A radio frequency circuit includes a first filter having a first passband including downlink bands of first and second bands. The downlink band of the second band at least partially overlaps the downlink band of the first band. The low-frequency edge of the downlink band of the second band is lower than the low-frequency edge of the downlink band of the first band. The low-frequency edge of a first guard band defined on the lower frequency side of the downlink band of the first band, for the downlink band of the first band, coincides with the low-frequency edge of a second guard band defined on the lower frequency side of the downlink band of the second band, for the downlink band of the second band. The first filter has a higher attenuation steepness on the lower frequency side of the first passband than on the higher frequency side.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
H03H 7/46 - Réseaux pour connecter plusieurs sources ou charges, fonctionnant sur des fréquences ou dans des bandes de fréquence différentes, à une charge ou à une source commune
H03H 9/00 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques
H03H 9/25 - Détails de réalisation de résonateurs utilisant des ondes acoustiques de surface
A pseudo-haptic sensation generation apparatus is provided that includes a first vibration generator, a second vibration generator, a first fitting device, and a second fitting device. The vibration generator is configured to generate a first vibration and a second vibration that each induce the pseudo-haptic sensation. The first fitting device is configured to fit the first vibration generator (21) to the index finger of a hand of a user. The second fitting device is configured to fit the second vibration generator to the little finger of the hand of the user. The first vibration generator, the first fitting device, the second fitting device, and the second vibration generator are arranged in this order in the row direction of fingers of the hand of the user.
A multilayer ceramic capacitor includes a multilayer body including first and second surfaces facing each other in a lamination direction, third and fourth surfaces facing each other in a first direction, and fifth and sixth surfaces facing each other in a second direction, and four outer electrodes on the multilayer body. About 0.85≤L/W≤ about 1.00 is satisfied. The multilayer body includes a first inner electrode including an end exposed on the third and fifth surfaces and another end exposed on the fourth and sixth surfaces, a second inner electrode including one end exposed on the third and sixth surfaces and another end exposed on the fourth and fifth surfaces, and a peripheral electrode in a region between the first inner electrode and the third to sixth surfaces.
A multilayer body includes a first surface and a second surface opposite each other in a lamination direction, a third surface and a fourth surface opposite each other in a first direction, and a fifth surface and a sixth surface opposite each other in a second direction orthogonal. An inner layer portion includes an inner dielectric layer and an inner electrode laminated on the inner dielectric layer in the lamination direction. The inner electrode includes an end portion at the fifth surface. An outer electrode on the fifth surface includes an inner base electrode layer on the inner layer portion at the fifth surface and connected to the inner electrode, an inner glass layer on the inner base electrode layer, a plating layer on the inner glass layer, and a connecting portion penetrating through the inner glass layer and electrically connecting the inner base electrode layer to the plating layer.
A multilayer ceramic capacitor includes a multilayer body and first and second outer electrodes. The first outer electrode includes a first direct plating layer covering the first end surface, a first main surface electrode covering at least a portion of the first main surface, a first upper plating layer, and a first front plating layer, and the second outer electrode includes a second direct plating layer covering a second end surface, a second main surface electrode covering at least a portion of the second main surface, a second upper plating layer, and a second front plating layer.
An acoustic resonator device is provided that includes a substrate; a piezoelectric layer attached to the substrate; and an interdigital transducer on a surface of the piezoelectric layer and having opposing busbars. Moreover, a first plurality of fingers extend from a first busbar of the opposing busbars and a second plurality of fingers extend from a second busbar of the opposing busbars. The first and second pluralities of fingers are interleaved fingers and are disposed on the portion of the piezoelectric layer over the cavity. At least one first strip of dielectric material is disposed in a first gap between an end of at least one finger of the first plurality of fingers attached to the first busbar and an inner surface of the second busbar that faces the first busbar.
A power supply includes a pair of output terminals, a high-potential power line, a battery, a switch located on the high-potential power line, a power converter circuit located on the high-potential power line, a voltage detector, a current detector, and a controller. The controller turns the switch off when a magnitude of a voltage detected by the voltage detector is equal to or smaller than a magnitude of a predetermined first voltage threshold and a magnitude of a current detected by the current detector is equal to or larger than a magnitude of a predetermined first current threshold.
An electronic component includes a substrate and a pillar electrode. The substrate includes a first principal surface. The pillar electrode protrudes from the first principal surface of the substrate in a thickness direction of the substrate. The pillar electrode is positioned between the first principal surface of the substrate and a bump electrode. The pillar electrode includes a second principal surface and a peripheral surface. The second principal surface is in contact with the bump electrode. The peripheral surface is connected to the second principal surface and to the first principal surface of the substrate. The pillar electrode includes a groove disposed at the second principal surface of the pillar electrode. A bottom of the groove is connected to the peripheral surface of the pillar electrode.
A cylindrical battery is provided and including a top cover, and a safety valve, wherein the safety valve has a safety cover and a stripper disk positioned inward in a battery axial direction from the safety cover, and a predetermined portion of the safety cover positioned between a portion where the safety cover and the top cover are in contact with each other and a portion where the safety cover and the stripper disk are in contact with each other is an inclined portion inclined inward in a battery axial direction with respect to a contact surface where the safety cover and the top cover are in contact with each other.
An LC composite part 1A comprises: an element body 10 formed by laminating ferrite layers 15 in the lamination direction; internal electrode layers 20 that are laminated in the lamination direction with the ferrite layers 15 therebetween inside the element body 10 and extend along the ferrite layers 15 in the plane direction perpendicular to the lamination direction; a first external electrode 30 provided on the surface of the element body 10; and a second external electrode 40 provided, on the surface of the element body 10, at a position away from the first external electrode 30. The internal electrode layers 20 include first capacitor electrode layers 22 that are not electrically connected to the second external electrode 40 and are electrically connected to the first external electrode 30, second capacitor electrode layers 23 that are not electrically connected to the first external electrode 30 and are electrically connected to the second external electrode 40, and an inductor electrode layer 21 located on the same main surface of a corresponding ferrite layer 15 and electrically connected to the first external electrode 30 and the second external electrode 40. The LC composite part has an inductor portion LP including the inductor electrode layer 21, and a capacitor portion CP which is provided on at least one side in the lamination direction with respect to the inductor portion LP and in which the first capacitor electrode layers 22 and the second capacitor electrode layers 23 are opposite to each other with the ferrite layers 15 therebetween.
H01G 4/40 - Combinaisons structurales de condensateurs fixes avec d'autres éléments électriques non couverts par la présente sous-classe, la structure étant principalement constituée par un condensateur, p. ex. combinaisons RC
This acceleration sensor comprises: a device layer that is provided with a weight portion, an elastic portion, a first vibrator, and a second vibrator each of which is disposed on an intersection surface intersecting with a sensitivity axis direction; an application mechanism that applies rotational force to the weight portion; a lower lid that is provided below the device layer in the sensitivity axis direction; and an upper lid that is provided above the device layer in the sensitivity axis direction, and is for detecting an acceleration in the sensitivity axis direction. The weight portion has a rotary shaft that is orthogonal to the sensitivity axis direction, a first rotating portion that extends from the rotary shaft, and a second rotating portion that extends from the rotary shaft to the opposite side from the first rotating portion. The elastic portion is connected to the rotary shaft of the weight portion, and holds the weight portion so as to enable the weight portion to be translated in the sensitivity axis direction. The first vibrator is connected to the first rotating portion of the weight portion, and is configured to have a resonance frequency which changes according to the displacement of the first rotating portion. The second vibrator is connected to the second rotating portion of the weight portion, and is configured to have a resonance frequency which changes according to the displacement of the second rotating portion. In detecting an acceleration in the sensitivity axis direction, the weight portion is inclined with respect to an orthogonal surface orthogonal to the sensitivity axis direction due to rotational force applied by the application mechanism, and undergoes acceleration in the sensitivity axis direction while being kept inclined, and is thus translated in the sensitivity axis direction. The acceleration in the sensitivity axis direction is detected on the basis of the difference between the resonance frequency of the first vibrator and the resonance frequency of the second vibrator.
G01P 15/097 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen d'éléments vibrants
Provided is a stretchable device comprising: a plurality of stretchable base materials that are laminated to each other; a plurality of stretchable wires that are each disposed on each of the plurality of stretchable base materials; and a via that electrically connects at least two of the stretchable wires that overlap each other via the stretchable base material therebetween when viewed from the lamination direction of the stretchable base materials. In a cross-sectional view, among the plurality of stretchable base materials, at least one of the stretchable base materials on each of which the stretchable wire connected to the via is disposed includes protrusions protruding toward the stretchable wire, around the via.
The present disclosure relates to a multilayer ceramic capacitor (100). A multilayer ceramic capacitor (100) according to the present disclosure includes a ceramic element (10) in which a plurality of dielectric layers (11) and a plurality of internal electrode layers (12) are alternately laminated. The dielectric layer (11) contains ceramic as a main component, the ceramic contains barium and titanium, and the dielectric layer (11) further contains tin. The internal electrode layer (12) contains nickel as a main component. The internal electrode layer (12) has, at the vicinity of an interface with at least the dielectric layer (11), a first region in which the tin is dissolved, and the dielectric layer has a second region in which a Perovskite structure containing barium and titanium is formed. The second region is in contact with the internal electrode layer (12), and tin is dissolved in the Perovskite structure in the second region.
