A multilayer substrate includes a stacked body and a first conductor layer. The stacked body includes insulator layers stacked in a stacking direction. The first conductor layer is provided in the stacked body. In the stacked body, interior spaces that are not connected to a space outside the stacked body are provided. The first conductor layer includes a first principal surface and a second principal surface including an exposed portion exposed to the interior spaces. A surface roughness of the exposed portion is greater than a surface roughness of the first principal surface.
A high-frequency module includes a mounting substrate and a plurality of reception paths. Each reception path includes a reception filter and a matching circuit. Each matching circuit includes an inductor and a low-noise amplifier. In each of the plurality of reception paths, the reception filter is connected to the low-noise amplifier through a respective matching circuit. At least one of the plurality of matching circuits includes, as the inductor, a chip inductor and an inner layer inductor built in the mounting substrate.
A multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrodes. The internal electrodes include opposing portions, and extension portions extending to a lateral surface and/or an end surface of laminate. The extension portions include through-holes, and column portions in the through-holes. The column portions are made of a same material as the dielectric layers, and connect adjacent dielectric layers to each other in a lamination direction so as to sandwich the extension portions therebetween. When the direction in which the extension portions extend is defined as an extension direction, and a distance of extension of the extension portions toward the lateral surface or the end surface is defined as the extension distance, the dimension of the column portions, in the extension direction is from about 20% to about 80%.
A connector includes a resin body member and one or more first outer connection terminals supported by the resin body member. The one or more first outer connection terminals each include a main body portion including a first portion that extends in an up-down direction, a second portion, above the first portion, that extends in a left-right direction, a third portion, below the second portion, that extends in the up-down direction, a first coupling portion that is bent and physically connects an upper-end portion of the first portion and a left-end portion of the second portion to each other, and a second coupling portion that is bent and physically connects a right-end portion of the second portion and an upper-end portion of the third portion to each other. A second front or rear surface is connected to a first inner peripheral surface via one or more chamfered portions.
A multilayer ceramic capacitor includes an inner layer portion including dielectric layers and internal electrode layers, first and second main surfaces, first and second lateral surfaces, and first and second end surfaces, and an outer layer portion sandwiching the inner layer portion, and first and second external electrodes on the first and second end surfaces. The inner dielectric layers include voids, a width-direction center portion-side dielectric layer in a region of a center portion in a width direction of the inner layer portion, and a width-direction end portion-side dielectric layer in a region of an end portion in the width direction of the inner layer portion. An amount of voids included in the width-direction end portion-side dielectric layer is less than an amount of voids in the width-direction center portion-side dielectric layer.
A filter includes first and second via electrodes, first and second shielding conductors, and first, second, third and fourth planar electrodes. The first shielding conductor is on a dielectric substrate and adjacent to an end of the first and second via electrodes. The second shielding conductor is on the dielectric substrate and adjacent to another end of the first and second via electrodes. The first planar electrode is connected to the end of the first via electrode. The second planar electrode is connected to the other end of the first via electrode. The third planar electrode is connected to the end of the second via electrode. The fourth planar electrode is connected to the other end of the second via electrode. The first and third planar electrodes are capacitively coupled to the first shielding conductor. The second and fourth planar electrodes define a common electrode.
A piezoelectric resonator includes: a piezoelectric element and an excitation electrode. According to some exemplary aspects, the excitation electrode includes a center portion in a plan view in a thickness direction of the piezoelectric element, the center portion is configured to form a high acoustic velocity region in the piezoelectric resonator. Further, the excitation electrode includes a first end portion and a second end portion at opposite sides of the center portion in a first direction intersecting the thickness direction. The first end portion and the second end portion are configured to form a first low acoustic velocity region and a second low acoustic velocity region on opposite sides of the high acoustic velocity region in the first direction with a lower acoustic velocity than the high acoustic velocity region. Also, some size requirements are provided for the piezoelectric resonator to improve performance.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Provided is a substrate with a built-in capacitor having an improved noise reduction effect. A substrate 100A with a built-in capacitor has an IC mounted thereon, and comprises a multi-terminal capacitor 1A that has a first internal electrode layer 21 and a second internal electrode layer that are embedded in the substrate and face each other, and has at least five terminals 41, 42, wherein the multi-terminal capacitor 1A is connected to the IC so that at least a portion of a DC electric current of an electric power supply of the IC flows through the first internal electrode layer 21 of the multi-terminal capacitor 1A.
This sensor is provided with a base material that is flexible and that has a first main surface and a second main surface facing each other, and a first piezoelectric element including a first piezoelectric film. The first main surface is provided with a first protrusion. The first piezoelectric element is in contact with the first protrusion. The first piezoelectric film is stretched under tension so as to be extended from the natural length of the film. When viewed in a second direction orthogonal to a first direction extending from the second main surface toward the first main surface, a central part of the first piezoelectric film is positioned farther in the first direction than an end part of the first piezoelectric film.
G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices
G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
A finger-mounted device is configured to be worn on a finger. A computer-readable program is stored in a storage medium. The finger-mounted device has a first optical sensor, a second optical sensor, and a control unit. Each of a first optical sensor and a second optical sensor includes a light-emitting unit that emits light toward the inside of the finger on which the finger-mounted device is worn, and a light-receiving unit that receives the light irregularly reflected inside the finger. The distance from the light-emitting unit to the light-receiving unit of the first optical sensor is shorter than the distance from the light-emitting unit to the light-receiving unit of the second optical sensor. The control unit operates the first optical sensor and the second optical sensor to collect light reception level measurement values. The storage medium stores a program with which, if it is detected that the pressing force at which the inner circumferential surface of the finger-mounted device is pressing the surface of the finger is lower than an appropriate range, a computer is caused to realize a low pressing force notification function for notifying a user that the pressing force is lower than the appropriate range.
In the present invention, a radiation conductor RE is formed on the upper surface of an antenna substrate 101, and a power supply electrode FP1, a first ground conductor GC11, and a second ground conductor GC12 are formed on the lower surface of the antenna substrate 101. A second ground connection conductor GC12C for connecting the second ground conductor GC12 and a ground part GP of the radiation conductor RE is formed in the antenna substrate 101. Furthermore, a power supply electrode connection conductor FPC for connecting the power supply electrode FP1 and a power supply point FP of the radiation conductor RE is formed in the antenna substrate 101. The first ground conductor GC11 faces the radiation conductor RE. The first ground conductor GC11 and the second ground conductor GC12 are separated on the lower surface of the antenna substrate 101.
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H01Q 9/26 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
This high-frequency module (1) comprises: a module substrate (90) having main surfaces (90a and 90b) facing each other; a duplexer (35) disposed on the module substrate (90) and including a filter (351) having a passband including a transmission band of an NTN band (E) and a filter (352) having a passband including a reception band of the NTN band (E); a power amplification circuit (13) disposed on one of the main surfaces (90a and 90b) and connected to the filter (351); and a low-noise amplification circuit (25) disposed on the other of the main surfaces (90a and 90b) and connected to the filter (352). In a plan view of the module substrate (90), the power amplification circuit (13) at least partially overlaps the low-noise amplification circuit (25).
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
H03F 3/68 - Combinations of amplifiers, e.g. multi-channel amplifiers for stereophonics
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
A high-frequency module (1) comprises: a filter (311) having a pass-band including a transmission band of a TN band (A) included in a low-band group; a filter (331) having a pass-band including a transmission band of a TN band (C) included in a mid-band group; a filter (351) having a pass-band including a transmission band of an NTN band (E); a matching circuit (41) connected between a power amplification circuit (11) and the filter (311) and including a chip inductor (411); a matching circuit (42) connected between a power amplification circuit (12) and the filter (331) and including a chip inductor (421); and a matching circuit (43) connected between a power amplification circuit (13) and the filter (351). In plan view of a module substrate (90), a region in which the power amplification circuit (13) and/or the matching circuit (43) is disposed is positioned between the chip inductors (411, 421).
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
15.
SWITCH-EQUIPPED COAXIAL CONNECTOR, AND COAXIAL CONNECTOR SET PROVIDED WITH SAID SWITCH-EQUIPPED COAXIAL CONNECTOR
A switch-equipped coaxial connector according to the present invention comprises: an electrically conductive internal terminal; an electrically insulating holder that holds the internal terminal; an electrically conductive external terminal that covers the holder; and a coaxial center that is the center of the internal terminal and the external terminal. The external terminal has a terminal upper surface portion extending in a planar shape, and a terminal protruding portion arranged on an outer periphery of the terminal upper surface portion and protruding outward. The terminal protruding portion has a protruding end shaped so as to be able to come into contact with a circumference centered on the coaxial center in a top view.
