A power amplifier circuit includes: a first switch circuit that switches conduction and non-conduction between a node between the drive stage amplifier and the power stage amplifier and an output terminal, and a second switch circuit that switches conduction and non-conduction between the power stage amplifier and the output terminal. The power amplifier circuit has a first mode in which the first switch circuit is made conductive and the second switch circuit is made non-conductive, and a second mode in which the first switch circuit is made non-conductive and the second switch circuit is made conductive. The power amplifier circuit makes, when shifting from the first mode to the second mode, the first switch circuit non-conductive after making the second switch circuit conductive, and makes, when shifting from the second mode to the first mode, the second switch circuit non-conductive after making the first switch circuit conductive.
H03F 3/21 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C comportant uniquement des dispositifs à semi-conducteurs
An acoustic wave device includes a piezoelectric substrate and an interdigital transducer electrode on the piezoelectric substrate. The interdigital transducer electrode includes a close-contact layer on the piezoelectric substrate, a Cu—Al alloy layer on the close-contact layer, and an Al electrode layer on the Cu—Al alloy layer and having a weight-percentage concentration, in % by weight, of Al of greater than about 50% by weight. The Cu—Al alloy layer and the Al electrode layer are epitaxial layers. A thickness of the Cu—Al alloy layer is about 40% or less of a total thickness of the Cu—Al alloy layer and the Al electrode layer.
An inductor component includes an insulating body, and a coil inside the body and wound around an axis. The coil includes a first coil wiring layer that extends in a direction intersecting with a first direction parallel to the axis, and a second coil wiring layer that is away from the first coil wiring layer in an axis direction and extends in a direction intersecting with the axis direction. The first and second coil wiring layers configure a facing portion in which they face each other with an interlayer insulating portion, which is part of the body, between them. In a cross section, of the facing portion, orthogonal to an extending direction of the first coil wiring layer, the first coil wiring layer has a first upper surface that is on an interlayer insulating portion side.
A low-temperature fired ceramic containing: a fired glass component that contains B2O3, SiO2, and an alkaline earth metal oxide and excluding Li2O, and a percentage of the alkaline earth metal oxide in the fired glass component is 10 mol % or less; and one or more oxides of ceramic crystalline components.
C03C 14/00 - Compositions de verre contenant un constituant non vitreux, p. ex. compositions contenant des fibres, filaments, trichites, paillettes ou similaires, dispersés dans une matrice de verre
5.
ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD OF MOUNTING ELECTRONIC COMPONENT ON CIRCUIT BOARD
An electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including Ca, Zr, and Ti.
A method of manufacturing an optical coupler that includes: preparing a light-transmitting substrate having a first main surface and a second main surface aligned in a first direction; applying a first photosensitive glass paste containing a first filler to the first main surface; arranging a grayscale mask formed in a binary pattern on the second main surface; emitting an ultraviolet ray to the second main surface to expose the first photosensitive glass paste; removing the grayscale mask from the second main surface and developing the first photosensitive glass paste; and removing the light-transmitting substrate from the first photosensitive glass paste developed and curing the first photosensitive glass paste, wherein a longest length of the first filler is larger than a wavelength of the ultraviolet ray.
A pulse wave measurement unit is provided that generates a pulse wave signal based on a measurement result from a pulse wave sensor attached to a site farther from the heart than a pressurization site that is pressurized for vascular occlusion. A peripheral blood pressure index calculation unit calculates a peripheral blood pressure index related to steepness of a rise per beat of the pulse wave signal generated by the pulse wave measurement unit. A vascular endothelial function evaluation unit evaluates vascular endothelial function, based on a calculated value of the peripheral blood pressure index from a time point of vascular occlusion release until an evaluation duration elapses.
A61B 5/02 - Détection, mesure ou enregistrement en vue de l'évaluation du système cardio-vasculaire, p. ex. mesure du pouls, du rythme cardiaque, de la pression sanguine ou du débit sanguin
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/021 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins
G16H 50/30 - TIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour le calcul des indices de santéTIC spécialement adaptées au diagnostic médical, à la simulation médicale ou à l’extraction de données médicalesTIC spécialement adaptées à la détection, au suivi ou à la modélisation d’épidémies ou de pandémies pour l’évaluation des risques pour la santé d’une personne
A solid-state battery that includes: a plurality of solid-state battery elements in which a positive electrode layer, a negative electrode layer, and a solid-state electrolyte layer interposed therebetween are stacked; and an interlayer conductive layer sandwiched between the positive or the negative electrode layer of a first solid-state battery element and the positive or the negative electrode layer of a second solid-state battery element of the plurality of solid-state battery elements, wherein the positive or the negative electrode layer sandwiching the interlayer conductive layer contains a solid-state electrolyte, a solid-state electrolyte ratio of the positive or the negative electrode layer sandwiching the interlayer conductive layer is 40 wt % to 60 wt % based on an entirety of the positive or the negative electrode layer, and a solid-state electrolyte ratio of the interlayer conductive layer is 10 wt % to 35 wt % based on an entirety of the interlayer conductive layer.
An electronic component includes a base body and an alumina film covering an outer surface of the base body. The alumina film includes a film-shaped part made of alumina and in contact with the outer surface of the base body, and a particle layer located on the outer surface side of the film-shaped part. The particle layer includes a plurality of alumina particles bonded to the outer surface of the film-shaped part. The average value of the thicknesses of the alumina film including the film-shaped part and the particle layer is 0.05 μm or more and 2.0 μm or less. The interval between the particles is 1.3 μm or less.
H01C 1/034 - BoîtiersEnveloppesEnrobageRemplissage de boîtier ou d'enveloppe le boîtier ou l'enveloppe étant constitué par un revêtement ou un moulage sans gaine extérieure
H01C 1/14 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01C 17/02 - Appareils ou procédés spécialement adaptés à la fabrication de résistances adaptés à la fabrication de résistances avec enveloppe ou carter
A sensor includes a piezoelectric film having a first and second main surfaces facing each other in a first direction, a first electrode on the first main surface, a second electrode on the second main surface, and a wiring portion. The first electrode and the second electrode overlap each other in the first direction and include a first portion overlapping the piezoelectric film and a second portion that does not overlap the piezoelectric film, the first portion and the second portion are arranged in a second direction orthogonal to the first direction, and the wiring portion includes a wiring substrate overlapping the second portion in the first direction and having a third and a fourth main surface, a first conductor on the third main surface and electrically connected to the first electrode, and a second conductor on the fourth main surface and electrically connected to the second electrode.
H10N 30/87 - Électrodes ou interconnexions, p. ex. connexions électriques ou bornes
G01B 7/16 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer les déformations dans un solide, p. ex. au moyen d'une jauge de contrainte à résistance
H10N 30/30 - Dispositifs piézo-électriques ou électrostrictifs à entrée mécanique et sortie électrique, p. ex. fonctionnant comme générateurs ou comme capteurs
An electronic component includes a base body, and a first internal electrode and a second internal electrode located inside the base body. In addition, the electronic component includes a first external electrode and a second external electrode that cover a part of the outer surface of the base body and do not contain a silver component. The first external electrode includes a first electrode covering a part of the outer surface of the base body and connected to the first internal electrode, and a second electrode covering the outer surface of the first electrode. The second electrode contains copper particles and a silicone resin as a synthetic resin. When viewed in a specific section including the first electrode and the second electrode, the copper particles of the second electrode are in line contact with the outer surface of the first electrode.
An electronic component includes a base body, a first internal electrode, and a first external electrode. The first internal electrode is located inside the base body. The first external electrode covers a part of the outer surface of the base body. The first external electrode includes a first electrode covering a part of the outer surface of the base body and connected to the first internal electrode, and a second electrode covering the outer surface of the first electrode. The second electrode has spherical copper particles and silicon. An average size of the spherical copper particles is different in a first part of the second electrode than in a second part of the spherical electrode.
A packaged solid-state battery including: a substrate; a solid-state battery with an end surface electrode on the substrate; and an exterior portion covering the solid-state battery so as to define a gap portion between the end surface electrode and the exterior portion. The exterior portion contains a resin.
H01M 50/11 - Boîtiers primairesFourreaux ou enveloppes caractérisés par leur forme ou leur structure physique ayant une structure compatible avec des puces, p. ex. micro-batteries intégrées dans des puces
H01M 10/0585 - Structure ou fabrication d'accumulateurs ayant uniquement des éléments de structure plats, c.-à-d. des électrodes positives plates, des électrodes négatives plates et des séparateurs plats
A solid electrolytic capacitor that includes: an anode plate including a porous layer at least on at least one a main surface thereof; a dielectric layer on a surface of the porous layer; a solid electrolyte layer on a surface of the dielectric layer; a conductor layer on a surface of the solid electrolyte layer; and an insulating layer on the surface of the dielectric layer, wherein the insulating layer covers at least a part of an end portion of the solid electrolyte layer in a region surrounding the solid electrolyte layer.
H01G 9/26 - Combinaisons structurales de condensateurs électrolytiques, de redresseurs électrolytiques, de détecteurs électrolytiques, de dispositifs de commutation électrolytiques, de dispositifs électrolytiques photosensibles ou sensibles à la température les uns avec les autres
An optical sensor includes two light emitters with the same or substantially the same temperature dependence of luminous intensity of light. A reflector reflects and diffuses light emitted by the light emitters such that a portion of the reflected light is incident on a light receiver. An elastic support supports the reflector, and deforms and changes a relative position of the reflector and the light emitters and the light receiver. A processor calculates a physical quantity depending on an amount of deformation of the elastic support based a ratio between two amounts of light received by the light receiver when respective light emitters emit light at different timings. The light emitters and the light receiver are fixed relative to each other, and a distance from one of the light emitters to the light receiver is different from a distance from another of the light emitters to the light receiver.
G01L 5/105 - Appareils ou procédés pour la mesure des forces, du travail, de la puissance mécanique ou du couple, spécialement adaptés à des fins spécifiques pour la mesure de la tension dans les éléments flexibles, p. ex. dans les cordages, les câbles, les fils métalliques, les filaments, les courroies ou les bandes en utilisant des moyens électriques en utilisant des moyens électro-optiques
G01S 7/48 - Détails des systèmes correspondant aux groupes , , de systèmes selon le groupe
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 17/48 - Systèmes de triangulation active, c.-à-d. utilisant la transmission et la réflexion d'ondes électromagnétiques autres que les ondes radio
16.