Provided is a stretchable device that comprises a stretchable substrate, an electronic component that is mounted on the stretchable substrate, and a plurality of stretchable wires that are provided at least inside the stretchable substrate. As seen from the thickness direction, the stretchable substrate has a first region that coincides with the stretchable wires and a second region that coincides with the electronic component and does not coincide with the stretchable wires, and in a cross-section of the stretchable substrate taken where the stretchable wires are provided, the second region is thicker than the first region. At least one of the stretchable wires has a first portion that extends in a first direction that is the stretching direction of the stretchable wires and a second portion that is continuous with the first portion and extends in a second direction that is different from the first direction so as to be electrically connectable to the electronic component.
This touch-type input device comprises: a housing having a first surface and a second surface on opposite sides from each other; a plurality of pressure-sensitive elements each having a rectangular shape in plan view; and a plurality of adhesive members. The polarity of the output of each of the plurality of pressure-sensitive elements differs between when extended in a first direction in which one side of the pressure-sensitive element extends and when being compressed in the first direction. The first surface has a plurality of operation regions. The second surface has a plurality of detection regions positioned overlapping the plurality of operation regions in plan view. The plurality of pressure-sensitive elements are respectively adhered to the plurality of detection regions by the plurality of adhesive members so as to be positioned at the centers of the plurality of detection regions. The plurality of pressure-sensitive elements are disposed such that the first direction of the plurality of pressure-sensitive elements and the direction in which the plurality of operation regions are aligned are substantially parallel to each other.
G06F 3/0362 - Dispositifs de pointage déplacés ou positionnés par l'utilisateurLeurs accessoires avec détection des translations ou des rotations unidimensionnelles [1D] d’une partie agissante du dispositif de pointage, p. ex. molettes de défilement, curseurs, boutons, rouleaux ou bandes
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
16.
MAGNETIC MATERIAL AND MANUFACTURING METHOD THEREFOR
The present disclosure provides a magnetic material comprising a plurality of metal magnetic bodies and a coating layer covering each of the metal magnetic bodies, wherein: the metal magnetic bodies contain at least Fe; the coating layers contain at least one of metal oxides and metal nitrides that contain Si and a first nonmagnetic metal element more susceptible to oxidation than Fe; and the average thickness of the coating layers is 10-153 nm, inclusive.
H01F 1/24 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées
B22F 1/07 - Poudres métalliques caractérisées par des particules ayant une structure nanométrique
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet
C22C 38/00 - Alliages ferreux, p. ex. aciers alliés
H01F 1/153 - Alliages métalliques amorphes, p. ex. métaux vitreux
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
Provided is a method for producing a plating composition that can be recovered from a plating composition containing metal ions in a high oxidation state. The method for producing a plating composition involves: in a working electrode chamber provided with a working electrode, using the working electrode as a cathode to reduce a portion of first metal ions contained in a first plating composition into metal, and thereby obtaining a reduction treatment liquid and a working electrode to which metal is adhered; bringing the reduction treatment liquid into contact with at least one type of adsorption material selected from the group consisting of chelate resins and ion exchange resins, and thereby obtaining a metal-ion-removed liquid from which at least some of the first metal ions have been further removed; and introducing the metal-ion-removed liquid into the working electrode chamber provided with the working electrode to which metal is adhered, using the working electrode to which metal is adhered as an anode to oxidize, in the metal-ion-removed liquid, at least a portion of the adhered metal into second metal ions having a lower oxidation number than the first metal ions, and thereby obtaining a second plating composition containing the second metal ions.
Provided is a multilayer inductor that reduces loss resulting from an eddy current with respect to an AC current by reducing resistance in the vicinity of an interface between a coil conductor and a metal magnetic body. A multilayer inductor 1 according to the present disclosure comprises an element body 10 having a metal magnetic body M on which a metal magnetic layer ML containing metal magnetic particles is layered, and a coil conductor CM on which a coil conductor layer CL is layered in the layering direction of the metal magnetic layer ML. The coil conductor CM has unevenness B on side surfaces thereof positioned in an intersection direction intersecting the lamination direction. The metal magnetic layer ML is disposed in recessed sections of the side surfaces. The density of a conductor constituting the coil conductor CM is greater at the side surfaces than at the center.
The present disclosure provides a magnetic material comprising a plurality of metal magnetic particles and an insulating layer that covers each of the plurality of metal magnetic particles. In a cross-sectional view, when any one of the metal magnetic particles among the plurality of metal magnetic particles is defined as a first metal magnetic particle, the metal magnetic particle closest to the first metal magnetic particle, among the metal magnetic particles adjacent to the first metal magnetic particle, is defined as a second metal magnetic particle, and the equivalent circle diameter of the first metal magnetic particle is defined as d, and the shortest distance between the surface of the first metal magnetic particle and the surface of the second metal magnetic particle is defined as 2δ, the standard deviation of the δ/d value is greater than 0 and equal to or less than 0.092, and the average value of the δ/d value is 0.001-0.085.
H01F 1/24 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 1/052 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules caractérisées par un mélange de particules de dimensions différentes ou par la distribution granulométrique des particules
C22C 19/03 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel
C22C 38/00 - Alliages ferreux, p. ex. aciers alliés
H01F 1/147 - Alliages caractérisés par leur composition
H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
A multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, first and second main surfaces, first and second side surfaces, first and second end surfaces, and first and second internal electrode layers laminated alternately with the plurality of dielectric layers and respectively exposed on the first and second end surfaces, a first outer electrode covering portions of the first end surface and the first main surface, and a second outer electrode covering portions of the second end surface and the first main surface. The first and second outer electrodes each include a thin film layer, a lower plating layer, an upper plating layer, and a front plating layer. An end edge portion of the thin film layer located adjacent to a center of the multilayer body is spaced apart from the multilayer body.
A multilayer ceramic capacitor includes end surface internal electrodes each exposed at end surfaces of a laminate, and side surface internal electrodes each exposed at side surfaces of the laminate. An end surface internal electrode closest to a first-main-surface side has a greater cross-sectional area in a first reference cross-section than an end surface internal electrode with a greatest cross-sectional area in the first reference cross-section among the end surface internal electrodes in either of a second-main-surface-side region and an intermediate region. A side surface internal electrode closest to the first-main-surface side has a greater cross-sectional area in a second reference cross-section than a side surface internal electrode that has a greatest cross-sectional area in the second reference cross-section among the side surface internal electrodes in either of the second-main-surface-side region and the intermediate region.
A laminated ceramic capacitor includes dielectric layers, first and second internal electrode layers respectively exposed at first and second end surfaces, and first and second external electrodes respectively on first and second end surfaces. The first and second external electrodes include an underlying electrode layer including a metal component, a conductive resin layer above the underlying electrode layer and including a thermosetting resin and a metal filler, and a plating layer above the conductive resin layer. The metal filler of the conductive resin layer includes a flat filler with a flat shape. A void is included on a surface of the flat filler.
A composite sensor includes a substrate including first and second surfaces facing in opposite directions, an optical proximity sensor including a first light emitter and a first light receiver on the first surface of the substrate to output a signal dependent on a distance to an object by receiving, at the first light receiver, light emitted from the first light emitter and reflected by the object, a force sensor on the second surface of the substrate to output a signal dependent on a component of force that is perpendicular or substantially perpendicular to the substrate, a processor configured or programmed to process the signal from the optical proximity sensor and the signal from the force sensor and calculate information on the distance to the object and information on force received from the object.
G01D 21/02 - Mesure de plusieurs variables par des moyens non couverts par une seule autre sous-classe
G01C 3/06 - Utilisation de moyens électriques pour obtenir une indication finale
G01L 1/24 - Mesure des forces ou des contraintes, en général en mesurant les variations des propriétés optiques du matériau quand il est soumis à une contrainte, p. ex. par l'analyse des contraintes par photo-élasticité
24.
SECONDARY BATTERY AND METHOD OF MANUFACTURING SECONDARY BATTERY
A secondary battery using a negative electrode capable of improving a cycle characteristic, improving energy density, and improving safety of the secondary battery without provision of a recess or a protrusion in a negative electrode current collector. In the secondary battery, a negative electrode active material layer has a compound containing silicon. The negative electrode active material layer has a plurality of recessed portions in which a surface on an opposite side to a surface adjacent to the negative electrode current collector is recessed toward the negative electrode current collector side, and a protruding portion formed on both sides of the recessed portion.
H01M 10/0585 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure plats, c.-à-d. des électrodes positives plates, des électrodes négatives plates et des séparateurs plats
A 90° coupler includes a first capacitor having a first end connected to a first terminal and a second end connected to a first amplifier, a first inductor having a first end connected to the first terminal and a second end connected to a second amplifier, a second inductor having a first end connected to the second end of the first capacitor and a second end connected to the ground through a resistance element and electromagnetically coupling to the first inductor, and a second capacitor having a first end connected to the first terminal and a second end connected to the second end of the second inductor.
H03F 1/56 - Modifications des impédances d'entrée ou de sortie, non prévues ailleurs
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
26.
RADAR SYSTEM AND SIGNAL PROCESSING METHOD FOR THE SAME
A radar system includes a first device that acquires a displacement of the subject of displacement acquisition by transmitting and receiving a radio wave, and a second device installed at the subject capable of transmitting to and receiving from the first device. The second device has a first mode in which it reradiates a received radio wave and a second mode in which it delays a phase of a received radio wave before reradiating. The first device acquires first IQ information while the second device is operating in the first mode and second IQ information while the second device is operating in the second mode. The first device then calculates a direct-current component of the first IQ information and generates third IQ information by removing the direct-current component from the first IQ information.
