This electroconductive paste contains electroconductive particles in which the tap density measured in accordance with ISO 3953:2011 is 2.5 g／mL or greater and the BET specific surface area is 2.5 m2/g or greater, (B) a thermoplastic resin, and (C) a solvent. Provided are: an electroconductive paste, an electroconductive film or an electroconductive pattern having exceptional low-resistance properties even when continuously caused to expand and contract; a cured article of said electroconductive paste, electroconductive film or electroconductive pattern; and a wearable device containing said electroconductive film or electroconductive pattern.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
A61B 5/266 - Électrodes bioélectriques à cet effet caractérisées par les matériaux des électrodes contenant des électrolytes, gels ou pâtes conducteurs
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
H01B 7/06 - Conducteurs ou câbles extensibles, p. ex. cordon torsadant automatiquement
2.
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Provided is a liquid compression molding material which has excellent injectability and forms a cured product containing few aggregates. This liquid compression molding material comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst, and is used for at least sealing a gap between an element and a substrate, wherein the initial viscosity at 25ºC is 10-250 Pa∙s, and a cured product obtained by curing the liquid compression molding material under condition (1) satisfies condition (2). (1) The molding temperature is 150ºC, the molding time is 700 seconds, the curing temperature is 180ºC, and the curing time is 60 minutes. (2) When a region of 250 μm×180 μm in length and width on a cross section of the cured product is observed with a scanning electron microscope (magnification: 500 times), the area ratio of aggregates, which have a circle equivalent diameter of at least 1 μm and are present in said region, is at most 1.0%.
The present invention provides a resin composition that has excellent adhesive strength at room temperature and excellent wire bonding properties in a temperature range suitable for Cu wire bonding. This resin composition contains: (A) a phenoxy resin having a glass transition temperature Tg1 of 50°C or less; (B) a curing agent; (C) a filler; and (D) at least one resin selected from the group consisting of a phenoxy resin having a glass transition temperature Tg2 of 100°C or more, a trifunctional or higher epoxy resin, and a naphthalene-type epoxy resin. The resin composition has a glass transition temperature Tg3 of 130°C or more, and the cured product thereof has a modulus of elasticity of 0.5 GPa or more at 200°C.
Provided is an epoxy resin composition having a low viscosity and a short gap filling time. This epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) core-shell rubber particles, wherein the shell layer of the core-shell rubber particles (D) contains (meth)acrylic acid and butyl (meth)acrylate as constituent units.
C08L 51/04 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des caoutchoucs
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
123412344 represents an aryl group having 6-14 carbon atoms.) and of a counter cation, and also satisfying at least one of the following characteristics (a) and (b); an adhesive agent or a sealing material including the same; a cured product thereof; and a semiconductor device and an electronic component including the cured product. (a) (D) A filler is further included. (b) The content of (A) the epoxy compound is 100-1300 parts by weight with respect to 100 pats by weight of (B) the oxetane compound.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
123412344 represents an aryl group having 6 to 14 carbon atoms) and a counter cation other than an iodonium cation; an adhesive agent or a sealing material which contains the resin composition; a cured product of the resin composition; a semiconductor device which comprises the cured product; and an electronic component.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
The present invention addresses the problem of providing at least a photocurable or thermosetting polymerizable composition and adhesive capable of suppressing a bleeding phenomenon. Provided are a polymerizable composition and an adhesive that contain (A) a cationically polymerizable compound, (B) an acid generator, and (C) a modified polydimethylsiloxane that satisfies at least one of the following features (a), (b), and (c): (a) an organic substituent containing a COOH group is bonded to the polydimethylsiloxane directly or via a linker; (b) an organic substituent containing an OH group and optionally an ether group is bonded to the polydimethylsiloxane directly or via a linker, and when the organic substituent contains an ether group, the ratio of the number of polypropylene glycol repeating units to the number of polyethylene glycol repeating units in the organic substituent is less than 0.3; and (c) the modified polydimethylsiloxane has a specific signal in a 1H NMR spectrum measured in deuterated chloroform and satisfies a specific formula.
The present invention addresses the problem of providing: a curable resin composition which can be applied with a narrow line width (for example, 1,000 μm or less) and a high coating height; an adhesive composition; a cured product of the same; a semiconductor device which comprises the cured product; and an electronic component. Provided are: a curable resin composition which contains (A) a polymerizable compound, (B) a polymerization initiator, (C) an inorganic thixotropy-imparting agent, and (D) a modified polydimethylsiloxane, wherein the content of (C) the inorganic thixotropy-imparting agent is 10-70 parts by mass with respect to 100 parts by mass of the curable resin composition, and the content of (D) the modified polydimethylsiloxane is 0.01-15 parts by mass with respect to 100 parts by mass of (C) the inorganic thixotropy-imparting agent; an adhesive composition; a cured product of the same; a semiconductor device which comprises the cured product; and an electronic component.
The present invention provides a conductive paste capable of forming an electrode having a relatively low specific resistance even when conductive particles having a relatively low silver content are used. Provided is a conductive paste containing (A) conductive particles, (B) an epoxy resin, and (C) a curing agent, wherein the (A) conductive particles include silver-coated copper particles, and in the particle size distribution of the silver-coated copper particles obtained by particle size distribution measurement using a laser diffraction scattering method, when the silver-coated copper particle content is set as 100 vol%, the amount of silver-coated copper particles having a particle diameter of less than 5.0 μm is 50 vol% or less.
R120R120 obtained by measuring solid content in the insulating composition at 120°C and 100 rpm using a rheometer is 28 mPa·s or more. The insulating composition preferably further contains a solvent (D).
Provided is a film for an adhesive layer, which is capable of suppressing breakage of a plating layer that is disposed on the inner surface of a through hole which is formed in a multilayer wiring board. Specifically provided is a film 10A for an adhesive layer, which is used for the production of a multilayer wiring board 100. The multilayer wiring board 100 comprises a fluororesin substrate 20 and the film 10A for an adhesive layer. The film 10A for an adhesive layer has a thickness of 10-35 μm. The film 10A for an adhesive layer has a thermal expansion coefficient in the thickness direction of 110 ppm/°C or less after curing, and satisfies the following relational expression (1). (1): X + Y ≤ 14,000 (In the relational expression (1), X is a value obtained by multiplying the thickness (μm) of the film 10A for an adhesive layer by the thermal expansion coefficient (ppm/°C) in the thickness direction after curing, Y is a value obtained by multiplying the thickness (μm) of the fluororesin substrate 20 by the thermal expansion coefficient (ppm/°C) in the thickness direction, and the thickness of the fluororesin substrate 20 is 50 μm or more.)
