A circuit module includes a circuit board that includes a circuit board body and a conductor, the circuit board body including a first upper end surface and a first lower end surface situated side by side in an upward direction and a downward direction, the conductor being provided at the first upper end surface, an insulator at the first upper end surface, a first electrode including a second upper end surface, a second lower end surface, and a first side surface, and electrically connected to the conductor, the second upper end surface and the second lower end surface being situated side by side in the upward direction and the downward direction, the first side surface being connected to the second upper end surface, and an electronic component including an electronic component body and a second electrode and located above the insulator. The second upper end surface is covered by the insulator, and the second electrode is electrically connected to the first electrode as a result of at least a portion of the first side surface being exposed from the insulator.
Bonding strength between a core and a top plate is increased in a coil component. Surface roughnesses of a top surface of a flange portion of the core and a lower main surface of the top plate are different. For example, the surface roughness of the lower main surface is smaller than the surface roughness of the top surface. A protrusion protruding from the lower main surface having smaller surface roughness and in contact with the top surface of the flange portion of the core is in a region where the lower main surface of the top plate and the top surface of the flange portion of the core face each other with an adhesive interposed therebetween. The protrusion can increase a surface area of a bonding surface of the top plate having smaller surface roughness, and provide an anchor effect of the adhesive on the top plate.
A secondary battery evaluation system includes a battery pack including a plurality of secondary battery cells, a voltage detection circuit that detects a terminal-to-terminal voltage value of the battery pack, a current detection circuit that detects a current value of the battery pack, a test secondary battery including at least one battery cell manufactured from the same material as the secondary battery cell, and a test power supply circuit that controls charge and discharge of the test secondary battery. The test power supply circuit sets a test charge voltage value and a test charge current value for the test secondary battery based on a terminal-to-terminal voltage value and a current value during charging of the battery pack, charges the test secondary battery with the test charge voltage value and the test charge current value, sets a test discharge voltage value and a test discharge current value for the test secondary battery based on a terminal-to-terminal voltage value and a current value during discharging of the battery pack, and discharges the test secondary battery with the test discharge voltage value and the test discharge current value to perform a simulation of charge and discharge of the battery pack. The test power supply circuit acquires SOC-OCV data of the test secondary battery by performing charge and discharge of the test secondary battery independently of driving of the battery pack at the time of measurement of SOC-OCV data.
G01R 31/374 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC] with means for correcting the measurement for temperature or ageing
B60L 50/64 - Constructional details of batteries specially adapted for electric vehicles
B60L 58/16 - Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling batteries responding to battery ageing, e.g. to the number of charging cycles or the state of health [SoH]
G01R 31/3842 - Arrangements for monitoring battery or accumulator variables, e.g. SoC combining voltage and current measurements
H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
A filter device is provided that includes a first chip comprising a first IDT of a first solidly-mounted resonator on a surface of a first piezoelectric layer. The IDT including a first plurality of interleaved fingers having a first thickness. A first acoustic reflector is sandwiched between the first piezoelectric layer and a first base. The filter device includes a second chip having a second IDT of a second solidly-mounted resonator on a surface of a second piezoelectric layer. The second IDT includes a second plurality of interleaved fingers having a second thickness that is different from the first thickness. A second acoustic reflector is sandwiched between the second piezoelectric layer and a second base. An electrical connection is provided between the first IDT and the second IDT.
A semiconductor composite device is provided that includes a voltage regulator including a plurality of active elements and a plurality of passive elements and arranged with a plurality of channels; a load including a semiconductor element and that is supplied with a direct-current voltage and regulated by the voltage regulator; and a wiring board electrically connected to the plurality of active elements, the plurality of passive elements, and the load. The load is disposed on a first mounting surface of the wiring board, and the first and second inductors are disposed on a second mounting surface of the wiring board that is opposite the first mounting surface. The first inductor is electrically connected to the wiring board via a first capacitor, and the second inductor is electrically connected to the wiring board via a second capacitor.
A MEMS device that includes: a first cover; a second cover defining a space between the second cover and the first cover; a first substrate opposite to the first cover in the space between the second cover and the first cover, the first substrate comprising single-crystal silicon; a second substrate opposite to the second cover in the space between the second cover and the first cover, the second substrate comprising single-crystal silicon, the second substrate including a movable portion, the single-crystal silicon of the second substrate being joined to the single-crystal silicon of the first substrate; and an electrostatic capacity portion between at least one of (1) the second cover and the second substrate or (2) the first substrate and the second substrate, the electrostatic capacity portion being configured such that electrostatic capacity changes depending on a distance between the movable portion and the second cover or the first substrate.