G01S 13/32 - Systèmes pour mesurer la distance uniquement utilisant la transmission d'ondes continues, soit modulées en amplitude, en fréquence ou en phase, soit non modulées
G01S 13/82 - Systèmes utilisant la reradiation d'ondes radio, p. ex. du type radar secondaireSystèmes analogues dans lesquels des signaux de type continu sont transmis
G01S 13/88 - Radar ou systèmes analogues, spécialement adaptés pour des applications spécifiques
A cylindrical secondary battery is provided and including: an electrode wound body having a structure in which a band-shaped positive electrode and a band-shaped negative electrode are stacked and wound with a separator interposed therebetween; a battery can accommodating the electrode wound body with one end portion being open while the electrode wound body is accommodated; and a battery lid provided at the one end portion of the battery can and having two or more opening portions, wherein the two or more opening portions have a non-overlapping form during rotation that does not overlap the two or more opening portions before rotation when the two or more opening portions are rotated by more than 0° and less than 360° about an axis of a cylindrical shape of the secondary battery in top view, and the battery lid has a cleavage impression at any one of joints between two adjacent opening portions out of the two or more opening portions.
H01M 50/152 - Couvercles caractérisés par leur forme pour des cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
H01M 10/0587 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure enroulés, c.-à-d. des électrodes positives enroulées, des électrodes négatives enroulées et des séparateurs enroulés
H01M 50/107 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une section transversale courbe, p. ex. ronde ou elliptique
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and inner electrode layers that are laminated, and an outer electrode to establish electrical continuity with the inner electrode layers. In the multilayer body, an outer surface at a boundary portion between an end-surface-side ineffective portion and a perpendicular ridge ineffective portion, an outer surface of the perpendicular ridge ineffective portion, and an outer surface at a boundary portion between the perpendicular ridge ineffective portion and a side-surface-side ineffective portion define a contiguous curved surface protruding outward in plan view in a lamination direction, and a protection film including carbon and silicon is provided on the curved surface.
An acoustic wave resonator includes a piezoelectric layer and an IDT electrode. Electrode fingers of the IDT electrode are arranged in a first direction along a main surface of the piezoelectric layer. A region where the IDT electrode is provided includes split regions in a matrix in the first direction and a second direction in which the electrode fingers extend. The split region includes some of the electrode fingers and a portion of the electrode fingers in the longitudinal direction. The split regions include one split region and another split region adjacent to each other in the second direction. A duty in the one split region is larger than a duty in the another split region, and an electrode finger pitch in the one split region is smaller than an electrode finger pitch in the another split region.
The present disclosure provides a vibration device and an imaging device that prevent foreign matter from collecting in a central part of a translucent body due to vibration and do not cause a decrease in vibration performance. A vibration device (10) comprises: an outermost-layer lens (1) (translucent body) that transmits light of a prescribed wavelength; a vibrating body (3) that contacts the outermost-layer lens (1) and vibrates the outermost-layer lens (1); a piezoelectric element (5) provided to the vibrating body (3); and a housing (2) that retains the outermost-layer lens (1) and covers the vibrating body (3). The vibrating body (3) includes: a first cylindrical part (31) that has a cylindrical shape and is in contact with the outermost-layer lens (1); a second cylindrical part (32) that is provided with the piezoelectric element (5); and a spring part (33) that links the first cylindrical part (31) and the second cylindrical part (32). The vibrating body (3) is such that at least one of the shape of the vibrating body (3), the physical characteristics of the material constituting the vibrating body (3), the position of the outermost-layer lens (1) in contact with the first cylindrical part, and the position of the piezoelectric element (5) provided to the second cylindrical part (32) is asymmetrical with respect to a central axis (C) of the cylindrical shape of the vibrating body (3).
G03B 30/00 - Modules photographiques comprenant des objectifs et des unités d'imagerie intégrés, spécialement adaptés pour être intégrés dans d'autres dispositifs, p. ex. des téléphones mobiles ou des véhicules
H04N 23/52 - Éléments optimisant le fonctionnement du capteur d'images, p. ex. pour la protection contre les interférences électromagnétiques [EMI] ou la commande de la température par des éléments de transfert de chaleur ou de refroidissement
H04N 23/57 - Détails mécaniques ou électriques de caméras ou de modules de caméras spécialement adaptés pour être intégrés dans d'autres dispositifs
This gas sensor comprises: a substrate; a detection element that is supported by the substrate and has a detection unit; an inner wall that is supported by the substrate and surrounds the detection unit; an outer wall that is supported by the substrate and surrounds the inner wall; and a lid part that is supported by the inner wall and the outer wall, closes a detection chamber that is a space inside the inner wall in which the detection unit is provided, and closes a flow path that is a space between the inner wall and the outer wall. The outer wall has a first outer hole penetrating in a first direction so as to communicate the outer side of the outer wall and the flow path, and a second outer hole provided on the opposite side of the first outer hole with respect to the detection chamber in the first direction and penetrating in the first direction so as to communicate the outer side of the outer wall and the flow path. The inner wall has an inner hole penetrating in a second direction so as to communicate the flow path and the detection chamber, the second direction intersecting the first direction.
G01N 27/18 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la résistance d'un corps chauffé électriquement dépendant de variations de température produite par des variations de la conductivité thermique d'un matériau de l'espace environnant à tester
G01N 25/18 - Recherche ou analyse des matériaux par l'utilisation de moyens thermiques en recherchant la conductivité thermique
G01N 27/22 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant l'impédance en recherchant la capacité
Provided is a stretchable device comprising: a stretchable substrate; stretchable wiring disposed on a main surface of the stretchable substrate; an electronic component electrically connected to the stretchable wiring; a first stretchable covering layer covering the stretchable wiring; and a protective resin covering the electronic component. The stretchable device is provided with an overlapping region in which the protective resin and a portion of the first stretchable covering layer overlap when viewed from the thickness direction of the stretchable substrate. The overlapping region is positioned at least over the stretchable wiring when viewed from the thickness direction. In the overlapping region, the overlapping width between the first stretchable covering layer and the protective resin is greater than the thickness of the first stretchable covering layer.
This high frequency circuit (1) comprises: a 90° hybrid circuit (10) having output terminals (10b and 10c); a combination circuit (30) having input terminals (30b and 30c) and an output terminal (30a); power amplifiers (21 and 22); a switch (41) having common terminals (41a and 41b) and selection terminals (41c and 41d); and filters (51 and 52). The input end of the power amplifier (21) is connected to the output terminal (10b) and the output end is connected to the common terminal (41a). The input end of the power amplifier (22) is connected to the output terminal (10c) and the output end is connected to the common terminal (41b). The input end of the filter (51) is connected to the selection terminal (41c) and the output end is connected to the input terminal (30b). The input end of the filter (52) is connected to the selection terminal (41d) and the output end is connected to the input terminal (30c). The number of elastic wave resonators in the filter (52) is greater than the number of elastic wave resonators in the filter (51).
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 1/52 - Circuits pour la protection de ces amplificateurs
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H03F 3/68 - Combinaisons d'amplificateurs, p. ex. amplificateurs à plusieurs voies pour stéréophonie
H03H 7/48 - Réseaux pour connecter plusieurs sources ou charges, fonctionnant sur la même fréquence ou dans la même bande de fréquence, à une charge ou à une source commune
Provided is a battery module which can be easily manufactured and in which there is reduced contact between an ejected substance that has been ejected from an abnormal battery where an abnormality occurred and a normal battery adjacent to the abnormal battery. A battery module BM according to the present disclosure comprises: a plurality of batteries BT that are each provided with an explosion-proof valve EV on the upper surface thereof and are arranged side by side in a first direction; a first heat-insulating plate HI1 that is disposed above the plurality of batteries BT; and second heat-insulating plates HI2 that are disposed between the plurality of batteries. The first heat-insulating plate HI1 is provided with a plurality of openings OP that are respectively provided at positions facing the explosion-proof valves EV and are arranged side by side in the first direction, and slits SL that are provided between the openings OP. The second heat-insulating plates HI2 are provided with body portions BP that face the batteries BT, and protruding portions PP that protrude from the body portions BP toward the first heat-insulating plate HI1. The protruding portions PP are inserted into the slits SL, and the protruding portions PP cover the openings OP.
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
H01M 50/291 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
This electronic component comprises an element body (20), an inorganic oxide layer (30) that covers the outer surface (21) of the element body (20), and a glass layer (50) that covers the outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. In the inorganic oxide layer (30), the concentration of the same element as one or more elements selected from the alkali metal and the alkaline earth metal contained in the glass layer (50) is less than the concentration of the same element in the glass layer (50).
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01C 1/032 - BoîtiersEnveloppesEnrobageRemplissage de boîtier ou d'enveloppe avec plusieurs couches entourant l'élément résistif
H01G 13/00 - Appareils spécialement adaptés à la fabrication de condensateursProcédés spécialement adaptés à la fabrication de condensateurs non prévus dans les groupes
Provided is an electronic component comprising: an element body (20); an inorganic oxide layer (30) that covers an outer surface (21) of the element body (20); and a glass layer (50) that covers an outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. Voids (P) are present between the element body (20) and the inorganic oxide layer (30).