H01R 24/46 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising switches
H01R 13/71 - Contact members of coupling parts operating as switch
16.
MULTILAYER CERAMIC ELECTRONIC COMPONENT, ELECTROCONDUCTIVE MATERIAL, AND METHOD FOR PRODUCING MULTILAYER CERAMIC ELECTRONIC COMPONENT
A multilayer ceramic electronic component includes outer electrodes including an electroconductive metal and glass including silicon. The electroconductive metal includes silver and copper, and a volume fraction of the copper is larger than a volume fraction of the silver. The silver and the copper are present in the form of silver particles, in the form of copper particles, and in the form of joined particles each including a silver particle and a copper particle joined together. The joined particles each have a flat shape. No copper is present on surfaces of the silver particles other than joint surfaces between the silver particles in the joined particles and the copper particles in the joined particles, and no silver is present on the surfaces of the copper particles other than joint surfaces. A portion of the copper in the outer electrodes is diffused into the inner electrodes.
Provided is a highly reliable multilayer ceramic capacitor that is capable of dispersing external stress applied to the multilayer ceramic capacitor while suppressing generation of squeaking generated therein, and that has a fixing force between an external electrode and bump portions and a fixing force between the bump portions and a mounting substrate on which the multilayer ceramic capacitor is mounted. A first bump portion (71) of the multilayer ceramic capacitor (1) comprises a first region (201), a second region (202), and a third region (203) interposed between the first region (201) and the second region (202). A second bump portion (72) comprises a fourth region (204), a fifth region (205), and a sixth region (206) interposed between the fourth region (204) and the fifth region (205). The porosity in the first region (201) and the second region (202) is lower than that in the third region (203), and the porosity in the fourth region (204) and the fifth region (205) is lower than that in the sixth region (206).
A differential transmission line (101) comprises a laminate that is formed from a plurality of insulator layers (11–16) and a plurality of conductors that are provided along the insulator layers. A hollow (HS) is formed in the laminate. A first signal line (61) and a second signal line (62) that are two conductors are joined via an inter-signal-line insulator layer (73). The first signal line (61) and the second signal line (62) are offset in the layer direction. The inter-signal-line insulator layer (73) as seen in the layering direction is in at least a signal line overlap region (OR) in which the first signal line (61) and the second signal line (62) overlap; a signal line laminate that is formed from the inter-signal-line insulator layer (73), the first signal line (61), and the second signal line (62) is inside the hollow (HS); and a space (SD) is formed by the hollow (HS) outside the signal line overlap region (OR).
A substrate 101 built into an electronic component comprises: a core substrate 110 which has a first surface 111 and a second surface 112 opposite the first surface 111, and is provided with an opening 120 on the inside; a multilayer ceramic electronic component 1 provided in the opening 120 and having a first external electrode 51, in a first direction orthogonal to the second surface 112 of the core substrate 110 and headed toward the first surface 111, and having a second external electrode 52 in a second direction opposite the first direction; a sealing material 130 provided, between the opening 120 and the multilayer ceramic electronic component 1, on the first external electrode 51 and the first surface 111, and having a third surface 133 on the first surface 111 side; and a first via conductor 141 penetrating the third surface 133 of the sealing material 130 and electrically connected to the first external electrode 51 of the multilayer ceramic electronic component 1. The multilayer ceramic electronic component 1 includes: a substantially rectangular parallelepiped-shaped laminate 10 having a first end face 13 and a second end face 14 facing the first end face 13; the first external electrode 51 provided on the first end face 13; and the second external electrode 52 provided on the second end face 14. The laminate 10 includes: an effective part 30, in which a plurality of internal electrode layers 21, 22 are overlapped and which functions as an electronic component; and a lead-out part 31 for drawing the internal electrode layer 21 out from the effective part 30 to the first external electrode 51. In the first direction, the thickness A1 of the lead-out part 31 on the first end face 13 side is greater than the thickness B1 of the first external electrode 51.
This antenna module comprises radiation elements (121, 126), an RFIC (110), a switch (105) for selecting one of the radiation elements, and power feeding wires (141, 142, 143, 145, 210). The radiation element (126) receives a high-frequency signal in a first frequency band and radiates radio waves. The radiation element (121) receives a high-frequency signal in a second frequency band higher than the first frequency band and radiates radio waves. The RFIC converts the high-frequency signal in the first frequency band into the high-frequency signal in the second frequency band. The power feeding wires (143, 210) transmit the high-frequency signal in the first frequency band to the switch. The power feeding wire (145) transmits the high-frequency signal in the first frequency band from the switch to the radiation element (126). The power feeding wire (142) transmits the high-frequency signal in the first frequency band from the switch to the RFIC. The power feeding wire (141) transmits the high-frequency signal in the second frequency band converted by the RFIC to the radiation element (121).
This resonance device (1) comprises: a resonator (10) comprising a vibration part (110) configured to be able to vibrate; a first substrate (30) comprising a first bottom plate part (32) provided to be spaced from the vibration part (110); and a second substrate (20) comprising a second bottom plate part (22) provided to be spaced from the vibration part (110) on the reverse side of the resonator (10) from the first substrate (30). The vibration part (110) has a piezoelectric layer (F3), a frequency adjustment film (125A-125D) for adjusting the frequency of the vibration part (110) by a mass addition effect, and a metal film (E1) comprising an excitation electrode for exciting the piezoelectric layer (F3) by applying voltage. The frequency adjustment film (125A-125D) is provided between the piezoelectric layer (F3) and the metal film (E1), the thickness of the frequency adjustment film (125A-125D) is larger than the thickness of the metal film (E1), and when viewed in plan view in a thickness direction in which the second substrate (20), the resonator (10), and the first substrate (30) overlap, the metal film (E1) overlaps at least an end portion of the frequency adjustment film (125A-125D).
H03H 9/24 - Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
H03H 3/007 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
Provides is a pressure sensor element with which it is possible to suppress a reduction in the sensitivity of pressure detection. This pressure sensor element includes: a membrane layer having a diaphragm part; and a plurality of electrode parts facing the membrane layer in the thickness direction. The diaphragm part includes a first conductive layer and a second conductive layer electrically insulated from the first conductive layer. The plurality of electrode parts are separated from each other. Each electrode part includes: a support part supported by the first conductive layer; and a movable part that is supported by the first conductive layer via the support part, is spaced apart from and faces the second conductive layer in the thickness direction, and moves due to deflection of the diaphragm part. When viewed along the thickness direction, each support part is located at a position outside both the center of the diaphragm part in the longitudinal direction and the center of the diaphragm part in the lateral direction, and has an elongated shape in the longitudinal direction of the diaphragm part.
G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
The present invention provides a coil component which does not readily become filled with resin and which improves insulation resistance. A coil component 1 according to the present disclosure comprises: a magnetic body part BB containing first metal magnetic particles MP1 and a resin; an element body 10 having coils C1, C2 embedded in the magnetic body part BB; and an external electrode 20 provided on a mounting surface of the element body 10 and connected to the coils C1, C2. The coils C1, C2 include a first coil C1 and a second coil C2. The first coil C1 and the second coil C2 are each formed by means of a coil conductor CL1 and are arranged to face each other. An insulating layer IL containing second metal magnetic particles MP2 is disposed in at least a portion along the mutually facing surfaces of the first coil C1 and the second coil C2. The average particle size of the second metal magnetic particles MP2 is smaller than the average particle size of the first metal magnetic particles MP1. In a plan view, the lateral surface of the insulating layer IL is located farther inward than the lateral surface of the element body 10.
An inductor component 1 comprises a parallelepiped element body 10 which contains an insulator, a coil 20 which is provided inside the element body 10 and which is wound along a coil axis direction, and a first external electrode 30 and a second external electrode 40 which are electrically connect to the coil 20. The element body 10 has a first end surface 11a and a second end surface 11b which are opposite from each other in a length direction L, a first main surface 12a and a second main surface 12b which are opposite from each other in a height direction T, and a first side surface 13a and a second side surface 13b which are opposite from each other in a width direction W. The first external electrode 30 has a first planar electrode portion 31 which extends in a planar manner along the first main surface 12a so as to be exposed on the element body 10, and a first columnar electrode portion 32 which extends in a columnar manner along a first ridge portion 14a and/or a second ridge portion 14b from the first planar electrode portion 31 so as to be exposed on the element body 10. The second external electrode 40 has a second planar electrode portion 41 which extends in a planar manner along the first main surface 12a so as to be exposed at a distance from the first planar electrode portion 31 on the element body 10, and a second columnar electrode portion 42 which extends in a columnar manner along a third ridge portion 14c and/or a fourth ridge portion 14d from the second planar electrode portion 41 so as to be exposed on the element body 10. When seen from the height direction T, the first planar electrode portion 31 and the second planar electrode portion 41 have a point-symmetrical shape.