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions
A power storage device according to one embodiment of the present disclosure comprises first and second battery packs and first and second power terminals. Each of the first and second battery packs has a first power node that is led to the first power terminal, a second power node that is led to the second power terminal, a storage battery that is provided on a power path that connects the first power node and the second power node, first and second field effect transistors, and a control circuit that can monitor the state of the storage battery and control the operation of the first and second field effect transistors. When the battery pack that is to output power is switched from the first battery pack to the second battery pack, the control circuits of the first battery pack and the second battery pack can set an operation state to a first state, a second state, and a third state in the given order.
An electronic component 1 comprises: a plate-like electronic component body 10 that extends in the plane direction orthogonal to the thickness direction; a sealing layer 20 that contains an insulating resin and that is provided so as to cover at least one main surface of the electronic component body 10; and a detachment prevention layer 30 that contains an insulating resin and that is provided to at least a partial area between the electronic component body 10 and the sealing layer 20. The storage modulus of the detachment prevention layer 30 is lower than the storage modulus of the sealing layer 20 in a temperature range of 25-265°C.
This piezoelectric vibration element (10) comprises: a piezoelectric piece (11) having a first main surface (11A) and a second main surface (11B) opposing each other; a first excitation electrode (14a) provided on the first main surface (11A); and a first extraction electrode (15a) connected to the first excitation electrode (14a). The average thickness (Tw) of the first extraction electrode (15a) on the first main surface (11A) is greater than the average thickness (Te) of the first extraction electrode (14a) on the first main surface (11A). At least one first opening (h2) is provided in at least one among the first excitation electrode (14a) and the first extraction electrode (15a), and the at least one opening (h2) is provided within a distance less than or equal to four times the thickness of the piezoelectric piece (11) from a first boundary (B) between the first excitation electrode (14a) and the first extraction electrode (15a).
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
A module 1 comprises: a substrate 10 having a first main surface 10a and a second main surface 10b facing each other in a thickness direction; a heat-generating element 20 disposed on the first main surface 10a of the substrate 10 and having a plurality of GND electrodes 21 on the first main surface 10a side; a plurality of heat-dissipation members 30 disposed on the second main surface 10b of the substrate 10; a connection conductor 40 penetrating the substrate 10 in the thickness direction and connecting the GND electrodes 21 of the heat-generating element 20 and the heat-dissipation members 30; and signal terminals 50 disposed on the second main surface 10b of the substrate 10 and connected to a signal line inside the substrate 10, the module being characterized in that the shape of the signal terminals 50 as viewed from the thickness direction is a substantially circular shape in which the dimension in the longitudinal direction and the dimension in the lateral direction are equal to each other, the plurality of signal terminals 50 are arranged at substantially equal intervals in the longitudinal direction and the lateral direction, respectively, a plurality of the heat-dissipation members 30 are connected to one of the GND electrodes 21, the number of GND electrodes 21 to which one heat-dissipation member 30 is connected is one, the number of heat-dissipation members 30 connected to each one of the GND electrode 21 is substantially the same, and the shape of the heat-dissipation members 30 when viewed from the thickness direction is substantially the same as the shape of the signal terminals 50.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
11.
ANTENNA MODULE AND COMMUNICATION DEVICE EQUIPPED WITH SAME
An antenna module (100) comprises: a dielectric substrate (125) that has a first main surface and a second main surface; a first radiation element (121) and a second radiation element (122) that are disposed on the dielectric substrate and that emit radio waves; a first ground electrode (141) that is disposed facing the first radiation element; a second ground electrode (142) that is disposed facing the second radiation element; and power supply wiring (150) that is disposed between the first ground electrode and the second main surface. In a plan view of the dielectric substrate from the first main surface or the second main surface side, the first radiation element and the first ground electrode are disposed in a first region of the dielectric substrate in which the power supply wiring is disposed, and the second radiation element and the second ground electrode are disposed in a second region of the dielectric substrate in which the power supply wiring is not disposed. The distance between the second radiation element and the second ground electrode is greater than the distance between the first radiation element and the first ground electrode.
Provided is a lithium secondary battery that improves charging/discharging characteristics. A lithium secondary battery according to the present invention comprises a positive electrode, a negative electrode, and an electrolyte solution. The electrolyte solution includes lithium ions, additional metal ions that are ions of a metal element that has a lower first ionization energy than lithium, and a fluoroalkyl ether. The concentration of the metal ions in the electrolyte solution is greater than 0 mol/L but no greater than 0.05 mol/L.
