An acoustic wave device includes a first substrate including first and second main surfaces, a second substrate including a third main surface, a functional electrode on the third main surface, a support portion between the first and third main surfaces to provide a space therebetween, and via conductors in the first substrate and extending from the first main surface toward the second main surface. The support portion includes first and second metal films in contact with each other. In plan view of the first main surface, a region of the first metal film includes a region of the second metal film and an area of the first metal film is larger than an area of the second metal film, and a hardness of the second metal film is greater than a hardness of the first metal film.
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and inner electrode layers, first and second main surfaces facing each other in a lamination direction of the dielectric layers, first and second side surfaces facing each other in a width direction, and first and second end surfaces facing each other in a length direction, a first outer electrode on the first main surface and the first end surface of the multilayer body, and a second outer electrode on the first main surface and the second end surface of the multilayer body. The inner electrode layers are exposed from the first and second end surfaces, which are inclined so as to splay out from the first main surface toward the second main surface. Projecting portions including the dielectric layers and the inner electrode layers are located on the first and second end surfaces.
A filter apparatus includes a first piezoelectric substrate including first and second main surfaces, a first resonator including a functional electrode on the first main surface, a second piezoelectric substrate including third and fourth main surfaces, a second resonator including a functional electrode on the third main surface, a support between the first and third main surfaces and providing a space between the first and third main surfaces, and a through electrode passing through the first piezoelectric substrate and electrically coupled to one of the first and second resonators. A thickness of the first piezoelectric layer is smaller than a thickness of the second piezoelectric layer.
In a three-terminal multilayer ceramic capacitor, each of third and fourth external electrodes includes a central portion having a thickness of about 3 μm or more, and first and second convex portions having a thickness greater than that of the central portion and located closer to first and second end surfaces than the central portion, and first and second limit points, adjacent to the first and second end surfaces, where, starting from first and second external electrode end portions on the side of the first and second end surfaces, a thickness is about 3 μm or more. Between the first and second limit points, first and second lead-out end portions, respectively of third and fourth lead-out electrode portions, are located.
In a multilayer ceramic electronic component, a laminate includes an inner layer portion including first and second internal electrode layers. A concentration of an additive in a first lateral surface side of the inner layer portion is higher than in a center portion in the width direction, a concentration of the additive in a second lateral surface side of the inner layer portion is higher than in the center portion, a concentration of the additive in an end of the second internal electrode layer on a first end surface side of the inner layer portion is higher than in the center portion, and a concentration of the additive in an end of the first internal electrode layer on a second end surface side of the inner layer portion is higher than in the center portion of the inner layer portion. The additive includes Sn, Mn, and/or Mg.
A three-terminal multilayer ceramic capacitor includes third and fourth base electrode layers including a joining portion, which is joined to first and second side surfaces, and first and second separated portions, which are spaced farther from the first and second side surfaces toward first and second end surfaces than the joining portion, and third and fourth plating layers including first and second edge portions extending along the first and second separated portions between the first and second separated portions and the first and second side surfaces, and a surface layer portion covering outer surfaces of the third and fourth base electrode layers continuously with the first and second edge portions.
A radio-frequency module includes first filters, a second filter, a first switch, a second switch, and a first variable circuit element. The first filters have a first pass band that includes a first communication band. The second filter has a second pass band that includes a second communication band. The first switch selects the connection destination of each of a plurality of antenna terminals from among first terminals of the first filters and the second filter. The second switch selects the connection destination of a second terminal of the second filter from among a first power amplifier and a first low-noise amplifier. The first variable circuit element is connected between the second filter and the second switch and shifts an attenuation band on the first pass band side in the second filter.
An azimuth measurement device is provided that includes a first angular velocity sensor, a rotation mechanism, and a second angular velocity sensor. The first angular velocity sensor has a first detection axis extending in a horizontal direction and is configured to detect a first angular velocity around the first detection axis serving as a rotation center. The rotation mechanism has a rotation axis extending in a vertical direction and is configured to rotate the first detection axis of the first angular velocity sensor around the rotation axis serving as a rotation center. The second angular velocity sensor corrects a rotation angle of the first detection axis in the rotation mechanism. The second angular velocity sensor has a second detection axis extending in the vertical direction and is configured to detect a second angular velocity around the second detection axis serving as a rotation center.
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
G01B 21/22 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour mesurer des angles ou des conicitésDispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative pour tester l'alignement des axes
A multilayer ceramic capacitor includes a ceramic body including six surfaces including main surfaces, side surfaces, and end surfaces, and external electrodes on the ceramic body and connected to some of internal electrode layers. The external electrodes include glass domains. In a longitudinal direction, a ratio of a sum of lengths, in a longitudinal direction, of the glass domains to a sum of lengths of a surface of an electrode arrangement portion on at least one of the side surfaces and the main surfaces, and of a surface of a corner portion contiguous with the surface of the electrode arrangement portion is about 40% to about 60%, and a ratio of a number of glass domains extending from a surface of the ceramic body to a surface of the external electrode located in the electrode arrangement portion is about 10% to about 30%.
An electronic component includes a first outer electrode, a base, and a second outer electrode, which are sequentially arranged in a first direction. The first outer electrode includes a first outer electrode main body arranged in a second direction with respect to the second outer electrode over the base and a first outer electrode extension that extends in the first direction from an edge portion of the first outer electrode main body. The second outer electrode includes a second outer electrode main body arranged in the first direction with respect to the first outer electrode over the base and a second outer electrode extension that extends in the second direction from an edge portion of the second outer electrode main body. Portions of the first and second outer electrode extensions opposed to each other in an orthogonal direction are separated by an insulating layer.
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
H01F 17/00 - Inductances fixes du type pour signaux
H01G 4/232 - Bornes pour la connexion électrique d'au moins deux couches d'un condensateur à empilement ou à enroulement
A radio frequency circuit includes a first band pass filter having a pass band corresponding to the uplink frequency range of LTE Band 28, a second band pass filter having a pass band corresponding to the downlink frequency range of LTE Band 28, a third band pass filter having a pass band including the uplink frequency range of LTE Band 28B and the downlink frequency range of LTE Band 29, and a switch group.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
12.
ORGANIC MATTER DECOMPOSITION CATALYST, HONEYCOMB STRUCTURE, METHOD FOR DECOMPOSING ORGANIC MATTER, AND ORGANIC MATTER DECOMPOSITION DEVICE
An organic matter decomposition catalyst that contains a ternary composite oxide containing zirconium, manganese, and neodymium and oxidatively decomposes organic matter. Also disclosed is a honeycomb structure, a method for decomposing organic matter, and an organic matter decomposition device that use the organic matter decomposition catalyst.
A battery pack includes a battery and a heat-absorbing member. The heat-absorbing member includes a heat-absorbing agent and a container housing the heat-absorbing agent. The heat-absorbing member is disposed at a position adjacent to the battery. The container includes a stacked body including a resin layer and a metal layer in this order from a side closer to the heat-absorbing agent. The stacked body has a hole extending through the resin layer and the metal layer. A region around the hole is sealed by the resin layer around the hole.
H01M 50/291 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
H01M 10/653 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des matériaux électriquement isolants ou thermiquement conducteurs
H01M 10/659 - Moyens de commande de la température associés de façon structurelle avec les éléments par stockage de la chaleur ou chaleur tampon, p. ex. capacité calorifique, changements ou transitions de phase liquide-solide
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
An acoustic wave device includes a resonator including a piezoelectric layer including first and second main surfaces opposed to each other, an upper electrode on the first main surface of the piezoelectric layer, and a lower electrode on the second main surface of the piezoelectric layer, and a capacitor including an upper interdigital transducer (IDT) electrode on the first main surface of the piezoelectric layer, and a lower IDT electrode on the second main surface of the piezoelectric layer. The capacitor is connected in parallel with the resonator. The upper IDT electrode and the lower IDT electrode of the capacitor are electrically connected to one another.
An acoustic wave filter device includes a series-arm resonator connected between an input terminal and an output terminal, a parallel-arm resonator connected between a ground terminal and a node on a path connecting the input terminal and the output terminal, and a capacitor connected between the input terminal and the output terminal. The capacitor is connected in parallel to the series-arm resonator. The acoustic wave filter device includes series-arm resonators. The capacitor is connected in parallel to the series-arm resonator connected to the input terminal of the series-arm resonators.
Provided is a coil component in which wire disconnection is less likely to occur in a part at which a wire is joined to a terminal electrode, the wire being led out from a winding core part in an oblique direction relative to the axial line direction while crossing the winding core part when viewed from the mounting surface side. A terminal electrode (19) is provided with: a mounting part (26) that is connected to a mounting board; a joint part (28) that provides a joining surface (27) to which an end portion (15a) of a wire (15) is joined at a position lower than the mounting part; and a connection part (29) that connects the mounting part and the joint part. The connection part is provided with: a vertical relay portion (30) that is contiguous with the mounting part and that extends along a step portion; and a horizontal relay portion (31) that is contiguous with the vertical relay portion and that continues toward the joint part (28). The end portion (15a) of the wire (15) is guided so as to at least partially overlap with the horizontal relay portion when viewed in a direction perpendicular to the joining surface (27) while joined to neither the vertical relay portion nor the horizontal relay portion, and is connected to the joint part.