SOLID ELECTROLYTIC CAPACITOR ELEMENT, SOLID ELECTROLYTIC CAPACITOR, AND SOLID ELECTROLYTIC CAPACITOR ELEMENT MANUFACTURING METHOD
A solid electrolytic capacitor element that includes: a valve acting metal substrate including a metal substrate layer and a porous layer on the metal substrate layer and having an anode terminal region and a cathode formation region; a dielectric layer on a surface of the porous layer in the cathode formation region; a solid electrolyte layer on the dielectric layer in the cathode formation region; a conductive layer on the solid electrolyte layer; and a mask having: a first portion dividing the valve acting metal substrate into the anode terminal region and the cathode formation region and in direct contact with the porous layer or in indirect contact with the porous layer via the dielectric layer, a second portion covering the solid electrolyte layer on the porous layer, and the mask does not cover the conductive layer.
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
H01G 9/26 - Combinaisons structurales de condensateurs électrolytiques, de redresseurs électrolytiques, de détecteurs électrolytiques, de dispositifs de commutation électrolytiques, de dispositifs électrolytiques photosensibles ou sensibles à la température les uns avec les autres
17.
METALLIZED FILM MANUFACTURING DEVICE, METALLIZED FILM, AND FILM CAPACITOR
A metallized film manufacturing device that includes: a feeding unit that feeds a dielectric film in a longitudinal direction; a printing roll that has a rotation axis along a width direction of the dielectric film, and prints an insulation pattern on a surface of the dielectric film, the printing roll has a protrusion extending on an outer circumferential surface of the printing roll in an axial direction of the printing roll and that corresponds to the insulation pattern, and a reinforcing portion is at a first end of the protrusion, the first end being an end in the axial direction of the printing roll; and a vapor deposition unit that forms a metal vapor deposition electrode in a place on a surface of the dielectric film where the insulation pattern is not printed.
H01G 13/00 - Appareils spécialement adaptés à la fabrication de condensateursProcédés spécialement adaptés à la fabrication de condensateurs non prévus dans les groupes
A deformation detection sensor according to one embodiment of the present invention comprises: a holding plate that is pressed by a user; a piezoelectric film; a buffer material; and a support body that supports the holding plate, the piezoelectric film, and the buffer material and that is harder than the holding plate. The piezoelectric film is disposed between the holding plate and the buffer material, and the buffer material is disposed between the piezoelectric film and the support body.
A high-frequency circuit (1) comprises: a transmission filter (31) that is connected to selection terminals (512 and 513) and has a passband including a transmission band of a band (A); a reception filter (33) that is connected to a selection terminal (516) and has a passband including a reception band of the band (A); and paths (P1 and P2) that respectively connect the transmission filter (31) to the selection terminals (512 and 513). The first reflection phase of the reception band of the band (A) when the transmission filter (31) is viewed from a common terminal (511) via the path (P1) differs from the second reflection phase of the reception band of the band (A) when the transmission filter (31) is viewed from the common terminal (511) via the path (P2). In the transmission band of the band (A), the phase fluctuation amount between the transmission filter (31) and the common terminal (511) via the path (P1) connection therebetween is smaller than the phase fluctuation amount between the transmission filter (31) and the common terminal (511) via the path (P2) connection therebetween.
H03H 7/46 - Réseaux pour connecter plusieurs sources ou charges, fonctionnant sur des fréquences ou dans des bandes de fréquence différentes, à une charge ou à une source commune
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
20.
CAPACITOR LAMINATE AND SOLID ELECTROLYTIC CAPACITOR
A capacitor laminate (10) comprises a plurality of capacitor elements (11, 12, 13, 14) each of which is formed in a flat film shape and which are laminated such that flat film surfaces thereof overlap. The capacitor elements (11, 12, 13, 14) are provided with: positive electrode bodies (111, 121, 131, 141) that are each composed of a film-shaped valve action metal; dielectric layers (112, 122, 132, 142) that cover the positive electrode bodies (111, 121, 131, 141); conductive polymer layers (113, 123, 133, 143) that cover the dielectric layers (112, 122, 132, 142); and conductive layers (114, 124, 134, 144) that cover the conductive polymer layers (113, 123, 133, 143). The conductive layers (114, 124, 134, 144): are formed to have a prescribed area that does not include one end, in a first direction, of each of the positive electrode bodies (111, 121, 131, 141) but includes the other end; and each have a first end on the one end side and a second end on the other end side. The conductive layers (114, 124, 134, 144) and the conductive polymer layers (113, 123, 133, 143) have a first region (RE1) on the first end side and a second region (RE2) on the second end side in a flat surface on which the conductive layers (114, 124, 134, 144) are formed. The conductive polymer layers (113, 123, 133, 143) are provided with first protrusions that extend in a direction orthogonal to the first direction (DIR1) in the second region (RE2) and protrude toward the conductive layers. At least a portion of the first protrusions of adjacent ones of the plurality of capacitor elements overlap each other when viewed in the lamination direction. The adjacent ones of the plurality of capacitor elements (11, 12, 13, 14) are connected through the respective first protrusions.
The present disclosure relates to: an ammonia decomposition catalyst comprising a composite oxide constituting a perovskite structure by means of at least barium, zirconium, and ruthenium; a honeycomb structure including an ammonia decomposition catalyst; and an internal combustion engine comprising the ammonia decomposition catalyst. The present disclosure makes it possible to provide: an ammonia decomposition catalyst that exhibits excellent heat resistance and initial activity even at low temperatures during ammonia decomposition activity; a honeycomb structure including an ammonia decomposition catalyst; and an internal combustion engine comprising the ammonia decomposition catalyst.
C01B 3/04 - Production d'hydrogène ou de mélanges gazeux contenant de l'hydrogène par décomposition de composés inorganiques, p. ex. de l'ammoniac
F02D 19/02 - Commande des moteurs caractérisés par l'emploi de combustible non liquide, de combustibles multiples ou de substances non combustibles ajoutées au mélange carburant particulière aux moteurs fonctionnant avec des combustibles gazeux
A solid-state battery module including a substrate; a solid-state battery on the substrate; and a wireless power supply circuit including a capacitor, in which at least the capacitor and the solid-state battery are on a same main surface side of the substrate.
H02J 50/12 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif du type couplage à résonance
A first chip includes a first insulating layer, a first device layer laminated on the first insulating layer, a first multilayer wiring layer laminated on the first device layer, and a first anchor. A high-frequency circuit is in the first chip. A second chip includes a substrate, a second multilayer wiring layer on the substrate, and a second anchor. A control circuit that controls the high-frequency circuit is in the second chip. The first anchor is embedded in the first device layer and the first insulating layer, and exposed from a surface of the first insulating layer. The second anchor is embedded in the second multilayer wiring layer, and exposed from a surface of the second multilayer wiring layer. The first and second anchors are formed from an identical metal material.
H01L 23/32 - Supports pour maintenir le dispositif complet pendant son fonctionnement, c.-à-d. éléments porteurs amovibles
H01L 23/528 - Configuration de la structure d'interconnexion
H01L 23/552 - Protection contre les radiations, p. ex. la lumière
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
24.
ACOUSTIC WAVE ELEMENT, ACOUSTIC WAVE FILTER DEVICE, AND MULTIPLEXER
An acoustic wave element includes a first IDT electrode and first reflectors on a first main surface of a piezoelectric layer and a second IDT electrode and second reflectors on a second main surface of the piezoelectric layer. When a region between the first reflectors in a first direction is a first region, a region between the second reflectors in the first direction is a second region, and a minimum region including the first and second regions as viewed in a third direction orthogonal or substantially orthogonal to the first and second directions is an inter-reflector region, in an end region of the inter-reflector region in the first direction, a region is provided in which none of the first and second electrode fingers face each other in the third direction.
An acoustic wave device includes a support board, an intermediate layer on the support board, a piezoelectric layer on the intermediate layer, and including first and second main surfaces, a first IDT electrode at the first main surface, and embedded in the intermediate layer, and a second IDT electrode at the second main surface. The first IDT electrode includes electrode fingers each including first and second surfaces opposed to each other in a thickness direction of the electrode fingers, and a side surface connected to the first and second surfaces. The side surface of each of the electrode fingers includes first and second portions, and in at least one of the electrode fingers, the first and second portions have different angles of inclination with respect to the thickness direction.
A magnetorheological elastomer composition that includes: a resin (A); a magnetic powder (B); and a plasticizer (C). The resin (A) contains a urethane resin (A1) having an average inter-crosslinking point molecular weight of 9,500 to 27,000, and the urethane resin (A1) contains a reaction product of a polyol (x) and a polyisocyanate (y). The polyol (x) contains a triol (x1) having a number-average molecular weight of 4,000 or more.
H01F 1/44 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en liquides magnétiques, p. ex. ferrofluides
Disclosed embodiments include a hybrid power converter including a switched capacitor converter and a buck converter in parallel where the buck converter is operated in an open loop and non-regulated mode; the switched capacitor converter and the buck converter are connected to an input terminal, where the switched capacitor converter operates in an open loop and non-regulated mode and provides power to a load based on an input voltage, the buck converter operates in an open loop mode and provides power to the load based on the voltage of the input terminal, and the controller enables the buck converter to provide power to the load based on at least one of a voltage of the load or a current of the load.
H02M 1/00 - Détails d'appareils pour transformation
H02M 1/14 - Dispositions de réduction des ondulations d'une entrée ou d'une sortie en courant continu
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
An electronic component is provided that includes a substrate, an insulator layer expanding over a surface of the substrate, a planar conductor on the substrate or in the insulator layer and expanding in a plane parallel to the surface of the substrate, and an inductor conductor pattern on the insulator layer or in the insulator layer. When viewed in a direction perpendicular to the surface of the substrate, a length in a longitudinal direction of a region in which a region with the inductor conductor pattern overlapping the planar conductor is represented by Ls, and a distance between the inductor conductor pattern and the planar conductor is represented by d, such that Ls/d is 1 or more and 60 or less.
H03H 1/00 - Détails de réalisation des réseaux d'impédances dont le mode de fonctionnement électrique n'est pas spécifié ou est applicable à plus d'un type de réseau
H03H 11/04 - Réseaux sélectifs en fréquence à deux accès
A piezoelectric element that includes a piezoelectric ceramic layer made of a ceramic sintered body having a main phase containing K, Na, Nb, and Mn, and a first secondary phase containing Mn and Nb. The piezoelectric element may further include an internal electrode layer containing Ni as a main component thereof on at least one main surface of the piezoelectric ceramic layer, and the ceramic sintered body may further have a second secondary phase containing Mn and Ni.