In this invention, a base mesa including a collector layer and a base layer arranged over the collector layer is disposed in a partial region of an upper surface of a substrate. An emitter mesa is disposed in a partial region of an upper surface of the base mesa. In a region of the upper surface of the base layer and on the outside of the emitter mesa in plan view, a base electrode is disposed at a distance from the emitter mesa. A region of the base layer that is farther, as seen from the emitter mesa in plan view, than at least the base electrode is an increased-resistance region containing impurities for increasing the resistance of the base layer, and an active region outside of the increased-resistance region is electrically connected to the base electrode.
The present invention improves resonance characteristics. This elastic wave device comprises: a piezoelectric layer, which has a first main surface and a second main surface on the opposite side from the first main surface, and which contains lithium niobate; an IDT electrode provided on the main-surface side of the first main surface and/or the second main surface; a dielectric layer provided on the main surface of the first main surface and/or the second main surface of the piezoelectric layer; and a support member provided on the second-main-surface side of the piezoelectric layer. The IDT electrode has a first busbar and a second bus bar that face each other, at least one first electrode finger having a base end connected to the first busbar, and at least one second electrode finger having a base end connected to the second busbar. The support member has an acoustic reflection part on the second-main-surface side. Let d be the thickness of the piezoelectric layer and p be the average of the center-to-center distance between adjacent first and second electrode fingers, in which case d/p is 0.5 or less. Let T be the total of the thickness of the piezoelectric layer and the sum of the thickness of each of the dielectric layer(s), in which case p/T is between 3.0 and 6.0, inclusive.
The present invention provides a module 1 comprising a substrate 10 which has a first main surface 10a and a second main surface 10b that face each other in the thickness direction, a heat generation element 20 which is disposed on the first main surface 10a of the substrate 10 and which has a plurality of GND electrodes 21 on the first main surface 10a side, a plurality of heat dissipation members 30 which are disposed on the second main surface 10b of the substrate 10, and connection conductors 40 which pass through the substrate 10 in the thickness direction and which connect the GND electrodes 21 and the heat dissipation members 30, said module 1 being characterized in that one or more heat dissipation members 30 are connected to one GND electrode 21, the number of GND electrodes 21 which are connected to one heat dissipation member 30 is one, and, as viewed in the thickness direction, each heat dissipation member 30 has an anisotropic shape in which the dimension thereof in the vertical direction differs from the dimension thereof in the horizontal direction.
An antenna module (100) is provided with a dielectric substrate (130), a flat plate-shaped radiating element (121), a ground electrode (GND) facing a main surface of the radiating element (121), and a flat plate electrode (151). The flat plate electrode (151) is electrically connected to the ground electrode (GND). The radiating element (121) includes a rectangular body portion (1211), and a protruding portion (1212) in a first direction from a side along a second direction of the body portion (1211). A high-frequency signal is supplied to a power supply point (SP1) offset in the first direction from the center of the radiating element (121). An end portion of the radiating element (121) in the first direction has a region (RG1) having the protruding portion (1212) and a region (RG2) not having the protruding portion (1212). When viewed in a plan view from a normal direction of the dielectric substrate (130), the flat plate electrode (151) is disposed at a position in the first direction from the region (RG2) and in the second direction from the protruding portion (1212).
Glycidyl-containing polymers and polymer compositions comprising them are described, as well as their use in electrode materials and/or as coatings for battery components. Also described are electrode materials, electrodes, electrochemical cells and batteries comprising the polymers and their uses.
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 4/08 - Metallic compounds other than hydrides and other than metallo-organic compoundsBoron halide or aluminium halide complexes with organic compounds containing oxygen of alkali metals
C08F 220/32 - Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 4/50 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 50/103 - Primary casingsJackets or wrappings characterised by their shape or physical structure prismatic or rectangular
Commissariat A L'Energie Atomique Et Aux Energies Alternatives (France)
Inventor
Buffle, Larry
Sallaz, Valentin
Voiron, Frédéric
Salvador, Violaine
Oukassi, Sami
Campo, Alain
Abstract
A method of manufacturing an integrated electrical device comprising an energy storage component, that includes: providing a support comprising a porous region; forming an insulating layer having an opening delimiting a portion of the porous region; forming a bottom electrode layer; etching the bottom electrode layer such that the bottom electrode layer is removed on the insulating layer and on the top surface of the portion of the porous region, such that there remains a bottom electrode layer inside pores of the portion of the porous region; forming an intermediate layer comprising a dielectric layer or an ionic conductor; and forming a top electrode layer on the intermediate layer.
H10D 1/68 - Capacitors having no potential barriers
19.