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01C 1/032 - BoîtiersEnveloppesEnrobageRemplissage de boîtier ou d'enveloppe avec plusieurs couches entourant l'élément résistif
H01C 7/02 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température positif
H01C 7/10 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants sensibles à la tension, p. ex. varistances
A battery 1 comprises: an electrode assembly 10 that has a positive electrode mixture layer 11a, a negative electrode mixture layer 11b, and a first current collector 12; and a second current collector 20 that accommodates the electrode assembly 10 and that is electrically connected to the positive electrode mixture layer 11a. The second current collector 20 has a shape obtained by bending one sheet member SH which has a first opening 23. The first current collector 12 is provided with a body part 12a that is electrically connected to the negative electrode mixture layer 11b inside the second current collector 20 and a protruding part 12b that protrudes from the body part 12a, that passes through the first opening 23, and that is exposed from the second current collector 20.
H01M 50/178 - Dispositions pour introduire des connecteurs électriques dans ou à travers des boîtiers adaptées à la forme des cellules pour des cellules en forme de poches ou de sacs souples
H01M 50/188 - Éléments de scellement caractérisés par la position des éléments de scellement les éléments de scellement étant arrangés entre le couvercle et la borne
H01M 50/211 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules en forme de poche
H01M 50/531 - Connexions d’électrodes dans un boîtier de batterie
This high frequency circuit (1) comprises: a switch circuit (51) that includes common terminals (511 and 512) respectively connected to antenna connection terminals (101 and 102) and selection terminals (513, 514, and 515); a switch circuit (52) that includes selection terminals (523 and 524) respectively connected to common terminals (521 and 522) and low-noise amplifiers (22 and 23), and a selection terminal (525) connected to a power amplifier (12); a filter (31) for the reception band of an FDD band A connected between the selection terminal (513) and a low-noise amplifier (21); a filter (32) for the transmission band of the FDD band A connected between the selection terminal (513) and a power amplifier (11); a filter (33) for a TDD band B connected between the selection terminal (514) and the common terminal (521); and a filter (34) for the TDD band B connected between the selection terminal (515) and the common terminal (522).
H04B 1/38 - Émetteurs-récepteurs, c.-à-d. dispositifs dans lesquels l'émetteur et le récepteur forment un ensemble structural et dans lesquels au moins une partie est utilisée pour des fonctions d'émission et de réception
H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
39.
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Provided is a surface-treated copper foil that has excellent adhesion between a resin substrate and the surface-treated copper foil, has low transmission loss, and can be used to manufacture a printed circuit board or the like with good laser workability. This surface-treated copper foil has, on at least one side, a roughened surface on which roughened particles have been formed, and measured physical values for the roughened surface fulfill the following (a), (b), and (c). (a) The true reflectance of the roughened surface, measured using a spectrophotometer with a light source that emits 45° polarized light at a wavelength of 600 nm, and on condition that the incidence angle and the reflection angle are both 70°, is at least 0.20% and no greater than 0.90%. (b) The Y value for the brightness of the roughened surface is at least 10.0 and no greater than 15.5. (c) The Ssk of the roughened surface, measured using a laser microscope, is at least 0.30 and no greater than 0.80.
A power amplification system includes: a first power amplifier configured to amplify a first radio-frequency signal; a second power amplifier configured to amplify a second radio-frequency signal; a switched-capacitor circuit configured to generate multiple discrete voltages based on a regulated voltage supplied from a pre-regulator; an output switch circuit configured to selectively output at least one of the multiple discrete voltages as a first power supply of the first power amplifier; and a digital predistortion circuit configured to predistort the first and second radio-frequency signals. The pre-regulator circuit is configured to convert an input voltage to the regulated voltage. The regulated voltage is provided as a second power supply of the second power amplifier without using the switched-capacitor circuit. The digital predistortion circuit predistorts the first radio-frequency signal by using a first mathematical-expression model for digital predistortion. The first mathematical-expression model is not applied on the second radio-frequency signal.
A power amplification system includes: a first power amplifier; an output switch circuit configured to output a power supply to the first power amplifier; a filter circuit that is to connect to a first path in a switchable manner, the first path providing the power supply from the output switch circuit to the first power amplifier; and a digital predistortion circuit configured to generate distortions in a first input signal of the first power amplifier. When the filter circuit is not connected to the first path, the digital predistortion circuit generates the distortions by using a first mathematical-expression model with the first parameter set. When the filter circuit is connected to the first path, the digital predistortion circuit generates the distortions by using a second mathematical-expression model with the second parameter set. The first and second parameter sets are at least partially different from each other.
A biological information measurement device in which a biological signal with a harmonic structure is input to a variable band-pass filter. A first signal, which has passed through the variable band-pass filter, is input to a frequency calculator. The frequency calculator outputs a second signal including information related to a frequency of the input first signal. A biological information acquirer acquires biological information from the second signal. A band-pass filter controller shifts a passband of the variable band-pass filter based on the information related to the frequency included in the second signal.
A soil modifier that includes: base particles that are particles of SiO2 having a particle size of 100 nm or more, and the central particle size of the base particles is 120 nm to 800 nm in a particle size distribution of the SiO2 particles. A culture soil includes soil and the base particles.
C09K 17/04 - Substances pour conditionner ou stabiliser les sols contenant uniquement des composés inorganiques appliqués sous une forme physique autre qu'une solution ou un coulis, p. ex. sous forme de granulés ou de gaz
A01G 24/12 - Substrats de cultureMilieux de cultureAppareils ou méthodes à cet effet basés sur ou contenant de la matière inorganique contenant des minéraux du sol
A01G 24/42 - Substrats de cultureMilieux de cultureAppareils ou méthodes à cet effet caractérisés par leur structure de structure granulaire ou agrégée
45.
POWER AMPLIFIER CIRCUIT AND POWER AMPLIFICATION DEVICE
A power amplifier circuit includes a first coupler that splits a first signal into a second signal and a third signal that is out of phase with the second signal; a carrier amplifier that amplifies the second signal to output a first amplified signal; a peak amplifier that amplifies the third signal to output a second amplified signal; a second coupler that generates a third amplified signal by combining the first amplified signal and the second amplified signal; and a first bias circuit that switches the bias point of the peak amplifier between a first bias point and a second bias point higher than the first bias point.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
An acoustic wave device includes an insulating layer including a recess, a piezoelectric layer on the insulating layer and over the recess to define a cavity, a first excitation electrode on a first surface of the piezoelectric layer opposite to the cavity, a second excitation electrode on a second surface of the piezoelectric layer and within the cavity, a dielectric layer on the first excitation electrode, and a first frame on the second excitation electrode and within the cavity.
A conductive paste for forming inner electrodes of a multilayer ceramic capacitor includes a conductive metal powder, a ceramic powder, an organic solvent, and an organic binder. At least a portion of the ceramic powder includes a powder including an ABO3-type oxide with a specified ionic radius. A ratio of a six-coordinate ionic radius of an A-site element in ABO3 to a six-coordinate ionic radius of a metal included in the conductive metal powder is about 0.97 or greater and about 1.02 or less.
A multilayer ceramic capacitor includes a multilayer body including stacked dielectric layers, first and second internal electrode layers respectively exposed at first and second end surfaces and a second internal electrode layer, and first and second external electrodes. The multilayer body includes an internal layer portion in which the first and second internal electrode layers are opposed. The dielectric layers include voids segregated in the dielectric layers. The dielectric layers include void-containing dielectric layers which are different from each other in an area occupancy of voids in respective cross-sections of the dielectric layers.
A multilayer ceramic capacitor includes an inner-layer portion including first and second inner electrode layers alternately stacked with dielectric layers, a first primary surface, a second primary surface opposite the first primary surface, a first side surface, a second side surface opposite the first side surface, a first end surface, and a second end surface opposite the first end surface, a first outer-layer portion covering the first primary surface in the stacking direction, a second outer-layer portion covering the second primary surface in the stacking direction, and a pair of outer end surface electrodes on the first and second end surfaces. Each of the ceramic dielectrics of the inner-layer portion, the first outer-layer portion, and the second outer-layer portion includes dielectric particles with a void therein. Intragranular void densities in the ceramic dielectric in the inner-layer portion (Ninner), and in the first and second portions (Nouter) satisfy Nouter
A multilayer ceramic capacitor includes a laminate, first and second internal electrode layers on dielectric layers, and first and second external electrodes on first and second end surfaces. The first and second external electrodes include a conductive resin layer including an underlayer electrode layer including a metal component and a thermosetting resin and a metal filler on the underlayer electrode layer, a Ni plating layer on the conductive resin layer, and a Sn plating layer on the Ni plating layer. Ni is provided on at least a portion of a surface of the metal filler, as a component of the Ni plating layer.
A module includes a first floor portion and a second floor portion in contact with an upper side of the first floor portion. Each of the first and second floor portions include a component group and a sealing resin sealing the component group. An interconnection is electrically connected to each component of the second component group on a lower surface of the second floor portion. A conductor pillar is in the first floor portion and extends through the first sealing resin in a thickness direction to electrically connect a lower surface of the first floor portion and the lower surface of the second floor portion. A ground conductor pattern covers at least a part of a 10 reference region. The ground conductor pattern is electrically isolated from the interconnection. The first sealing resin and the second sealing resin are in direct contact with each other in at least any part.