C04B 35/495 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base d'oxydes de vanadium, de niobium, de tantale, de molybdène ou de tungstène ou de leurs solutions solides avec d'autres oxydes, p. ex. vanadates, niobates, tantalates, molybdates ou tungstates
H10N 30/053 - Fabrication de dispositifs piézo-électriques ou électrostrictifs multicouches ou de leurs parties constitutives, p. ex. en empilant des corps piézo-électriques et des électrodes par frittage intégral de corps piézo-électriques ou électrostrictifs et d’électrodes
H10N 30/50 - Dispositifs piézo-électriques ou électrostrictifs avec une structure empilée ou multicouche
H10N 30/87 - Électrodes ou interconnexions, p. ex. connexions électriques ou bornes
30.
COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
A composite component device including two or more composite component layers having an electronic component layer and a rewiring layer on the electronic component layer. The two or more composite component layers are laminated in a thickness direction such that the electronic component layer and the rewiring layer are alternately disposed, and the electronic component layer has one or more electronic components having an electronic component main body having a first surface perpendicular to the thickness direction and a second surface opposed to the first surface; and component electrodes on the first surface. The component electrode of the one or more electronic components is electrically connected to the rewiring layer, and an electronic component layer in a composite component layer adjacent to the rewiring layer of two or more composite component layers has an electronic component layer through-via electrically connected to the rewiring layer of another composite component layer.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
31.
ANTENNA MODULE AND COMMUNICATION APPARATUS INCLUDING THE SAME
An antenna module includes a ground electrode disposed in a dielectric substrate (and radiating elements and feed wiring lines. The radiating elements are disposed to face the ground electrode. The feed wiring lines transmit radio frequency signals to the radiating elements. The radiating element is disposed between the radiating element and the ground electrode. The radiating element is disposed between the radiating element and the ground electrode. The radiating element is larger in size than the radiating element, and the radiating element is larger in size than the radiating element. In plan view in a direction normal to the dielectric substrate, the radiating elements are disposed to overlap with each other. The feed wiring line transmits a radio frequency signal to the radiating element. The feed wiring line transmits a radio frequency signal to the radiating elements.
H01Q 5/20 - Dispositions pour faire fonctionner simultanément des antennes sur plusieurs gammes d'ondes, p. ex. dispositions bibandes ou multibandes caractérisées par les gammes d'ondes exploitées
H01Q 1/27 - Adaptation pour l'utilisation dans ou sur les corps mobiles
H01Q 1/48 - Moyens de mise à la terreÉcrans de terreContrepoids
A film capacitor including: a wound body comprising a pair of dielectric films each having a vapor-deposited metal on surface thereof, the pair of dielectric films being overlapped in a thickness direction of the wound body such that there is a gap between the pair of dielectric films, and the wound body having a pair of opposed ends; and a pair of end face electrodes at the opposed ends of the wound body, respectively, wherein the wound body has a shape in which a first dimension in a first direction is shorter than a second dimension in a second direction orthogonal to the first direction in a cross section in a third direction along an extending surface of each of the end face electrodes, and a ratio of a thickness of the gap to a thickness of the pair of dielectric films in the first direction is 0.003 to 0.029.
A core for an inductor includes a plurality of axially fibers and an electrically insulating material disposed between the fibers. The core may be incorporated into an inductor, a transformer, or other electrical components. A method of making the core includes forming insulated fibers or bundles of insulated fibers.
H01F 1/14 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
34.
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT
Provided is a multilayer ceramic electronic component capable of suppressing a decrease in reliability. A multilayer ceramic capacitor 10 comprises: a laminate 12 in which a plurality of ceramic layers 14 and a plurality of internal electrode layers 16 are alternately laminated; and an external electrode 30 formed on an outer surface of the laminate 12 and electrically connected to the internal electrode layers 16. The external electrode 30 includes a resin electrode layer 33 including: a resin 50; and a plurality of conductive fillers 40. At least some of the plurality of conductive fillers 40 each have a core of Cu particles 41, and at least a portion of a surface of each conductive filler 40 is composed of a Cu-Ag alloy of Cu and Ag.
A connector set (2) has: a first terminal (14) and a second terminal (16) which each are disposed independently at intervals in a first direction; a plurality of third terminals (18) which is arranged along the first direction between the first terminal (14) and the second terminal (16) in the first direction; a first shield member (20) which is provided around the first terminal (14); and a second shield member (22) which is provided around the second terminal (16). The connector set (2) comprises: a substrate-mounted connector (5) mounted on a substrate (4); a first connector (8) having a fourth terminal (38) that is fitted into the first terminal (14); and a second connector (10) having a fifth terminal (44) that is fitted into the second terminal (16). A third connector (12) having a plurality of sixth terminals (86) that is fitted into the plurality of third terminals (18) can also be connected to the connector set (2).
The present invention relates to a capacitive temperature monitoring attachment for monitoring the temperature chain of a temperature-sensitive product such as vaccines or food, comprising an electric power source, a temperature tracker powered by said electric power source, and a memory for storage of temperature tracking data from the temperature tracker, wherein said temperature tracker includes a temperature dosimeter for collecting temperature dose data indicative of phases of undesired temperatures above and/or below a temperature threshold and an application time thereof, and a temperature switch for switching-off powering of said temperature dosimeter by said electric power source in response to temperature.
G01K 1/022 - Moyens d’indication ou d’enregistrement spécialement adaptés aux thermomètres pour l’enregistrement
G01K 1/024 - Moyens d’indication ou d’enregistrement spécialement adaptés aux thermomètres pour l’indication à distance
G01K 3/00 - Thermomètres donnant une indication autre que la valeur instantanée de la température
G01K 3/04 - Thermomètres donnant une indication autre que la valeur instantanée de la température fournissant des valeurs moyennesThermomètres donnant une indication autre que la valeur instantanée de la température fournissant des valeurs intégrées par rapport au temps
G01K 7/24 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance dans un circuit spécialement adapté, p. ex. un circuit en pont
G01K 7/34 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments capacitifs
37.
SURFACE ACOUSTIC WAVE RESONATOR, SURFACE ACOUSTIC WAVE FILTER, AND MULTIPLEXER
This surface acoustic wave resonator (1) comprises: at least one electrode (4) disposed on a substrate (3) and including an IDT electrode (41); and a plurality of load members (51) that are disposed on or in the substrate (3), are spaced apart from each other, and are composed of a dielectric material. Each of the plurality of load members (51) at least partially overlaps at least one corresponding electrode finger in a planar view of the substrate (3). The number of electrode fingers that overlap the plurality of load members (51) among the electrode fingers disposed in a first sub-region (3b1) and the number of electrode fingers that overlap the plurality of load members (51) among the electrode fingers disposed in a third sub-region (3b3) are each greater than the number of electrode fingers that overlap the plurality of load members (51) among the electrode fingers disposed in a second sub-region (3b2). The plurality of load members (51) include two or more load members (51) that overlap the electrode fingers disposed in the first sub-region (3b1) and two or more load members (51) that overlap the electrode fingers disposed in the third sub-region (3b3).
The present invention relates to a technology for inducing brain waves, and a communication technology using brain waves. The present invention addresses the problem of providing a system for inducing brain waves of a user while suppressing effects due to the state of the user. The present invention solves the aforementioned problem by means of a brain wave induction system (10X) comprising: an image setting unit (21) that sets a moving body illusion image in an image (IM) and sets a flashing frequency for the image; and a display (30) that displays the image.
A ceramic composition contains Fe, Cu, Zn, Mn, Co, Ni, Y, and Cr, and when the Fe, the Cu, the Zn, the Mn, the Co, and the Ni are expressed in terms of Fe2O3, CuO, ZnO, MnO, CoO, and NiO, respectively, and a total amount of the Fe2O3, the CuO, the ZnO, the MnO, the CoO, and the NiO is set to 100 mol %, the ceramic composition contains the Fe of an amount from 41.9 mol % to 49.2 mol % in terms of the Fe2O3, the Cu of an amount from 4.4 mol % to 7.5 mol % in terms of the CuO, the Zn of an amount from 21.9 mol % to 36.0 mol % in terms of the ZnO, the Mn of an amount from 0.043 mol % to 0.867 mol % in terms of the MnO, and the Co of an amount from 0.0004 mol % to 1.2293 mol % in terms of the CoO.
C04B 35/26 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base de ferrites
Provided is a method, comprising contacting a composition that comprises metal oxide nanofilaments to a dye and/or an organic compound under such conditions that the dye and/or the organic compound undergoes at least partial decomposition or degradation, the metal oxide nanofilaments the metal oxide nanofilaments optionally comprising titanium, the metal oxide nanofilaments optionally comprising carbon, the structure of the oxide nanofilaments optionally being an lepidocrocite structure; and further optionally comprising illuminating the composition and the dye and/or the organic compound. Also provided is a system, the system comprising a conduit and an amount of a composition that comprises a metal oxide nanofilaments, the conduit placing the composition into fluid communication with a process stream, the process stream comprising a dye and/or an organic compound.
A62D 3/17 - Procédés pour rendre les substances chimiques nuisibles inoffensives ou moins nuisibles en effectuant un changement chimique dans les substances par exposition à une énergie électrique ou ondulatoire ou à un rayonnement particulaire ou ionisant à un rayonnement électromagnétique, p. ex. émis par un laser
An acoustic resonator is provided that includes a first piezoelectric layer of a material with a first crystallographic orientation and a second piezoelectric layer coupled to the first piezoelectric layer and comprising a material with a second crystallographic orientation, such that a piezoelectric tensor of the second piezoelectric layer is an opposite polarity to a piezoelectric tensor of the fist piezoelectric layer. Moreover, an interdigital transducer (IDT) including interleaved fingers is disposed on a surface of the first piezoelectric layer; and a first dielectric coating layer is disposed over the IDT and the first piezoelectric layer.
A capacitor that includes: a first electrode; a dielectric body on a surface of the first electrode; a second electrode on a surface of the dielectric body and facing the first electrode across the dielectric body; an externally connecting terminal electrode on a surface of the second electrode and electrically connected to the second electrode; and an insulating film covering the second electrode, the dielectric body, a portion excluding an externally connecting portion of the terminal electrode, and a part of the first electrode, wherein, when a thickness of the dielectric body is represented by Td and a shortest distance along a surface of the insulating film that connects a first portion of the terminal electrode that is not covered with the insulating film and a second portion of the first electrode that is not covered with the insulating film is represented by Tsr, Tsr<18×Td2.