Provided is a coil component capable of reducing damage due to the mutual influence of a bonding material, a terminal electrode, and a core. The coil component comprises: a core having a winding core section extending in an axial direction and a flange section connected to an axial end of the winding core section and protruding in a direction intersecting the outer peripheral surface of the winding core section; a coil wound around the outer peripheral surface of the winding core section; and a terminal electrode that is attached to the flange section and made from a metal plate. The terminal electrode has a mounting section that faces an end surface of the flange section on the winding core section side in the intersecting direction and extends straight along the axial direction. A gap is provided in at least a portion of the area between the end surface and the mounting section. The gap opens to the winding core section side in the axial direction. The end of the mounting section on the winding core section side in the axial direction is positioned closer to the winding core section side than the end of the end surface on the winding core section side. The size of the gap in the intersecting direction is equal to or less than the thickness of the mounting section.
The present invention provides a circuit board in which conduction between a terminal electrode and a land pattern is less likely to be interrupted even after long-term use. The circuit board comprises: a substrate on which a land electrode is provided; and a coil component mounted on the substrate. The coil component comprises: a core having a winding core part extending in the axial direction and a flange part connected to an end, in the axial direction, of the winding core part and extending at least in a direction intersecting the outer peripheral surface of the winding core part; a coil wound around the outer peripheral surface of the winding core part; and a terminal electrode attached to the flange part. The terminal electrode has an inner surface that faces the flange part, and an outer surface that is the rear surface of the inner surface of the terminal electrode and is joined to the land electrode via a joining material. An end, in the axial direction, of the land electrode on the winding core part side is located closer to the winding core part than is an end, in the axial direction, on the winding core part side of a specific outer surface of the outer surface of the terminal electrode, the specific outer surface facing the land electrode in the intersecting direction.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
H01F 41/10 - Raccord des connexions aux enroulements
19.
COIL COMPONENT AND ELECTRONIC APPARATUS INCLUDING SAME
The present disclosure provides: a coil component in which cracks are unlikely to occur in a metal conductor during the manufacturing process, and the effect of springback on the quality of the metal conductor is small; and an electronic apparatus including the coil component. The coil component (1) disclosed herein comprises: a metal conductor (2) that constitutes a coil having at least two turns; and a resin member that covers the metal conductor (2). A part of one end side of the metal conductor (2) serves an input terminal, a part of the other end side of the metal conductor (2) serves as an output terminal, and a part of an intermediate part of the metal conductor (2) serves as an intermediate terminal. A first coil (L1) formed between the input terminal and the intermediate terminal and a second coil (L2) formed between the output terminal and the intermediate terminal are magnetically coupled to each other to form a transformer. At least the input terminal, the output terminal, and the intermediate terminal are exposed on the same surface of the resin member.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
Provided are: an inductor that enables shape miniaturization and high-density mounting while reducing magnetic coupling between coils; and a method for manufacturing the inductor. Inductors 1A, 1B according to the present disclosure each comprise: an element body 10 containing metal magnetic particles DP; and a first coil 21 and second coil 22 disposed in the element body 10. The first coil 21 and second coil 22 are disposed adjacent to each other in a direction intersecting the winding axes. In the plan view as viewed from the top surface of the element body 10, the shape of a first winding part 51 of the first coil 21 is symmetrical to the shape of a second winding part 52 of the second coil 22. In the plan view as viewed from the top surface of the element body 10, the first winding part 51 of the first coil 21 and the second winding part 52 of the second coil 22 partially overlap.
H01F 37/00 - Inductances fixes non couvertes par le groupe
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
A multilayer ceramic capacitor includes a laminate including dielectric layers and first and second internal electrode layers, and first and second external electrodes respectively on first and second end surfaces. Materials of the first and second internal electrode layers are different from one another. The first internal electrode layers and the dielectric layers are Schottky-joined. The second internal electrode layers and the dielectric layers are Schottky-joined or ohmic-joined. Where no voltage is applied between the first external electrode and the second external electrode, a difference between a work function of the first internal electrode layers and a work function of the dielectric layers is greater than a difference between a work function of the second internal electrode layers and the work function of the dielectric layers.
An acoustic wave device includes a support including a support substrate with a thickness direction in a first direction, a piezoelectric layer on the support, and resonators each including a functional electrode provided to the piezoelectric layer. The support is provided with a hollow portion at a position overlapping at least a portion of each of the resonators in plan view in the first direction. The resonators include a first resonator and a second resonator adjacent to each other. A through hole reaching the hollow portion is provided to the piezoelectric layer between the first resonator and the second resonator.
A multilayer ceramic capacitor includes dielectric layers, inner electrode layers, first and second main surfaces facing each other in a lamination direction, first and second side surfaces facing each other in a width direction, and first and second end surfaces facing each other in a length direction, a first outer electrode on the first main surface and the first end surface, and a second outer electrode on the first main surface and the second end surface, the first and second end surfaces include inclined surfaces splayed out from the first main surface toward the second main surface and including a first inclined portion on the first main surface side and a second inclined portion on the second main surface side, and an inclination angle of the first inclined portion to the length direction is different from an inclination angle of the second inclined portion to the length direction.
A multilayer ceramic capacitor includes an outer electrode and a multilayer body including a plurality of dielectric layers and a plurality of inner electrode layers that are stacked on top of each other. The outer electrode includes a plating layer and a base electrode layer. The base electrode layer includes glass. The glass includes an alkaline-earth metal. In a thickness direction of the base electrode layer, when a mass ratio of the alkaline-earth metal in the glass present in a central portion is 100, a mass ratio of the alkaline-earth metal in the glass present in a near-surface portion adjacent to the plating layer is 90 or more and less than 100.
A piezoelectric device includes a piezoelectric layer including upper and lower surfaces in a first direction, a support on a lower surface side of the piezoelectric layer, and a functional electrode on the upper or second surface of the piezoelectric layer. The piezoelectric layer or the support includes a space portion in a region overlapping a portion of the functional electrode. When a region of the piezoelectric layer overlapping the space portion and the functional electrode in plan view in the first direction is a first portion and a region of the piezoelectric layer overlapping the space portion in plan view in the first direction and not overlapping the functional electrode in plan view in the first direction is a second portion, a maximum thickness of the second portion is larger than a minimum thickness of the first portion.
In a multilayer ceramic capacitor, a laminate includes an inner layer portion including first and second internal electrode layers, and an outer layer portion including a dielectric material. When a length in a direction parallel to a lamination direction of the inner layer portion at a central position thereof in a width direction is defined as a first length, and when a length in the parallel direction parallel, at a position at which a length from a width-direction end portion of the inner layer portion in the direction parallel to the another width-direction end portion of the inner layer portion in the width direction is about 0.3-8.0% of the length of the inner layer portion in the width direction, is defined as a second length, the second length is longer than the first length.
A three-terminal multilayer ceramic capacitor includes a first internal electrode layer including a first facing electrode portion, and first and second extracting electrode portions extending from the first facing electrode portion to a first end surface and a second end surface, respectively, and a second internal electrode layer including a second facing electrode portion facing the first facing electrode portion, and third and fourth extracting electrode portions extending from the second facing electrode portion to first and second side surfaces, respectively, wherein thicknesses of the third and fourth extracting electrode portions in the height direction x>thicknesses of the first and second extracting electrode portions in the height direction x>at least one among thicknesses of the first and second facing electrode portions in the height direction.
A battery pack includes a battery; a heat absorbing member that includes a heat absorbing agent and a container accommodating the heat absorbing agent; and a thermal expansion member that is interposed between the battery and the heat absorbing member.
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
H01M 10/613 - Refroidissement ou maintien du froid
H01M 10/655 - Structures solides pour l'échange ou la conduction de la chaleur
H01M 10/659 - Moyens de commande de la température associés de façon structurelle avec les éléments par stockage de la chaleur ou chaleur tampon, p. ex. capacité calorifique, changements ou transitions de phase liquide-solide
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
H01M 50/291 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
29.
SUBSTRATE CONNECTION STRUCTURE, AND ANTENNA DEVICE AND COMMUNICATION DEVICE INCORPORATING SAME
An opposing surface of a first substrate faces a side surface of a second substrate. The first substrate includes a first signal line, a first signal electrode, and a first ground electrode. The first ground electrode has an opening that surrounds the first signal electrode. The second substrate includes a second signal electrode, a second signal line, and a second ground electrode. The second ground electrode includes a first portion that overlaps the second signal electrode and a second portion that does not overlap the second signal electrode when viewed in an X-axis direction. A distance in the X-axis direction between the second signal electrode and the first portion is greater than a distance in the X-axis direction between the second signal line and the second portion.
An acoustic wave device includes a resonator including a piezoelectric layer including first and second principal surfaces opposed to each other, an upper electrode on the first principal surface of the piezoelectric layer, and a lower electrode on the second principal surface of the piezoelectric layer, and a capacitive element on one of the first and second principal surfaces of the piezoelectric layer and electrically connected to the resonator. The capacitive element includes an interdigital transducer (IDT) electrode including electrode fingers arranged in a predetermined direction.
An electronic component module includes: a rigid board; a plurality of electronic components mounted on the rigid board; and a bendable flexible substrate mounted on the rigid board. The flexible substrate is mounted on the rigid board, passing between the plurality of electronic components. The flexible substrate includes a wiring line for transmitting a signal, and a first ground layer. The first ground layer is electrically connected to a reference potential of the rigid board.