Provided is a filter device with which it is possible to reduce loss without lowering electric power resistance. A filter device according to the present invention comprises a plurality of elastic wave resonators each having a support member 8, a piezoelectric film that is provided on the support member 8 and includes a piezoelectric layer 5, and an IDT electrode 11 that is provided on the piezoelectric film and has a plurality of electrode fingers. The plurality of elastic wave resonators include at least one series arm resonator and at least one parallel arm resonator P1a. In each of the plurality of elastic wave resonators, an acoustic reflection part (cavity part 9a) is provided in the support member 8 at a position overlapping the IDT electrode 11 as seen in plan view, and d/p is 0.5 or greater, where d is the thickness of the piezoelectric film, and p is the distance between the centers of adjacent electrode fingers in the IDT electrode 11. The number of the plurality of electrode fingers is lowest in the parallel arm resonator, among the plurality of elastic wave resonators, and the number of the plurality of electrode fingers in the parallel arm resonator is lower than the number of the plurality of electrode fingers in any series arm resonator.
Provided is a bathing determination apparatus capable of enhancing accuracy in determining bathing of a wearer. Provided is a bathing determination apparatus comprising: a ring device configured to be fitted on a finger; and a storage medium. The ring device is provided with: a first temperature sensor; a second temperature sensor; an optical sensor that emits light toward a finger having the ring device fitted thereon and that receives diffused reflection light from the finger; a control unit that controls the first temperature sensor, the second temperature sensor, and the optical sensor; and one or more wiring boards that each have a surface facing the inner peripheral side and a surface facing the outer peripheral side. The first temperature sensor is disposed on the surface facing the inner peripheral side of one of the wiring boards, and the second temperature sensor is disposed on the surface facing the outer peripheral side of one of the wiring boards. The storage medium stores a program for causing a computer to implement: a bathing detection function for detecting that a wearer of the ring device has bathed on the basis of a first temperature measurement value measured by the first temperature sensor and a second temperature measurement value measured by the second temperature sensor; and a bathing-time data processing function for performing data processing based on an optical sensor measurement value measured by the optical sensor, when bathing has been detected by the bathing detection function.
A cylindrical battery is provided and including a top cover, and a safety valve, wherein the safety valve has a safety cover and a stripper disk positioned inward in a battery axial direction from the safety cover, and a predetermined portion of the safety cover positioned between a portion where the safety cover and the top cover are in contact with each other and a portion where the safety cover and the stripper disk are in contact with each other is an inclined portion inclined inward in a battery axial direction with respect to a contact surface where the safety cover and the top cover are in contact with each other.
A power supply includes a pair of output terminals, a high-potential power line, a battery, a switch located on the high-potential power line, a power converter circuit located on the high-potential power line, a voltage detector, a current detector, and a controller. The controller turns the switch off when a magnitude of a voltage detected by the voltage detector is equal to or smaller than a magnitude of a predetermined first voltage threshold and a magnitude of a current detected by the current detector is equal to or larger than a magnitude of a predetermined first current threshold.
An electronic component includes a substrate and a pillar electrode. The substrate includes a first principal surface. The pillar electrode protrudes from the first principal surface of the substrate in a thickness direction of the substrate. The pillar electrode is positioned between the first principal surface of the substrate and a bump electrode. The pillar electrode includes a second principal surface and a peripheral surface. The second principal surface is in contact with the bump electrode. The peripheral surface is connected to the second principal surface and to the first principal surface of the substrate. The pillar electrode includes a groove disposed at the second principal surface of the pillar electrode. A bottom of the groove is connected to the peripheral surface of the pillar electrode.
A radio frequency circuit includes a first filter having a first passband including downlink bands of first and second bands. The downlink band of the second band at least partially overlaps the downlink band of the first band. The low-frequency edge of the downlink band of the second band is lower than the low-frequency edge of the downlink band of the first band. The low-frequency edge of a first guard band defined on the lower frequency side of the downlink band of the first band, for the downlink band of the first band, coincides with the low-frequency edge of a second guard band defined on the lower frequency side of the downlink band of the second band, for the downlink band of the second band. The first filter has a higher attenuation steepness on the lower frequency side of the first passband than on the higher frequency side.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
H03H 9/00 - Networks comprising electromechanical or electro-acoustic elementsElectromechanical resonators
H03H 9/25 - Constructional features of resonators using surface acoustic waves
31.
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS WITH GAP DIELECTRIC STRIPES IN BUSBAR-ELECTRODE GAPS
An acoustic resonator device is provided that includes a substrate; a piezoelectric layer attached to the substrate; and an interdigital transducer on a surface of the piezoelectric layer and having opposing busbars. Moreover, a first plurality of fingers extend from a first busbar of the opposing busbars and a second plurality of fingers extend from a second busbar of the opposing busbars. The first and second pluralities of fingers are interleaved fingers and are disposed on the portion of the piezoelectric layer over the cavity. At least one first strip of dielectric material is disposed in a first gap between an end of at least one finger of the first plurality of fingers attached to the first busbar and an inner surface of the second busbar that faces the first busbar.
A multilayer body includes a first surface and a second surface opposite each other in a lamination direction, a third surface and a fourth surface opposite each other in a first direction, and a fifth surface and a sixth surface opposite each other in a second direction orthogonal. An inner layer portion includes an inner dielectric layer and an inner electrode laminated on the inner dielectric layer in the lamination direction. The inner electrode includes an end portion at the fifth surface. An outer electrode on the fifth surface includes an inner base electrode layer on the inner layer portion at the fifth surface and connected to the inner electrode, an inner glass layer on the inner base electrode layer, a plating layer on the inner glass layer, and a connecting portion penetrating through the inner glass layer and electrically connecting the inner base electrode layer to the plating layer.
A multilayer ceramic capacitor includes a multilayer body and first and second outer electrodes. The first outer electrode includes a first direct plating layer covering the first end surface, a first main surface electrode covering at least a portion of the first main surface, a first upper plating layer, and a first front plating layer, and the second outer electrode includes a second direct plating layer covering a second end surface, a second main surface electrode covering at least a portion of the second main surface, a second upper plating layer, and a second front plating layer.
A pseudo-haptic sensation generation apparatus is provided that includes a first vibration generator, a second vibration generator, a first fitting device, and a second fitting device. The vibration generator is configured to generate a first vibration and a second vibration that each induce the pseudo-haptic sensation. The first fitting device is configured to fit the first vibration generator (21) to the index finger of a hand of a user. The second fitting device is configured to fit the second vibration generator to the little finger of the hand of the user. The first vibration generator, the first fitting device, the second fitting device, and the second vibration generator are arranged in this order in the row direction of fingers of the hand of the user.
A multilayer ceramic capacitor includes a multilayer body including first and second surfaces facing each other in a lamination direction, third and fourth surfaces facing each other in a first direction, and fifth and sixth surfaces facing each other in a second direction, and four outer electrodes on the multilayer body. About 0.85≤L/W≤ about 1.00 is satisfied. The multilayer body includes a first inner electrode including an end exposed on the third and fifth surfaces and another end exposed on the fourth and sixth surfaces, a second inner electrode including one end exposed on the third and sixth surfaces and another end exposed on the fourth and fifth surfaces, and a peripheral electrode in a region between the first inner electrode and the third to sixth surfaces.
Provided is a multilayer inductor that reduces loss resulting from an eddy current with respect to an AC current by reducing resistance in the vicinity of an interface between a coil conductor and a metal magnetic body. A multilayer inductor 1 according to the present disclosure comprises an element body 10 having a metal magnetic body M on which a metal magnetic layer ML containing metal magnetic particles is layered, and a coil conductor CM on which a coil conductor layer CL is layered in the layering direction of the metal magnetic layer ML. The coil conductor CM has unevenness B on side surfaces thereof positioned in an intersection direction intersecting the lamination direction. The metal magnetic layer ML is disposed in recessed sections of the side surfaces. The density of a conductor constituting the coil conductor CM is greater at the side surfaces than at the center.
The present disclosure provides a magnetic material comprising a plurality of metal magnetic bodies and a coating layer covering each of the metal magnetic bodies, wherein: the metal magnetic bodies contain at least Fe; the coating layers contain at least one of metal oxides and metal nitrides that contain Si and a first nonmagnetic metal element more susceptible to oxidation than Fe; and the average thickness of the coating layers is 10-153 nm, inclusive.