This vibration device comprises: an internal vibration body that can amplify vibrations; a piezoelectric element that is connected to one end of the internal vibration body in a first direction, and can produce vibrations; a translucent body that is connected to the other end of the internal vibration body in the first direction, and has an optical axis extending along the first direction; and an external vibration body that is located to the outside of the internal vibration body in a second direction intersecting the first direction, and surrounds the internal vibration body. The external vibration body includes a first connection part that is connected to the translucent body, a second connection part that extends from the first connection part in a direction away from the translucent body along the second direction and is configured so as to attenuate vibrations, and a cylinder part that extends along the first direction and has a first end part connected to the first connection part and a second end part connected to the second connection part. The vibration device comprises a suppression part that is configured so as to minimize the difference between the amount of deformation of the first end part and the amount of deformation of the second end part due to the vibrations produced by the piezoelectric element. The suppression part is located between the translucent body and the second connection part in the first direction.
H04N 23/52 - Éléments optimisant le fonctionnement du capteur d'images, p. ex. pour la protection contre les interférences électromagnétiques [EMI] ou la commande de la température par des éléments de transfert de chaleur ou de refroidissement
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
G02B 7/02 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles
G03B 30/00 - Modules photographiques comprenant des objectifs et des unités d'imagerie intégrés, spécialement adaptés pour être intégrés dans d'autres dispositifs, p. ex. des téléphones mobiles ou des véhicules
This RFID module has: a substrate that comprises first and second outermost layers; a coil conductor that extends in a first direction along the substrate; and an RFIC chip that is electrically connected to the coil conductor. The coil conductor includes a plurality of semi-annular conductors that each comprise two ends provided on the first outermost layer, and are arranged side by side in the first direction, a plurality of conductor patterns that are provided side by side in the first direction on a different layer from the first outermost layer, and a plurality of interlayer connection conductors that are provided side by side in the first direction between the first outermost layer and the layer where the conductor patterns are provided, and electrically connect the plurality of semi-annular conductors and the respectively corresponding conductor patterns.
H01Q 7/00 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre
G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
H01Q 19/02 - Combinaisons d'éléments actifs primaires d'antennes avec des dispositifs secondaires, p. ex. avec des dispositifs quasi optiques, pour donner à une antenne une caractéristique directionnelle désirée Détails
The present invention provides a multilayer ceramic electronic component, such as a multilayer ceramic capacitor, that is highly reliable. In a multilayer ceramic electronic component (1): a plurality of internal electrode layers have a first internal electrode layer (6a) exposed from a first end surface (E1) and a second internal electrode layer (6b) exposed from a second end surface (E2); a laminate (2) has an inner layer part in which the first internal electrode layer (6a) and the second internal electrode layer (6b) face each other in the lamination direction (T); the particle diameter of ceramic contained on a first lateral surface (S1) side and a second lateral surface (S2) side of the laminate (2) is smaller than the particle diameter of the ceramic contained in the center part of the laminate (2) in the width direction (W); and the particle diameter of the ceramic contained in the end parts of the inner layer part on the first end surface (E1) side and the second end surface (E2) side is the same as or larger than the particle diameter of the ceramic contained in the center part of the inner layer part.
This magnetic core is obtained by integrally molding a first soft magnetic body and a second soft magnetic body having differing average particle diameters, and has a corner part. The magnetic core includes a first region formed from the first soft magnetic body and a second region formed from the second soft magnetic body. The second soft magnetic body has a smaller average particle diameter than the first soft magnetic body. The corner part is included in the second region.
22, glass containing Si, and copper particles (52) containing Cu. A cross section of the protective film (50) orthogonal to the outer surface (21) of the element body (20) is defined as a specific cross section, in which the protective film (50) is bisected into an element-body-side portion (P1) located on the element body (20) side and an outer portion (P2) on the opposite side from the element body (20). In the bisected form, 80% or more of the copper particles (52) are present in the element-body-side portion (P1) in the specific cross section.
H01C 7/04 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants à coefficient de température négatif
H01C 1/034 - BoîtiersEnveloppesEnrobageRemplissage de boîtier ou d'enveloppe le boîtier ou l'enveloppe étant constitué par un revêtement ou un moulage sans gaine extérieure
H01C 7/10 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants sensibles à la tension, p. ex. varistances
H01F 27/32 - Isolation des bobines, des enroulements, ou de leurs éléments
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
H01G 4/00 - Condensateurs fixesProcédés pour leur fabrication
An acoustic resonator is provided that includes a first piezoelectric layer (610A) of a material with a first crystallographic orientation and a second piezoelectric layer (610B) coupled to the first piezoelectric layer and comprising a material with a second crystallographic orientation, such that a piezoelectric tensor of the second piezoelectric layer is an opposite polarity to a piezoelectric tensor of the fist piezoelectric layer. Moreover, an interdigital transducer, IDT, (638a, 638b) including interleaved fingers is disposed on a surface of the first piezoelectric layer; and a first dielectric coating layer (612) is disposed over the IDT and the first piezoelectric layer.
09 - Appareils et instruments scientifiques et électriques
38 - Services de télécommunications
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Telecommunication apparatus, instruments and equipment;
modems; network routers; antennas; telecommunication devices
and modules, and electrical or electronic circuits for use
with mobile communication apparatus; SIM cards; embedded SIM
cards; smartphones; mobile phones; computers; computer
memory devices; computer peripheral devices; electronic tags
for goods; data processing apparatus; printed circuits;
light-emitting diodes [LED]; readers [data processing
equipment]; game programs for video game consoles; game
programs for arcade video game machines; battery chargers;
buzzers; inductors [electricity]; laptop computers; tablet
computers; wearable computers; wearable activity trackers;
electrical or electronic filters; antenna filters; filters
for radio interference suppression; radio frequency filters;
noise filters; measuring apparatus; measuring instruments;
testing apparatus; testing instruments; telecommunication
cables; sensors; sensors for use in mobile communications;
sensors for use with mobile communication apparatus;
batteries; batteries being parts of mobile communication
apparatus; electric accumulators; computer software;
software applications; software platforms; downloadable or
recorded computer software or software platforms for use in
telecommunications or mobile communications; downloadable or
recorded computer software or software platforms for
operating, managing and controlling mobile communication
apparatus; downloadable or recorded cloud computing
software; capacitors; electronic circuits; integrated
circuits; thermostats; data communication modules for use
with the Internet of Things (IoT). Telecommunications services; mobile telecommunications
services; rental of telecommunication equipment, apparatus
and instruments; broadcasting; news agency services;
providing telecommunication connections to the Internet of
Things (IoT) devices via computer networks. Providing, hosting, managing, developing and maintaining
computer software, software applications, software
platforms, websites and databases in the fields of
telecommunications and mobile communications; providing a
temporary use of non-downloadable computer software and
software platforms for use in telecommunications or mobile
communications; providing a temporary use of
non-downloadable computer software and software platforms
for operating, managing and controlling mobile communication
apparatus; platform as a service [PaaS]; cloud computing
services; computer services, namely, cloud hosting provider
services; server hosting; software as a service [SaaS];
industrial design; computer software design; computer
programming; maintenance of computer software; technological
advisory services; testing and research services in the
field of electricity; testing and research services in the
field of telecommunications technology; scientific research,
testing and analysis services; industrial analysis, testing
and research services; rental of measuring apparatus and
instruments; rental of web servers; electronic data storage;
providing non-downloadable computer software platforms for
use in management of the Internet of Things (IoT) devices;
providing non-downloadable computer software platforms for
use in device network connections to cloud computing
services or the Internet of Things (IoT) devices; providing
non-downloadable cloud computer software platforms for use
in zero touch deployment services; providing
non-downloadable computer software platforms for use in
remote control and monitoring of SIM cards; providing
non-downloadable computer software platforms for use in
controlling, operating and managing service and product
market places.
Power converter circuits and methods that include self-timed bootstrap capacitor power sources. Added to a power converter having a diode stack for charging bootstrap capacitors are three types of supplemental circuit blocks: a trigger block, a trigger-bypass block, and a bypass block. In operation, adjacent supplemental circuit blocks work in pairs. The upper block of the pair functions, when triggered, to charge an associated bootstrap capacitor by connecting the top plate of its associated bootstrap capacitor to the top plate of the bootstrap capacitor associated with the lower block of the pair, essentially bypassing the diode associated with the upper block. In addition, the lower block of the pair functions to initiate (trigger) the bypass function of the upper block. The bypass function of the upper block automatically terminates when the connected bootstrap capacitors are disconnected and their respective voltages “fly” apart, or is controllably terminated.
H02M 1/088 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques pour la commande simultanée de dispositifs à semi-conducteurs connectés en série ou en parallèle
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
A piezoelectric resonator that includes: a piezoelectric member and an excitation electrode that overlap with each other in a thickness direction, the piezoelectric resonator has a high acoustic velocity region and a low acoustic velocity region, in a plan view in the thickness direction, the high acoustic velocity region overlaps a center portion of the excitation electrode, and the low acoustic velocity region overlaps an end portion of the excitation electrode, the high acoustic velocity region includes a plurality of holes, in a first direction intersecting the thickness direction, a dimension of a portion of the low acoustic velocity region adjacent to the high acoustic velocity region in the first direction is smaller than a dimension of the high acoustic velocity region in the first direction, and in the plan view, an area of the low acoustic velocity region is smaller than an area of the high acoustic velocity region.
A device includes proof masses within a device layer defining an xy-plane and perpendicular z-direction. The proof masses have first and second rotor comb sets extending in the x-direction. Four sets of stator combs in the device layer extend along the x-direction and are electrically insulated from each other. The proof masses are mobile in the y-and z-directions relative to the stator combs. The first and second stator comb sets interdigitate with the first rotor comb set, forming capacitors, while the third and fourth stator comb sets interdigitate with the second rotor comb set, forming additional capacitors. The device layer has parallel top and bottom surfaces in the xy-plane. All rotor and stator comb bottoms align, with the tops of the first and fourth stator comb sets level with the device layer's top surface, enabling precise capacitive measurements based on relative comb movement in the device layer.