An acoustic resonator is provided that includes a piezoelectric layer having at least a portion attached to a substrate either directly or via one or more intermediate layers; and a conductor pattern on the piezoelectric layer. The conductor pattern includes a multi-mark interdigital transducer having a plurality of interleaved fingers extending from opposing busbars, and a length between outermost fingers of the interleaved fingers. The IDT is divided along the length into at least three sections. A change in the mark between the at least three sections has a smaller effect on a resonance frequency of a primary shear acoustic mode of all of the at least three sections of the acoustic resonator in comparison to an effect that the change in the mark has on a spurious acoustic mode other than the primary shear acoustic mode of all of the at least three sections.
A piezoelectric device includes a piezoelectric layer including first and second principal surfaces opposed to each other, a support on a second principal surface side of the piezoelectric layer, a first functional electrode on at least one of the first and second principal surfaces, a substrate opposed to the first principal surface of the piezoelectric layer with a space therebetween and including a second functional electrode, and a shield between the piezoelectric layer and the substrate. The shield at least partially overlaps the first functional electrode in plan view in the first direction. A distance from a center of the shield to the piezoelectric layer is smaller than a distance from the center of the shield to the substrate.
An inductor component includes an element body, a coil in the element body, and a non-magnetic insulation layer covering at least part of the coil. The element body includes first and second magnetic layers laminated in order in a first direction. The coil includes a small-turn inductor wiring of 0.5 or less turns extending along a plane orthogonal to the first direction between the first and second magnetic layers. In a first cross-section orthogonal to an extending direction of the small-turn inductor wiring, the small-turn inductor wiring has a top surface facing in the first direction, a bottom surface facing in a second direction opposite from the first direction, a first side surface facing in a third direction orthogonal to the first direction, and a second side surface facing in a fourth direction opposite from the third direction.
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
A communication module includes: an amplification control device connected to a main device to receive, from the main device, a main signal including a command signal, an address signal that identifies an address of at least one register included in an antenna switch and a band select switch, and a write data signal to be recorded in a register corresponding to the address and interpret the command signal; and the antenna switch and the band select switch connected to the amplification control device via a first signal line where a clock signal is transmitted and a second signal line where a data signal is transmitted.
Provided are a circuit board and a coil component capable of reducing a leakage magnetic field. The circuit board comprises a substrate and a coil component mounted on the substrate. The coil component comprises: a core having a winding core portion extending in the axial direction and a flange portion connected to an end portion of the winding core portion in the axial direction; a coil wound around the outer circumferential surface of the winding core portion; and a terminal electrode attached to the flange portion, bonded to the substrate with a bonding material interposed therebetween, and composed of a metal sheet. The terminal electrode comprises: an inner part that is attached to the outer surface of the flange part intersecting the axial direction and that overlaps the winding core part when viewed along the axial direction; and an outer part that is continuous with the inner part, is attached to the outer surface of the flange part, and does not overlap the winding core part when viewed along the axial direction. The bonding material comprises: an inner covering part that covers the inner part from the side opposite to the flange part; and an outer covering part that covers the outer part from the side opposite to the flange part. The inner covering part is provided with a protruding part that protrudes in the axial direction with respect to the outer covering part.
H01F 27/30 - Fixation ou serrage de bobines, d'enroulements ou de parties de ceux-ci entre euxFixation ou montage des bobines ou enroulements sur le noyau, dans l'enveloppe ou sur un autre support
H01F 27/34 - Moyens particuliers pour éviter ou réduire les effets électriques ou magnétiques indésirables, p. ex. pertes à vide, courants réactifs, harmoniques, oscillations, champs de fuite
H01F 41/10 - Raccord des connexions aux enroulements
A biological substance cumulative amount measurement device 1 for measuring a cumulative amount of a biological substance generated in a living body, said device including: a biofuel cell 20 for generating power using a specific biological substance 13 as a substrate; a power storage unit 40 for storing electric energy generated through power generation by the biofuel cell 20; and a communication unit 50 for outputting information on the electric energy stored in the power storage unit 40 in response to a trigger from the outside.
A61B 5/1468 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des procédés chimiques ou électrochimiques, p. ex. par des moyens polarographiques
A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
A61B 5/083 - Mesure du taux de métabolisme en utilisant un essai respiratoire, p. ex. mesure du taux de consommation d'oxygène
A61B 5/1473 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des procédés chimiques ou électrochimiques, p. ex. par des moyens polarographiques invasifs, p. ex. introduits dans le corps par un cathéter
A61B 5/1486 - Mesure des caractéristiques du sang in vivo, p. ex. de la concentration des gaz dans le sang ou de la valeur du pH du sang en utilisant des procédés chimiques ou électrochimiques, p. ex. par des moyens polarographiques en utilisant des électrodes enzymatiques, p. ex. avec oxydase immobilisée
This semiconductor module (1) comprises: a module substrate (10) that has a first surface (10A), and a second surface (10B) that is on the opposite side from the first surface (10A); a first electronic component group (21) that is mounted on an outer peripheral portion of the first surface (10A); and an external output electrode group (20) for mounting the module substrate (10) on an external substrate (30), the external output electrode group (20) being disposed on the first surface (10A) closer to the central portion of the module substrate (10) than the outer peripheral portion on which the first electronic component group (21) is mounted.
H01L 25/04 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
39.
EXHAUST GAS TREATMENT DEVICE AND EXHAUST GAS TREATMENT METHOD
The present disclosure relates to an exhaust gas treatment device (100) comprising a combustion chamber (101) and a plurality of heat storage layers (107) connected to the combustion chamber (101). An untreated exhaust gas passes through at least one heat storage layer (107) among the plurality of heat storage layers (107) and is supplied to the combustion chamber (101), and after the exhaust gas has been treated, the treated exhaust gas passes through at least one heat storage layer (107) different from the previous at least one heat storage layer (107) and is discharged. The supply direction of the untreated exhaust gas and the exhaust direction of the treated exhaust gas are alternately switched at prescribed time intervals to carry out the exhaust gas treatment. The combustion chamber (101) is provided with a heating mechanism (105), and the temperature of the combustion chamber (101) is maintained at 750°C or higher. The plurality of heat storage layers (107) are provided with a heat source in an area of 60% or more from the bottom in the height direction, and the temperature of an area of 80% or more from the bottom in the height direction is maintained at a temperature that is higher than the temperature of the combustion chamber (101) by 50°C or more.
F23G 7/06 - Procédés ou appareils, p. ex. incinérateurs, spécialement adaptés à la combustion de déchets particuliers ou de combustibles pauvres, p. ex. des produits chimiques de gaz d'évacuation ou de gaz nocifs, p. ex. de gaz d'échappement
F23G 7/07 - Procédés ou appareils, p. ex. incinérateurs, spécialement adaptés à la combustion de déchets particuliers ou de combustibles pauvres, p. ex. des produits chimiques de gaz d'évacuation ou de gaz nocifs, p. ex. de gaz d'échappement dans lesquels la combustion a lieu en présence de matériau catalytique
40.
POWER CONVERSION DEVICE AND PROGRAM FOR POWER CONVERSION DEVICE
A switch circuit (85) has a bidirectional switch. The switch circuit (85) is connected between a third output terminal (82A) of a second power conversion circuit (80) and a first end of a primary-side winding (41A). During execution of second control in which the second power conversion circuit (80) outputs power, a control unit (90) controls the switch circuit (85) so as to allow the flow of current from the second power conversion circuit (80) to the primary-side winding (41A). During execution of first control in which a first power conversion circuit (30) outputs power, the control unit (90) controls the switch circuit (85) so as to block the flow of current from the first power conversion circuit (30) to the second power conversion circuit (80).
H02M 5/293 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant alternatif, p. ex. pour changement de la tension, pour changement de la fréquence, pour changement du nombre de phases sans transformation intermédiaire en courant continu par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
This acceleration sensor comprises a device layer including a weight part, a fixing part, and a vibrator each disposed on an intersection plane intersecting with a sensitivity axis direction, and a housing for housing the device layer, the acceleration sensor detecting acceleration in the sensitivity axis direction. The weight part has a rotation axis extending in a first orthogonal axis direction orthogonal to the sensitivity axis direction, and is held by the housing so as to rotate around the rotation axis by receiving acceleration in the sensitivity axis direction. The fixing part is fixed to the housing via an anchor part protruding from the housing in the sensitivity axis direction. The vibrator is connected to the weight part at one end portion in a second orthogonal axis direction orthogonal to the sensitive axis direction and the first orthogonal axis direction, is connected to the fixing part at the other end portion opposite to the one end portion in the second orthogonal axis direction, and is configured such that the resonance frequency changes on the basis of bending stress according to displacement of the weight part. When the weight part is in a stationary state, the rotation axis of the weight part is separated in the sensitivity axis direction from a plane extending along the intersection surface from a neutral plane with respect to the bending stress of the vibrator.
G01P 15/10 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen d'éléments vibrants par cordes vibrantes
G01P 15/08 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques
42.
ARTIFICIAL PEPTIDE AND APPLICATION PRODUCT OF ARTIFICIAL PEPTIDE
NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY (Japon)
Inventeur(s)
Murakami, Ryota
Kumita, Hideyuki
Oide, Shinichi
Tamura, Atsuo
Iida, Yoshihiro
Abrégé
An artificial peptide 20 in which a catalytic site 30 exhibiting hydrolysis activity and a cell membrane-permeable peptide unit 40 are bonded, wherein the cell membrane-permeable peptide unit 40 has 3-5 cationic amino acids at the N-terminus, and at least 3 cationic amino acids are consecutive in the amino acid sequence of the cell membrane-permeable peptide unit 40.