H01F 1/24 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
B22F 1/07 - Metallic powder characterised by particles having a nanoscale microstructure
B22F 1/16 - Metallic particles coated with a non-metal
B22F 3/00 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor
The present disclosure relates to a multilayer ceramic capacitor (100). A multilayer ceramic capacitor (100) according to the present disclosure includes a ceramic element (10) in which a plurality of dielectric layers (11) and a plurality of internal electrode layers (12) are alternately laminated. The dielectric layer (11) contains ceramic as a main component, the ceramic contains barium and titanium, and the dielectric layer (11) further contains tin. The internal electrode layer (12) contains nickel as a main component. The internal electrode layer (12) has, at the vicinity of an interface with at least the dielectric layer (11), a first region in which the tin is dissolved, and the dielectric layer has a second region in which a Perovskite structure containing barium and titanium is formed. The second region is in contact with the internal electrode layer (12), and tin is dissolved in the Perovskite structure in the second region.
The present disclosure provides a magnetic material comprising a plurality of metal magnetic particles and an insulating layer that covers each of the plurality of metal magnetic particles. In a cross-sectional view, when any one of the metal magnetic particles among the plurality of metal magnetic particles is defined as a first metal magnetic particle, the metal magnetic particle closest to the first metal magnetic particle, among the metal magnetic particles adjacent to the first metal magnetic particle, is defined as a second metal magnetic particle, and the equivalent circle diameter of the first metal magnetic particle is defined as d, and the shortest distance between the surface of the first metal magnetic particle and the surface of the second metal magnetic particle is defined as 2δ, the standard deviation of the δ/d value is greater than 0 and equal to or less than 0.092, and the average value of the δ/d value is 0.001-0.085.
H01F 1/24 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/16 - Metallic particles coated with a non-metal
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
C22C 19/03 - Alloys based on nickel or cobalt based on nickel
An LC composite part 1A comprises: an element body 10 formed by laminating ferrite layers 15 in the lamination direction; internal electrode layers 20 that are laminated in the lamination direction with the ferrite layers 15 therebetween inside the element body 10 and extend along the ferrite layers 15 in the plane direction perpendicular to the lamination direction; a first external electrode 30 provided on the surface of the element body 10; and a second external electrode 40 provided, on the surface of the element body 10, at a position away from the first external electrode 30. The internal electrode layers 20 include first capacitor electrode layers 22 that are not electrically connected to the second external electrode 40 and are electrically connected to the first external electrode 30, second capacitor electrode layers 23 that are not electrically connected to the first external electrode 30 and are electrically connected to the second external electrode 40, and an inductor electrode layer 21 located on the same main surface of a corresponding ferrite layer 15 and electrically connected to the first external electrode 30 and the second external electrode 40. The LC composite part has an inductor portion LP including the inductor electrode layer 21, and a capacitor portion CP which is provided on at least one side in the lamination direction with respect to the inductor portion LP and in which the first capacitor electrode layers 22 and the second capacitor electrode layers 23 are opposite to each other with the ferrite layers 15 therebetween.
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
This acceleration sensor comprises: a device layer that is provided with a weight portion, an elastic portion, a first vibrator, and a second vibrator each of which is disposed on an intersection surface intersecting with a sensitivity axis direction; an application mechanism that applies rotational force to the weight portion; a lower lid that is provided below the device layer in the sensitivity axis direction; and an upper lid that is provided above the device layer in the sensitivity axis direction, and is for detecting an acceleration in the sensitivity axis direction. The weight portion has a rotary shaft that is orthogonal to the sensitivity axis direction, a first rotating portion that extends from the rotary shaft, and a second rotating portion that extends from the rotary shaft to the opposite side from the first rotating portion. The elastic portion is connected to the rotary shaft of the weight portion, and holds the weight portion so as to enable the weight portion to be translated in the sensitivity axis direction. The first vibrator is connected to the first rotating portion of the weight portion, and is configured to have a resonance frequency which changes according to the displacement of the first rotating portion. The second vibrator is connected to the second rotating portion of the weight portion, and is configured to have a resonance frequency which changes according to the displacement of the second rotating portion. In detecting an acceleration in the sensitivity axis direction, the weight portion is inclined with respect to an orthogonal surface orthogonal to the sensitivity axis direction due to rotational force applied by the application mechanism, and undergoes acceleration in the sensitivity axis direction while being kept inclined, and is thus translated in the sensitivity axis direction. The acceleration in the sensitivity axis direction is detected on the basis of the difference between the resonance frequency of the first vibrator and the resonance frequency of the second vibrator.
G01P 15/097 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by vibratory elements
Provided is a stretchable device comprising: a plurality of stretchable base materials that are laminated to each other; a plurality of stretchable wires that are each disposed on each of the plurality of stretchable base materials; and a via that electrically connects at least two of the stretchable wires that overlap each other via the stretchable base material therebetween when viewed from the lamination direction of the stretchable base materials. In a cross-sectional view, among the plurality of stretchable base materials, at least one of the stretchable base materials on each of which the stretchable wire connected to the via is disposed includes protrusions protruding toward the stretchable wire, around the via.
Provided is a method for producing a plating composition that can be recovered from a plating composition containing metal ions in a high oxidation state. The method for producing a plating composition involves: in a working electrode chamber provided with a working electrode, using the working electrode as a cathode to reduce a portion of first metal ions contained in a first plating composition into metal, and thereby obtaining a reduction treatment liquid and a working electrode to which metal is adhered; bringing the reduction treatment liquid into contact with at least one type of adsorption material selected from the group consisting of chelate resins and ion exchange resins, and thereby obtaining a metal-ion-removed liquid from which at least some of the first metal ions have been further removed; and introducing the metal-ion-removed liquid into the working electrode chamber provided with the working electrode to which metal is adhered, using the working electrode to which metal is adhered as an anode to oxidize, in the metal-ion-removed liquid, at least a portion of the adhered metal into second metal ions having a lower oxidation number than the first metal ions, and thereby obtaining a second plating composition containing the second metal ions.
This touch-type input device comprises: a housing having a first surface and a second surface on opposite sides from each other; a plurality of pressure-sensitive elements each having a rectangular shape in plan view; and a plurality of adhesive members. The polarity of the output of each of the plurality of pressure-sensitive elements differs between when extended in a first direction in which one side of the pressure-sensitive element extends and when being compressed in the first direction. The first surface has a plurality of operation regions. The second surface has a plurality of detection regions positioned overlapping the plurality of operation regions in plan view. The plurality of pressure-sensitive elements are respectively adhered to the plurality of detection regions by the plurality of adhesive members so as to be positioned at the centers of the plurality of detection regions. The plurality of pressure-sensitive elements are disposed such that the first direction of the plurality of pressure-sensitive elements and the direction in which the plurality of operation regions are aligned are substantially parallel to each other.
G06F 3/0362 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 1D translations or rotations of an operating part of the device, e.g. scroll wheels, sliders, knobs, rollers or belts
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Provided is a stretchable device that comprises a stretchable substrate, an electronic component that is mounted on the stretchable substrate, and a plurality of stretchable wires that are provided at least inside the stretchable substrate. As seen from the thickness direction, the stretchable substrate has a first region that coincides with the stretchable wires and a second region that coincides with the electronic component and does not coincide with the stretchable wires, and in a cross-section of the stretchable substrate taken where the stretchable wires are provided, the second region is thicker than the first region. At least one of the stretchable wires has a first portion that extends in a first direction that is the stretching direction of the stretchable wires and a second portion that is continuous with the first portion and extends in a second direction that is different from the first direction so as to be electrically connectable to the electronic component.
A 90° coupler includes a first capacitor having a first end connected to a first terminal and a second end connected to a first amplifier, a first inductor having a first end connected to the first terminal and a second end connected to a second amplifier, a second inductor having a first end connected to the second end of the first capacitor and a second end connected to the ground through a resistance element and electromagnetically coupling to the first inductor, and a second capacitor having a first end connected to the first terminal and a second end connected to the second end of the second inductor.
A laminated ceramic capacitor includes dielectric layers, first and second internal electrode layers respectively exposed at first and second end surfaces, and first and second external electrodes respectively on first and second end surfaces. The first and second external electrodes include an underlying electrode layer including a metal component, a conductive resin layer above the underlying electrode layer and including a thermosetting resin and a metal filler, and a plating layer above the conductive resin layer. The metal filler of the conductive resin layer includes a flat filler with a flat shape. A void is included on a surface of the flat filler.
A multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, first and second main surfaces, first and second side surfaces, first and second end surfaces, and first and second internal electrode layers laminated alternately with the plurality of dielectric layers and respectively exposed on the first and second end surfaces, a first outer electrode covering portions of the first end surface and the first main surface, and a second outer electrode covering portions of the second end surface and the first main surface. The first and second outer electrodes each include a thin film layer, a lower plating layer, an upper plating layer, and a front plating layer. An end edge portion of the thin film layer located adjacent to a center of the multilayer body is spaced apart from the multilayer body.
A composite sensor includes a substrate including first and second surfaces facing in opposite directions, an optical proximity sensor including a first light emitter and a first light receiver on the first surface of the substrate to output a signal dependent on a distance to an object by receiving, at the first light receiver, light emitted from the first light emitter and reflected by the object, a force sensor on the second surface of the substrate to output a signal dependent on a component of force that is perpendicular or substantially perpendicular to the substrate, a processor configured or programmed to process the signal from the optical proximity sensor and the signal from the force sensor and calculate information on the distance to the object and information on force received from the object.
G01D 21/02 - Measuring two or more variables by means not covered by a single other subclass
G01C 3/06 - Use of electric means to obtain final indication
G01L 1/24 - Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis
50.
RADAR SYSTEM AND SIGNAL PROCESSING METHOD FOR THE SAME
A radar system includes a first device that acquires a displacement of the subject of displacement acquisition by transmitting and receiving a radio wave, and a second device installed at the subject capable of transmitting to and receiving from the first device. The second device has a first mode in which it reradiates a received radio wave and a second mode in which it delays a phase of a received radio wave before reradiating. The first device acquires first IQ information while the second device is operating in the first mode and second IQ information while the second device is operating in the second mode. The first device then calculates a direct-current component of the first IQ information and generates third IQ information by removing the direct-current component from the first IQ information.
G01S 13/32 - Systems for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated
G01S 13/82 - Systems using reradiation of radio waves, e.g. secondary radar systemsAnalogous systems wherein continuous-type signals are transmitted
G01S 13/88 - Radar or analogous systems, specially adapted for specific applications
A multilayer ceramic capacitor includes end surface internal electrodes each exposed at end surfaces of a laminate, and side surface internal electrodes each exposed at side surfaces of the laminate. An end surface internal electrode closest to a first-main-surface side has a greater cross-sectional area in a first reference cross-section than an end surface internal electrode with a greatest cross-sectional area in the first reference cross-section among the end surface internal electrodes in either of a second-main-surface-side region and an intermediate region. A side surface internal electrode closest to the first-main-surface side has a greater cross-sectional area in a second reference cross-section than a side surface internal electrode that has a greatest cross-sectional area in the second reference cross-section among the side surface internal electrodes in either of the second-main-surface-side region and the intermediate region.
A secondary battery using a negative electrode capable of improving a cycle characteristic, improving energy density, and improving safety of the secondary battery without provision of a recess or a protrusion in a negative electrode current collector. In the secondary battery, a negative electrode active material layer has a compound containing silicon. The negative electrode active material layer has a plurality of recessed portions in which a surface on an opposite side to a surface adjacent to the negative electrode current collector is recessed toward the negative electrode current collector side, and a protruding portion formed on both sides of the recessed portion.
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
A cylindrical secondary battery is provided and including: an electrode wound body having a structure in which a band-shaped positive electrode and a band-shaped negative electrode are stacked and wound with a separator interposed therebetween; a battery can accommodating the electrode wound body with one end portion being open while the electrode wound body is accommodated; and a battery lid provided at the one end portion of the battery can and having two or more opening portions, wherein the two or more opening portions have a non-overlapping form during rotation that does not overlap the two or more opening portions before rotation when the two or more opening portions are rotated by more than 0° and less than 360° about an axis of a cylindrical shape of the secondary battery in top view, and the battery lid has a cleavage impression at any one of joints between two adjacent opening portions out of the two or more opening portions.
H01M 50/152 - Lids or covers characterised by their shape for cells having curved cross-section, e.g. round or elliptic
H01M 10/0587 - Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
A multilayer ceramic capacitor includes a multilayer body including dielectric layers and inner electrode layers that are laminated, and an outer electrode to establish electrical continuity with the inner electrode layers. In the multilayer body, an outer surface at a boundary portion between an end-surface-side ineffective portion and a perpendicular ridge ineffective portion, an outer surface of the perpendicular ridge ineffective portion, and an outer surface at a boundary portion between the perpendicular ridge ineffective portion and a side-surface-side ineffective portion define a contiguous curved surface protruding outward in plan view in a lamination direction, and a protection film including carbon and silicon is provided on the curved surface.
An acoustic wave resonator includes a piezoelectric layer and an IDT electrode. Electrode fingers of the IDT electrode are arranged in a first direction along a main surface of the piezoelectric layer. A region where the IDT electrode is provided includes split regions in a matrix in the first direction and a second direction in which the electrode fingers extend. The split region includes some of the electrode fingers and a portion of the electrode fingers in the longitudinal direction. The split regions include one split region and another split region adjacent to each other in the second direction. A duty in the one split region is larger than a duty in the another split region, and an electrode finger pitch in the one split region is smaller than an electrode finger pitch in the another split region.
The present disclosure provides a vibration device and an imaging device that prevent foreign matter from collecting in a central part of a translucent body due to vibration and do not cause a decrease in vibration performance. A vibration device (10) comprises: an outermost-layer lens (1) (translucent body) that transmits light of a prescribed wavelength; a vibrating body (3) that contacts the outermost-layer lens (1) and vibrates the outermost-layer lens (1); a piezoelectric element (5) provided to the vibrating body (3); and a housing (2) that retains the outermost-layer lens (1) and covers the vibrating body (3). The vibrating body (3) includes: a first cylindrical part (31) that has a cylindrical shape and is in contact with the outermost-layer lens (1); a second cylindrical part (32) that is provided with the piezoelectric element (5); and a spring part (33) that links the first cylindrical part (31) and the second cylindrical part (32). The vibrating body (3) is such that at least one of the shape of the vibrating body (3), the physical characteristics of the material constituting the vibrating body (3), the position of the outermost-layer lens (1) in contact with the first cylindrical part, and the position of the piezoelectric element (5) provided to the second cylindrical part (32) is asymmetrical with respect to a central axis (C) of the cylindrical shape of the vibrating body (3).
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
This high frequency circuit (1) comprises: a 90° hybrid circuit (10) having output terminals (10b and 10c); a combination circuit (30) having input terminals (30b and 30c) and an output terminal (30a); power amplifiers (21 and 22); a switch (41) having common terminals (41a and 41b) and selection terminals (41c and 41d); and filters (51 and 52). The input end of the power amplifier (21) is connected to the output terminal (10b) and the output end is connected to the common terminal (41a). The input end of the power amplifier (22) is connected to the output terminal (10c) and the output end is connected to the common terminal (41b). The input end of the filter (51) is connected to the selection terminal (41c) and the output end is connected to the input terminal (30b). The input end of the filter (52) is connected to the selection terminal (41d) and the output end is connected to the input terminal (30c). The number of elastic wave resonators in the filter (52) is greater than the number of elastic wave resonators in the filter (51).
This high frequency circuit (1) comprises: a switch circuit (51) that includes common terminals (511 and 512) respectively connected to antenna connection terminals (101 and 102) and selection terminals (513, 514, and 515); a switch circuit (52) that includes selection terminals (523 and 524) respectively connected to common terminals (521 and 522) and low-noise amplifiers (22 and 23), and a selection terminal (525) connected to a power amplifier (12); a filter (31) for the reception band of an FDD band A connected between the selection terminal (513) and a low-noise amplifier (21); a filter (32) for the transmission band of the FDD band A connected between the selection terminal (513) and a power amplifier (11); a filter (33) for a TDD band B connected between the selection terminal (514) and the common terminal (521); and a filter (34) for the TDD band B connected between the selection terminal (515) and the common terminal (522).
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
Provided is a battery module which can be easily manufactured and in which there is reduced contact between an ejected substance that has been ejected from an abnormal battery where an abnormality occurred and a normal battery adjacent to the abnormal battery. A battery module BM according to the present disclosure comprises: a plurality of batteries BT that are each provided with an explosion-proof valve EV on the upper surface thereof and are arranged side by side in a first direction; a first heat-insulating plate HI1 that is disposed above the plurality of batteries BT; and second heat-insulating plates HI2 that are disposed between the plurality of batteries. The first heat-insulating plate HI1 is provided with a plurality of openings OP that are respectively provided at positions facing the explosion-proof valves EV and are arranged side by side in the first direction, and slits SL that are provided between the openings OP. The second heat-insulating plates HI2 are provided with body portions BP that face the batteries BT, and protruding portions PP that protrude from the body portions BP toward the first heat-insulating plate HI1. The protruding portions PP are inserted into the slits SL, and the protruding portions PP cover the openings OP.