G01P 15/08 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
G01P 15/125 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
Provided is a stacked ceramic capacitor which can be made thinner. Provided is stacked ceramic capacitor 1 comprising: a laminate 2 in which internal electrodes 15 and dielectric layers 14 are stacked so as to alternate and which has two main surfaces with one on either side in the stacking direction, two end surfaces with one on either side in the length direction orthogonal to the stacking direction, and two side surfaces with one on either side in the width direction orthogonal to the stacking direction and the length direction; and external electrodes 3 which each include a Ni-plating layer 321, which are disposed respectively on either the end surfaces or the side surfaces of the laminate 2, and which each have a connection portion 3c connected to the internal electrodes 15 and a main surface bent portion 3a extending along a main surface side, said stacked ceramic capacitor 1 having a stacking direction dimension which is smaller than the length direction and width direction dimensions, wherein the Ni-plating layer 321 has a section thinner than the connection portion 3c in the main surface bent portion 3a, and the thickness of the thinnest portion X2 in the main surface bent portion 3a is at least 24% and at most 74% of the thickness of the connection portion 3c.
In the present invention, a capacitor is disposed on one surface of a support substrate, namely the upper surface. A first insulating film that covers the capacitor is disposed on the support substrate. A second insulating film is disposed on the first insulating film. A multilayer wiring layer that includes a plurality of wiring layers and a plurality of third insulating films which are alternately stacked is disposed on the second insulating film. The multilayer wiring layer includes an inductor constituted by conductor patterns in the wiring layers. The weight average molecular weight of the resin forming the second insulating film is greater than the weight average molecular weight of the resin forming the third insulating films.
H01G 4/40 - Combinaisons structurales de condensateurs fixes avec d'autres éléments électriques non couverts par la présente sous-classe, la structure étant principalement constituée par un condensateur, p. ex. combinaisons RC
H01F 17/00 - Inductances fixes du type pour signaux
H01F 27/00 - Détails de transformateurs ou d'inductances, en général
A wireless communication device according to the present invention comprises: a base material that has a circumferential surface; an antenna conductor that has first and second ends and is provided to the base material so as to extend along the circumferential surface; and an RFIC chip that is provided to the base material and performs wireless communication using the antenna conductor. The first end and the second end of the antenna conductor face each other with a gap therebetween in the circumferential direction of the circumferential surface. The antenna conductor has a slit that begins from the first end and extends circumferentially toward the second end.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electronically delivered downloadable register-transfer level (RTL) code, namely software for use in design and development of transmitters including transmitters for wireless devices; RTL embodiments of circuitry in the nature of electronic circuits for wireless devices and hardware including mobile handsets and base stations; Electronically delivered downloadable RTL code, namely software for use in design and development of signal processors including a digital signal processor (DSP) or digital predistortion (DPD) processor for use in transmitters including transmitters for wireless devices; Register-transfer level (RTL) embodiments of circuitry in the nature of electronic circuits for wireless devices and hardware including mobile handsets and base stations; Electronically delivered downloadable computer code to generate and/or manage coefficients used by a digital signal processor (DSP) or digital predistortion (DPD) processor to improve efficiency/performance of radio frequency transmitters; Electronically delivered downloadable computer code to generate and/or manage coefficients used by a digital signal processor (DSP) or digital predistortion (DPD) processor to improve efficiency/performance of radio frequency transmitters including wireless transmitters for use in mobile handset and base stations; Power management circuitry in the nature of electronic circuits for use with digital supply modulation systems implementing discrete supply modulation to improve efficiency of wireless devices such as wireless transmitters; Power management circuitry in the nature of electronic circuits for use with digital supply modulation systems implementing discrete supply modulation to improve efficiency of wireless devices including wireless transmitters for use in mobile handset and base stations; Wireless electronic devices for transmission of RF signals; Wireless transmitters for use in mobile handset and base stations; Mobile telephone handsets; Telecommunication base stations and access points for receiving and transmitting rf signals; Radio frequency (RF) devices namely amplifiers; Computer hardware for telecommunications; Computer hardware, namely, wireless access point (WAP) devices, wireless network extenders, and wireless network repeaters; Downloadable middleware for software application integration; Electronic communications systems comprised of computer hardware and recorded software for the transmission of data between two points; Computer networking hardware; Downloadable application programming interface (API) software; Circuit boards; Integrated circuits; Printed circuit boards (PCBs); Modems; Power amplifiers; Electrical power supplies; Telecommunications transmitters; Broadband wireless equipment, namely, telecommunications base station equipment for cellular and fixed networking and communications applications; Telecommunication base stations; Semiconductor chip sets; Computer chips; Computer hardware, namely, wireless network extenders; Computer hardware, namely, wireless network repeaters.
An insulating layer made of an inorganic insulating material is provided on an upper surface which is one surface of a support substrate made of a polymer or a filler-containing polymer. A circuit formation layer including a semiconductor element is provided on the insulating layer. A lower surface on an opposite side from the upper surface and a side surface of the support substrate are covered with a coating film formed of a material having lower moisture permeability than the support substrate.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 23/58 - Dispositions électriques structurelles non prévues ailleurs pour dispositifs semi-conducteurs
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
Disclosed embodiments may include systems, devices, processes, and methods for fabricating and packaging power converters on an integrated circuit. In some embodiments, a power converter device may be processed and packaged using a hybrid (co-packaged) approach. The power converter includes a first integrated circuit die with a plurality of first switches and a plurality of second switches. The power converter further includes a second integrated circuit die including a controller circuit that is electrically coupled to control switching of the plurality of first switches and the plurality of second switches. The power converter may include additional integrated circuit dies coupled to the controller circuit. The plurality of first switches and the plurality of second switches may each include vertical double-diffused metal-oxide semiconductor field effect transistors. The plurality of first switches and the plurality of second switches may each include lateral double-diffused metal-oxide semiconductor field effect transistors.
H01L 29/417 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative transportant le courant à redresser, à amplifier ou à commuter
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 27/088 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant uniquement des composants semi-conducteurs d'un seul type comprenant uniquement des composants à effet de champ les composants étant des transistors à effet de champ à porte isolée
A power converter includes a first bridge arm connected between an input power supply and a reference potential, the first bridge arm including a first switch and a second switch connected at a first connection point, a second bridge arm connected in parallel with the first bridge arm between the input power supply and the reference potential, the second bridge arm including a first capacitor and a second capacitor connected at a second connection point, a coupling inductance connected between the first and second connection points, where a center tap of the coupling inductance is connected to a load, and a first resonant inductor connected in series with the coupling inductance between the first and second connection points, the first resonant inductor defining a series resonant circuit with each of the first capacitor and the second capacitor.
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
H02M 3/00 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu
A field effect transistor includes a source region of a first conductive type on a device layer, a drain region of the first conductive type, a body region of a second conductive type that is opposite to the first conductive type, and a gate electrode on the device layer. The body region is directly below the gate electrode. When the insulating surface is in plan view, the gate electrode and the body region each have a shape elongated in a first direction, the source region is on one side of the gate electrode, and the drain region is on another side of the gate electrode. The field effect transistor further includes a body-contact region of the second conductive type extending from each of a plurality of body-contact connecting portions on an edge of the body region facing the source region toward the source region.
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
Methods and devices for realizing RF processing paths associated to different frequency bands are presented. According to one aspect, the RF processing paths are provided by a hybrid input LNA RF frontend that includes RF processing paths that are dedicated to specific frequency bands and RF processing paths that are shared between several frequency bands. Sharing of the RF processing paths is provided by an input combiner network and/or a multi-input cascode amplifier that includes a cascode transistor that is coupled to at least two input transistors. Further presented in a toolkit that includes circuit blocks that can be used in specific combinations to customize the RF processing paths to achieve specific performance or cost optimization. A decision tree based on performance and cost priorities assigned to each of the frequency bands is used to provide the specific combinations.
Squaric acid-based polymers and their use in electrode materials and/or electrolyte compositions, as well as their production processes are described herein. Also described are electrode materials, electrodes, electrolyte compositions, electrochemical cells, electrochemical accumulators, and optoelectronic devices comprising the polymers and their uses.
C08G 65/00 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule
C08G 65/40 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir de composés hydroxylés ou de leurs dérivés métalliques dérivés des phénols à partir des phénols et d'autres composés
G02F 1/1516 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur un effet électrochromique caractérisés par le matériau électrochromique, p. ex. par le matériau électro-déposé comprenant un matériau organique
H01B 1/12 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques substances organiques
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 10/0565 - Matériaux polymères, p. ex. du type gel ou du type solide
A filter device applied to a radio-frequency circuit includes a dielectric substrate on which a ground electrode is disposed and a main line which has an input end and an output end. The filter device also includes first and second resonators and an intermediate resonator. The main line is disposed to face the ground electrode and extends in a first direction. The first resonator intersects the main line and extends in a second direction. The second resonator intersects the main line and extends in the second direction in a region further to an output end side than the first resonator. At least part of the intermediate resonator is disposed between the first resonator and the second resonator.
A laminated coil component includes a multilayer body in which a coil, which is obtained by electrically connecting a plurality of coil conductors with a via conductor interposed therebetween, is provided in an inside of an insulator portion which is obtained by laminating a plurality of insulation layers. Each of a first coil conductor and a second coil conductor that are adjacent to each other in a lamination direction and are electrically connected in series with a first via conductor interposed therebetween includes a first main surface that faces the opposite direction to the lamination direction and on which a void exists. The second coil conductor includes a second main surface that faces the lamination direction and on which another void exists, and the other void locally exists on a position opposed to the first via conductor.
Provided is a coil component in which a wire can be easily wound around a winding core part of an integrated core even if there is a member disposed at a predetermined distance from the winding core part. A core (2) is provided with a gap (11) for interrupting a part of a magnetic flux loop passing through a winding core part (3), a first flange part (5), a second flange part (6), and a top plate part (7), the gap (11) penetrating in the width direction (W) while being defined by a first wall surface (13) and a second wall surface (14) facing each other. When viewed from the outside of the core (2) in a direction in which the first wall surface (13) and the second wall surface (14) face each other, a part of the first wall surface (13) forms an extension part (13p) that extends in the width direction (W) beyond the periphery of the second wall surface (14). In order to form the extension part (13p) of the first wall surface (13), for example, a recess (15) is provided at a portion where the second wall surface (14) is formed, or a protrusion is provided at a portion where the first wall surface (13) is formed.
An optical device (10) comprises: a translucent body (1) that transmits light of a prescribed wavelength; a housing (2) that holds the translucent body; a piezoelectric element (5); a first vibration body (3) that vibrates the translucent body by the vibration of the piezoelectric element; and a second vibration body (50) that has an attenuation coefficient smaller than the attenuation coefficient of the translucent body and that is in contact with the translucent body to vibrate together with the translucent body.