A61K 8/64 - ProtéinesPeptidesLeurs dérivés ou produits de dégradation
A61K 38/16 - Peptides ayant plus de 20 amino-acidesGastrinesSomatostatinesMélanotropinesLeurs dérivés
A61K 47/64 - Conjugués médicament-peptide, médicament-protéine ou médicament-acide polyaminé, c.-à-d. l’agent de modification étant un peptide, une protéine ou un acide polyaminé lié par covalence ou complexé à un agent thérapeutiquement actif
The purpose of the present invention is to reduce damage due to the interaction between a bonding material, a terminal electrode, and a core. This coil component comprises: a core having a winding core part that extends in the axial direction and a flange part that is connected to an axial end portion of the winding core part and protrudes in a direction intersecting the outer peripheral surface of the winding core part; a coil wound around said outer peripheral surface; a terminal electrode attached to the flange part; and a plating layer. The terminal electrode has a mounting part facing an end surface of the flange part in the intersecting direction. A gap is provided between the end surface and the mounting part. The gap opens to the winding core part side in the axial direction. The wettability of the plating layer with respect to the bonding material is greater than the wettability of the terminal electrode with respect to the bonding material. The terminal electrode has a tip side surface positioned at the end portion of the mounting part on the winding core part side. At least a portion of the outer surface of the terminal electrode is covered with the plating layer. On the tip side surface of the terminal electrode, a portion of the terminal electrode on the inner surface side with respect to the center position in the thickness direction of the terminal electrode is not covered with the plating layer.
A consumable product having an anti-gram-negative bacterial compound with the amino acid sequence represented by the chemical formula below. Also described is a consumable product having Bacillus subtilis capable of producing a compound having the sequence represented by the chemical formula below. The Bacillus subtilis may be Bacillus subtilis MT2 strain (accession number: NITE BP-02767). Also described are methods of treating enteritis by administering a product as described herein to a patent in need thereof.
In a coil component, each time a first wire is wound around a central axis from a first wire end toward a second wire end and forms one turn, the number of turns of the first wire increases by one, and each time a second wire is wound around the central axis from a first wire end toward a second wire end and forms one turn, the number of turns of the second wire increases by one. A 35th turn of the second wire has a first crossing point where the 35th turn of the second wire on an outside of a 35th turn of the first wire crosses the 35th turn of the first wire, and a second crossing point where the 35th turn of the second wire on an outside of a 34th turn of the second wire crosses the 34th turn of the second wire.
A microelectromechanical device is provided that includes a device layer and first and second comb structures. The bottom of the first comb structure has a z-coordinate that is greater than both the z-coordinate of the bottom face of the device layer and the z-coordinate of the bottom of the second comb structure. The top of the second comb structure has a z-coordinate that is smaller than both the z-coordinate of the top face of the device layer and the z-coordinate of the top of the first comb structure. The device layer also comprises a cavity which extends from the bottom face of the device layer to the bottom of the second comb structure.
A circuit and a method are provided for extracting a digitized DC voltage value representing a magnitude of a discrete-time signal received from a discrete-time system. A first full-wave rectifier performs a full-wave rectification of the discrete-time signal to obtain a full-wave rectified signal, and an oversampling analog-to-digital converter digitizes the full-wave rectified signal to obtain a bitstream. The oversampling ADC includes a second-order or higher order delta-sigma modulator and a filter. The filter is configured to filter the bitstream to extract the digitized DC voltage value.
H03M 1/06 - Compensation ou prévention continue de l'influence indésirable de paramètres physiques
G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
G01C 19/5776 - Traitement de signal non spécifique à l'un des dispositifs couverts par les groupes
48.
ELECTRICAL DEVICE COMPRISING A CAPACITOR FORMED USING A POROUS STRUCTURE AND CONDUCTIVE WIRES
Commissariat A L'Energie Atomique Et Aux Energies Alternatives (France)
Inventeur(s)
Buffle, Larry
Voiron, Frédéric
Archambault, Sophie
Abrégé
An electrical device and a method for manufacturing thereof. The electrical device comprises a capacitor including a porous structure, the porous structure comprising: a first electrode region comprising first pores, wherein these first pores comprise first conductive wires; a second electrode region comprising second pores, wherein these second pores comprise second conductive wires; and a dielectric region comprising third pores and interposed between the first and second electrode regions, wherein the capacitor is formed by the first pores of the first electrode region and the second pores of the second electrode region facing each other and being separated by the third pores of the dielectric region.
A positive electrode for the secondary battery includes a positive electrode active material layer and a positive electrode current collector. The positive electrode active material layer includes a positive electrode active material and a polymer compound. The positive electrode current collector supports the positive electrode active material layer. The positive electrode active material includes a lithium-transition-metal compound. A thermogravimetric loss rate measurable when the polymer compound is fired until a temperature of the polymer compound becomes 400° C. in atmospheric air is 60% or higher.
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
H01M 10/54 - Récupération des parties utiles des accumulateurs usagés
An acoustic wave device includes a support including a support substrate with a thickness in a first direction, a piezoelectric layer on the support in the first direction on the support, and resonators each including a functional electrode on the piezoelectric layer in the first direction on the piezoelectric layer. The support includes space portions therein at positions where the functional electrodes at least partially overlap in a planar view in the first direction. The support includes a lead portion communicating with at least one of the space portions in a planar view in the first direction, at a position that does not overlap the space portion. At least one lead portion communicates with at least two of the space portions. The piezoelectric layer includes a through-hole penetrating the piezoelectric layer at a position overlapping the lead portion in a planar view in the first direction.
A radio frequency module includes a substrate having major surfaces, a SiP module, a connector, first and second resins. The SiP module is mounted on the major surface and feeds the radiating element with a radio frequency signal. The connector is mounted on the major surface and is spaced from the SiP module in a first direction along a longer side. The first resin is between the dielectric substrate and the SiP module. The second resin is in a region between the SiP module and the connector and covers a side surface of the SiP module facing the connector. When the second resin has a first length from the SiP module to an end of the resin in the first direction and a second length is between the SiP module and the connector, the first length is equal to or larger than one half of the second length.
A semiconductor module includes a semiconductor device having a power terminal, a power supply path connected to the power terminal, and a first and second inductors in the power supply path. A capacitor has a first end connected to the power supply path and a second end connected to a ground. The second inductor is disposed in the power supply path, and connected between the first inductor and the power terminal. The first inductor and the second inductor are arranged to couple a magnetic field generated at the first inductor and a magnetic field generated at the second inductor.
A secondary battery that includes a positive electrode, a negative electrode, and an electrolytic solution. The positive electrode includes a positive electrode active material and a plurality of fibrous materials. The fibrous materials are tangled with each other and form a three-dimensional mesh structure. The fibrous materials each include a carbon fiber part, and a plurality of carbon covering parts that cover a surface of the carbon fiber part and hold the positive electrode active material. The carbon covering parts are spaced from each other in an extending direction of the carbon fiber part. The carbon fiber part includes a plurality of exposed parts that are not covered with the carbon covering parts. The fibrous materials have a flexibility F that is higher than or equal to 8.6 and lower than or equal to 19.2.
A substrate connection structure includes a first substrate, a second substrate partially facing the first substrate, and a transmission line extending over the first and second substrates. The transmission line includes a first transmission line on a first surface of the first substrate facing the second substrate, a second transmission line on a second surface of the second substrate facing the first substrate. A through-hole wiring is located at a position not overlapping with the second transmission line. A connection conductor is on the first surface and connects to the through-hole wiring. The first transmission line connect the connection conductor to the second transmission line. A size of the first transmission line is smaller than a size of the connection conductor in a direction orthogonal to a direction in which the first transmission line extends.
This connector set (100) comprises a first connector (10) and a second connector (20). The first connector (10) has an FPC (110) and a first mating part (120). The FPC (110) includes a signal transmission part (111), a bent part (112), and an insertion part (113), and has a shape bent at the bent part (112). The signal transmission part (111) extends from the bent part (112) in a first direction (D1), and the insertion part (113) extends from the bent part (112) in a second direction (D2) intersecting the first direction (D1). The FPC (110) includes a first electrode part (12a) provided on a first main surface (11) of the insertion part (113) and a second electrode part (14b) provided on a second main surface (13) of the insertion part (113). The second connector (20) has an internal terminal (210) that pinches the insertion part (113) and a second mating part (220) with which the first mating part (120) mates.
H01R 12/77 - Dispositifs de couplage pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires
H01R 13/6594 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs le blindage étant monté sur une carte de circuits imprimés et raccordé à des organes conducteurs
A multi-phase converter system (10) comprises a plurality of power conversion circuits (50) each configured with an inductor and a switching circuit including a power semiconductor. The plurality of power conversion circuits (50) constitute a plurality of master power conversion circuits and a plurality of slave power conversion circuits. A plurality of unit power conversion circuits (40) are configured by allocating the plurality of slave power conversion circuits to one master power conversion circuit in the plurality of master power conversion circuits. The multi-phase converter system (10) comprises: a centralized control circuit (20) that generates a master drive pulse signal for driving and controlling the plurality of master power conversion circuits; and a drive extension circuit (30) that is provided to the plurality of unit power conversion circuits (40) and generates a slave drive pulse signal for driving and controlling the slave power conversion circuits on the basis of the master drive pulse signal. The output terminals of the plurality of power conversion circuits (50) are connected to each other to constitute a system output terminal (Pout). In the output impedances of the current paths from switching-current output terminals of the switching circuits to the system output terminal (Pout) in the plurality of power conversion circuits (50), the plurality of power conversion circuits (50) are disposed so as to reduce the variance of the output impedances of the power conversion circuits (50) constituting the unit power conversion circuits (40). The centralized control circuit (20) controls inductor currents of the plurality of master power conversion circuits so as to be uniform, and controls an inductor current of one master power conversion circuit and the corresponding slave power conversion circuits constituting the plurality of unit power conversion circuits (40) so as to be uniform through the disposition of the plurality of power conversion circuits (50) and the drive extension circuit (30), thereby controlling the inductor currents of all the power conversion circuits (50) so as to be uniform.