H01L 23/552 - Protection contre les radiations, p. ex. la lumière
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
A Doherty amplifier circuit includes a 90° hybrid coupler that includes an input terminal receiving a first input signal, a first output terminal outputting a first output signal on the basis of the first input signal, a second output terminal outputting, on the basis of the first input signal, a second output signal different in phase by 90° from the first output signal, and an isolation terminal whose isolation from the input terminal is ensured; a carrier amplifier that amplifies the first output signal to output a first amplified signal; and a peak amplifier that amplifies the second output signal to output a second amplified signal. The isolation terminal is a terminal which receives a second harmonic in the second harmonic frequency band of the first input signal.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 1/32 - Modifications des amplificateurs pour réduire la distorsion non linéaire
H03F 3/60 - Amplificateurs dans lesquels les réseaux de couplage ont des constantes réparties, p. ex. comportant des résonateurs de guides d'ondes
53.
HIGH FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS
A high frequency circuit (1) comprises a 90° hybrid circuit (10) including an input terminal (10a) and output terminals (10b and 10c), a synthesis circuit (30) including input terminals (30b and 30c) and an output terminal (30a), power amplifiers (21 and 22), a switch (43) including a common terminal (43a) and selection terminals (43b and 43c), and a clamp circuit (65). An input end of the power amplifier (21) is connected to the output terminal (10b), an output end of the power amplifier (21) is connected to the input terminal (30b) and the selection terminal (43c), an input end of the power amplifier (22) is connected to the output terminal (10c), an output end of the power amplifier (22) is connected to the input terminal (30c) and the selection terminal (43b), and the clamp circuit (65) is connected between the common terminal (43a) and the ground.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 1/52 - Circuits pour la protection de ces amplificateurs
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H03F 3/68 - Combinaisons d'amplificateurs, p. ex. amplificateurs à plusieurs voies pour stéréophonie
H03H 7/01 - Réseaux à deux accès sélecteurs de fréquence
H03H 7/21 - Réseaux pour commande de déphasage produisant plusieurs signaux de sortie décalés en phase, p. ex. sortie à n phases
H03H 7/48 - Réseaux pour connecter plusieurs sources ou charges, fonctionnant sur la même fréquence ou dans la même bande de fréquence, à une charge ou à une source commune
A Doherty amplification circuit (10) to which a D-ET mode or an SPT mode is applied comprises: a power amplifier (11) used as a carrier amplifier; a power amplifier (12) used as a peak amplifier; and a synthesizer (22) including an input terminal (221) connected to an output terminal of the power amplifier (11), an input terminal (222) connected to an output terminal of the power amplifier (12), and an output terminal (223). The size of the power amplifier (12) is smaller than the size of the power amplifier (11).
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H03F 3/68 - Combinaisons d'amplificateurs, p. ex. amplificateurs à plusieurs voies pour stéréophonie
The present invention provides a piezoelectric vibrator, the frequency precision of which is adjustable after encapsulation. A piezoelectric vibrator (1) comprises: a piezoelectric vibration element (10) having a vibrating part (110) and excitation electrodes (14a, 14b) respectively provided on upper and lower surfaces of the vibrating part (110); an upper substrate layer (20) provided on the upper-surface side of the piezoelectric vibration element (10); a lower substrate layer (30) provided on the lower-surface side of the piezoelectric vibration element (10); first resin bonding materials (X1, X2) provided between the upper substrate layer (20) and the lower substrate layer (30), and along an outer periphery in a plan view; and a first protective film (F1) having light-shielding properties against irradiating light (R) of a prescribed wavelength for cleaning the excitation electrodes (14a, 14b), said film being provided on the upper substrate layer (20) and/or the lower substrate layer (30) in an area overlapping the first resin bonding materials (X1, X2) in a plan view.
A battery 1 includes: an electrode assembly 10 having a positive electrode 11a and a negative electrode 11b the potential of which is different from the positive electrode 11a; an exterior member 40 that includes a first main surface 41a having a first opening 41b and a second main surface 42a having a second opening 42b, and that houses the electrode assembly 10; and a first conductor 20 and a second conductor 30 electrically connected to the positive electrode 11a inside the exterior member 40. The exterior member 40 is electrically connected to the negative electrode 11b. The first main surface 41a and the second main surface 42a are opposite to each other across the electrode assembly 10. The first conductor 20 has a first exposed part 21 exposed from the first opening 41b. The second conductor 30 has a second exposed part 31 exposed from the second opening 42b.
H01M 50/178 - Dispositions pour introduire des connecteurs électriques dans ou à travers des boîtiers adaptées à la forme des cellules pour des cellules en forme de poches ou de sacs souples
H01M 50/184 - Éléments de scellement caractérisés par leur forme ou leur structure
H01M 50/186 - Éléments de scellement caractérisés par la position des éléments de scellement
H01M 50/211 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules en forme de poche
This elastic wave device comprises a mounting substrate, an elastic wave element that is mounted on the mounting substrate, and a resin member that is provided to at least a portion of a surface of the elastic wave element that faces the mounting substrate. The elastic wave element is provided with a piezoelectric layer that has a first main surface and a second main surface on opposite sides from each other, an electrode that is provided to at least one of the first main surface and the second main surface of the piezoelectric layer, and a support member that is provided to the second-main-surface side of the piezoelectric layer and is provided with a cavity on the second-main-surface-side of the piezoelectric layer. The piezoelectric layer has an opening that is provided in a region overlapping an outer edge of the cavity. The support member has a side portion and a bottom portion that form the cavity, and has a plurality of protrusions that are provided to at least one of the side portion and the bottom portion in a region overlapping the opening of the piezoelectric layer.
H03H 9/25 - Détails de réalisation de résonateurs utilisant des ondes acoustiques de surface
H03H 3/08 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface
This capacitor element 1 comprises: a capacitor part 10 which includes a positive electrode plate 11 that has a porous part 11B on at least one main surface of a core part 11A, a dielectric layer 13 that is provided on the surface of the porous part 11B, and a negative electrode layer 12 that is provided on the surface of the dielectric layer 13; and a sealing layer 20 that is provided so as to cover at least one main surface of the capacitor part 10. The surface roughness R1 of a first portion on a first side surface of the porous part 11B exposed at a side edge end of the capacitor part 10 is higher than the surface roughness R2 of a second portion on a second side surface of the porous part 11B exposed in a recess that is provided on a main surface of the capacitor part 10.
H01G 9/28 - Combinaisons structurales de condensateurs électrolytiques, de redresseurs électrolytiques, de détecteurs électrolytiques, de dispositifs de commutation électrolytiques, avec d'autres composants électriques non couverts par la présente sous-classe
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
An elastic wave device (1) comprises: a support member that includes a support substrate (34); a piezoelectric layer (31) that is disposed on the support member and has main surfaces (31a and 31b) facing each other; an IDT electrode (10) that is disposed on the main surface (31a); an IDT electrode (20) that is disposed on the main surface (31b); and a dielectric film (41) that covers at least a portion of the IDT electrode (10). The IDT electrode (20) is covered by the support member, and when the main surfaces (31a and 31b) are seen in plan view, a first electrode finger among a plurality of electrode fingers included in the IDT electrode (10) at least partially overlaps a second electrode finger among a plurality of electrode fingers included in the IDT electrode (20). The electrode finger duty of the second electrode finger is less than the electrode finger duty of the first electrode finger.
An electronic component is provided that includes a substrate having a top side and a bottom side. The substrate defines a horizontal xy-plane and a vertical z-direction that is perpendicular to the xy-plane. An ASIC die is provided having a top side and a bottom side that is attached to the top side of the substrate. Moreover, a MEMS die is provided that includes a top part and a bottom part, the bottom part including at least one horizontal surface and at least one non-horizontal surface. An adhesive layer extends from the top side of the ASIC die to the horizontal surface and to a portion of the non-horizontal surface of the bottom part of the MEMS die. A bonding pad is attached to the top side of the ASIC die adjacent to the adhesive layer. An electrical connection extends from the bonding pad to the MEMS die.
A vibration device that includes: an internal vibration body constructed to amplify vibration; a piezoelectric element connected to a first end of the internal vibration body in a first direction and constructed to generate vibration; a light transmissive body connected to a second end of the internal vibration body in the first direction and has an optical axis extending in the first direction; and an external vibration body including a first connection portion connected to the light transmissive body and an attenuator portion that extends in a second direction intersecting the first direction from the first connection portion toward an outside of the light transmissive body and constructed to attenuate vibration, wherein the attenuator portion has non-axisymmetry with respect to the optical axis.
G02B 27/00 - Systèmes ou appareils optiques non prévus dans aucun des groupes ,
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
B08B 7/02 - Nettoyage par des procédés non prévus dans une seule autre sous-classe ou un seul groupe de la présente sous-classe par distorsion, battage ou vibration de la surface à nettoyer
B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
A secondary battery is provided and includes a positive electrode, a negative electrode, and an electrolytic solution. The positive electrode includes a positive electrode active material layer. The positive electrode active material layer includes positive electrode active material particles. The positive electrode active material particles each include a center part and a covering part. The center part includes a lithium composite oxide. The covering part is provided on a surface of the center part. The lithium composite oxide has a layered rock-salt crystal structure, and includes lithium, nickel, and another element as constituent elements. Where a sum of a content of nickel in the lithium composite oxide and a content of the other element in the lithium composite oxide is taken as 100 parts by mole, the content of nickel is greater than or equal to 80 parts by mole and less than or equal to 100 parts by mole. Based on an analysis of the positive electrode active material layer in a depth direction by time-of-flight secondary ion mass spectrometry, a first negative secondary ion derived from NiO2− and a second negative secondary ion derived from LiBO2F− are detectable, and a first depth profile and a second depth profile are acquirable.