The present invention provides: a resin composition that has excellent low gloss properties even when a specific trithiol compound is contained therein; and an adhesive or sealing material, a cured product, and a semiconductor device or electronic component which contain said resin composition. Provided are: a resin composition containing (A) a (meth)acrylate compound, (B) a thiol compound represented by chemical formula (I), and (C) a thermally latent curing catalyst that is solid at room temperature; and an adhesive or sealing material, a cured product, and a semiconductor device or electronic component which contain said resin composition.
The present invention addresses the problem of providing: a resin composition having favorable storage stability and low-temperature curability even when a specific trithiol compound is contained; an adhesive or sealing material comprising the same; a cured product; and a semiconductor device or electronic component. Provided are: a resin composition comprising (A) a (meth)acrylate compound, (B) a thiol compound represented by chemical formula (I), (C) a thermally latent curing catalyst, and (D) an inorganic filler having a specific surface area of at least 4 m2/g; an adhesive or sealing material comprising the same; a cured product; and a semiconductor device or electronic component.
C08G 75/045 - Polythioéthers à partir de composés mercapto ou de leurs dérivés métalliques à partir de composés mercapto et de composés insaturés
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 81/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du soufre, avec ou sans azote, oxygène ou carboneCompositions contenant des polysulfonesCompositions contenant des dérivés de tels polymères
The present invention provides: a thermosetting insulating film which is capable of achieving excellent insulating properties when used for the production of a multilayer substrate; and a multilayer insulating sheet which uses this thermosetting insulating film. Provided are: a thermosetting insulating film which contains at least a solid epoxy resin as an epoxy resin, wherein the area change rate R expressed by formula (1) is 222% or less; and a multilayer insulating sheet which uses this thermosetting insulating film. Formula (1): R = 100 × Sp/Si (In formula (1), Sp represents the area (cm2) of a square film after being subjected to vacuum pressure pressing under conditions of a pressing temperature of 175°C, a pressing pressure of 2.5 MPa, and a pressing time of 30 minutes, the square film having a thickness of 100 μm and a horizontal and vertical size of 160 mm × 160 mm, and Si represents the area (cm2) of the film before the vacuum heating pressing is performed.)
The present invention addresses the problem of providing a novel latent polymerization initiator which is excellent in terms of storage stability and enables thermal curing of a resin composition at a low temperature. The present invention also addresses the problem of providing a resin composition and an adhesive or a sealing material, which are excellent in terms of storage stability and can be thermally cured at a low temperature. The present invention provides: a thermal latent polymerization initiator in which a thermal radical initiator is supported by inorganic ion exchanger particles; a resin composition which contains (A) a radically polymerizable compound and (B) the thermal latent polymerization initiator; and an adhesive or a sealing material which contains the resin composition.
11) of a shape when an electrode formed using the conductive paste is extended or contracted in one cycle with a length of 115% with respect to the length before the extension of the electrode is 8.0% or less.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
H01B 1/24 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des compositions à base de carbone-silicium, du carbone ou du silicium
17.
CONDUCTIVE PASTE, CONDUCTIVE FILM, CERAMIC CIRCUIT SUBSTRATE, AND ELECTRONIC COMPONENT
Provided are: a conductive paste capable of forming a circuit pattern by a screen printing method and forming a conductive film having high adhesion to a ceramic substrate; a conductive film; a ceramic circuit substrate; and an electronic component. The conductive paste includes (A) a conductive powder, (B) a glass frit, and (C) an organic vehicle. The (B) glass frit may be a glass frit in which, when the glass frit is disposed on a ceramic substrate and is melted under the condition of 900°C in a nitrogen atmosphere, the contact angle of the molten glass frit with respect to the ceramic substrate measured in conformance with JIS R3257 is 40 degrees or less.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
18.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
The present invention provides an epoxy resin composition wherein running on the surface of a BSM-treated silicon chip is less likely to occur. This epoxy resin composition contains an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The epoxy resin composition has a surface tension of 30-40 mN/m as measured at 110°C using a plate method.
The present invention addresses the problem of providing at least a thermosetting resin composition and an adhesive agent that can suppress the bleeding phenomenon. Provided is a resin composition comprising (A) a polymerizable compound having a carbon-carbon double bond, (B) a polythiol compound, (C) a polymerization initiator, and (D) a modified polydimethylsiloxane satisfying at least one of features (a) and (b): (a) an organic substituent group including a COOH group or an OH group is bound to a polydimethylsiloxane directly or via a linker; and (b) an 122O.
The present invention addresses the problem of providing: a curable resin composition that can be rapidly cured at a low temperature (for example, cured at 70°C-80°C within 30 minutes), exhibits high adhesive strength after curing at a low temperature for a short time, and has a long pot life; a method for producing the curable resin composition; an adhesive or sealing material including the curable resin composition; a cured product thereof; and a semiconductor device and electronic component including the cured product. Provided are: a curable resin composition comprising (A) a radically polymerizable curable compound, (B) a radical polymerization initiator, (C) a polymerization inhibitor, and (D) inorganic particles, wherein the content of the (C) polymerization inhibitor in the curable resin composition falls within the range of 0.1-3.0 parts by mass with respect to 100 parts by mass of the radical polymerization initiator (B); a method for producing the curable resin composition; an adhesive or sealing material including the curable resin composition; a cured product thereof; and a semiconductor device and electronic component including the cured product.
A copper member, comprising a copper material and a protrusion formed on the surface of the copper material. The protrusion contains copper and/or a copper oxide. When the copper member is measured using a nanoindenter under a prescribed measurement condition, the copper member satisfies at least one of (1) indentation creep (CIT) of 80% or greater, (2) indentation hardness (GPa) of 1 or less, and (3) an indentation elastic modulus (GPa) of 120 or less. The copper member is excellent in adhesion to a resin base material and heat-resistance reliability.
Provided is a liquid compression molding material including an epoxy resin composition containing an epoxy resin (A), a curing accelerator (B), a filler (C), and an elastomer (D), in which blending ratio of the filler (C) to the epoxy resin composition is 73.0 mass % or more, and blending ratio of the elastomer (D) to a total of components excluding the filler (C) from the epoxy resin composition is 7.0 mass % or more.