H02M 3/155 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
21414B-type compound as a principal phase (11). RE represents at least one type of rare earth element. Grain boundary regions (12) that are present between the crystal grains have a layered structure that is formed by the layering of at least two types of grain boundary phases. The grain boundary phases contain at least one type of rare earth element, at least one type of transition metal element, and at least one element selected from the group that consists of F and O. The at least one type of transition metal element includes Fe or Co. The grain boundary phases have a different concentration of F or O from the principal phase (11) or have a different crystal structure and/or a different concentration of the at least one transition metal element from the principal phase (11).
H01F 1/057 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments IIIa, p. ex. Nd2Fe14B
B22D 11/06 - Coulée continue des métaux, c.-à-d. en longueur indéfinie dans des moules dont les parois se déplacent, p. ex. entre des rouleaux, des plaques, des courroies, des chenilles
C21D 6/00 - Traitement thermique des alliages ferreux
C22C 19/00 - Alliages à base de nickel ou de cobalt, seuls ou ensemble
C22C 19/03 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel
C22C 19/07 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de cobalt
C22C 38/00 - Alliages ferreux, p. ex. aciers alliés
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/02 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid en atmosphère neutre ou contrôlée ou dans le vide
C22F 1/10 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid du nickel ou du cobalt ou de leurs alliages
This connector set comprises: a first connector provided with a first substrate, a first electrode portion disposed on the first substrate, and an electrically conductive first external terminal that covers the first substrate while exposing the first electrode portion; and a second connector provided with a second substrate, a second electrode portion disposed on the second substrate, and an electrically conductive second external terminal that is disposed on the second substrate so as to surround the second electrode portion, is configured so as to come into contact with and fit into the first external terminal from the outside, and is electrically connected to a ground potential. When the first external terminal and the second external terminal are fitted together, the first electrode portion is disposed facing the second electrode portion with a gap therebetween, and performs non-contact transmission with the second electrode portion.
H04B 5/40 - Systèmes de transmission en champ proche, p. ex. systèmes à transmission capacitive ou inductive caractérisés par des composants spécialement adaptés à la transmission en champ proche
H01Q 1/44 - Détails de dispositifs associés aux antennes utilisant un équipement ayant une autre fonction principale servant en outre d'antenne
A vibrator and a frequency modulation-type gyroscope according to the present disclosure include: a test mass; four bases positioned so as to surround the test mass in plan view; a first arm extending from one of the four bases in a first direction in plan view and connected to the test mass; and a second arm extending from one of the four bases in a second direction intersecting the first direction in plan view and connected to the test mass. The first arm is driven so as to bend and vibrate in the second direction on the basis of an electrical signal. The second arm is driven so as to bend and vibrate in the first direction on the basis of the electrical signal. The first arm includes one or more first protrusions protruding in the second direction.
G01C 19/5684 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant le décalage de phase d'un nœud ou d'un anti-nœud de vibration de vibrateurs essentiellement à deux dimensions, p. ex. vibrateurs en forme d'anneau les dispositifs comportant une structure micromécanique
Described are concepts, systems, circuits, methods, and techniques for power management control over distance. In particular, described are concepts, systems, circuits, methods, and techniques for power management control in applications where power control information needs to be transmitted over relatively long distances in space-constrained environments, such as in massive multiple-input multiple-output (mMIMO) applications. Also described are concepts, systems, circuits, methods, and techniques for power management control in applications where power control information needs to be communicated to multiple PAs transmitting multiple unique IQ envelopes.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 1/32 - Modifications des amplificateurs pour réduire la distorsion non linéaire
H03F 3/68 - Combinaisons d'amplificateurs, p. ex. amplificateurs à plusieurs voies pour stéréophonie
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
A coil component has a core portion and first and second wires would around the core portion. A 35th turn of a second wire has a first crossing point where the 35th turn of the second wire on an outside of a 35th turn of a first wire crosses the 35th turn of the first wire. A 36th turn of the second wire includes a specific part located between the 35th turn of the first wire and the 35th turn of the second wire in a direction along a central axis of a winding core portion. A part of the 36th turn of the second wire closer to a second wire end than the specific part has a third crossing point where the 36th turn of the second wire on an outside of the 35th turn of the second wire crosses the 35th turn of the second wire.
A coil component comprising a winding core portion. When one of side surfaces of the winding core portion is a specific side surface, a 35th turn of a second wire has a first crossing point where the 35th turn of the second wire on an outside of a 35th turn of a first wire crosses the 35th turn of the first wire on the specific side surface. A part of the 35th turn of the second wire closer to a second wire end than the first crossing point is wound around an outside between a 34th turn of the first wire and a 34th turn of the second wire adjacent to the 34th turn of the first wire in a direction along a central axis on the specific side surface.
A MEMS mirror device is provided that includes a reflector, a support structure and a first suspension structure. The first suspension structure configures the reflector to rotate about a rotation axis. Stiffening springs extend from the support structure to the reflector. Each stiffening spring comprises one or more folds in the support plane.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
A multilayer ceramic capacitor includes a capacitive element including ceramic layers, first and second internal electrodes, first and second main surfaces, end surfaces, and side surfaces. A portion of the first and second side surfaces, and a portion of the first and second end surfaces include SiO2 films. The SiO2 films on the first and second side surfaces cover the first and second internal electrodes, respectively exposed on the first and second side surfaces. First and second external electrodes are respectively provided at least on an outer surface of the first end surface on which the SiO2 film is not provided and an outer surface of the SiO2 film provided on the first end surface and on at least on an outer surface of the second end surface on which the SiO2 film is not provided and an outer surface of the SiO2 film provided on the second end surface.
A solid electrolytic capacitor that includes: a valve metal base including dielectric layers on both surfaces in a thickness direction thereof; a conductive paste layer on each of both sides of the dielectric layer relative to the valve metal base in the thickness direction, the conductive paste layer including a conductive filler; an insulating layer on each of the conductive paste layers on the side opposite from the valve metal base, the insulating layer having a via hole; an outer electrode layer on each of the insulating layers, the outer electrode layer electrically connected to the conductive paste layer through the via hole and in direct contact with a portion of the conductive filler in the conductive paste layer in the via hole when viewed in a lamination direction of the conductive paste layer, the insulating layer, and the outer electrode layer.
In an intermediate laminate (100r), when viewed from the lamination direction, when a virtual rectangle that is positioned inside the peripheral edge of the intermediate laminate (100r) and that has the maximum area among virtual rectangles where each of four sides passes through at least two of a plurality of first openings (120H) and a plurality of second openings (130H) is defined as a maximum virtual rectangle (MVS), in the intermediate laminate (100r), when viewed from the lamination direction, the plurality of first openings (120H) and the plurality of second openings (130H) are defined as a plurality of specific openings (SH) through which the maximum virtual rectangle (MVS) passes and at least one non-specific opening (UH) positioned inside the maximum virtual rectangle (MVS). Dummy patterns (160r, 170r) are formed inside each of the plurality of specific openings (SH), and dummy patterns (160r, 170r) are not formed inside the at least one non-specific opening (UH).
Provided is a multilayer ceramic capacitor capable of achieving lower ESL. A multilayer ceramic capacitor 10 according to the present invention is provided with a multilayer body having a first surface and a second surface opposing each other in the stacking direction, a third surface and a fourth surface opposing each other in a first direction orthogonal to the stacking direction, and a fifth surface and a sixth surface opposing each other in a second direction orthogonal to the stacking direction and to the first direction, a first external electrode disposed on the first and the third surfaces, a second external electrode disposed on the first and the third surfaces, a third external electrode disposed on the first and the fourth surfaces, a fourth external electrode disposed on the first and the fourth surfaces, a fifth external electrode disposed on the first and the third surfaces so as to be positioned between the first external electrode and the second external electrode, a sixth external electrode disposed on the first and the sixth surfaces, a seventh external electrode disposed on the first and the fourth surfaces so as to be positioned between the third external electrode and the fourth external electrode, and an eighth external electrode disposed on the first and the fifth surfaces. The multilayer body has a first internal electrode exposed on the third and the fourth surfaces and connected to the first external electrode or to the fourth external electrode, and a second internal electrode exposed on the third, the fourth, the fifth, and the sixth surfaces and connected to the fifth external electrode or to the eighth external electrode. When L denotes the dimension in the first direction, and W denotes the dimension in the second direction, 0.85 ≤ L / W ≤ 1.00 is satisfied.
The present invention provides an antenna device and an electronic apparatus that make it possible to achieve a small size and a wide bandwidth. An antenna device (100) according to the present disclosure comprises: a first radiation element (11) to which a power supply circuit (30) is connected; a second radiation element (12) at least one end of which is open; and a filter circuit (20) which is provided at an intermediate portion of the second radiation element (12). The first radiation element (11) and the second radiation element (12) are electromagnetically coupled. The filter circuit (20) includes a plurality of inductance elements, at least two of which are magnetically coupled to constitute a parallel resonance circuit.