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/209 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
H01M 50/291 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A battery 1 comprises: an electrode assembly 10 that has a positive electrode mixture layer 11a, a negative electrode mixture layer 11b, and a first current collector 12; and a second current collector 20 that accommodates the electrode assembly 10 and that is electrically connected to the positive electrode mixture layer 11a. The second current collector 20 has a shape obtained by bending one sheet member SH which has a first opening 23. The first current collector 12 is provided with a body part 12a that is electrically connected to the negative electrode mixture layer 11b inside the second current collector 20 and a protruding part 12b that protrudes from the body part 12a, that passes through the first opening 23, and that is exposed from the second current collector 20.
Provided is a stretchable device comprising: a stretchable substrate; stretchable wiring disposed on a main surface of the stretchable substrate; an electronic component electrically connected to the stretchable wiring; a first stretchable covering layer covering the stretchable wiring; and a protective resin covering the electronic component. The stretchable device is provided with an overlapping region in which the protective resin and a portion of the first stretchable covering layer overlap when viewed from the thickness direction of the stretchable substrate. The overlapping region is positioned at least over the stretchable wiring when viewed from the thickness direction. In the overlapping region, the overlapping width between the first stretchable covering layer and the protective resin is greater than the thickness of the first stretchable covering layer.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
This gas sensor comprises: a substrate; a detection element that is supported by the substrate and has a detection unit; an inner wall that is supported by the substrate and surrounds the detection unit; an outer wall that is supported by the substrate and surrounds the inner wall; and a lid part that is supported by the inner wall and the outer wall, closes a detection chamber that is a space inside the inner wall in which the detection unit is provided, and closes a flow path that is a space between the inner wall and the outer wall. The outer wall has a first outer hole penetrating in a first direction so as to communicate the outer side of the outer wall and the flow path, and a second outer hole provided on the opposite side of the first outer hole with respect to the detection chamber in the first direction and penetrating in the first direction so as to communicate the outer side of the outer wall and the flow path. The inner wall has an inner hole penetrating in a second direction so as to communicate the flow path and the detection chamber, the second direction intersecting the first direction.
G01N 27/18 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by changes in the thermal conductivity of a surrounding material to be tested
G01N 25/18 - Investigating or analysing materials by the use of thermal means by investigating thermal conductivity
G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
Provided is an electronic component comprising: an element body (20); an inorganic oxide layer (30) that covers an outer surface (21) of the element body (20); and a glass layer (50) that covers an outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. Voids (P) are present between the element body (20) and the inorganic oxide layer (30).
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
This electronic component comprises an element body (20), an inorganic oxide layer (30) that covers the outer surface (21) of the element body (20), and a glass layer (50) that covers the outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. In the inorganic oxide layer (30), the concentration of the same element as one or more elements selected from the alkali metal and the alkaline earth metal contained in the glass layer (50) is less than the concentration of the same element in the glass layer (50).
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element
H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
65.
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Provided is a surface-treated copper foil that has excellent adhesion between a resin substrate and the surface-treated copper foil, has low transmission loss, and can be used to manufacture a printed circuit board or the like with good laser workability. This surface-treated copper foil has, on at least one side, a roughened surface on which roughened particles have been formed, and measured physical values for the roughened surface fulfill the following (a), (b), and (c). (a) The true reflectance of the roughened surface, measured using a spectrophotometer with a light source that emits 45° polarized light at a wavelength of 600 nm, and on condition that the incidence angle and the reflection angle are both 70°, is at least 0.20% and no greater than 0.90%. (b) The Y value for the brightness of the roughened surface is at least 10.0 and no greater than 15.5. (c) The Ssk of the roughened surface, measured using a laser microscope, is at least 0.30 and no greater than 0.80.
A Doherty amplifier circuit includes a 90° hybrid coupler that includes an input terminal receiving a first input signal, a first output terminal outputting a first output signal on the basis of the first input signal, a second output terminal outputting, on the basis of the first input signal, a second output signal different in phase by 90° from the first output signal, and an isolation terminal whose isolation from the input terminal is ensured; a carrier amplifier that amplifies the first output signal to output a first amplified signal; and a peak amplifier that amplifies the second output signal to output a second amplified signal. The isolation terminal is a terminal which receives a second harmonic in the second harmonic frequency band of the first input signal.
A power amplification system includes: a first power amplifier configured to amplify a first radio-frequency signal; a second power amplifier configured to amplify a second radio-frequency signal; a switched-capacitor circuit configured to generate multiple discrete voltages based on a regulated voltage supplied from a pre-regulator; an output switch circuit configured to selectively output at least one of the multiple discrete voltages as a first power supply of the first power amplifier; and a digital predistortion circuit configured to predistort the first and second radio-frequency signals. The pre-regulator circuit is configured to convert an input voltage to the regulated voltage. The regulated voltage is provided as a second power supply of the second power amplifier without using the switched-capacitor circuit. The digital predistortion circuit predistorts the first radio-frequency signal by using a first mathematical-expression model for digital predistortion. The first mathematical-expression model is not applied on the second radio-frequency signal.
A power amplification system includes: a first power amplifier; an output switch circuit configured to output a power supply to the first power amplifier; a filter circuit that is to connect to a first path in a switchable manner, the first path providing the power supply from the output switch circuit to the first power amplifier; and a digital predistortion circuit configured to generate distortions in a first input signal of the first power amplifier. When the filter circuit is not connected to the first path, the digital predistortion circuit generates the distortions by using a first mathematical-expression model with the first parameter set. When the filter circuit is connected to the first path, the digital predistortion circuit generates the distortions by using a second mathematical-expression model with the second parameter set. The first and second parameter sets are at least partially different from each other.
A biological information measurement device in which a biological signal with a harmonic structure is input to a variable band-pass filter. A first signal, which has passed through the variable band-pass filter, is input to a frequency calculator. The frequency calculator outputs a second signal including information related to a frequency of the input first signal. A biological information acquirer acquires biological information from the second signal. A band-pass filter controller shifts a passband of the variable band-pass filter based on the information related to the frequency included in the second signal.
A soil modifier that includes: base particles that are particles of SiO2 having a particle size of 100 nm or more, and the central particle size of the base particles is 120 nm to 800 nm in a particle size distribution of the SiO2 particles. A culture soil includes soil and the base particles.
C09K 17/04 - Soil-conditioning materials or soil-stabilising materials containing inorganic compounds only applied in a physical form other than a solution or a grout, e.g. as granules or gases
A01G 24/12 - Growth substratesCulture mediaApparatus or methods therefor based on or containing inorganic material containing soil minerals
A01G 24/42 - Growth substratesCulture mediaApparatus or methods therefor characterised by their structure of granular or aggregated structure
72.
POWER AMPLIFIER CIRCUIT AND POWER AMPLIFICATION DEVICE
A power amplifier circuit includes a first coupler that splits a first signal into a second signal and a third signal that is out of phase with the second signal; a carrier amplifier that amplifies the second signal to output a first amplified signal; a peak amplifier that amplifies the third signal to output a second amplified signal; a second coupler that generates a third amplified signal by combining the first amplified signal and the second amplified signal; and a first bias circuit that switches the bias point of the peak amplifier between a first bias point and a second bias point higher than the first bias point.
An acoustic wave device includes an insulating layer including a recess, a piezoelectric layer on the insulating layer and over the recess to define a cavity, a first excitation electrode on a first surface of the piezoelectric layer opposite to the cavity, a second excitation electrode on a second surface of the piezoelectric layer and within the cavity, a dielectric layer on the first excitation electrode, and a first frame on the second excitation electrode and within the cavity.
A conductive paste for forming inner electrodes of a multilayer ceramic capacitor includes a conductive metal powder, a ceramic powder, an organic solvent, and an organic binder. At least a portion of the ceramic powder includes a powder including an ABO3-type oxide with a specified ionic radius. A ratio of a six-coordinate ionic radius of an A-site element in ABO3 to a six-coordinate ionic radius of a metal included in the conductive metal powder is about 0.97 or greater and about 1.02 or less.