B29C 43/00 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
B29C 43/36 - Moules pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés
B29K 21/00 - Utilisation de caoutchouc non spécifié ou élastomères non spécifiés comme matière de moulage
B29K 63/00 - Utilisation de résines époxy comme matière de moulage
B29K 105/00 - Présentation, forme ou état de la matière moulée
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
This invention prevents the occurrence of peeling failure during lamination processing using a multilayer sheet. A multilayer sheet 100 is formed by laminating a first base material film 12, an adhesive film 14, a second base material film 16, and a third base material film 18 in this order, and satisfies the following formula (1). Formula (1): P1 < P2 < P3 [In the formula, P1 represents a peel strength between the first base material film and the adhesive film, P2 represents a peel strength between the adhesive film and the second base material film, and P3 represents a peel strength between the second base material film and the third base material film.]
The prevent invention is a conductive paste comprising (A) conductive particles, (B) a thermosetting resin, and (C) rubber particles. The rubber particles (C) include a carbon-carbon bond in the main chain skeleton thereof. Rubber particles having an average particle size less of than 1 μm are included. The present invention makes it possible to provide a conductive paste having improved adhesion to a copper base material.
This invention makes it possible to achieve a semiconductor device demonstrating excellent electrical connection reliability despite a narrow pitch between electrodes. There is provided an adhesive film which is used for bonding a semiconductor element with a semiconductor element or bonding a semiconductor element with a circuit board, the film having: a width of 40°C or more and less than 110°C of a temperature range indicative of a melt viscosity of 50000 Pa･s or less in a temperature range of more than 90°C and less than 200°C; and a ratio (V2/V1) exceeding 1.0 of a melt viscosity V2 at 200°C to a minimum melt viscosity V1 in a temperature range of more than 90°C and less than 200°C.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
27.
RESIN COMPOSITION AND CURABLE RESIN COMPOSITION USING THE SAME
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
and a molecular weight of 230˜1,000, and (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m2/g˜250 m2/g.
The present invention provides a resin composition which has a low refractive index and good heat resistance such as good reflow resistance. Disclosed is a resin composition which contains (A1) a cyclic siloxane compound that has a reactive functional group, (A2) a linear siloxane compound that has a reactive functional group, and (B) a polymerization initiator. It is preferable that the cyclic siloxane compound (A1) that has a reactive functional group is an epoxy-modified cyclic siloxane compound that has 2 or 4 epoxy groups. It is also preferable that the linear siloxane compound (A2) that has a reactive functional group has a glycidyl ether structure at both ends.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
Provided is a resin composition for an adhesive, the composition having a low refractive index and a low weight reduction rate after a reflow step is performed. The resin composition for an adhesive comprises: (A) a siloxane compound that has a reactive functional group; and (B) a polymerization initiator. The (B) polymerization initiator contains at least one onium salt selected from the group consisting of onium borate salts and onium gallate salts. The onium salt preferably contains at least one cation selected from the group consisting of iodonium and sulfonium.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
This invention provides a resin composition having low viscosity and high transparency. The resin composition comprises (A) an organic substance, (B) a polymerization initiator, and (C) inorganic particles, wherein the (C) inorganic particles include inorganic particles which have a median diameter (D50) of 0.05-3.0 μm and for which D90/D10 is 1-4, D90/D10 being the ratio of a cumulative volume 90% value (D90) to a cumulative volume 10% value (D10) in particle size distribution. It is preferable that the (C) inorganic particles include silica particles.
OPTICAL FIBER ARRAY, OPTICAL WAVEGUIDE MODULE, METHOD FOR REDUCING REFRACTIVE INDEX OF ADHESIVE LAYER, AND METHOD FOR MANUFACTURING OPTICAL FIBER ARRAY
Provided is an optical fiber array (1) comprising an adhesive layer (20) that exhibits a low refractive index and excellent transparency. This optical fiber array comprises an optical fiber (10) and an adhesive layer (20), wherein the optical fiber (10) is optically coupled to an optical waveguide element (30) by the adhesive layer (20) and the content of the adhesive layer (20) in terms of the element Si is at least 10%. The adhesive layer (20) preferably has a transmittance of at least 90% at a wavelength of 1310 nm. The adhesive layer (20) preferably has a refractive index of not greater than 1.47 at a wavelength of 1310 nm. The adhesive layer (20) preferably contains a cured product of (A) a siloxane compound having a reactive functional group and (B) a polymerization initiator.
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
The present invention provides a novel method for manufacturing a hybrid quantum dot, a novel hybrid quantum dot, a novel energy storage device, a novel energy generation device, and a novel paste for forming a varistor. The present invention relates to a method for producing a hybrid quantum dot. The hybrid quantum dot contains elemental carbon and an elemental metal. The method includes: a gelling step in which a composition containing elemental carbon precursor and an elemental metal precursor is gelled to obtain a gelled product; a supercritical drying step in which the gelled product is dried by supercritical drying to obtain an aerogel powder; and a pyrolysis step in which the aerogel powder is pyrolyzed to obtain the hybrid quantum dot.
B82B 3/00 - Fabrication ou traitement des nanostructures par manipulation d’atomes ou de molécules, ou d’ensembles limités d’atomes ou de molécules un à un comme des unités individuelles
The present invention addresses the problem of providing: an epoxy resin composition with which it is possible to suppress the discoloration of an object having the composition applied thereto even when the composition contains a specific trithiol compound; an adhesive agent or a sealing material containing the composition; a cured article; and a semiconductor device or an electronic component. Provided are: an epoxy resin composition containing (A) an epoxy resin having a halogen content of 1600 ppm or less, (B) a thiol compound represented by chemical formula (I), and (C) a basic curing catalyst; an adhesive agent or a sealing material containing the epoxy resin composition; a cured article; and a semiconductor device or an electronic component.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
The present invention addresses the problem of providing: an epoxy resin composition which exhibits good low temperature curability even if a specific trithiol compound is contained therein; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition. Provided are: an epoxy resin composition that contains (A) a thiol compound represented by chemical formula (I), (B) a thiol compound having an isocyanuric acid skeleton, (C) an epoxy resin and (D) a latent thermal curing catalyst; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
35.
PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION
The present invention addresses the problem of providing: a photocurable resin composition that does not require full curing by heat; an adhesive, a sealing material, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, an adhesion method, a sealing method, and a coating method using a photocurable resin composition. Provided are: a photocurable resin composition containing (A) a polymerizable compound, (B) a photopolymerization initiator, and (C) a photon upconversion material; an adhesive, a sealing material, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, an adhesion method, a sealing method, and a coating method using a photocurable resin composition.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08F 20/20 - Esters des alcools polyhydriques ou des phénols polyhydriques
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08K 3/01 - Emploi de substances inorganiques en tant qu'adjuvants caractérisées par leur fonction
An object of the present invention is to provide a liquid epoxy resin composition suitable for use as a mold underfill material for TSV, which composition may provide an electronic component having high wiring density, satisfactorily releasing heat generated during its driving and having high reliability. The liquid epoxy resin composition of the present invention comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C) consisting of a silica filler and an alumina filler and carbon black (D); the epoxy resin (A) comprises a specific aliphatic epoxy resin, the alumina filler has a specific particle size distribution, and the liquid epoxy resin composition gives a cured product having a thermal conductivity within a predetermined range. The liquid epoxy resin composition of the present invention gives a cured product having high thermal conductivity. Thus, in a semiconductor device that includes electronic components manufactured using the composition as a mold underfill material for TSV, deterioration of performance due to heat is suppressed. Furthermore, an electronic component manufactured using the liquid epoxy resin composition of the present invention as a mold underfill material for TSV exhibits sufficient reliability. Thus, the liquid epoxy resin composition of the present invention is highly suitable for use as a mold underfill material for TSV.
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
37.
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
The present invention suppresses the occurrence of a mold flash at the time of compression molding. Provided are: a liquid compression molding material comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a vinyl polymer; an electronic component and a semiconductor device manufactured using the same; and a method for manufacturing an electronic component using the same.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
C08G 59/02 - Polycondensats contenant plusieurs groupes époxyde par molécule
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 57/00 - Compositions contenant des polymères non spécifiés obtenus par des réactions ne faisant intervenir que des liaisons non saturées carbone-carbone
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
38.
ELECTRICALLY CONDUCTIVE PASTE, USE OF ELECTRICALLY CONDUCTIVE PASTE, SOLAR CELL, AND METHOD FOR PRODUCING SOLAR CELL
GFGFGF of the glass frit (C) and the content G of the glass frit (C) in terms of parts by weight in the electrically conductive paste, if the content of the electrically conductive particles (A) in the electrically conductive paste is taken to be 100 parts by weight, falls within the range 0.25-1.45.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01L 31/068 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails adaptés comme dispositifs de conversion photovoltaïque [PV] caractérisés par au moins une barrière de potentiel ou une barrière de surface les barrières de potentiel étant uniquement du type homojonction PN, p.ex. cellules solaires à homojonction PN en silicium massif ou cellules solaires à homojonction PN en couches minces de silicium polycristallin
39.
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE
The present invention suppresses warping of a sealed article and has excellent rapid curing properties. A liquid compression molding material according to the present invention comprises a resin composition containing (A) an epoxy resin, (B1) a phenolic curing agent, (B2) an acid anhydride curing agent, and (C) an inorganic filler, wherein a glass transition temperature Tg of a cured product of the resin composition is in a range of 50°C to 120°C.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
B29C 43/34 - Alimentation en matière à mouler des moules ou des moyens de pressage
C08G 59/00 - Polycondensats contenant plusieurs groupes époxyde par moléculeMacromolécules obtenues par réaction de polycondensats polyépoxydés avec des composés monofonctionnels à bas poids moléculaireMacromolécules obtenues par polymérisation de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08G 59/42 - Acides polycarboxyliquesLeurs anhydrides, halogénures ou esters à bas poids moléculaire
[Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 μm or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.
Provided are a resin composition for a semiconductor device of a wafer level chip size package type, which exhibits excellent high-frequency properties, and can form a coating film which has a thickness that has less unevenness, and is unlikely to cause warpage of the semiconductor substrate, a semiconductor device using the same, and a method for producing a semiconductor device. A resin composition for a semiconductor device of a wafer level chip size package type, the resin composition comprising (A) a modified polyphenylene ether resin having an unsaturated double bond at the end thereof, (B) an elastomer having a butadiene skeleton, and optionally (C) a solvent, a semiconductor device using the same, and a method for producing a semiconductor device.
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
The purpose of the present invention is to provide a novel metal member. A metal member according to the present invention includes a layer containing Ni and Zn on at least one surface of a metal material, wherein the Zn adhesion amount in the layer containing Ni and Zn is 1.0 mg/dm2to 7.5 mg/dm2 (exclusive of 7.5), and the Zn content in the layer containing Ni and Zn is 55 mass% to 100 mass% (exclusive of 100 mass%).
The objective of the present invention is to provide a novel metal member. A metal member according to the present invention comprises a metal material which is a non-magnetic body, and a layer formed on the surface of the metal material and containing a magnetic metal and a non-magnetic metal. The metal member has a peak having a peak height of 0.7 to 1.2 times a reference value and/or a phase width of 0.8 to 1.5 times a reference value in a histogram obtained by measuring a magnetic field using a magnetic force microscope (MFM), wherein the peak height is a measured peak maximum value (hmax) of the histogram, the phase width is a range in which h/hmax is 0.01 or more, and the reference value is a value obtained by using the metal member yet to be processed.
The present invention addresses the problem of providing: a novel substance capable of solving the problem of conventional bismaleimides having a dimer acid skeleton; a curable composition, adhesive, or sealing material containing same and having excellent photo-curability and adhesive strength; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product. Provided are: a dimer acid-modified acrylamide; a composition mainly containing the dimer acid-modified acrylamide; a curable composition, adhesive, or sealing material containing the dimer acid-modified acrylamide and a radical polymerization initiator; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product.
To provide: an epoxy resin composition capable of suppressing small pores generated when the surface of a cured product thereof is polished; an electronic component using the epoxy resin composition; a semiconductor device using the epoxy resin composition; and a method for manufacturing the semiconductor device. The epoxy resin composition contains an epoxy resin, a curing accelerator, a filler, and an elastomer. The elastomer is at least one selected from a solid elastomer and a liquid elastomer. The solid elastomer has a structure in which a double bond is not included in the main chain.
Provided are: a semiconductor device comprising an interlayer insulating film having a high tensile elongation; and a resin composition. The semiconductor device comprises: a semiconductor chip; an encapsulation material for covering the semiconductor chip; wiring for electrically connecting the semiconductor chip to an external terminal; and a rewiring layer including an interlayer insulating film that surrounds the wiring, wherein the rewiring layer has an area larger than that of the semiconductor chip in a plan view, and the interlayer insulating film has a tensile elongation of at least 15% at 25°C.
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
C08L 71/00 - Compositions contenant des polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleCompositions contenant des dérivés de tels polymères
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
47.