This wireless power supply system comprises: a power transmission device including a power transmission coil; and a power reception device including a power reception coil. The power transmission device comprises: a power conversion circuit that converts an input DC voltage into an AC current by a switching operation and causes the AC current to flow through the power transmission coil; and a power transmission resonance circuit including the power transmission coil and a power transmission resonance capacitor. The power reception device comprises: a power reception resonance circuit that includes the power reception coil and a power reception resonance capacitor; a power reception rectification circuit that rectifies the AC current received by the power reception coil; and a smoothing capacitor that smoothes the rectified current and outputs a DC voltage. The power transmission coil is configured from an air-core planar spiral loop coil with no magnetic core. The power reception coil is configured from a cored helical solenoid coil with a magnetic core having a relative magnetic permeability of 100 or more, and has a greater number of turns than the number of turns of the power transmission coil. The power transmission resonance capacitor is set to a capacitance value at which the impedance looking into the power reception device at the switching frequency at which the switching operation is performed is close to the minimum. The capacitance value of the power reception resonance capacitor is set so that the power reception resonance frequency of the power reception resonance circuit is substantially the same as the switching frequency.
H02J 50/12 - Circuits ou systèmes pour l'alimentation ou la distribution sans fil d'énergie électrique utilisant un couplage inductif du type couplage à résonance
Multiple subarrays are arranged on a board, each including two radiating elements arranged two-dimensionally in first and second directions that are parallel to the in-plane direction of the board and perpendicular to each other. The subarrays are arranged along a straight line in the first direction, forming multiple subarray rows. Each radiating element includes a conductor pattern having a pair of first edges parallel to a third direction inclined with respect to the first and second directions, and a pair of second edges perpendicular to the third direction. The spacing in the second direction between lines parallel to the first direction that connect the geometric centers of the multiple subarrays included in each of the multiple subarray rows is narrower than the dimension of each of the multiple subarrays in the second direction.
Commissariat A L'Energie Atomique Et Aux Energies Alternatives (France)
Inventeur(s)
Voiron, Frédéric
Soulier, Brigitte
Sallaz, Valentin
Laviron, Cyrille
Ferreira, Delphine
Baudin, Floriane
Dominguez, Sébastien
Abrégé
An integrated structure that includes: a substrate; a conductive layer, the conductive layer having a first cavity, the first cavity being filled with a first insulating region, the first insulating region having a top surface flush with a top surface of the conductive layer to form a first planar surface; a protective liner on the top surface of the conductive layer and the top surface of the first insulating region; and an anodization barrier layer on the protective liner, the protective liner and the anodization barrier layer having a second cavity passing through the protective liner and the anodization barrier layer and opening onto the first insulating region, the second cavity being filled with a second insulating region, the second insulating region having a top surface flush with a top surface of the anodization barrier layer to form a second planar surface.
A radio frequency circuit is provided that includes a power amplifier connected to an antenna and configured to amplify a millimeter-wave signal; a power amplifier connected to an antenna different from the antenna and configured to amplify the millimeter-wave signal; a voltage generation circuit configured to generate multiple discrete voltages based on an input voltage; a first supply modulator configured to selectively output one of the multiple discrete voltages to the power amplifier; and a second supply modulator configured to selectively output one of the multiple discrete voltages to the power amplifier. The first and second supply modulators are configured to select a same voltage from among the multiple discrete voltages in accordance with a first digital control signal.
H03F 1/02 - Modifications des amplificateurs pour augmenter leur rendement, p. ex. étages classe A à pente glissante, utilisation d'une oscillation auxiliaire
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
A semiconductor device that includes a substrate having an insulating surface; a first electrode on the insulating surface; a dielectric film on the first electrode; and a second electrode on the dielectric film. The second electrode has a protruding shape in a sectional view.
A multilayer inductor and a multilayer inductor array in which the element area is reduced and the direct current superposition characteristics are further improved. A multilayer inductor includes an element body in which magnetic layers are stacked and that has a bottom surface having a rectangular shape, first, second, third and fourth outer electrodes respectively at four corners of the bottom surface of the element body, a first winding portion in which a plurality of conductor layers in the element body are connected in a stacking direction and that has a winding axis in the stacking direction, and a second winding portion that is above the first winding portion in the stacking direction, in which conductor layers in the element body are connected in the stacking direction and that has the winding axis in the stacking direction.
A radio frequency circuit includes first and second filters for first and second time division duplex (TDD) bands. Third and fourth filters cover third and fourth bands. A switch including a first terminal, a second terminal, and a third terminal to connect these filter to an antenna. The first terminal is connected to only the first filter and the second terminal is connected to only the second filter, among the filters having acoustic wave filters. The third terminal connects to both the third filter and the fourth filter. This configuration enables simultaneous transfer of a transmission signal of the first band and a reception signal of the second band, as well as simultaneous transfer of signals of the third and fourth bands. By isolating the TDD filters on separate terminals, signal quality and isolation are improved during simultaneous operation.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie
A compression resin sealing molding device for molding a sealing resin layer on a substrate having a first surface and a second surface opposite to each other. The device includes a lower mold facing the first surface and an upper mold that abuts the second surface. The lower mold includes an outer frame and an inner frame, at least part of the inner frame being vertically displaceable with respect to the outer frame. The outer frame is configured to abut the upper mold outside the substrate to determine a fixed distance between the lower mold and the upper mold. The inner frame has two states: a first state in which a resin is confined in an inner region of the inner frame and a second state achieved when the outer frame abuts the upper mold and excess resin is leaked outside of the inner frame into an overflow region.
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
A measurement circuit includes a resistive element array including m first lines, n second lines, and a plurality of measurement resistive elements connected between the m first lines and the n second lines where m×n≥2; a voltage control circuit controlling a voltage of an output terminal by an operational amplifier located between an input terminal connected to a first connection line to which a constant current is supplied from a constant current source and the output terminal so that a difference between a voltage of the input terminal and the voltage of the output terminal is reduced; and a selection circuit connecting one of the m first lines to the first connection line, connecting one of the n second lines to a second connection line connected to ground, and connecting remaining lines among the m first lines and the n second lines to the output terminal.
A filter device is provided that includes a first chip comprising at least one first bulk acoustic resonator including a first piezoelectric material between a first upper conductor and a first lower conductor; a second chip comprising at least one second bulk acoustic resonator including a second piezoelectric material between a second upper conductor and a second lower conductor; and a circuit card coupled to the first chip and the second chip. A thickness of the first piezoelectric material is greater than a thickness of the second piezoelectric material.
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The positive electrode includes a positive electrode active material layer. The electrolytic solution includes an aqueous solvent. The positive electrode active material layer includes a positive electrode active material and a positive electrode binder. The positive electrode active material includes a lithium-containing compound which a lithium ion is to be inserted into and extracted from. The positive electrode binder includes a polymer compound. The polymer compound includes a repeating unit represented by Formula (1), a repeating unit represented by Formula (2), or both. A solubility of the polymer compound in 100 g of water is less than or equal to 1 g. A ratio of a volume density of the positive electrode active material layer to a true density of the positive electrode active material is greater than or equal to 30% and less than or equal to 70%.
H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p. ex. liants, charges
H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
H01M 4/505 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de manganèse d'oxydes ou d'hydroxydes mixtes contenant du manganèse pour insérer ou intercaler des métaux légers, p. ex. LiMn2O4 ou LiMn2OxFy
H01M 4/58 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs de composés inorganiques autres que les oxydes ou les hydroxydes, p. ex. sulfures, séléniures, tellurures, halogénures ou LiCoFyEmploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs de structures polyanioniques, p. ex. phosphates, silicates ou borates
This piezoelectric vibration element comprises a piezoelectric substrate having a first main surface and a second main surface that oppose each other, a first excitation electrode that is provided on the first main surface of the piezoelectric substrate, and a second excitation electrode that is provided on the second main surface of the piezoelectric substrate, wherein: a plurality of first recesses and protrusions are provided in a region of the first main surface of the piezoelectric substrate that overlaps the first excitation electrode, and a plurality of second recesses and protrusions are provided in a region of the second main surface of the piezoelectric substrate that overlaps the second excitation electrode; and a first maximum dimension of the plurality of first recesses and protrusions in the thickness direction of the piezoelectric substrate is different from a second maximum dimension of the plurality of second recesses and protrusions in the thickness direction.
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
A catheter device according to the present disclosure comprises: a plurality of arms extending along an axial direction between a distal end part and a proximal end part and arranged in a first direction intersecting the axial direction; and a temperature sensor disposed on each of the plurality of arms. When viewed from the axial direction, the plurality of arms are deformable between a contracted state in which an interval between the arms at both ends in the first direction is a first interval and an expanded state in which the interval is a second interval larger than the first interval. When viewed in cross section from the axial direction, in each of the plurality of arms, a second dimension in a second direction intersecting the first direction is larger than a first dimension in the first direction.
An antenna substrate includes a dielectric substrate having a main surface; and first to third planar radiation electrodes and first and second feed lines located on the main surface of the dielectric substrate. A size difference between the first and second radiation electrodes and a size difference between the first and third radiation electrodes are larger than a size difference between the second and third radiation electrodes. The first and second feed lines are connected to at least one of the first to third radiation electrode at first and second connection points different from each other. The first radiation electrode is adjacent to the second radiation electrode in a first direction and is adjacent to the third radiation electrode in a second direction different from the first direction.