A multilayer ceramic capacitor includes a multilayer body including stacked dielectric layers, first and second internal electrode layers respectively exposed at first and second end surfaces and a second internal electrode layer, and first and second external electrodes. The multilayer body includes an internal layer portion in which the first and second internal electrode layers are opposed. The dielectric layers include voids segregated in the dielectric layers. The dielectric layers include void-containing dielectric layers which are different from each other in an area occupancy of voids in respective cross-sections of the dielectric layers.
A multilayer ceramic capacitor includes an inner-layer portion including first and second inner electrode layers alternately stacked with dielectric layers, a first primary surface, a second primary surface opposite the first primary surface, a first side surface, a second side surface opposite the first side surface, a first end surface, and a second end surface opposite the first end surface, a first outer-layer portion covering the first primary surface in the stacking direction, a second outer-layer portion covering the second primary surface in the stacking direction, and a pair of outer end surface electrodes on the first and second end surfaces. Each of the ceramic dielectrics of the inner-layer portion, the first outer-layer portion, and the second outer-layer portion includes dielectric particles with a void therein. Intragranular void densities in the ceramic dielectric in the inner-layer portion (Ninner), and in the first and second portions (Nouter) satisfy Nouter
A multilayer ceramic capacitor includes a laminate, first and second internal electrode layers on dielectric layers, and first and second external electrodes on first and second end surfaces. The first and second external electrodes include a conductive resin layer including an underlayer electrode layer including a metal component and a thermosetting resin and a metal filler on the underlayer electrode layer, a Ni plating layer on the conductive resin layer, and a Sn plating layer on the Ni plating layer. Ni is provided on at least a portion of a surface of the metal filler, as a component of the Ni plating layer.
A module includes a first floor portion and a second floor portion in contact with an upper side of the first floor portion. Each of the first and second floor portions include a component group and a sealing resin sealing the component group. An interconnection is electrically connected to each component of the second component group on a lower surface of the second floor portion. A conductor pillar is in the first floor portion and extends through the first sealing resin in a thickness direction to electrically connect a lower surface of the first floor portion and the lower surface of the second floor portion. A ground conductor pattern covers at least a part of a 10 reference region. The ground conductor pattern is electrically isolated from the interconnection. The first sealing resin and the second sealing resin are in direct contact with each other in at least any part.
H01L 23/552 - Protection against radiation, e.g. light
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
79.
HIGH FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS
A high frequency circuit (1) comprises a 90° hybrid circuit (10) including an input terminal (10a) and output terminals (10b and 10c), a synthesis circuit (30) including input terminals (30b and 30c) and an output terminal (30a), power amplifiers (21 and 22), a switch (43) including a common terminal (43a) and selection terminals (43b and 43c), and a clamp circuit (65). An input end of the power amplifier (21) is connected to the output terminal (10b), an output end of the power amplifier (21) is connected to the input terminal (30b) and the selection terminal (43c), an input end of the power amplifier (22) is connected to the output terminal (10c), an output end of the power amplifier (22) is connected to the input terminal (30c) and the selection terminal (43b), and the clamp circuit (65) is connected between the common terminal (43a) and the ground.
A Doherty amplification circuit (10) to which a D-ET mode or an SPT mode is applied comprises: a power amplifier (11) used as a carrier amplifier; a power amplifier (12) used as a peak amplifier; and a synthesizer (22) including an input terminal (221) connected to an output terminal of the power amplifier (11), an input terminal (222) connected to an output terminal of the power amplifier (12), and an output terminal (223). The size of the power amplifier (12) is smaller than the size of the power amplifier (11).
The present invention provides a piezoelectric vibrator, the frequency precision of which is adjustable after encapsulation. A piezoelectric vibrator (1) comprises: a piezoelectric vibration element (10) having a vibrating part (110) and excitation electrodes (14a, 14b) respectively provided on upper and lower surfaces of the vibrating part (110); an upper substrate layer (20) provided on the upper-surface side of the piezoelectric vibration element (10); a lower substrate layer (30) provided on the lower-surface side of the piezoelectric vibration element (10); first resin bonding materials (X1, X2) provided between the upper substrate layer (20) and the lower substrate layer (30), and along an outer periphery in a plan view; and a first protective film (F1) having light-shielding properties against irradiating light (R) of a prescribed wavelength for cleaning the excitation electrodes (14a, 14b), said film being provided on the upper substrate layer (20) and/or the lower substrate layer (30) in an area overlapping the first resin bonding materials (X1, X2) in a plan view.
A battery 1 includes: an electrode assembly 10 having a positive electrode 11a and a negative electrode 11b the potential of which is different from the positive electrode 11a; an exterior member 40 that includes a first main surface 41a having a first opening 41b and a second main surface 42a having a second opening 42b, and that houses the electrode assembly 10; and a first conductor 20 and a second conductor 30 electrically connected to the positive electrode 11a inside the exterior member 40. The exterior member 40 is electrically connected to the negative electrode 11b. The first main surface 41a and the second main surface 42a are opposite to each other across the electrode assembly 10. The first conductor 20 has a first exposed part 21 exposed from the first opening 41b. The second conductor 30 has a second exposed part 31 exposed from the second opening 42b.
This elastic wave device comprises a mounting substrate, an elastic wave element that is mounted on the mounting substrate, and a resin member that is provided to at least a portion of a surface of the elastic wave element that faces the mounting substrate. The elastic wave element is provided with a piezoelectric layer that has a first main surface and a second main surface on opposite sides from each other, an electrode that is provided to at least one of the first main surface and the second main surface of the piezoelectric layer, and a support member that is provided to the second-main-surface side of the piezoelectric layer and is provided with a cavity on the second-main-surface-side of the piezoelectric layer. The piezoelectric layer has an opening that is provided in a region overlapping an outer edge of the cavity. The support member has a side portion and a bottom portion that form the cavity, and has a plurality of protrusions that are provided to at least one of the side portion and the bottom portion in a region overlapping the opening of the piezoelectric layer.
H03H 9/25 - Constructional features of resonators using surface acoustic waves
H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
This capacitor element 1 comprises: a capacitor part 10 which includes a positive electrode plate 11 that has a porous part 11B on at least one main surface of a core part 11A, a dielectric layer 13 that is provided on the surface of the porous part 11B, and a negative electrode layer 12 that is provided on the surface of the dielectric layer 13; and a sealing layer 20 that is provided so as to cover at least one main surface of the capacitor part 10. The surface roughness R1 of a first portion on a first side surface of the porous part 11B exposed at a side edge end of the capacitor part 10 is higher than the surface roughness R2 of a second portion on a second side surface of the porous part 11B exposed in a recess that is provided on a main surface of the capacitor part 10.
H01G 9/28 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
An elastic wave device (1) comprises: a support member that includes a support substrate (34); a piezoelectric layer (31) that is disposed on the support member and has main surfaces (31a and 31b) facing each other; an IDT electrode (10) that is disposed on the main surface (31a); an IDT electrode (20) that is disposed on the main surface (31b); and a dielectric film (41) that covers at least a portion of the IDT electrode (10). The IDT electrode (20) is covered by the support member, and when the main surfaces (31a and 31b) are seen in plan view, a first electrode finger among a plurality of electrode fingers included in the IDT electrode (10) at least partially overlaps a second electrode finger among a plurality of electrode fingers included in the IDT electrode (20). The electrode finger duty of the second electrode finger is less than the electrode finger duty of the first electrode finger.
An electronic component is provided that includes a substrate having a top side and a bottom side. The substrate defines a horizontal xy-plane and a vertical z-direction that is perpendicular to the xy-plane. An ASIC die is provided having a top side and a bottom side that is attached to the top side of the substrate. Moreover, a MEMS die is provided that includes a top part and a bottom part, the bottom part including at least one horizontal surface and at least one non-horizontal surface. An adhesive layer extends from the top side of the ASIC die to the horizontal surface and to a portion of the non-horizontal surface of the bottom part of the MEMS die. A bonding pad is attached to the top side of the ASIC die adjacent to the adhesive layer. An electrical connection extends from the bonding pad to the MEMS die.
A vibration device that includes: an internal vibration body constructed to amplify vibration; a piezoelectric element connected to a first end of the internal vibration body in a first direction and constructed to generate vibration; a light transmissive body connected to a second end of the internal vibration body in the first direction and has an optical axis extending in the first direction; and an external vibration body including a first connection portion connected to the light transmissive body and an attenuator portion that extends in a second direction intersecting the first direction from the first connection portion toward an outside of the light transmissive body and constructed to attenuate vibration, wherein the attenuator portion has non-axisymmetry with respect to the optical axis.