RESIN COMPOSITION, ELECTRICALLY CONDUCTIVE ADHESIVE, CURED OBJECT, AND SEMICONDUCTOR DEVICE
There are provided: a resin composition that has low elasticity, is curable at low temperature, and has a long pot life; an electrically conductive adhesive that contains the resin composition; a cured product of the resin composition; and a semiconductor device that contains the electrically conductive adhesive or the cured product of the resin composition. The resin composition contains (A) a radically polymerizable curable resin, (B) a radical polymerization initiator, and (C) a radical polymerization inhibitor. The (C) component contains (C1) a nitrosamine compound. The (A) component contains (A1) a urethane acrylate oligomer. The (A1) component has a mass average molecular weight of 1,600 or more and 20,000 or less. The resin composition is useful as an electrically conductive adhesive, a material for mounting components or a sealing material for protecting components, and an insulating material for reinforcement which are used in the FHE field.
Provided is a resin composition with low dielectric characteristics while having good ability to permeate into circuit boards. This composition comprises (A) a thermosetting resin comprising vinylbenzyl groups and/or maleimide groups, and (B) a compound with a butadiene backbone that has a 1,2-vinyl group, and the number average molecular weight of component (B) is 1000-10000.
C08L 9/00 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures à diènes conjugués
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/04 - Additifs non macromoléculaires inorganiques
Provided are: a curable resin composition which can be cured at low temperatures, from which a cured product having a low Tg can be obtained, and which has excellent conformability to an adherend; an adhesive; a sealing material; a cured product having a low Tg; a semiconductor apparatus including the cured product; and an electronic device including the cured product. The curable resin composition comprises (A) a cationic curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxydicarbonate-type organic peroxide. The component (A) includes at least one selected from the group consisting of (A1) an epoxy resin having a ring skeleton in a molecule, and (A2) an oxetane resin.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 171/00 - Adhésifs à base de polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
Provided are: a curable resin composition which can be cured at a low temperature and which has excellent pot life; an adhesive; a sealing material; a cured product; a semiconductor device; and an electronic device. This curable resin composition comprises (A) a cation-curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxy dicarbonate-type organic peroxide represented by formula (1). The peroxycarbonate-type organic peroxide represented by formula (1) includes an alkyl group represented by R1and an alkyl group represented by R2, the alkyl groups each having at least 10 carbon atoms.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 171/00 - Adhésifs à base de polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
Provided are: a curable resin composition which can be cured through heating at a low temperature and/or ultraviolet ray irradiation and with which corrosion of an adherend is suppressed; an adhesive; a sealing material; a cured product obtained by curing same; and a semiconductor device and electronic device including the cured product. This curable resin composition comprises (A) a cation-curable resin, (B) an acid generator including an iodonium salt, and (C) an ion trapping agent including at least one kind of atom selected from the group consisting of Zr, Mg, and Al.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 171/00 - Adhésifs à base de polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
52.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Provided are: an epoxy resin composition that yields a cured product that can prevent warping of a board and peeling from a chip; a cured product using the same; and a semiconductor device. The epoxy resin composition contains an epoxy resin, a filler, and at least one selected from a curing agent and a curing catalyst. The epoxy resin contains a flexible epoxy resin, and the content of flexible epoxy resin is from 8.0 mass% to 25.0 mass% relative to the epoxy resin.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
53.
RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DIE ATTACHMENT MATERIAL, CURED PRODUCT AND ELECTRONIC DEVICE
The present invention provides: a resin composition which has a low viscosity and enables the achievement of a cured product that has a high Tg; an adhesive and a sealing material, each of which comprises this resin composition; a die attachment material; a cured product; and an electronic device. This resin composition is characterized by containing (A) a pentaerythritol tetraglycidyl ether and (B) an epoxy resin other than the component (A), and is also characterized in that the amount of the component (A) is less than 30% by mass in 100% by mass of organic matters that include the component (A) and the component (B).
The present invention is directed to provide novel methods for manufacturing laminates. The method includes the steps of: bonding the insulating substrate layer and a copper component having protrusions on a surface thereof; transferring the protrusions to a surface of the insulating substrate layer by peeling off the copper component to form a seed layer; forming a resist on a predetermined area of a surface of the seed layer; plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper; removing the resist; and removing the seed layer that has been exposed by the removal of the resist.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/16 - Procédés de couchageAppareillages à cet effet
G03F 7/26 - Traitement des matériaux photosensiblesAppareillages à cet effet
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
55.
INSULATIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT
The present invention addresses the problem of providing an insulative resin composition suitable for aerosol-jet printing technologies. Provided is an insulative resin composition which contains (A) inorganic particles having a mean particle diameter (D50) of 0.02-0.5 μm, (B) a polyfunctional thermosetting compound, and (C) a curing agent, and which has a viscosity of 400 mPa·s or less as measured using a type-E viscometer at a condition of 25°C and 50 rpm.
The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
G01N 23/20058 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffraction de la radiation par les matériaux, p. ex. pour rechercher la structure cristallineRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffusion de la radiation par les matériaux, p. ex. pour rechercher les matériaux non cristallinsRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la réflexion de la radiation par les matériaux en mesurant la diffraction des électrons, p. ex. la diffraction d’électrons lents [LEED] ou la diffraction d’électrons de haute énergie en incidence rasante [RHEED]
G01N 23/20091 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffraction de la radiation par les matériaux, p. ex. pour rechercher la structure cristallineRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffusion de la radiation par les matériaux, p. ex. pour rechercher les matériaux non cristallinsRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la réflexion de la radiation par les matériaux en mesurant le spectre de dispersion d’énergie [EDS] du rayonnement diffracté
G01N 33/00 - Recherche ou analyse des matériaux par des méthodes spécifiques non couvertes par les groupes
Provided is a highly efficient crystalline silicon solar cell which has a high open-circuit voltage (Voc) and fill factor (FF). A solar cell comprising a crystalline silicon substrate (1) which contains an impurity diffusion layer, a passivation film (2) positioned on at least the impurity diffusion layer of the substrate (1), and an electrode (20) which contains silver (Ag) and is positioned on at least part of the passivation film (2), wherein: one or more AgSi regions (30) are further included in the solar cell and positioned in at least part of the interval between the electrode (20) and the substrate (1); the AgSi regions (30) include one or more AgSi regions (30) which have a depth of at least 100nm; and the residual rate of the passivation film (2), which is the proportion of the residual length of the passivation film (2) in a scanning electron micrograph of a cross-section which is 5.7µm×3.9µm and includes the AgSi regions (30) of the solar cell, is 10-90%.