H01M 4/525 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de nickel, de cobalt ou de fer d'oxydes ou d'hydroxydes mixtes contenant du fer, du cobalt ou du nickel pour insérer ou intercaler des métaux légers, p. ex. LiNiO2, LiCoO2 ou LiCoOxFy
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 4/131 - Électrodes à base d'oxydes ou d'hydroxydes mixtes, ou de mélanges d'oxydes ou d'hydroxydes, p. ex. LiCoOx
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
A transducer that includes: a base portion; a plurality of beam portions each having a fixed end portion connected to the base portion and a crest portion located close to a center of the base portion on a side thereof opposite to the fixed end portion, the plurality of beam portions each extending from the fixed end portion toward the crest portion; and a connection portion that connects a pair of beam portions of the plurality of beam portions to each other, the pair of beam portions being adjacent to each other in a peripheral direction of the base portion, wherein the connection portion includes: at least one bent portion, and at least one dividing slit in the connection portion, the at least one dividing slit dividing the connection portion such that the connection portion is partially branched and rejoined.
An acoustic wave device includes an insulating layer and a piezoelectric layer defining a cavity, a first excitation electrode on a first surface of the piezoelectric layer opposite to the cavity, a second excitation electrode on a second surface of piezoelectric layer and within the cavity, a wiring electrode on the piezoelectric layer and connected to the first excitation electrode, a lid, a conductive wall extending between a first portion of the wiring electrode and the lid, and a sealing frame extending between a second portion of the wiring electrode and the lid. A first width of a first portion of the sealing frame is larger than a second width of a second portion of the sealing frame. A third width of the second portion of the wiring electrode is smaller than the first width and is larger than the second width.
A multilayer ceramic capacitor includes a multilayer body including ceramic dielectric layers stacked together and inner electrodes extending along interfaces between the dielectric layers. The inner electrodes include a conductive component including X and a ceramic component including XTiO3, where X represents a conductive metal or an alloy including a conductive metal.
An antenna component includes a radiator located on a negative side of a Z-axis relative to a first radiating conductor layer and connected to the first radiating conductor layer. A first ground conductor layer overlaps with the first radiating conductor layer and the radiator as viewed in a negative direction of the Z-axis and is located on the negative side of the Z-axis relative to the first radiating conductor layer. A composite dielectric constant of a first region is higher than a composite dielectric constant of a second region.
A multilayer substrate includes a first insulator layer including a first through-hole penetrating the first insulator layer along a Z-axis, a second insulator layer including a second through-hole penetrating the second insulator layer along the Z-axis. The second through-hole overlaps the first through-hole when viewed downward. When viewed in a positive direction of the Z-axis, an area of an end portion of the second through-hole on a positive side of the Z-axis is larger than an area of an end portion of the first through-hole on a negative side of the Z-axis. A first interlayer connection conductor extends along the Z-axis inside the first through-hole and the second through-hole and electrically connects first and second conductor layers. A space exists between a boundary of the first insulator layer and the second insulator layer and the first interlayer connection conductor.
Circuits and methods for a radio frequency amplifier, such as an LNA, that include a wideband coupled input impedance matching network. One embodiment includes a first inductor coupled between a first terminal and a first node, the first terminal couplable to a degeneration terminal of an amplifier core; a second inductor coupled between a second terminal and either the first node or a second node, the second terminal couplable to an input terminal of the amplifier core; a third inductor coupled between the first node and a third terminal, the third terminal couplable to a reference potential; and, in a variant embodiment, a fourth inductor coupled between the second node and a fourth terminal, the fourth terminal couplable to the reference potential; wherein the first inductor and the second inductor are mutually coupled. Some embodiments allow multiple modes to allow tradeoffs of gain versus linearity and NF characteristics.
H03F 1/56 - Modifications des impédances d'entrée ou de sortie, non prévues ailleurs
H03F 3/195 - Amplificateurs à haute fréquence, p. ex. amplificateurs radiofréquence comportant uniquement des dispositifs à semi-conducteurs dans des circuits intégrés
H03F 3/72 - Amplificateurs commandés, c.-à-d. amplificateurs mis en service ou hors service au moyen d'un signal de commande
A multilayer ceramic capacitor includes an inner-layer portion, first and second outer-layer portions, and first and second side margin portions, and outer electrodes on the first and second end surfaces. Each of ceramic dielectrics of the inner-layer portion, the first and second outer-layer portions, and the first and second side margin portions includes multiple dielectric particles with a void therein. An intragranular void density in the ceramic dielectric in the inner-layer portion (Ninner), intragranular void densities in the ceramic dielectrics in the first outer-layer portion and the second outer-layer portion (Nouter), and intragranular void densities in the ceramic dielectrics in the first side margin portion and the second side margin portion (Nside) satisfy Nouter
Provided is a multilayer ceramic capacitor in which inhibition of connection between a base electrode layer and an internal electrode layer is suppressed and deterioration in moisture resistance is also suppressed. In this multilayer ceramic capacitor (1), the base electrode layer contains a second metal different from a first metal as a main component, the base electrode layer has a first region (71) and a second region (72) from a laminate (2) side, the thickness of the first region (71) in the length direction L is 1.5 times or more the distance between internal electrode layers, the particle diameter of the second metal in the first region (71) is 80% or more and 120% or less of the distance between the internal electrode layers, the content of a glass 90 in the first region (71) is 10% or less, and the content of the glass (90) in the second region (72) is 20% or more and 50% or less.
Provided is a multilayer inductor in which a concentration of current density is mitigated and heat generation is reduced. A multilayer inductor according to the present disclosure comprises an element body 10 and an external electrode 20 provided to a mounting surface of the element body 10, wherein: the element body 10 is obtained by layering each of a coil conductor part CL, a magnetic part ML that is disposed around the coil conductor part CL and is configured by joining a plurality of metal magnetic particles, and through hole conductor parts TL that electrically connect each of the external electrode 20 and one end or the other end of the coil conductor part CL; a through hole conductor obtained by layering the through hole conductor parts TL comprises a coil-side through hole conductor part TL1 that is in contact with the coil conductor part CL and an external electrode-side through hole conductor part TL2 that is in contact with the external electrode 20; and the coil-side through hole conductor part TL1 projects further toward the inside of the element body 10 relative to the external electrode-side through hole conductor part TL2.
This elastic wave device comprises: a piezoelectric layer having a first main surface and a second main surface that face each other; an electrode provided to at least one of the first main surface and the second main surface of the piezoelectric layer; and a support member provided to the second main surface side of the piezoelectric layer and provided with a cavity part on the second main surface side of the piezoelectric layer. A membrane part that includes at least a portion of the piezoelectric layer is formed in a region that overlaps the cavity part. The support member has a first portion and a modified second portion. The second portion is disposed at a position closer to the cavity part as compared with the first portion. The membrane part has a third portion and a modified fourth portion. The fourth portion is disposed at a position closer to the cavity part as compared with the third portion.
H03H 9/25 - Détails de réalisation de résonateurs utilisant des ondes acoustiques de surface
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 3/08 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux utilisant des ondes acoustiques de surface
This compression resin sealing and molding device is for molding a sealing resin layer so as to partially cover a first surface (10a) of a substrate (10) while sealing a component (13) disposed on the first surface (10a) of the substrate (10) having the first surface (10a) and a second surface (10b) that constitute the front and back of the substrate. The compression resin sealing and molding device comprises: a lower mold that faces the first surface (10a); an upper mold (5) that abuts the second surface (10b); and a pressure sensor (8). The lower mold comprises: a lower mold center part (32) having a lower mold center upper surface corresponding to the lower surface of the sealing resin layer; a stripper part (33) arranged so as to surround the lower mold center part (32); and a passage closing member (35). A notch is provided in a part of the inner periphery of the stripper part (33), and the passage closing member (35) is disposed inside the notch. A cavity for melting and molding a resin material is formed by an inner peripheral side surface of the stripper part (33), a side surface of the passage closing member (35) on the side opposite from the stripper part (33), and the lower mold center upper surface. The stripper part (33) has, on the outside of the cavity, a pocket section that is a recess for accommodating the resin material flowing out from the cavity. The passage closing member (35) can assume, by being lowered, a first state in which outflow of the resin material from the cavity to the pocket section is allowed and, by being lifted, a second state in which outflow of the resin material from the cavity to the pocket section is hindered. The passage closing member (35) has a contact surface facing upward at a constant height. The pressure sensor (8) is disposed on at least one of an upper mold (5) and the lower mold so that the internal pressure of the cavity can be measured.
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
B29C 43/36 - Moules pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
A soft magnetic powder includes soft magnetic particles each having a nucleus that contains a soft magnetic metal and an insulating film on the surface of the nucleus. The insulating film contains Si and a hydrocarbon group having a C8 or longer linear-chain moiety, and the ratio by weight of Si to C in the insulating film is 7.6 or more and 42.8 or less (i.e., from 7.6 to 42.8).
H01F 1/24 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées
H01F 1/147 - Alliages caractérisés par leur composition
A multilayer ceramic capacitor includes a laminate including an inner layer portion and two outer layer portions, and outer electrodes on end surfaces on two sides in a length direction of the laminate and connected to the inner electrode layer. When one of the two outer layer portions is divided into three equal or substantially equal portions in the layering direction, a porosity S1 of an outermost layer positioned on the main surface side, a porosity S2 of a middle layer, and a porosity S3 of an innermost layer positioned on the inner layer portion side satisfy S1>S2>S3.