G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
B08B 7/02 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
A secondary battery is provided and includes a positive electrode, a negative electrode, and an electrolytic solution. The positive electrode includes a positive electrode active material layer. The positive electrode active material layer includes positive electrode active material particles. The positive electrode active material particles each include a center part and a covering part. The center part includes a lithium composite oxide. The covering part is provided on a surface of the center part. The lithium composite oxide has a layered rock-salt crystal structure, and includes lithium, nickel, and another element as constituent elements. Where a sum of a content of nickel in the lithium composite oxide and a content of the other element in the lithium composite oxide is taken as 100 parts by mole, the content of nickel is greater than or equal to 80 parts by mole and less than or equal to 100 parts by mole. Based on an analysis of the positive electrode active material layer in a depth direction by time-of-flight secondary ion mass spectrometry, a first negative secondary ion derived from NiO2− and a second negative secondary ion derived from LiBO2F− are detectable, and a first depth profile and a second depth profile are acquirable.
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 4/131 - Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
A transducer that includes: a base portion; a plurality of beam portions each having a fixed end portion connected to the base portion and a crest portion located close to a center of the base portion on a side thereof opposite to the fixed end portion, the plurality of beam portions each extending from the fixed end portion toward the crest portion; and a connection portion that connects a pair of beam portions of the plurality of beam portions to each other, the pair of beam portions being adjacent to each other in a peripheral direction of the base portion, wherein the connection portion includes: at least one bent portion, and at least one dividing slit in the connection portion, the at least one dividing slit dividing the connection portion such that the connection portion is partially branched and rejoined.
An acoustic wave device includes an insulating layer and a piezoelectric layer defining a cavity, a first excitation electrode on a first surface of the piezoelectric layer opposite to the cavity, a second excitation electrode on a second surface of piezoelectric layer and within the cavity, a wiring electrode on the piezoelectric layer and connected to the first excitation electrode, a lid, a conductive wall extending between a first portion of the wiring electrode and the lid, and a sealing frame extending between a second portion of the wiring electrode and the lid. A first width of a first portion of the sealing frame is larger than a second width of a second portion of the sealing frame. A third width of the second portion of the wiring electrode is smaller than the first width and is larger than the second width.
A multilayer ceramic capacitor includes a multilayer body including ceramic dielectric layers stacked together and inner electrodes extending along interfaces between the dielectric layers. The inner electrodes include a conductive component including X and a ceramic component including XTiO3, where X represents a conductive metal or an alloy including a conductive metal.
An antenna component includes a radiator located on a negative side of a Z-axis relative to a first radiating conductor layer and connected to the first radiating conductor layer. A first ground conductor layer overlaps with the first radiating conductor layer and the radiator as viewed in a negative direction of the Z-axis and is located on the negative side of the Z-axis relative to the first radiating conductor layer. A composite dielectric constant of a first region is higher than a composite dielectric constant of a second region.
A multilayer substrate includes a first insulator layer including a first through-hole penetrating the first insulator layer along a Z-axis, a second insulator layer including a second through-hole penetrating the second insulator layer along the Z-axis. The second through-hole overlaps the first through-hole when viewed downward. When viewed in a positive direction of the Z-axis, an area of an end portion of the second through-hole on a positive side of the Z-axis is larger than an area of an end portion of the first through-hole on a negative side of the Z-axis. A first interlayer connection conductor extends along the Z-axis inside the first through-hole and the second through-hole and electrically connects first and second conductor layers. A space exists between a boundary of the first insulator layer and the second insulator layer and the first interlayer connection conductor.
Circuits and methods for a radio frequency amplifier, such as an LNA, that include a wideband coupled input impedance matching network. One embodiment includes a first inductor coupled between a first terminal and a first node, the first terminal couplable to a degeneration terminal of an amplifier core; a second inductor coupled between a second terminal and either the first node or a second node, the second terminal couplable to an input terminal of the amplifier core; a third inductor coupled between the first node and a third terminal, the third terminal couplable to a reference potential; and, in a variant embodiment, a fourth inductor coupled between the second node and a fourth terminal, the fourth terminal couplable to the reference potential; wherein the first inductor and the second inductor are mutually coupled. Some embodiments allow multiple modes to allow tradeoffs of gain versus linearity and NF characteristics.
A multilayer ceramic capacitor includes an inner-layer portion, first and second outer-layer portions, and first and second side margin portions, and outer electrodes on the first and second end surfaces. Each of ceramic dielectrics of the inner-layer portion, the first and second outer-layer portions, and the first and second side margin portions includes multiple dielectric particles with a void therein. An intragranular void density in the ceramic dielectric in the inner-layer portion (Ninner), intragranular void densities in the ceramic dielectrics in the first outer-layer portion and the second outer-layer portion (Nouter), and intragranular void densities in the ceramic dielectrics in the first side margin portion and the second side margin portion (Nside) satisfy Nouter
Provided is a multilayer ceramic capacitor in which inhibition of connection between a base electrode layer and an internal electrode layer is suppressed and deterioration in moisture resistance is also suppressed. In this multilayer ceramic capacitor (1), the base electrode layer contains a second metal different from a first metal as a main component, the base electrode layer has a first region (71) and a second region (72) from a laminate (2) side, the thickness of the first region (71) in the length direction L is 1.5 times or more the distance between internal electrode layers, the particle diameter of the second metal in the first region (71) is 80% or more and 120% or less of the distance between the internal electrode layers, the content of a glass 90 in the first region (71) is 10% or less, and the content of the glass (90) in the second region (72) is 20% or more and 50% or less.
Provided is a multilayer inductor in which a concentration of current density is mitigated and heat generation is reduced. A multilayer inductor according to the present disclosure comprises an element body 10 and an external electrode 20 provided to a mounting surface of the element body 10, wherein: the element body 10 is obtained by layering each of a coil conductor part CL, a magnetic part ML that is disposed around the coil conductor part CL and is configured by joining a plurality of metal magnetic particles, and through hole conductor parts TL that electrically connect each of the external electrode 20 and one end or the other end of the coil conductor part CL; a through hole conductor obtained by layering the through hole conductor parts TL comprises a coil-side through hole conductor part TL1 that is in contact with the coil conductor part CL and an external electrode-side through hole conductor part TL2 that is in contact with the external electrode 20; and the coil-side through hole conductor part TL1 projects further toward the inside of the element body 10 relative to the external electrode-side through hole conductor part TL2.
This elastic wave device comprises: a piezoelectric layer having a first main surface and a second main surface that face each other; an electrode provided to at least one of the first main surface and the second main surface of the piezoelectric layer; and a support member provided to the second main surface side of the piezoelectric layer and provided with a cavity part on the second main surface side of the piezoelectric layer. A membrane part that includes at least a portion of the piezoelectric layer is formed in a region that overlaps the cavity part. The support member has a first portion and a modified second portion. The second portion is disposed at a position closer to the cavity part as compared with the first portion. The membrane part has a third portion and a modified fourth portion. The fourth portion is disposed at a position closer to the cavity part as compared with the third portion.
H03H 9/25 - Constructional features of resonators using surface acoustic waves
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 3/08 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
This compression resin sealing and molding device is for molding a sealing resin layer so as to partially cover a first surface (10a) of a substrate (10) while sealing a component (13) disposed on the first surface (10a) of the substrate (10) having the first surface (10a) and a second surface (10b) that constitute the front and back of the substrate. The compression resin sealing and molding device comprises: a lower mold that faces the first surface (10a); an upper mold (5) that abuts the second surface (10b); and a pressure sensor (8). The lower mold comprises: a lower mold center part (32) having a lower mold center upper surface corresponding to the lower surface of the sealing resin layer; a stripper part (33) arranged so as to surround the lower mold center part (32); and a passage closing member (35). A notch is provided in a part of the inner periphery of the stripper part (33), and the passage closing member (35) is disposed inside the notch. A cavity for melting and molding a resin material is formed by an inner peripheral side surface of the stripper part (33), a side surface of the passage closing member (35) on the side opposite from the stripper part (33), and the lower mold center upper surface. The stripper part (33) has, on the outside of the cavity, a pocket section that is a recess for accommodating the resin material flowing out from the cavity. The passage closing member (35) can assume, by being lowered, a first state in which outflow of the resin material from the cavity to the pocket section is allowed and, by being lifted, a second state in which outflow of the resin material from the cavity to the pocket section is hindered. The passage closing member (35) has a contact surface facing upward at a constant height. The pressure sensor (8) is disposed on at least one of an upper mold (5) and the lower mold so that the internal pressure of the cavity can be measured.
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