The present invention provides an electrically conductive paste which is suitable for the formation of an electrode by a laser process for the production of a crystalline silicon solar cell. This electrically conductive paste is used for the purpose of forming an electrode on a passivation film which is disposed on the surface of a p-type semiconductor layer that is disposed on the surface of an n-type semiconductor substrate; and this electrically conductive paste contains (A) silver particles, (B) an organic vehicle and (C) glass frit. This electrically conductive paste additionally contains 0.5 part by weight or less of (D) aluminum particles relative to 100 parts by weight of the (A) silver particles; or alternatively, this electrically conductive paste does not contain the (D) aluminum particles.
The present invention further suppresses the occurrence of recess defects which are formed in a polished surface when a surface of a cured product of an epoxy resin composition is polished. Provided is an epoxy resin composition comprising (A) an epoxy resin, B) at least one component selected from the group consisting of curing agents and curing accelerators, and (C) a filler, wherein the average presence density of recesses which have a diameter of not less than 0.5 μm and which are observed in a polished surface of a cured product of the epoxy resin composition is not more than 1.00/mm2. Also provided are an electronic component mounting structure using the epoxy resin composition, and a method for producing the electronic component mounting structure.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08K 3/013 - Charges, pigments ou agents de renforcement
C08K 7/22 - Particules expansibles, poreuses ou creuses
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
61.
CONDUCTIVE COMPOSITION, CONDUCTIVE PASTE, ELECTRIC CIRCUIT, FLEXIBLE ELECTRIC CIRCUIT BODY AND METHOD OF PRODUCING MOLDED BODY
A conductive composition includes conductive particles, a thermoplastic resin, and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C.
The present invention addresses the problem of providing: a resin composition which has excellent reactivity and from which a cured product having excellent stress relaxation properties is formed; and an adhesive. Provided is a resin composition comprising: (A) a polyfunctional epoxy compound having an epoxy equivalent of less than 215 g/eq; (B) a polyfunctional epoxy compound having an epoxy equivalent of at least 215 g/eq; (C) a polyfunctional thiol compound; (D) a curing catalyst; and (E) a monofunctional compound having one group (e), which includes an unsaturated double bond and an electron-withdrawing group adjacent thereto, in a molecule.
C09J 4/06 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
The object of the present invention is to provide a resin composition and an adhesive that cure under a low temperature condition, provide a cured product with an excellent stress relaxation property, and have a low self-exothermic temperature during a curing reaction. The present invention provides a resin composition comprising (A) a polyfunctional epoxy compound, (B) a polyfunctional thiol compound, (C) a monofunctional compound having one group (c) containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule, and (D) a curing catalyst.
C08G 59/06 - Polycondensats contenant plusieurs groupes époxyde par molécule de composés polyhydroxylés avec l'épihalohydrine ou ses précurseurs de polyphénols
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08G 75/045 - Polythioéthers à partir de composés mercapto ou de leurs dérivés métalliques à partir de composés mercapto et de composés insaturés
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
64.
RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE
The object of the present invention is to provide a resin composition and an adhesive that can reduce odor derived from thiol curing agents and provide a cured product with reduced odor. The present invention provides a resin composition comprising (A) a thiol curing agent having two or more thiol groups, (B) a main agent having two or more groups (b) each of which is reactive with a thiol group, (C) an odor masking agent having one group (c) reactive with a thiol group, and (D) a heat latent curing catalyst, wherein the amount of the (A) thiol curing agent is 10 to 60% by weight of the total weight of the resin composition, and the component (C) is a monofunctional compound having one group containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08G 75/045 - Polythioéthers à partir de composés mercapto ou de leurs dérivés métalliques à partir de composés mercapto et de composés insaturés
65.
EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.
Provided are an epoxy resin composition whereby it is possible to achieve both injectability and reliability, a semiconductor device, and a method for producing the semiconductor device. The epoxy resin composition contains a polyalkylene glycol epoxy resin, a heterocyclic compound including a nitrogen atom, and a filler. The content of the filler is 55 mass% or more and less than 77 mass% with respect to the total amount of the epoxy resin composition.
The present invention provides: an epoxy resin composition which can be applied by means of a jet dispenser, while having good injectability; a semiconductor device; and a method for producing a semiconductor device. This epoxy resin composition contains a polytetramethylene glycol-type epoxy resin, a heterocyclic compound that contains a nitrogen atom, and a filler; the filler is surface-treated with at least one of 3-methacryloxypropyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysilane; and the content of the filler is not less than 55% by mass but less than 77% by mass relative to the total mass of this epoxy resin composition.
The problem addressd by this invention is to provide a conductive composition that can be sintered at low temperature and has low resistance, the composition forming a conductive film having excellent flexibility and bend resistance. Provided is a conductive composition comprising (A) surface-modified silver nanoparticles in which the surface is coated with a lower carboxylic acid, (B) a binder resin, and (C) an organic solvent, wherein the lower carboxylic acid of (A) the surface-modified silver nanoparticles present in the conductive composition starts desorption from the silver nanoparticles at 40 to 130 °C.
The purpose of the present invention is to provide a resin composition having favorable elongation in a cured product, a cured product that uses the resin composition, a camera module, and an electronic device. That is, provided is a resin composition containing a polyfunctional epoxy resin, a monofunctional epoxy resin, and a latent curing agent. The polyfunctional epoxy resin contains a polyfunctional epoxy resin having an epoxy equivalent weight of 400 g/eq. or greater, and the resin composition satisfies the following conditions. Conditions: Given X as the content of the polyfunctional epoxy resin with an epoxy equivalent weight of 400 g/eq. or greater / the epoxy equivalent weight of the polyfunctional epoxy resin with an epoxy equivalent weight of 400 g/eq. or greater, Y as the content of the monofunctional epoxy resin / the epoxy equivalent weight of the monofunctional epoxy resin, and Z as the content of all polyfunctional epoxy resin / the epoxy equivalent weight of all polyfunctional epoxy resin, X/Z is 0.3 to 1.0 and Y/Z is 0.35 to 1.20.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
G02B 1/16 - Revêtements optiques obtenus par application sur les éléments optiques ou par traitement de la surface de ceux-ci ayant un effet antistatique, p. ex. revêtements conducteurs électriques
The present invention provides: a resin composition which is curable at a relatively low temperature and which has a long pot life; a cured product; and a semiconductor device and an electronic component which include the cured product. Provided are: a resin composition comprising (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor that can be sublimated, said resin composition further comprising (D) conductive particles as necessary; a cured product obtained by curing the resin composition; and a semiconductor device and an electronic component which comprise the cured product.
C08L 101/02 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés
C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an end and (B) a thermoplastic elastomer having a number average molecular weight of 60,000 or more.