H01Q 21/24 - Combinaisons d'unités d'antennes polarisées dans des directions différentes pour émettre ou recevoir des ondes polarisées circulairement ou elliptiquement ou des ondes polarisées linéairement dans n'importe quelle direction
H01Q 5/307 - Éléments rayonnants individuels ou couplés, chaque élément étant alimenté d’une façon non précisée
H01Q 13/08 - Terminaisons rayonnantes de lignes de transmission micro-ondes à deux conducteurs, p. ex. lignes coaxiales ou lignes micro-rayées
83.
RADIO FREQUENCY SWITCHING CIRCUIT, RADIO FREQUENCY MODULE, AND COMMUNICATION APPARATUS
A radio frequency switching circuit includes a common terminal, a first input/output terminal, a first serial FET, a first parallel FET, a charge pump, a voltage supply path, a first switch, and a second switch. The first serial FET is connected, on a first signal path L1, to the common terminal and the first input/output terminal. The first parallel FET 6 is connected between a signal path and ground. The voltage supply path is connected to a connection node connected to an output part of the charge pump and a control electrode of the first serial FET. The first switch is provided on a first path connecting the output part of the charge pump and the connection node. The second switch is provided on the voltage supply path.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
A high-frequency signal is input to a first node. A high-frequency signal is output from each of a plurality of second nodes. A first branch transmission line connects the first node to each of the plurality of second nodes. The first branch transmission line includes a plurality of cascade-connected dividers, each of which has one input node and two output nodes. At least one of the dividers is an unequal divider with a distribution ratio of 2 or less. The first branch transmission line is configured to equally divide a high-frequency power input to the first node to the plurality of second nodes.
H04B 1/00 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission
H03D 7/00 - Transfert de modulation d'une porteuse à une autre, p. ex. changement de fréquence
A battery pack includes a cylindrical secondary battery and a heat absorbing member, and an exterior body of the heat absorbing member accommodates a heat absorbing agent between a first inner resin layer L1a and a second inner resin layer. A flange portion of the exterior body has an inner resin continuous portion in which the first inner resin layer and the second inner resin layer are continuous over the entire circumference. In a sectional shape of the heat absorbing member, the inner resin continuous portion includes a first continuous portion located inward of a first metal layer and a second metal layer, and a second continuous portion, a third continuous portion, and a fourth continuous portion each having a portion exposed to outside of the exterior body. The heat absorbing member is arranged in an orientation in which the first continuous portion is closer to an end of the secondary battery than the second continuous portion, the third continuous portion, and the fourth continuous portion in an axial direction of the secondary battery.
H01M 10/659 - Moyens de commande de la température associés de façon structurelle avec les éléments par stockage de la chaleur ou chaleur tampon, p. ex. capacité calorifique, changements ou transitions de phase liquide-solide
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
H01M 50/291 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
86.
INFRARED SENSOR ELEMENT, INFRARED SENSOR, AND POSITION DETECTION SYSTEM
An infrared sensor element is provided that includes a pyroelectric element having a first main surface facing a first side in a thickness direction and a second main surface overlapping with the first main surface as viewed from the thickness direction and facing a second side in the thickness direction. The sensor element includes a first-side electrode on the first main surface; and a second-side electrode on the second main surface and overlapping with the first-side electrode as viewed from the thickness direction. As viewed from the thickness direction, the first-side electrode or the second-side electrode has a curved outer edge portion that is parabolic in shape.
An acoustic wave device includes a piezoelectric layer and an IDT electrode including first and second busbars and first and second electrode fingers. A virtual line connecting tip portions of the second electrode fingers is defined as a first envelope, and a virtual line connecting tip portions of the first electrode fingers is defined as a second envelope, and a region between the first and second envelopes is an intersection region. The intersection region includes parallel regions in which the first and second electrode fingers extend in parallel and a non-parallel region in which directions in which the first and second electrode fingers extend intersect each other. The parallel and non-parallel regions are alternately arranged in the intersection region. The first and second electrode fingers linearly extend in the parallel and non-parallel regions, and are bent at the boundaries between the parallel and non-parallel regions.
A semiconductor device includes a field effect transistor (FET). The FET includes a gate electrode in a gate layer. The gate electrode has a first gate length and a second gate length. The second gate length is greater than the first gate length. The FET also includes an active region in a active region layer. The active region includes a source region and a drain region. The active region layer is beneath the gate layer. The FET has a first channel under the gate electrode having the first gate length and between the source region and the drain region. The FET also has a second channel under the gate electrode having the second gate length and between the source region and the drain region.
H10D 62/10 - Formes, dimensions relatives ou dispositions des régions des corps semi-conducteursFormes des corps semi-conducteurs
H10D 30/60 - Transistors à effet de champ à grille isolée [IGFET]
H10D 62/17 - Régions semi-conductrices connectées à des électrodes ne transportant pas de courant à redresser, amplifier ou commuter, p. ex. régions de canal
H10D 64/27 - Électrodes ne transportant pas le courant à redresser, à amplifier, à faire osciller ou à commuter, p. ex. grilles
H10D 84/83 - Dispositifs intégrés formés dans ou sur des substrats semi-conducteurs qui comprennent uniquement des couches semi-conductrices, p. ex. sur des plaquettes de Si ou sur des plaquettes de GaAs-sur-Si caractérisés par l'intégration d'au moins un composant couvert par les groupes ou , p. ex. l'intégration de transistors IGFET de composants à effet de champ uniquement de transistors FET à grille isolée [IGFET] uniquement
The occurrence of solder explosion when a plating layer is formed on a surface of an element body is prevented or reduced. This inductor has: an element body which is formed of a metal magnetic powder and a resin and in which a coil formed by winding a conductive wire is embedded; a small particle layer which is formed of particles having an average particle diameter smaller than the average particle diameter of metal magnetic particles contained in the metal magnetic powder on an outer peripheral surface of the element body; and a lead-out part which is led out from the small particle layer with respect to the coil.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
The purpose of the present invention is to provide an inductor that further reduces a short circuit between conductor layers inside an element body and improves insulation. An inductor according to the present disclosure comprises: an element body 10 in which a first coil C1 configured by laminating a plurality of first conductor layers CD1 and a second coil C2 configured by laminating a plurality of second conductor layers CD2 are embedded so as to overlap each other in a lamination direction; and external electrodes 21-24 disposed on a mounting surface of the element body 10. The element body 10 has a first magnetic portion ML1 containing first metal magnetic particles MP1, a second magnetic portion ML2 containing second metal magnetic particles MP2 having an average particle diameter smaller than that of the first metal magnetic particles MP1, a first lead-out conductor TH1 led out from one end of the first coil C1 toward the external electrodes 21-24, a second lead-out conductor TH2 led out from the other end of the first coil C1 located farther from the mounting surface than the one end of the first coil C1 toward the external electrodes 21-24, a third lead-out conductor TH3 led out from one end of the second coil C2 toward the external electrodes 21-24, and a fourth lead-out conductor TH4 led out toward the external electrodes 21-24 from the other end of the second coil C2 positioned farther from the mounting surface than the one end of the second coil C2. The first magnetic portion ML1 is positioned inside at least the winding portions of the first coil C1 and the second coil C2. The second magnetic portion ML2 is positioned between the first conductor layers CD1 in the lamination direction, between the second conductor layers CD2 in the lamination direction, and between the first conductor layers CD1 and the second conductor layers in the lamination direction. The second magnetic portion ML2 positioned between the first conductor layers CD1 extends to a position overlapping the first lead-out conductor TH1 in a plan view viewed from the upper surface side of the element body and extends to be in contact with the second lead-out conductor TH2. The second magnetic portion ML2 positioned between the second conductor layers CD2 extends to a position overlapping the third lead-out conductor TH3 in a plan view viewed from the upper surface side of the element body and extends to be in contact with the fourth lead-out conductor TH4.
Provided is a method for manufacturing a solid electrolytic capacitor by: laminating a first sheet and a second sheet, the first sheet being provided with a valve-acting metal substrate with a porous portion, a dielectric layer, and a solid electrolyte layer and having formed therein a first through-hole of a width equal to or greater than the width of an element region so as to straddle a first end, and a second through-hole of a width smaller than the width of the element region so as to straddle a second end, the second sheet being provided with a metal foil and having formed therein a third through-hole of a width smaller than the width of the element region so as to straddle the first end, and a fourth through-hole of a width equal to or greater than the width of the element region so as to straddle the second end, and the first and second sheets being laminated in a manner in which the first through-hole and the third through-hole are in communication, and the second through-hole and the fourth through-hole are in communication; filling the first to fourth through-holes with a sealing material; and cutting a first side part and a second side part with a guillotine blade while applying ultrasonic vibrations.
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
H01G 9/048 - Électrodes caractérisées par leur structure
92.