A capacitor element that includes: a capacitor portion including: an anode plate including a core portion and a porous portion on least one main surface of the core portion, a dielectric layer on a surface of the porous portion, and a cathode layer on a surface of the dielectric layer; a seal layer covering at least one main surface of the capacitor portion. A plurality of through-portions extend through the capacitor portion and the seal layer in a thickness direction. A cover layer with lower moisture permeability than the seal layer 20 is on either one or both of at least a part of a space between an insulating member filled in the through-portions and a wall surface of the anode plate exposed to the through-portions and at least a part of an exposed side surface of the anode plate at an edge of the capacitor portion.
H01G 9/10 - Scellement, p. ex. de fils de traversée
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
H01G 9/048 - Électrodes caractérisées par leur structure
An antenna module includes a patch antenna having feed points, power amplifiers, a transformer having an input-side coil and an output-side coil, and a ¼ wavelength transmission line. An output end of the power amplifier is connected to one end of the input-side coil, an output end of the power amplifier is connected to another end of the input-side coil, one end of the output-side coil is connected to the feed point, another end of the output-side coil is connected to one end of the ¼ wavelength transmission line, and another end of the ¼ wavelength transmission line is connected to the feed point.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
79.
POWER AMPLIFICATION SYSTEM, DIGITAL PREDISTORTION METHOD, AND DIGITAL PREDISTORTION CIRCUIT
A power amplification system includes: a power amplifier, a D-ET mode and an APT mode being selectively applied to the power amplifier; tracker circuitry configured to selectively supply at least one of multiple discrete voltages as a power supply of the power amplifier in each of the D-ET mode and the APT mode; and a digital predistortion circuit configured to predistort an input signal of the power amplifier. When the D-ET mode is applied to the power amplifier, the digital predistortion circuit predistorts the input signal by using a first mathematical-expression model for digital predistortion. When the APT mode is applied to the power amplifier, the digital predistortion circuit predistorts the input signal by using a second mathematical-expression model for digital predistortion or does not predistort the input signal.
H03F 1/32 - Modifications des amplificateurs pour réduire la distorsion non linéaire
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
80.
POWER AMPLIFICATION SYSTEM, POWER AMPLIFICATION METHOD, AND DIGITAL PREDISTORTION CIRCUIT
A power amplification system includes: a power amplifier; an output switch circuit configured to selectively output at least one of three or more discrete voltages as a power supply of the power amplifier; and a digital predistortion circuit configured to generate distortions in an input signal of the power amplifier. In a first mode, the digital predistortion circuit is configured to generate distortions in an input signal of the power amplifier by using a first mathematical-expression model for digital predistortion with a first parameter set. In a second mode with a lower average voltage of the power supply than the first mode, the digital predistortion circuit generates the distortions by using at least a different parameter set from the first parameter set, such as a second mathematical-expression model for digital predistortion with a second parameter set or the first mathematical-expression model with a third parameter set.
H03F 1/32 - Modifications des amplificateurs pour réduire la distorsion non linéaire
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H02M 3/00 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
82.
ARRIVAL DIRECTION ESTIMATION DEVICE AND ARRIVAL DIRECTION ESTIMATION METHOD
An arrival direction estimation device and method are provided to accurately estimating the arrival direction of a radio wave by discriminating true signals from false images caused by antenna imperfections. The device includes an array antenna having a plurality of antenna elements arranged in one direction; a target estimation circuit that estimates an arrival direction of a radio wave based on reception signals from the antenna elements. To validate these arrival directions, an electric power estimation circuit estimates the received electric power for each arrival direction for across a plurality of sub-array antennas having a same number of the antenna elements. A target discrimination circuit determines if a variation amount of the electric power in the arrival direction estimated for each of the sub-array antennas is equal to or less than a predetermined value. An arrival direction with a low power variation is designated as the arrival direction estimation target.
G01S 3/48 - Systèmes pour déterminer une direction ou une déviation par rapport à une direction prédéterminée en utilisant des antennes espacées et en mesurant la différence de phase ou de temps entre les signaux venant de ces antennes, c.-à-d. systèmes à différence de parcours les ondes arrivant aux antennes étant continues ou intermittentes et la différence de phase entre les signaux provenant de ces antennes étant mesurée
H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles
83.
QUARTZ VIBRATING ELEMENT AND QUARTZ VIBRATOR INCLUDING THE SAME
A quartz vibrating element that includes: a quartz substrate having: a vibrating portion; a holding portion; and a support arm that connects the vibrating portion and the holding portion; first and second excitation electrodes on first and second surfaces of the vibrating portion, respectively; first and second extended electrodes on the support arm, and electrically connected to the first and second excitation electrodes, respectively, the first extended electrode extending over a first main surface, a first side surface, and a second main surface of the quartz substrate, and the second extended electrode extending over the first main surface, a second side surface, and the second main surface of the quartz substrate.
An optical detection sensor includes at least four first optical elements and at least one second optical element arranged on a virtual plane. One of the first and second optical elements is a light emitter, and another of the first and second optical elements is a light receiver. At least four first optical elements and one second optical element define a minimum unit. The directional characteristics of the four first optical elements of the minimum unit are the same. The at least four first optical elements are neither arranged on one common straight line passing through the second optical element, nor on one common circumference centered on the second optical element. A calculator obtains a distance from the virtual plane to a target object on a reference axis, an inclination angle, and an inclination azimuth angle of a surface of the target object based on a measurement value.
A hybrid coupler has a first port, a second port, a third port, and a fourth port to which a load is connected. An input signal distributor distributes a first input signal that is a radio frequency signal into a second input signal and a third input signal. The second input signal is inputted to a balanced amplifier. The balanced amplifier outputs two amplified radio frequency signals with a phase difference of 90° from each other from two output ends, one of which is coupled to the first port and another one of which is coupled to the second port. The control amplifier amplifies the third input signal and outputs the amplified third input signal from an output end. The output end of the control amplifier is coupled to the third port without any circuit component affecting impedance matching disposed in between.
A power amplification circuit (10) comprises: an orthogonal hybrid coupler (22) that includes an input port (221) which is connected to an output terminal (213) of a distributor (21) and output ports (222 and 223) which are respectively connected to input ends of power amplifiers (12 and 13); an orthogonal hybrid coupler (23) that includes input ports (232 and 233) which are respectively connected to output ends of the power amplifiers (12 and 13), an isolation port (234) which is connected to an output end of a power amplifier (11), and an output port (231) which is connected to a high-frequency output terminal (102); and a bias circuit (31) that is configured to supply a bias current (Ib1) to the power amplifier (13) in a D-ET mode or an SPT mode and to supply, to the power amplifier (13) in an APT mode, a bias current (Ib2) which has a smaller current value than the bias current (Ib1).
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/20 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C
H03F 3/68 - Combinaisons d'amplificateurs, p. ex. amplificateurs à plusieurs voies pour stéréophonie
87.
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
An inductor component comprises an element body (11), internal wiring, and a first external electrode. The element body (11) contains metal magnetic particles (12) and a synthetic resin (13). The internal wiring extends inside the element body (11). A part of the internal wiring is exposed to the outside of the element body (11). The first external electrode is laminated on a surface of the element body (11). The first external electrode is in contact with the internal wiring. The first external electrode has a first layer (31A) located closest to the element body (11) within the first external electrode. The first layer (31A) contains Cu. A plurality of voids P are present between the first layer (31A) and the synthetic resin (13) in the element body (11).
H01F 17/04 - Inductances fixes du type pour signaux avec noyau magnétique
H01F 27/255 - Noyaux magnétiques fabriqués à partir de particules
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
A vibration motor (10) comprises one movable element magnet (40), a tubular holder (30), driving windings (61, 62), a tubular case (20), and first and second fixed element magnets (51, 52). The tubular holder (30) has a through-hole (300) opening at both end sections in a first direction. The tubular holder (30) houses the movable element magnet (40) in the through-hole (300). The driving windings (61, 62) are wound around the outer periphery of the tubular holder (30). The tubular holder (30) and the driving windings (61, 62) are accommodated in the tubular case (20). The first and second fixed element magnets (51, 52) are respectively positioned at both end sections of the tubular holder (30), sandwiching the movable element magnet (40), so as to each generate a magnetic force that repels the movable element magnet (40). As viewed in the first direction, the movable element magnet (40) has a circular shape, and the through-hole (300) has an n-gon shape.
B06B 1/04 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par électromagnétisme
This health management system executes a bathing determination process, a first acquisition process, a second acquisition process, a pulse data acquisition process, a determination process, and an output process. The bathing determination process is for determining bathing and bathing completion of a subject. The first acquisition process is for acquiring, as a first oxygen saturation level, the result of measurement of the blood oxygen saturation level of the subject during a first measurement period. The second acquisition process is for acquiring, as a second oxygen saturation level, the blood oxygen saturation level of the subject during a second measurement period. The pulse data acquisition process is for acquiring the pulse rate of the subject. The determination process is for making a determination related to the state of health based cardiac failure in the subject, on the basis of the value of the first oxygen saturation level, the value of the second oxygen saturation level, and a change in the pulse rate. The output process is for outputting the result of determination in the determination process.