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
This conductive paste contains (A) conductive particles and (B) a binder resin. The (A) conductive particles include surface-treated metal particles. The surface-treated metal particles each contain a metal particle and a surface-treated layer disposed on at least a portion of the surface of the metal particle. The conductive paste has high sulfidization resistance, and an electrode can be formed therefrom at relatively low cost.
An electroconductive paste comprising (A) electroconductive particles and (B) a binder resin, wherein the electroconductive particles (A) include surface-treated metal particles, the surface-treated metal particles comprising metal particles and a surface treatment layer disposed on at least some of the surfaces of the metal particles, the surface treatment layer including a zinc compound. The electroconductive paste has high sulfurization resistance and can form relatively inexpensive electrodes.
Provided is a conductive paste comprising conductive particles (A) and a binder resin (B), wherein the conductive particles (A) have metal particles and a surface treatment layer containing a palladium compound, the surface treatment layer being placed on at least a part of the surface of the metal particles. This conductive paste contains the conductive particles (A) in an amount of 80 parts by weight or more with respect to 100 parts by weight of the conductive paste. The conductive paste exhibits high sulfidation resistance, and can achieve excellent printing characteristics even with an increased content of conductive particles.
Provided is a conductive paste comprising conductive particles (A), binder resin (B), and glass frits (C), wherein the conductive particles (A) have metal particles and a surface treatment layer containing a palladium compound, the surface treatment layer being placed on at least a part of the surface of the metal particles. The softening point of the glass frits (C) is 800 °C or below. Even when containing glass frits with a low softening point, this conductive paste can suppress outflow of glass components from an electrode during firing, and exhibits excellent sulfidation resistance.
An alumina composite sol composition includes (A) an alumina sol containing an alumina hydrate, (B) an alkoxysilane compound, (C) a polyvalent organic acid, and (D) a solvent, wherein the amount of the alumina hydrate in the alumina sol (A) is 3 to 11% by mass.
Provided is a resin composition exhibiting excellent high frequency characteristics and heat resistance reliability. The resin composition comprises: (A) a polyphenylene ether resin that has, at a terminal end, a functional group including a carbon-carbon double bond; and (B) a compound that is a liquid at 25°C and has an isocyanuric ring structure and two allyl groups per molecule. (Provided that R1 in formula (1) is a hydrogen atom or an alkyl group.)
Provided is a conductive composition capable of achieving excellent die shear strength by sintering silver particles together even by heat treatment at a low temperature or for a short period of time regardless of whether pressure is applied or not. The conductive composition contains silver particles (A) having an average particle size of 0.05 to 5 μm, a solvent (B), and a thermosetting resin (C). Easily saponifiable chlorine concentration of the thermosetting resin (C) is 3,000 to 12,000 ppm. The conductive composition contains 0.1 to 1.5 parts by mass of the thermosetting resin (C) based on 100 parts by mass of the silver particles (A).
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
79.
CONDUCTIVE RESIN COMPOSITION, ELECTROMAGNETIC WAVE SHIELD LAYER, AND ELECTRONIC COMPONENT
Provided is an electroconductive paste capable of forming, in an electric circuit, an electric wiring line that is less likely to break even when the electric circuit and/or the electric wiring line is elongated and/or flexed. This flexible electric circuit-forming electroconductive paste is for forming an electric circuit on the surface of a flexible substrate, and comprises (A) electroconductive particles, (B) a thermoplastic resin, and (C) a solvent. When the temperature Tm (°C) for measuring the storage modulus of the electroconductive paste is set to Tm=178°C, the storage modulus of a cured product obtained by curing the electroconductive paste at 120°C for 30 minutes is 0.001-0.5 GPa at said temperature Tm.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
C08K 3/01 - Emploi de substances inorganiques en tant qu'adjuvants caractérisées par leur fonction
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
H01B 1/00 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs
H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
A base-releasing composition which suppresses release of a basic compound at room temperature and rapidly releases the basic compound under predetermined conditions. The base-releasing composition includes (A) a side-chain crystalline (meth)acrylate copolymer includes (i) repeating units each derived from an ester of a C8-C32 saturated, linear primary alcohol with acrylic acid or methacrylic acid and (ii) repeating units each derived from acrylic acid or methacrylic acid, and (B) a basic compound. The amount of basic groups in the (B) basic compound is 0.01 to 1.00 mmol per 1 g of the base-releasing composition, and at least a portion of the Component (B) is included in the Component (A). A curable resin composition includes a specific 2-methylene-1,3-dicarbonyl compound in combination with the base-releasing composition.
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
82.
ELECTRICALLY CONDUCTIVE PASTE, SOLAR CELL, AND METHOD FOR MANUFACTURING SOLAR CELL
GFGFGF of the glass frit (C) and the contained amount G of the glass frit (C), where the unit of the contained amount G of the glass frit (C) is expressed as parts by weight in the electrically conductive paste with respect to 100 parts by weight of the electrically conductive particles (A) contained in the electrically conductive paste, is in the range of 0.25-1.45.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01L 31/068 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails adaptés comme dispositifs de conversion photovoltaïque [PV] caractérisés par au moins une barrière de potentiel ou une barrière de surface les barrières de potentiel étant uniquement du type homojonction PN, p.ex. cellules solaires à homojonction PN en silicium massif ou cellules solaires à homojonction PN en couches minces de silicium polycristallin
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
The present invention addresses the problem of providing a resin composition and an adhesive which are curable at least thermally and can be inhibited from suffering bleeding. Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) zeolite particles.
H01L 23/10 - ConteneursScellements caractérisés par le matériau ou par la disposition des scellements entre les parties, p. ex. entre le couvercle et la base ou entre les connexions et les parois du conteneur
The present invention addresses the problem of providing: a resin composition which has at least thermosetting properties and with which the bleeding phenomenon can be suppressed; and an adhesive agent. Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) a surfactant having at least two hydrophilic groups per molecule, the hydrophilic groups being selected from hydroxyl groups and carbonyl groups.
H01L 23/10 - ConteneursScellements caractérisés par le matériau ou par la disposition des scellements entre les parties, p. ex. entre le couvercle et la base ou entre les connexions et les parois du conteneur
An object of the present invention is to provide at least a thermosetting resin composition and an adhesive that can suppress the bleeding phenomenon. Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) a rubber component.
H01L 23/10 - ConteneursScellements caractérisés par le matériau ou par la disposition des scellements entre les parties, p. ex. entre le couvercle et la base ou entre les connexions et les parois du conteneur
86.