SOLID ELECTROLYTIC CAPACITOR MANUFACTURING METHOD AND SOLID ELECTROLYTIC CAPACITOR
A solid electrolytic capacitor manufacturing method according to the present invention comprises the following steps. (A) A step for preparing a first sheet 10. The first sheet 10 comprises: a valve metal substrate 11 having a porous section 12 on a surface thereof; a dielectric layer formed on the surface of the porous section 12; and a solid electrolyte layer 13 provided on the dielectric layer. The first sheet 10 further has a plurality of element regions R11, R12. Each of the element regions R11, R12 is defined by a first end section E11 and a second end section E12 facing each other in the length direction and a first side section S11 and a second side section S12 facing each other in the width direction. In the first sheet 10, a first through-hole H1 having a width equal to or larger than the width of each of the element regions R11, R12 is formed so as to extend across the first end section E11 of each of the element regions R11, R12, and one or more second through-holes H2 having a width smaller than the width of each of the element regions R11, R12 are formed so as to extend across the second end section E12 of each of the element regions R11, R12. (B) A step for preparing a second sheet 20. The second sheet 20 is composed of a metal foil. The second sheet 20 further has a plurality of element regions R21, R22. Each of the element regions R21, R22 is defined by a first end section E21 and a second end section E22 facing each other in the length direction, and a first side section S21 and a second side section S22 facing each other in the width direction. In the second sheet 20, one or more third through-holes H3 having a width smaller than the width of each of the element regions R21, R22 are formed so as to extend across the first end section E21 of each of the element regions R21, R22, and a fourth through-hole H4 having a width equal to or larger than the width of each of the element regions R21, R22 is formed so as to extend across the second end section E22 of each of the element regions R21, R22. (C) A step for fabricating a laminated sheet 30. In the step (C), the first sheet 10 and the second sheet 20 are laminated so that the first end sections E11, E21 of the respective element regions R11, R12, R21, R22 face each other and the second end sections E12, E22 thereof face each other. In the laminated sheet 30, the first through-holes H1 and the third through-holes H3, and the second through-holes H2 and the fourth through-holes H4 communicate with each other in the lamination direction. (D) A step for fabricating a laminated block body 40, as needed. In the step (D), the first through-holes H1 and the third through-holes H3, and the second through-holes H2 and the fourth through-holes H4 are respectively filled with a sealing material from at least one principal surface side of a first principal surface M31 and a second principal surface M32 facing each other in the lamination direction of the laminated sheet 30. (E) A step for fabricating a plurality of element laminates 100 by cutting the laminated sheet 30 or the laminated block body 40. (F) A step for forming a first external electrode 141 and a second external electrode 142 on each of the element laminates 100. The step (A) for preparing the first sheet 10 includes a step for forming the first through-holes H1 and the second through-holes H2 in the first sheet 10. The step (B) for preparing the second sheet 20 includes a step for forming the third through-holes H3 and the fourth through-holes H4 in the second sheet 20. In at least one of the step (A) for preparing the first sheet 10 and the step (B) for preparing the second sheet 20, at least one of the first through-holes H1, the second through-holes H2, the third through-holes H3, and the fourth through-holes H4 is formed by laser processing. In the laser processing, the sheet is cut while the periphery of a laser-irradiated section is oxidized by irradiating the sheet with a laser beam.
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
H01G 9/012 - Bornes spécialement adaptées pour les condensateurs à solides
93.
SPLIT CORE, ANNULAR CORE AND METHOD FOR MANUFACTURING SAME, AND ROTATING ELECTRICAL MACHINE
This split core comprises a core back part and a tooth part. The core back part has: a first lateral surface facing a first direction, which is one way in a circumferential direction centered on a rotation axis of a rotating electrical machine when the split core is incorporated into said rotating electrical machine; an inner main surface facing a second direction toward the rotation axis; a first end surface facing a third direction along the rotation axis; and a second end surface facing a direction that is the opposite of the third direction. The tooth part extends from the inner main surface in the second direction. A first groove extending along the first direction is formed in the first lateral surface. The first groove is exposed from either the first end surface or the second end surface.
A MEMS device that includes: a first cover; a second cover defining a space between the second cover and the first cover; a first substrate opposite to the first cover in the space between the second cover and the first cover, the first substrate comprising single-crystal silicon; a second substrate opposite to the second cover in the space between the second cover and the first cover, the second substrate comprising single-crystal silicon, the second substrate including a movable portion, the single-crystal silicon of the second substrate being joined to the single-crystal silicon of the first substrate; and an electrostatic capacity portion between at least one of (1) the second cover and the second substrate or (2) the first substrate and the second substrate, the electrostatic capacity portion being configured such that electrostatic capacity changes depending on a distance between the movable portion and the second cover or the first substrate.
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
G01P 15/125 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs à capacité
G01P 15/18 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération dans plusieurs dimensions
A circuit module includes a circuit board that includes a circuit board body and a conductor, the circuit board body including a first upper end surface and a first lower end surface situated side by side in an upward direction and a downward direction, the conductor being provided at the first upper end surface, an insulator at the first upper end surface, a first electrode including a second upper end surface, a second lower end surface, and a first side surface, and electrically connected to the conductor, the second upper end surface and the second lower end surface being situated side by side in the upward direction and the downward direction, the first side surface being connected to the second upper end surface, and an electronic component including an electronic component body and a second electrode and located above the insulator. The second upper end surface is covered by the insulator, and the second electrode is electrically connected to the first electrode as a result of at least a portion of the first side surface being exposed from the insulator.
A secondary battery evaluation system includes a battery pack including a plurality of secondary battery cells, a voltage detection circuit that detects a terminal-to-terminal voltage value of the battery pack, a current detection circuit that detects a current value of the battery pack, a test secondary battery including at least one battery cell manufactured from the same material as the secondary battery cell, and a test power supply circuit that controls charge and discharge of the test secondary battery. The test power supply circuit sets a test charge voltage value and a test charge current value for the test secondary battery based on a terminal-to-terminal voltage value and a current value during charging of the battery pack, charges the test secondary battery with the test charge voltage value and the test charge current value, sets a test discharge voltage value and a test discharge current value for the test secondary battery based on a terminal-to-terminal voltage value and a current value during discharging of the battery pack, and discharges the test secondary battery with the test discharge voltage value and the test discharge current value to perform a simulation of charge and discharge of the battery pack. The test power supply circuit acquires SOC-OCV data of the test secondary battery by performing charge and discharge of the test secondary battery independently of driving of the battery pack at the time of measurement of SOC-OCV data.
G01R 31/374 - Dispositions pour le test, la mesure ou la surveillance de l’état électrique d’accumulateurs ou de batteries, p. ex. de la capacité ou de l’état de charge avec des moyens pour corriger la mesure en fonction de la température ou du vieillissement
B60L 50/64 - Détails de construction des batteries spécialement adaptées aux véhicules électriques
B60L 58/16 - Procédés ou agencements de circuits pour surveiller ou commander des batteries ou des piles à combustible, spécialement adaptés pour des véhicules électriques pour la surveillance et la commande des batteries en fonction du vieillissement de la batterie, p. ex. du nombre de cycles de charge ou de l'état de santé [SoH]
G01R 31/3842 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge combinant des mesures de tension et de courant
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
Bonding strength between a core and a top plate is increased in a coil component. Surface roughnesses of a top surface of a flange portion of the core and a lower main surface of the top plate are different. For example, the surface roughness of the lower main surface is smaller than the surface roughness of the top surface. A protrusion protruding from the lower main surface having smaller surface roughness and in contact with the top surface of the flange portion of the core is in a region where the lower main surface of the top plate and the top surface of the flange portion of the core face each other with an adhesive interposed therebetween. The protrusion can increase a surface area of a bonding surface of the top plate having smaller surface roughness, and provide an anchor effect of the adhesive on the top plate.
A filter device is provided that includes a first chip comprising a first IDT of a first solidly-mounted resonator on a surface of a first piezoelectric layer. The IDT including a first plurality of interleaved fingers having a first thickness. A first acoustic reflector is sandwiched between the first piezoelectric layer and a first base. The filter device includes a second chip having a second IDT of a second solidly-mounted resonator on a surface of a second piezoelectric layer. The second IDT includes a second plurality of interleaved fingers having a second thickness that is different from the first thickness. A second acoustic reflector is sandwiched between the second piezoelectric layer and a second base. An electrical connection is provided between the first IDT and the second IDT.
A semiconductor composite device is provided that includes a voltage regulator including a plurality of active elements and a plurality of passive elements and arranged with a plurality of channels; a load including a semiconductor element and that is supplied with a direct-current voltage and regulated by the voltage regulator; and a wiring board electrically connected to the plurality of active elements, the plurality of passive elements, and the load. The load is disposed on a first mounting surface of the wiring board, and the first and second inductors are disposed on a second mounting surface of the wiring board that is opposite the first mounting surface. The first inductor is electrically connected to the wiring board via a first capacitor, and the second inductor is electrically connected to the wiring board via a second capacitor.
H02M 3/04 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques
The present invention provides a module 1 comprising a substrate 10 which has a first main surface 10a and a second main surface 10b that face each other in the thickness direction, a heat generation element 20 which is disposed on the first main surface 10a of the substrate 10 and which has a plurality of GND electrodes 21 on the first main surface 10a side, a plurality of heat dissipation members 30 which are disposed on the second main surface 10b of the substrate 10, and connection conductors 40 which pass through the substrate 10 in the thickness direction and which connect the GND electrodes 21 and the heat dissipation members 30, said module 1 being characterized in that one or more heat dissipation members 30 are connected to one GND electrode 21, the number of GND electrodes 21 which are connected to one heat dissipation member 30 is one, and, as viewed in the thickness direction, each heat dissipation member 30 has an anisotropic shape in which the dimension thereof in the vertical direction differs from the dimension thereof in the horizontal direction.