H04N 23/52 - Éléments optimisant le fonctionnement du capteur d'images, p. ex. pour la protection contre les interférences électromagnétiques [EMI] ou la commande de la température par des éléments de transfert de chaleur ou de refroidissement
B60S 1/62 - Autres accessoires sur véhicules pour le nettoyage
G03B 15/00 - Procédés particuliers pour prendre des photographiesAppareillage à cet effet
A laminated coil component 1 according to one embodiment of an electronic component comprises a ceramic element 10 and an external electrode 20 that is provided to an outer surface of the ceramic element 10. The external electrode 20 includes an underlayer electrode layer 20a, a Ni plating film 20b, and a Au plating film 20c in this order starting from the ceramic element 10 side. The Au plating film 20c extends from the Ni plating film 20b to a part of the ceramic element 10. At a portion where the Au plating film 20c is in contact with the ceramic element 10, at least part of the Au plating film 20c permeates into the ceramic element 10.
In a second lead-out region (G2) of a coil component (1) of the present disclosure, when viewed in the thickness direction of a first coil portion (20), the distance (r4) between a right side-surface (43) and an inner peripheral side of the first coil conductor (2) overlapping the second lead-out region (G2) in the first coil portion (20) is shorter than the distance (r2) between the right side-surface (43) and an inner peripheral side of the first coil portion (20) not overlapping the second lead-out region (G2) in the first coil portion (20).
The present invention improves durability. A flexible substrate (1) comprises a first stationary part (11), a second stationary part (12), a plastic deformation portion (21), a first non-stationary part (31), and a second non-stationary part (32). The plastic deformation portion (21) has a protruding shape and is disposed between the first stationary part (11) and the second stationary part (12). The first non-stationary part (31) is disposed on a main surface (911) of a first base plate (91) between the first stationary part (11) and the plastic deformation portion (21) and is not fixed to the first base plate (91). The second non-stationary part (32) is disposed on a main surface (921) of a second base plate (92) between the second stationary part (12) and the plastic deformation portion (21) and is not fixed to the second base plate (92). The depth (H1) of the plastic deformation portion (21) is greater than three-sevenths times the width (W1) of the plastic deformation portion (21) at a position at half the depth (H1) of the plastic deformation portion (21).
A filter (10) is provided with a plurality of elastic wave resonance circuits, and an elastic wave resonance circuit (11) among the plurality of elastic wave resonance circuits is composed of series arm resonators (111-113) connected in series to each other. Each of the series arm resonators (111-113) has an IDT electrode that is disposed on a piezoelectric substrate (50) and has a plurality of electrode fingers that are parallel to each other. When a region in which two or more electrode fingers having the same duty are continuously arranged is defined as an electrode finger region, the IDT electrode of each of the series arm resonators (111-113) is divided into a plurality of electrode finger regions having different duties D. When the plurality of electrode finger regions are compared, the larger the duty D, the smaller an electrode finger pitch that is the interval between the adjacent electrode fingers.
B01J 20/02 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique
B01J 20/28 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation caractérisées par leur forme ou leurs propriétés physiques
72.
ELASTIC WAVE FILTER DEVICE AND METHOD FOR MANUFACTURING ELASTIC WAVE FILTER DEVICE
Provided is a compact elastic wave filter device that allows improvement in resonance characteristics. This elastic wave filter device has a plurality of resonators, and comprises: a support member provided with a support substrate having a thickness in a first direction; a first piezoelectric layer provided on a main surface of the support member; a second piezoelectric layer provided on the main surface of the support member and provided at a position different from that of the first piezoelectric layer; and functional electrodes of resonators provided in the first piezoelectric layer and the second piezoelectric layer. The plurality of resonators include a first resonator in the first piezoelectric layer and a second resonator in the second piezoelectric layer. The first piezoelectric layer has a first piezoelectric film and a second piezoelectric film stacked on the first piezoelectric film. The first piezoelectric film and the second piezoelectric film have different polarization directions. The second piezoelectric layer has a smaller number of piezoelectric films than the first piezoelectric layer.
Provided is an electrolyte additive, including a compound of formula (1), wherein R1 is selected from a substituted or unsubstituted five-membered heterocyclic group, a substituted or unsubstituted six-membered heterocyclic group, or a substituted or unsubstituted amino group; L is a sulfone group, a sulfate ester group, or a sulfonate ester group; and R2 is selected from a substituted or unsubstituted C1-18 alkyl group, a substituted or unsubstituted C1-18 alkoxy group, a substituted or unsubstituted conjugated five-membered carbocyclic group or heterocyclic group, a substituted or unsubstituted conjugated six-membered carbocyclic group or heterocyclic group, a di(C1-6 alkyl)amino group, a di(C6-12 aryl)amino group, a tri(C1-6 alkyl)silyl group, a substituted or unsubstituted C3-6 alkenyl group, a substituted or unsubstituted C3-6 alkynyl group, or a substituted or unsubstituted ester group. The electrolyte additive, electrolyte, and lithium ion secondary battery comprising same of the present disclosure achieve better protection of electrodes, improve the cycle performance of the battery, and achieve lower post-cycle impedance.
Provided is an electrolyte additive, including a compound of formula (1), wherein R1 is selected from a substituted or unsubstituted five-membered heterocyclic group, a substituted or unsubstituted six-membered heterocyclic group, or a substituted or unsubstituted amino group; L is a sulfone group, a sulfate ester group, or a sulfonate ester group; and R2 is selected from a substituted or unsubstituted C1-18 alkyl group, a substituted or unsubstituted C1-18 alkoxy group, a substituted or unsubstituted conjugated five-membered carbocyclic group or heterocyclic group, a substituted or unsubstituted conjugated six-membered carbocyclic group or heterocyclic group, a di(C1-6 alkyl)amino group, a di(C6-12 aryl)amino group, a tri(C1-6 alkyl)silyl group, a substituted or unsubstituted C3-6 alkenyl group, a substituted or unsubstituted C3-6 alkynyl group, or a substituted or unsubstituted ester group. The electrolyte additive, electrolyte, and lithium ion secondary battery comprising same of the present disclosure achieve better protection of electrodes, improve the cycle performance of the battery, and achieve lower post-cycle impedance.
R1-L-R2 (1)
H01M 10/0567 - Matériaux liquides caracterisés par les additifs
C07C 305/24 - Esters d'acides sulfuriques ayant des atomes d'oxygène de groupes sulfate liés à des atomes de carbone de cycles aromatiques à six chaînons de cycles aromatiques à six chaînons non condensés
C07C 307/02 - Monoamides d'acides sulfuriques ou de leurs esters, p. ex. acides sulfamiques
C07C 309/76 - Esters d'acides sulfoniques ayant des atomes de soufre de groupes sulfo estérifiés liés à des atomes de carbone de cycles aromatiques à six chaînons d'un squelette carboné contenant des atomes d'azote, ne faisant pas partie de groupes nitro ou nitroso, liés au squelette carboné
C07C 311/16 - Sulfonamides ayant des atomes de soufre de groupes sulfonamide liés à des atomes de carbone de cycles aromatiques à six chaînons ayant l'atome d'azote d'au moins un des groupes sulfonamide lié à des atomes d'hydrogène ou à un atome de carbone acyclique
C07C 311/29 - Sulfonamides, le squelette carboné de la partie acide étant substitué de plus par des atomes d'oxygène liés par des liaisons simples ayant l'atome de soufre d'au moins un des groupes sulfonamide lié à un atome de carbone d'un cycle aromatique à six chaînons
C07D 213/71 - Atomes de soufre auxquels est lié un second hétéro-atome
C07D 233/60 - Composés hétérocycliques contenant des cycles diazole-1, 3 ou diazole-1, 3 hydrogéné, non condensés avec d'autres cycles comportant deux liaisons doubles entre chaînons cycliques ou entre chaînons cycliques et chaînons non cycliques avec uniquement des atomes d'hydrogène ou des radicaux ne contenant que des atomes d'hydrogène et de carbone, liés aux atomes de carbone du cycle avec des radicaux hydrocarbonés, substitués par des atomes d'oxygène ou de soufre, liés aux atomes d'azote du cycle
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
74.
EPITAXIALLY-GROWN SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
An epitaxially-grown substrate includes: a substrate made of a III-V-group compound semiconductor containing Ga or In as a III-group element; a sacrificial layer epitaxially grown on the substrate; and a semiconductor layer epitaxially grown on the sacrificial layer. The sacrificial layer includes a layer made of a mixed-crystal semiconductor containing Al or In as a III-group element, a composition ratio of Al or In varies in a thickness direction, and a location indicating a local maximum value of the composition ratio of Al or In is positioned inside other than a lower surface and an upper surface of the sacrificial layer.
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 29/04 - Corps semi-conducteurs caractérisés par leur structure cristalline, p.ex. polycristalline, cubique ou à orientation particulière des plans cristallins
H01L 29/205 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV comprenant plusieurs composés dans différentes régions semi-conductrices
H01L 29/36 - Corps semi-conducteurs caractérisés par la concentration ou la distribution des impuretés
An acoustic sensor includes a piezoelectric plate including a conductor plate with first and second surfaces, and a piezoelectric element on the second surface, a cover facing the first surface of the conductor plate, a support substrate facing the second surface of the conductor plate and the piezoelectric element, a first connector including a conductor between the piezoelectric element and the support substrate and electrically connecting the piezoelectric element and the support substrate, a first insulating structure including an insulator between the second surface of the conductor plate and the support substrate at an outer edge of the second surface of the conductor plate, and a second connector including a conductor on an outer edge of the first surface of the conductor plate and electrically connecting the conductor plate and the cover.
B06B 1/02 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique
B06B 1/06 - Procédés ou appareils pour produire des vibrations mécaniques de fréquence infrasonore, sonore ou ultrasonore utilisant l'énergie électrique fonctionnant par effet piézo-électrique ou par électrostriction
H04R 1/46 - Adaptation particulière pour usage comme microphone de contact, p. ex. sur instrument de musique, sur stéthoscope
A filter device is provided that includes a substrate; a piezoelectric layer; an acoustic Bragg reflector between the substrate and the piezoelectric layer; and a conductor pattern on a surface of the piezoelectric layer. The conductor pattern includes interdigital transducers (IDTs) of a plurality of resonators, and a plurality of conductors that connect the plurality of resonators in a ladder filter circuit, the plurality of conductors comprising adjacent first and second conductors. Moreover, the piezoelectric layer has an opening between the first and second conductors. A width dp of the opening of the piezoelectric layer is less than a distance dm between the first and second conductors.