RESIN COMPOSITION, ADHESIVE OR ENCAPSULATION MATERIAL, CURED OBJECT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
The present invention addresses the problem of providing a low-temperature-curable resin composition and an adhesive which are able to be inhibited from suffering bleeding. Provided is a resin composition comprising (A) an epoxy compound, (B) a polythiol compound, (C) a cyclic carbodiimide compound, and (D) a curing catalyst.
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
88.
CURABLE RESIN COMPOSITION, ADHESIVE, CURED PRODUCT, CAMERA MODULE, AND ELECTRONIC DEVICE
The purpose of the present invention is to provide a curable resin composition that cures rapidly and can reduce the occurrence of bleed. That is, this curable resin composition comprises an epoxy resin, a latent curing agent, and an imidazole derivative having a melting point of not more than 180°C.
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
89.
RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC PARTS
The present invention addresses the problem of providing a resin composition and an adhesive with which a cured material, in which unreacted residues are suppressed after thermal curing following UV curing, can be obtained. Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polyfunctional thiol compound, (C) a photoradical polymerization initiator, and (D) a thermal curing accelerator containing an azabicyclo ring compound having bridgehead nitrogen.
A conductive paste that can reduce an increase in electrical resistance caused by stretching of a wiring when the wiring of an electrical circuit and/or an electronic circuit is formed on a surface of a stretchable and/or bendable base material. The stretchable conductive paste includes (A) surface-treated silver particles and (B) a thermoplastic resin. The (A) surface-treated silver particles include a surface-treated layer.
C09D 11/037 - Encres d’imprimerie caractérisées par des particularités autres que la nature chimique du liant caractérisées par le pigment
C09D 11/102 - Encres d’imprimerie à base de résines artificielles contenant des composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
91.
RESIN COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME
The purpose of the present invention is to provide a resin composition containing a 2-methylene-1,3-dicarbonyl compound and having improved workability. The resin composition contains: (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) and having a molecular weight of 230 to 1000; and (B) fumed silica having an average primary particle diameter of 1 to 50 nm and a specific surface area of 50 m2/g to 250 m2/g.
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 135/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un radical carboxyle, et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
92.
LIQUID POLYMERIZABLE COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME
One purpose of the present invention is to provide a liquid polymerizable composition that can impart a suitable viscosity to a 2-methylene-1,3-dicarbonyl compound without impairing curability. A polymerizable composition according to the present invention includes (a) a 2-methylene-1,3-dicarbonyl compound, and (b) a specific (meth)acrylate polymer.
C08L 33/06 - Homopolymères ou copolymères des esters d'esters ne contenant que du carbone, de l'hydrogène et de l'oxygène, l'oxygène, faisant uniquement partie du radical carboxyle
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08K 3/01 - Emploi de substances inorganiques en tant qu'adjuvants caractérisées par leur fonction
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 133/00 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un seul radical carboxyle, ou ses sels, anhydrides, esters, amides, imides ou nitrilesAdhésifs à base de dérivés de tels polymères
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
93.
CONDUCTIVE COMPOSITION, CONDUCTIVE PASTE, CURED PRODUCT AND SOLAR CELL
The present invention provides a conductive composition for forming an electrode, which has a low specific resistance, at low temperatures. The present invention provides a conducive composition which contains (A) conductive particles, (B) a solvent and (C) an epoxy resin, wherein: the concentration of easily saponifiable chlorine of the epoxy resin (C) is 1,600 ppm or more; and the amount of the epoxy resin (C) is 1.2 to 10 parts by weight relative to 100 parts by weight of the conductive particles (A).
The purpose of the present invention is to provide a novel metal member. According to the present invention, provided is a metal member containing a first metal wherein N and Si are detected by elemental analysis of the surface of the metal member by X-ray Photoelectron Spectroscopy (XPS), the value of the ratio (N/Si) of the number of the N atoms to that of the Si atoms is 0.04-0.8, and the color difference ΔE*ab before and after an alkali metal elution test on the surface is 15 or less.
C23C 26/00 - Revêtements non prévus par les groupes
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
C25D 5/48 - Post-traitement des surfaces revêtues de métaux par voie électrolytique
95.
COMPOSITE COPPER MEMBER AND POWER MODULE INCLUDING COMPOSITE COPPER MEMBER
The purpose of the present invention is to provide a novel composite copper member and a power module which includes the composite copper member. The composite copper member includes a copper member and a nickel layer which is formed on at least a partial surface of the copper member. The surface including the nickel layer has convex parts, wherein in a cross-sectional image of the composite copper member photographed using a scanning electron microscope, convex parts having a length of 50 nm to 1500 nm as measured in a direction parallel to the surface including the nickel layer are present in the quantity of 5 or more per 3.8 µm, and the nickel layer has a predetermined amount or a predetermined thickness of nickel. The power module includes the composite copper member and an insulating material which is bonded to the composite copper member at the surface including the nickel layer.
There are provided a photosensitive resin composition, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product. This photosensitive resin composition is cured by irradiation with active energy rays, instead of by heat treatment at high temperatures. In this photosensitive resin composition, film loss after a development process is restrained. Furthermore, a miniaturized pattern can be accurately formed by photolithography. An aspect of the present invention is a photosensitive resin composition including components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2), (B) a silsesquioxane compound represented by formula (3), and (C) a photopolymerization initiator, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product.
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
C08K 5/3417 - Cycles à cinq chaînons condensés avec des carbocycles
C08L 83/06 - Polysiloxanes contenant du silicium lié à des groupes contenant de l'oxygène
An object of the present invention is to provide an epoxy amine adduct, a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. There is prepared an epoxy amine adduct in which a value of (melting onset temperature at a temperature increasing rate of 50° C./min)/(melting onset temperature at a temperature increasing rate of 10° C./min) in differential scanning calorimetry (DSC) is 1.00 or more and 1.10 or less. There are prepared a curing catalyst for epoxy resin containing the epoxy amine adduct, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition.
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.
[Problem] To provide an epoxy resin composition that has excellent injection properties and thermal conductivity for a cured product and can be used to produce a semiconductor device that has high operation reliability. [Solution] An epoxy resin composition that includes an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D). The epoxy resin composition is characterized by: the filler (D) including an aluminum nitride filler (D-1); the average particle size of the aluminum nitride filler (D-1) being no more than 10.0 μm; the uranium content in the aluminum nitride filler (D-1) being no more than 20 ppb; and the blending ratio of the aluminum nitride filler (D-1) to the total amount of filler (D) is at least 70% by mass.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
The present invention provides a curable resin composition that yields a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by curing the curable resin composition or the sealing material. The present invention further provides a camera module that includes the cured product.
