrylamide, composition containing same, curable composition, adhesive, sealing material, c...
Invention Metal member. The purpose of the present invention is to provide a novel metal member. A metal me...
Invention Metal member. The objective of the present invention is to provide a novel metal member. A metal ...
Invention Liquid compression molding material, electronic component, semiconductor device, and method for m...
Invention Liquid compression molding material, electronic component, and semiconductor device. The present ...
Invention Semiconductor device and resin composition. Provided are: a semiconductor device comprising an in...
Invention Resin composition, and inter-layer insulating adhesive film, laminated circuit board, electronic ...
2023 Invention Resin composition, adhesive, sealing material, die attachment material, cured product and electro...
Invention Insulative resin composition, cured product of same, and electronic component. The present invent...
Invention Epoxy resin composition, electronic component, semiconductor device, and semiconductor device man...
Invention Solar cell. Provided is a highly efficient crystalline silicon solar cell which has a high open-c...
Invention Curable resin composition, adhesive, sealing material, cured product, semiconductor apparatus, an...
Invention Curable resin composition, adhesive, sealing material, cured product, semiconductor device, and e...
Invention Epoxy resin composition, cured product, and semiconductor device. Provided are: an epoxy resin co...
Invention Resin composition and curable resin composition using the same. A resin composition includes (A)...
2022 Invention Resin composition, semiconductor device, and method for producing semiconductor device. Provided...
Invention Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor d...
Invention Liquid compression molding material, electronic component, semiconductor device and method for pr...
Invention Method for manufacturing laminate. The present invention is directed to provide novel methods fo...
Invention Resin composition, electrically conductive adhesive, cured object, and semiconductor device. The...
2021 P/S Chemicals; industrial chemicals; soldering pastes (chemicals); chemicals in paste form used in m...
P/S Industrial chemicals; chemicals in paste form used in manufacturing electronic circuits; chemical...
Invention Laminate for wiring board. The present invention is directed to provide novel laminates for wiri...
2012 P/S Chemicals for use in the copper industry, namely, surface preparation agents for copper foil [us...
P/S Surface preparation agents for copper foil used for manufacturing copper clad laminates; surface...
P/S Chemicals; chemicals (industrial); adhesives for industrial purposes; conductive adhesives for i...
2011 P/S Electric conductors, namely, conductive pastes for industrial purposes; electric conductors, name...
P/S Chemicals for use in industry; industrial chemicals; adhesives for industrial purposes; industria...
P/S Insulating liquid sealants, namely underfill sealants, encapsulant sealants, chip resistor protec...
P/S Chemicals; chemicals (industrial); adhesives for industrial purposes; conductive pastes for indus...
2005 P/S Adhesives for semiconductors; adhesives, other than for stationery or household purposes Electric...
P/S Adhesives for semiconductors; adhesives (not for stationery or household purposes). Conductive t...
P/S Conductive pastes for use with electronic components. Conductive paste for use with electronic co...
P/S Conductive pastes for use with electronic components. Conductive films, tapes and sheets, namely,...
P/S Conductive pastes for use in the manufacture of electronic components, namely, chip resisters, ch...
P/S Conductive pastes.
P/S Conductive pastes for use in the electrodes and circuits of various electronic parts and the inte...
P/S Conductive substances (chemicals); conductive materials (chemicals); chemical preparations having...
2004 P/S Paints for use in protecting the surfaces of electric and electronic parts
P/S Paints [ Precious metals ]
P/S Paints. Electrical insulating materials.
P/S Electrical insulating materials
P/S Paints Electrical insulating materials
P/S Paints. Precious metals.
2001 P/S Insulating paints for use in the manufacture of electrical components; insulating and protective ...
P/S Insulating paints; insulating and protective coating for semi-conductor; wire insulating tube; el...
2000 P/S EPOXY COMPOUNDS FOR UNDERFILLING AND/OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; EPOXY [ AND ...
P/S Electric insulating materials.
1998 P/S ADHESIVES AND CONDUCTIVE PASTES AND POWDERS FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVIC...
P/S Paints, pastes and powders for industrial purposes, especially epoxy/phenolic resin coating mater...