Disclosed embodiments may include systems, devices, processes, and methods for fabricating and packaging power converters on an integrated circuit. In some embodiments, a power converter device may be processed and packaged using a hybrid (co-packaged) approach. The power converter includes a first integrated circuit die with a plurality of first switches and a plurality of second switches. The power converter further includes a second integrated circuit die including a controller circuit that is electrically coupled to control switching of the plurality of first switches and the plurality of second switches. The power converter may include additional integrated circuit dies coupled to the controller circuit. The plurality of first switches and the plurality of second switches may each include vertical double-diffused metal-oxide semiconductor field effect transistors. The plurality of first switches and the plurality of second switches may each include lateral double-diffused metal-oxide semiconductor field effect transistors.
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 27/092 - Transistors à effet de champ métal-isolant-semi-conducteur complémentaires
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H03K 17/687 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
This capacitive sensor detects a force acting in at least one direction of a first direction, a second direction intersecting the first direction, and a third direction intersecting both the first direction and the second direction, on the basis of a change in capacitance of an electrode unit composed of a first comb tooth structure and a second comb tooth structure facing the first comb tooth structure. The capacitive sensor comprises: a first substrate layer (40) that has a thickness direction in the third direction, has a boss part (40A) for receiving a force acting in at least one direction, and bends and deforms on the basis of the force acting on the boss part (40A); a mass part (60) that has a thickness direction in the third direction, and has transmitted thereto the force acting in at least one direction from the boss part (40A); and a second substrate layer (30) that has a movable electrode having the first comb tooth structure and is displaced in association with the mass part (60), and a fixed electrode having the second comb tooth structure.
G01L 5/165 - Appareils ou procédés pour la mesure des forces, du travail, de la puissance mécanique ou du couple, spécialement adaptés à des fins spécifiques pour la mesure de plusieurs composantes de la force en utilisant des variations de la capacité
This substrate 1 with a built-in capacitor includes: a core layer 10 that includes at least one core material 11, which has a cavity 11X, in the thickness direction; a capacitor element 20 that is built in the cavity 11X of the core material 11; and a through conductor 30 that is provided so as to penetrate the core layer 10 in the thickness direction. The through conductor 30 includes: a first through conductor 31 which is provided so as to penetrate the capacitor element 20 in the core layer 10, and so as to be electrically connected to a load 50 and a power supply 55; and a second through conductor 32 which is provided so as to penetrate the capacitor element 20 in the core layer 10 at a distance from the first through conductor 31, and so as to be electrically connected to the load 50 and the power supply 55. The first through conductor 31 is electrically connected to a first electrode 21 of the capacitor element 20. The second through conductor 32 is electrically connected to a second electrode 22 of the capacitor element 20, the second electrode 22 having a polarity that is different from the polarity of the first electrode 21.
A gas concentration sensing device (10) is provided with a gas balancer (31), a pump (32), a gas concentration sensor (34), and a plurality of second cylinders. The gas balancer (31) is provided with a first cylinder that is permeable to a component to be sensed that is gas, and impermeable to moisture. The gas balancer (31) is provided with a structure making it possible to bring the concentration of the component to be sensed that is gas to a balanced state, without allowing water to permeate between gas of an interior space of the first cylinder and moisture of the exterior. The pump (32) creates airflow in the interior space. The gas concentration sensor (34) senses the concentration of the component to be sensed that is in the gas. The plurality of second cylinders are each constituted of cylindrical walls that are gas- and moisture-impermeable. The plurality of second cylinders (34) are used to connect the interior space (110) of the first cylinder, the pump (32), and the gas concentration sensor (32), thereby constituting a circulating flow path (300) allowing for circulation of gas within the flow path. The pump (32) is arranged on the downstream side of the gas balancer (31) in the circulating flow path (300).
abb (in the formula, M is at least one element selected from the group consisting of elements in groups 3, 4, 5, 6, and 7, Q is at least one element (excluding O) selected from the group consisting of elements in groups 12, 13, 14, 15, and 16, a is greater than or equal to 0 and less than or equal to 2, and b is greater than 0 and less than or equal to 2).
B01J 20/02 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique
B01D 53/02 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par adsorption, p. ex. chromatographie préparatoire en phase gazeuse
B01J 20/06 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant des oxydes ou des hydroxydes des métaux non prévus dans le groupe
C01B 32/907 - OxycarburesSulfocarburesMélange de carbures
The purpose of the present invention is to provide a piezoelectric device and a filter capable of suppressing unwanted waves near a resonance point. This piezoelectric device (1) comprises: a support member (10) provided with a support substrate (11); a piezoelectric layer (20) having thickness in a first direction (Z0), said piezoelectric layer (20) being provided on the main surface of the support member (10); and functional electrodes (31, 32) provided on main surfaces (20a, 20b) of the piezoelectric layer (20). The piezoelectric layer (10) has a first piezoelectric film (21), and a second piezoelectric film (22) laminated on the first piezoelectric film (21). A polarization direction (Z1) of the first piezoelectric film (21) and a polarization direction (Z2) of the second piezoelectric film (22) intersect each other. A displacement direction (W1) of the main wave of the first piezoelectric film (21) and a displacement direction (W2) of the main wave of the second piezoelectric film (22) are parallel to each other.
The present invention provides a piezoelectric device in which cracking of a piezoelectric layer is suppressed. This piezoelectric device is provided with: a support member that is provided with a support substrate; a piezoelectric layer that has a thickness in a first direction and is provided on a main surface of the support member; and a functional electrode that is provided on a main surface of the piezoelectric layer. The piezoelectric layer has a first piezoelectric film and a second piezoelectric film that is superposed on the first piezoelectric film. The first piezoelectric film and the second piezoelectric film are single crystals which are formed of the same material. The first piezoelectric film and the second piezoelectric film have different polarization directions. The first piezoelectric film and the second piezoelectric film have cleavage surfaces. At least one cleavage surface among the cleavage surfaces of the first piezoelectric film and at least one cleavage surface among the cleavage surfaces of the second piezoelectric film extend in intersecting directions when viewed in plan in the first direction.
Disclosed embodiments may include systems, devices, processes, and methods for fabricating and packaging power converters on an integrated circuit. In some embodiments, a power converter device may be processed and packaged using a hybrid (co-packaged) approach. The power converter includes a first integrated circuit die with a plurality of first switches and a plurality of second switches. The power converter further includes a second integrated circuit die including a controller circuit that is electrically coupled to control switching of the plurality of first switches and the plurality of second switches. The power converter may include additional integrated circuit dies coupled to the controller circuit. The plurality of first switches and the plurality of second switches may each include vertical double-diffused metal-oxide semiconductor field effect transistors. The plurality of first switches and the plurality of second switches may each include lateral double-diffused metal-oxide semiconductor field effect transistors.
H10D 62/10 - Formes, dimensions relatives ou dispositions des régions des corps semi-conducteursFormes des corps semi-conducteurs
H10D 84/83 - Dispositifs intégrés formés dans ou sur des substrats semi-conducteurs qui comprennent uniquement des couches semi-conductrices, p. ex. sur des plaquettes de Si ou sur des plaquettes de GaAs-sur-Si caractérisés par l'intégration d'au moins un composant couvert par les groupes ou , p. ex. l'intégration de transistors IGFET de composants à effet de champ uniquement de transistors FET à grille isolée [IGFET] uniquement
H10D 30/64 - Transistors FET à semi-conducteurs à oxyde métallique à double diffusion [DMOS]
A power converter includes a first bridge arm and a second bridge arm connected in parallel between a voltage input terminal and a voltage output terminal, a first winding and an inductor connected in series between first and second nodes, a second winding and a third winding connected in series, a third switch connected between the second winding and a ground, and a fourth switch connected between the third winding and the ground. The first bridge arm includes first and second switches connected in series. The second bridge arm includes first and second capacitors connected in series. The first node is on a path connecting the first switch and the second switch, and the second node is on a path connecting the first capacitor and the second capacitor. The first to third windings define a transformer.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/00 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu
A film including: particles of a two-dimensional material containing one or plural layers, wherein the one or plural layers comprise a layer body represented by: MmXn, wherein M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon or nitrogen atom, or a combination thereof, n is 1 to 4, and m is more than n but not more than 5, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom; and a polymer having an anionic functional group and a cationic functional group, wherein a ratio of the polymer to a sum of the particles of the two-dimensional material and the polymer in the film is 5 vol % to 70 vol %.
C08K 9/02 - Ingrédients traités par des substances inorganiques
A61B 5/268 - Électrodes bioélectriques à cet effet caractérisées par les matériaux des électrodes contenant des polymères conducteurs, p. ex. des polymères PEDOT:PSS
An acoustic resonator device is provided that includes a piezoelectric layer; and an interdigital transducer (IDT) at a surface of the piezoelectric layer, the IDT comprising interleaved fingers. At least one interleaved finger of the interleaved fingers comprises a first layer and a second layer over the first layer, wherein the first layer is between the piezoelectric layer and the second layer. Moreover, a shape of the second layer varies with respect to at least one other interleaved finger of the interleaved fingers. A thickness of the first layer is less than a thickness of the second layer.
A capacitor element that includes: a capacitor portion including an anode plate including a porous portion on a core portion, a dielectric layer on the porous portion, and a cathode layer on the dielectric layer; a sealing layer covering the capacitor portion; conductive interconnect layers on the sealing layer; and an outer insulating layer covering the sealing layer and the conductive interconnect layers. In a plan view from a thickness direction of the anode plate, a center-to-center distance between a first anode through conductor and a first cathode through conductor is equivalent to a center-to-center distance between the first anode through conductor and a second cathode through conductor, and a center-to-center distance between a fifth cathode through conductor and the first cathode through conductor is equivalent to a center-to-center distance between the fifth cathode through conductor and the second cathode through conductor.
A three-dimensional (3D) package includes one or more frames, circuit assemblies, and an encapsulating material to encapsulate at least a part of the one or more frames and the circuit assemblies. The one or more frames each include one or more supporting portions and conductive connecting portions extending from the one or more supporting portions and defining assembly mounting spaces therebetween. Circuit assemblies are each mounted in one assembly mounting space and electrically attached to corresponding one or more of the first and second conductive connecting portions.