A61B 10/00 - Instruments pour le prélèvement d'échantillons corporels à des fins de diagnostic Autres procédés ou instruments pour le diagnostic, p. ex. pour le diagnostic de vaccination ou la détermination du sexe ou de la période d'ovulationInstruments pour gratter la gorge
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/01 - Mesure de la température de parties du corps
A61B 5/0245 - Mesure du pouls ou des pulsations cardiaques utilisant des capteurs engendrant des signaux électriques
A61B 5/1455 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des capteurs optiques, p. ex. des oxymètres à photométrie spectrale
G08B 21/02 - Alarmes pour assurer la sécurité des personnes
G08B 25/04 - Systèmes d'alarme dans lesquels l'emplacement du lieu où existe la condition déclenchant l'alarme est signalé à une station centrale, p. ex. systèmes télégraphiques d'incendie ou de police caractérisés par le moyen de transmission utilisant une ligne de signalisation unique, p. ex. en boucle fermée
A hybrid coupler includes a first port, a second port, a third port, and a fourth port. An input signal splitter splits a first input signal at a high frequency into two second input signals. A peak amplifier includes two first amplifiers. The two first amplifiers amplify two high frequency signals obtained by splitting a first one of the second input signals, and output ends of the two first amplifiers are coupled to the first port and the second port. A carrier amplifier includes two second amplifiers and a combiner. The two second amplifiers amplify two high frequency signals obtained by splitting a second one of the second input signals. The combiner combines the high frequency signals amplified by the two second amplifiers together and inputs a combined high frequency signal to the third port.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 1/56 - Modifications des impédances d'entrée ou de sortie, non prévues ailleurs
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
H03F 3/60 - Amplificateurs dans lesquels les réseaux de couplage ont des constantes réparties, p. ex. comportant des résonateurs de guides d'ondes
A filter device is provided a substrate; a piezoelectric layer attached to the substrate; a conductor pattern on a first surface of the piezoelectric layer and including a plurality of interdigital transducers of a plurality of resonators that each have interleaved fingers at s respective diaphragm; a first dielectric layer over at least the interleaved fingers of the plurality of interdigital transducers and on the first surface of the piezoelectric layer; and a second dielectric layer on the second surface of the piezoelectric layer that is opposite the first surface. The second dielectric layer provides a more uniform dielectric coating on the second surface of the piezoelectric layer than a coating of the at least one first dielectric layer that is over the interleaved fingers.
H03H 3/04 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs pour obtenir une fréquence ou un coefficient de température désiré
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
H03H 9/02 - Réseaux comprenant des éléments électromécaniques ou électro-acoustiquesRésonateurs électromécaniques Détails
H03H 9/17 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique
An optical device that includes: a light transmission body that transmits light having a predetermined wavelength; a housing that holds the light transmission body; a joining member adhered to part of the light transmission body; a vibrator having a cylindrical body having a first end with a first portion that contacts the joining member, and a second end with a second portion, the vibrator constructed to vibrate the light transmission body through the joining member; and a piezoelectric element connected the second portion at the second end of the vibrator and constructed to vibrate the vibrator.
G03B 5/00 - Réglage du système optique relatif à l'image ou à la surface du sujet, autre que pour la mise au point présentant un intérêt général pour les appareils photographiques, les appareils de projection ou les tireuses
G02B 7/02 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles
An electrode including: a film containing metal cation-containing layered material particles, the metal cation-containing layered material particles each have one layer or a plurality of layers and a metal cation, the one layer or each of the plurality of layers includes a layer body represented by: MmXn, wherein M is at least one metal of Group 3-7 and includes at least a Ti atom, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, m is more than n but not more than 5, a modifier or terminal T existing on a surface of the layer body, and a content of the metal cation is 0.004 mol or more per gram of the film; and a conductive gel portion in contact with the film.
A stretchable device including: a laminated body having a plurality of stretchable substrates; and a stretchable wiring arranged inside the laminated body. The stretchable wiring includes two wiring main surfaces facing each other in a lamination direction of the stretchable substrate. In a sectional view, at least one of the wiring main surfaces includes a first region and a second region. The first region is a region in which a part of the wiring main surface is raised in the lamination direction more than that of the second region.
A secondary battery includes a plurality of current collectors electrically connected to a plurality of electrodes; and a terminal joined to the plurality of current collectors, wherein an outer surface of the terminal at a joint portion between the plurality of current collectors and the terminal has a first uneven region having an uneven shape, the first uneven region has a first uneven pattern having a plurality of first recessed portions; and two second uneven patterns each having a plurality of second recessed portions each having a larger area than an area of each of the first recessed portions in plan view of the outer surface of the terminal, and the first uneven pattern is located between the two second uneven patterns in the plan view.
A battery module is provided and includes a battery; a battery holder that houses the battery and includes a cavity through which a part of the battery is exposed; a temperature sensor in contact with a part of the battery exposed from the cavity; a circuit board; a first interposed elastic member interposed between the temperature sensor and the circuit board; and a second interposed elastic member interposed between the circuit board and the battery holder and surrounding a periphery of the cavity. The first interposed elastic member is sandwiched between the circuit board and the temperature sensor, and the second interposed elastic member is sandwiched between the circuit board and the battery holder.
H01M 50/24 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par les propriétés physiques des boîtiers ou des bâtis, p. ex. dimensions adaptés pour protéger les batteries de leur environnement, p. ex. de la corrosion
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
H01M 50/242 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par les propriétés physiques des boîtiers ou des bâtis, p. ex. dimensions adaptés pour protéger les batteries contre les vibrations, les collisions ou le gonflement
H01M 50/291 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
A method for producing a VOC adsorption device, the method including: mixing a VOC adsorption material, a solvent, a binder, and resin beads to form a slurry; coating the slurry on a substrate; and firing the substrate coated with the slurry at a temperature higher than a thermal decomposition temperature of the resin beads.
B01J 20/30 - Procédés de préparation, de régénération ou de réactivation
B01D 53/02 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par adsorption, p. ex. chromatographie préparatoire en phase gazeuse
B01J 20/10 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant de la silice ou un silicate
B01J 20/20 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant du carbone libreCompositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant du carbone obtenu par des procédés de carbonisation
B01J 20/28 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation caractérisées par leur forme ou leurs propriétés physiques
A high-frequency module disclosed herein includes: an antenna terminal; a switch having a common terminal connected to the antenna terminal, a first selection terminal, and a second selection terminal, and configured so that the common terminal can be connected to at least one of the first selection terminal or the second selection terminal; a power amplifier connected to the first selection terminal and amplifying a transmission signal; a transmission filter connected between the first selection terminal and the power amplifier; a low-noise amplifier connected to the second selection terminal and amplifying a reception signal; a reception filter connected between the second selection terminal and the low-noise amplifier; a first inductor connected between an output terminal of the power amplifier and the transmission filter; a second inductor connected between an input terminal of the low-noise amplifier and the reception filter; a third inductor connected between the first selection terminal and the transmission filter; a fourth inductor connected between the second selection terminal and the reception filter; a mounting substrate having a main surface; a metal first shield member disposed on the main surface; and a metal second shield member disposed on the main surface. The first shield member has a first portion extending in a first direction along the main surface, and a second portion extending in a second direction, intersecting the first direction, along the main surface. The second shield member has a third portion extending in the second direction, and a fourth portion extending in a third direction, intersecting the second direction, along the main surface. In a plan view in the thickness direction of the mounting substrate, at least a portion of the second portion overlaps at least a portion of the third portion. A compartment shield configured by combining the first shield member and the second shield member divides a specific region of the main surface into a first region, a second region, a third region, and a fourth region in a plan view. The first inductor is disposed in the first region, the second inductor is disposed in the second region, the third inductor is disposed in the third region, and the fourth inductor is disposed in the fourth region. At least two metal members constituting the compartment shield are disposed between the first inductor and the second inductor.
H01L 23/06 - ConteneursScellements caractérisés par le matériau du conteneur ou par ses propriétés électriques
H04B 1/38 - Émetteurs-récepteurs, c.-à-d. dispositifs dans lesquels l'émetteur et le récepteur forment un ensemble structural et dans lesquels au moins une partie est utilisée pour des fonctions d'émission et de réception
The present disclosure improves safety. This negative electrode is used for a secondary battery. The negative electrode is provided with: a negative electrode current collector that contains copper as a main component; a negative electrode coating layer that is provided to the negative electrode current collector and that contains copper and an element other than copper; and a dendrite suppression layer that is provided on the side opposite to the negative electrode current collector with respect to the negative electrode coating layer and that contains carbon nanotubes.
The present invention suppresses spurious waves. This piezoelectric device comprises: a piezoelectric layer that is thick in a first direction and has a top surface and a bottom surface; a support member provided on the bottom-surface side of the piezoelectric layer; a top electrode provided on the top-surface side of the piezoelectric layer; and a bottom electrode provided on the bottom-surface side of the piezoelectric layer. The piezoelectric layer includes a plurality of piezoelectric films stacked in the first direction and formed from the same material. The plurality of piezoelectric films include a first piezoelectric film closest to the top electrode, a second piezoelectric film closest to the bottom electrode, and a third piezoelectric film between the first piezoelectric film and the second piezoelectric film. The respective displacement directions of multiple adjacent piezoelectric films are different directions. When an excitation region is defined as the region where the top electrode and the bottom electrode overlap in a plan view from the first direction, in the excitation region, the third piezoelectric film is thicker than the first piezoelectric film and/or thicker than the second piezoelectric film.