H01L 23/04 - ConteneursScellements caractérisés par la forme
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
The present invention relates to a flow measurement device for measuring wind or a fluid flow, comprising a heating element, a plurality of temperature sensor elements located at different positions and an evaluation unit for determining speed and/or direction of the wind or fluid flow from sensor signals of the temperature sensor elements, wherein the plurality of temperature sensor elements are arranged on a flat, sheet-like sensor carrier to form a substantially planar temperature sensor field around said heating element. The plurality of temperature sensor elements are associated to the same heating element to detect changes of the heat distribution from said heating element due to wind or fluid flow passing over the heating element and the temperature sensor field.
G01P 5/12 - Mesure de la vitesse des fluides, p. ex. d'un courant atmosphériqueMesure de la vitesse de corps, p. ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques en utilisant la variation de la résistance d'un conducteur chauffé
G01P 13/02 - Indication de la direction uniquement, p. ex. par une girouette
G01P 13/00 - Indication ou enregistrement de l'existence ou de l'absence d'un mouvementIndication ou enregistrement de la direction d'un mouvement
G01F 1/68 - Mesure du débit volumétrique ou du débit massique d'un fluide ou d'un matériau solide fluent, dans laquelle le fluide passe à travers un compteur par un écoulement continu en utilisant des effets thermiques
G01F 1/69 - Dispositions de structureMontage des éléments, p. ex. relativement à l'écoulement de fluide utilisant un élément de chauffage, de refroidissement ou de détection d'un type particulier du type à résistance
A power converter includes a first bridge arm including a first switch and a second switch connected in series such that the first switch is connected to the second switch to define a first connection point, a second bridge arm including a third switch and a fourth switch connected in series such that the third switch is connected to the fourth switch to define a second connection point, a first LC resonant cavity connected between the first connection point and the second connection point, a first rectifier and a second rectifier including switches, and a coupling inductance connected to the second switch, the third switch, the first rectifier and the second rectifier respectively, such that a center tap of the coupling inductance is connected to a load.
H02M 1/00 - Détails d'appareils pour transformation
H02M 7/219 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continu sans possibilité de réversibilité par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs dans une configuration en pont
An inductor component including an element body, a coil in the element body, and first and second outer electrodes that are at the element body and are electrically coupled to the coil. The coil includes a winding portion spirally wound along an axis direction. The coil includes the winding portion, and first and second extended wirings that couple one end and the other end of the winding portion to the first and second outer electrodes, respectively, at least one of the first and second outer electrodes includes an embedded portion embedded in the element body, at least one of the first and second extended wirings includes a coupling portion coupled to the winding portion and a curved portion curved from the coupling portion toward the embedded portion. In a view from the axial direction, the curved portion has a recessed shape.
A switching power supply device includes a passive EMI filter including capacitors coupled to an output terminal of the passive EMI filter and a ground, a first soft switching converter coupled to the passive EMI filter output terminal and the ground, including a primary side switching circuit coupled to the passive EMI filter output terminal, an isolation transformer including a primary winding coupled to the primary side switching circuit and a secondary winding, and a rectification circuit coupled to the secondary winding and an output terminal of the switching power supply device, and including a rectifier, and a first common-mode noise reduction path coupled between a node coupling the capacitor and the passive EMI filter output terminal and a node coupling a homonymous end of the secondary winding and the rectifier. The first common-mode noise reduction path includes an impedance.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/00 - Détails d'appareils pour transformation
H02M 1/12 - Dispositions de réduction des harmoniques d'une entrée ou d'une sortie en courant alternatif
H02M 1/44 - Circuits ou dispositions pour corriger les interférences électromagnétiques dans les convertisseurs ou les onduleurs
A radio frequency circuit includes: a first output terminal; a second output terminal; a first low-noise amplifier; a second low-noise amplifier; a first filter connected between an output end of the first low-noise amplifier and the first output terminal, the first filter having a passband that includes at least a portion of a first band; and a second filter connected between the output end of the first low-noise amplifier and the second output terminal, the second filter having a passband that includes at least a portion of a second band. The second low-noise amplifier is connected between the second filter and the second output terminal, and the first band and the second band are a combination of bands usable in dual connectivity.
H04B 1/10 - Dispositifs associés au récepteur pour limiter ou supprimer le bruit et les interférences
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
95.
SECONDARY BATTERY AND METHOD FOR MANUFACTURING SECONDARY BATTERY
A secondary battery of the present disclosure includes a stacked electrode assembly in which a plurality of positive electrodes and a plurality of negative electrodes are alternately stacked with a separator interposed therebetween. The positive electrodes include a positive electrode metal current collector, a positive electrode active material layer stacked on the positive electrode metal current collector, and an adhesive layer adhering to the separator. A region of the positive electrode metal current collector where the positive electrode active material layer is not stacked forms a positive electrode metal current collector exposed portion. An edge portion of the positive electrode active material layer includes a first edge portion adjacent to the positive electrode metal current collector exposed portion and a second edge portion disposed on a side opposite to the first edge portion when viewed from a stacking direction in which the positive electrode and the negative electrode are stacked. The adhesive layer includes a first adhesive layer stacked on the positive electrode metal current collector exposed portion and extending along the first edge portion, and a second adhesive layer extending along the second edge portion.
A secondary battery having higher operation reliability is provided. The secondary battery includes an electrode wound body, a first tape, a second tape, and a third tape. The electrode wound body has a first end face and a second end face that are opposed to each other in a first direction, and a side surface coupling the first end face and the second end face to each other. The first tape covers a first side surface part, of the side surface of the electrode wound body, that is positioned on a side of the first end face. The second tape covers a second side surface part, of the side surface of the electrode wound body, that is positioned on a side of the second end face. The third tape covers a third side surface part, of the side surface of the electrode wound body, that is positioned between the first side surface part and the second side surface part. The third tape has an elongation percentage higher than both an elongation percentage of the first tape and an elongation percentage of the second tape.
H01M 50/586 - Moyens pour empêcher un usage ou une décharge indésirables pour empêcher les contacts incorrects à l’intérieur ou à l’extérieur des batteries à l’intérieur des batteries p. ex. les contacts incorrects des électrodes
97.
LOW LOSS REFLECTIVE PASSIVE PHASE SHIFTER USING TIME DELAY ELEMENT WITH DOUBLE RESOLUTION
A phase shifter for altering the phase of a radio frequency signal is disclosed herein. A Lange coupler is used having reflective ports that are coupled to artificial transmission lines. The artificial transmission lines provide a reflection transmission path, the length of which can be determined by digital control lines. Transistors placed along the length of the central trace provide independent paths to ground that serve to shorten the electrical length of the ATL. Accordingly, by selectively turning the transistors on/off, the electrical length of the ATL can be selected and thus the amount of phase delay introduced by the phase shifter.
A coil component is capable of reducing specific resistance of a coil and reliably mitigating stress. A coil component includes a base body and a coil disposed in the base body. The base body includes a plurality of magnetic layers laminated in a first direction. The coil includes a plurality of coil wires laminated in the first direction. The coil wires extend along a plane orthogonal to the first direction. Each of the coil wires includes a first coil conductor layer and a second coil conductor layer laminated in the first direction. Specific resistance of the first coil conductor layer is smaller than specific resistance of the second coil conductor layer. Also, in a section orthogonal to an extending direction of each of the coil wires, the second coil conductor layer is adjacent to one side of the first coil conductor layer in the first direction, and a cavity portion is disposed in at least a part between the first coil conductor layer and one of the magnetic layers adjacent to another side of the first coil conductor layer in the first direction.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
The present invention provides a multilayer ceramic capacitor which makes it possible to determine the specs of the multilayer ceramic capacitor on the basis of a view in the lamination direction. A multilayer ceramic capacitor 10 according to the present invention comprises: a laminate having a first main surface and a second main surface that are opposite from each other in a lamination direction, a first lateral surface and a second lateral surface that are opposite from each other in a first direction which is orthogonal to the lamination direction, and a third lateral surface and a fourth lateral surface that are opposite from each other in a second direction which is orthogonal to the lamination direction and the first direction; a first external electrode disposed on the first lateral surface, the third lateral surface, the first main surface, and/or the second main surface; a second external electrode disposed on the second lateral surface, the third lateral surface, the first main surface, and/or the second main surface; a third external electrode disposed on the first lateral surface, the fourth lateral surface, the first main surface, and/or the second main surface; and a fourth external electrode disposed on the second lateral surface, the fourth lateral surface, the first main surface, and/or the second main surface. The first external electrode is provided with: a first thin film layer disposed on the first main surface and/or second main surface; a first underlayer plating layer disposed on the first lateral surface and the third lateral surface; and a first surface layer plating layer disposed on the first underlayer plating layer. The second external electrode is provided with: a second thin film layer disposed on the first main surface and/or the second main surface; a second underlayer plating layer disposed on the second lateral surface and the third lateral surface; and a second surface layer plating layer disposed on the second underlayer plating layer. The third external electrode is provided with: a third thin film layer disposed on the first main surface and/or the second main surface; a third underlayer plating layer disposed on the first lateral surface and the fourth lateral surface; and a third surface layer plating layer disposed on the third underlayer plating layer. The fourth external electrode is provided with: a fourth thin film layer disposed on the first main surface and/or the second main surface; a fourth underlayer plating layer disposed on the second lateral surface and the fourth lateral surface; and a fourth surface layer plating layer disposed on the fourth underlayer plating layer. When the first to fourth external electrodes which are disposed on the first main surface and/or the second main surface are formed in a rectangular shape, and a first region is defined as a corner part side and a second region is defined as a center part side as divided by a straight line that, of the four vertices, connects vertices so as to divide the first to fourth external electrodes into two sides which are a corner part side and a center part side of the laminate, the area of the second region is less than the area of the first region, and at least one protrusion that protrudes toward the center of the laminate is disposed in the second region of at least one external electrode among the first to fourth external electrodes which are disposed on the first main surface and/or the second main surface.
In the present invention, an inductor component comprises an element, a first interlayer insulation layer (31), an inter-wiring insulation layer (32), and inductor wiring. The element has a first main surface. The first interlayer insulation layer (31) extends parallel to the first main surface within the element. The first interlayer insulation layer (31) assumes a flat-plate form. The inter-wiring insulation layer (32) extends from the first interlayer insulation layer in a first positive direction that is orthogonal to the first main surface. The inductor wiring has a portion adjacent to the inter-wiring insulation layer (32) in a direction parallel to the first main surface, and extends parallel to the first main surface on the first positive direction side with respect to the first interlayer insulating layer (31). The inductor wiring assumes a linear form. The first interlayer insulation layer (31) includes an insulating synthetic resin (SR) and a plurality of fillers (FL) dispersed in the synthetic resin (SR).