BIOLOGICAL SIGNAL MEASUREMENT SYSTEM, BIOLOGICAL SIGNAL MEASUREMENT APPARATUS, DATA ANALYSIS APPARATUS, BIOLOGICAL SIGNAL PROCESSING METHOD, BIOLOGICAL SIGNAL MEASUREMENT PROGRAM, DATA ANALYSIS PROGRAM
A biological signal measurement system includes a biological signal measurement apparatus and a data analysis apparatus. The data analysis apparatus generates a stimulation signal and wirelessly transmits the stimulation signal to the measurement apparatus. The measurement apparatus measures a biological signal of a subject responding to the stimulation. The measurement apparatus acquires a trigger signal corresponding to the stimulation signal, and utilizes a synchronous sampling circuit to synchronize and sample the trigger signal and the biological signal, generating a synchronously sampled data set. The measurement apparatus transmits the synchronously sampled data set to the data analysis apparatus. The data processing apparatus performs data processing on the received biological signal and trigger signal within the synchronously sampled data set to time-align the biological signal with the trigger signal.
An antenna module includes a dielectric substrate, first to fourth radiating elements disposed in a line at the dielectric substrate, and corresponding first to fourth phase shifting circuits. Each phase shifting circuit adjusts a phase of a high frequency signal to be supplied to a corresponding radiating element and includes N number of phase shifters connected in series. For a minimum resolution R, representing a minimum amount of variation of a phase difference between adjacent radiating elements, a maximum phase difference between the adjacent radiating elements is equal to R×2(N−1). A maximum phase difference between the first and fourth phase shifting circuits is equal to R×2(N−1)×3. Phases in each of the first and fourth phase shifting circuits are settable at increments of R×3. Phases in each of the second and third phase shifting circuits are settable at increments of R.
H01Q 3/30 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
21.
CAPACITOR ELEMENT AND METHOD FOR MANUFACTURING CAPACITOR ELEMENT
A capacitor element 1 includes a capacitor part 10 including an anode plate 11 having a porous layer 11B on at least one main surface of a core part 11A, a dielectric layer 13 disposed on a surface of the porous layer 11B, a cathode layer 12 disposed on a surface of the dielectric layer 13, and an insulating layer 25. The cathode layer 12 includes a solid electrolyte layer 12A disposed on a surface of the dielectric layer 13 inside the porous layer 11B, and a conductor layer 12B disposed on an outer surface 11Ba of the porous layer 11B and electrically connected to the solid electrolyte layer 12A. The capacitor part 10 includes an effective region RG1 where the anode plate 11 and the cathode layer 12 are opposed to each other via the dielectric layer 13, and a non-effective region RG2 which is a region other than the effective region RG1 and in which the insulating layer 25 is disposed. When a cross section orthogonal to the thickness direction and passing through the vicinity of the outer surface 11Ba of the porous layer 11B is viewed, then between two adjacent insulating layer portions 26, distribution of the material constituting the solid electrolyte layer 12A is concentrated in a first linear region 73a adjacent to one insulating layer portion 26a, a second linear region 73b adjacent to the other insulating layer portion 26b, and a third linear region 73c and a fourth linear region 73d located between the first linear region 73a and the second linear region 73b.
A cavity resonance power transmission device 100 comprises: a structure 10 in which the entire internal space is surrounded by an electromagnetic-wave-shielding member having electrical conductivity; a substantially cylindrical first protrusion 15 which is provided in the internal space of the structure 10; and at least one power transmitter 20 which wirelessly supplies power to a product 31 via a power receiver 30 disposed in the internal space of the structure 10. The structure 10 has a bottom part 10a, a top part 10b facing the bottom part 10a, and a side part 10c connecting outer edges of the bottom part 10a and the top part 10b. The first protrusion 15 has electrical conductivity and extends from a central portion of the bottom part 10a toward the top part 10b. Wireless power supply by the power transmitter 20 is performed in a resonance mode in which an electric field or a magnetic field rotates about the central axis CA of the first protrusion 15 outside the first protrusion 15.
A cavity resonance power transmission device 100 comprises: a structure 10 in which an entire internal space is surrounded by an electromagnetic wave shielding member having conductivity; and a power transmitter 20 that wirelessly supplies power to a product via a power receiver 30 disposed in the internal space of the structure 10. The device is configured such that: the structure 10 is a housing 11 having a bottom part 11a, a top part 11b facing the bottom part 11a, and a lateral part 11c that connects outer edges of the bottom part 11a and the top part 11b; the housing 11 has a substantially cylindrical shape or further includes a substantially cylindrical conductive part 16 extending from the inner surface of the bottom part 11a of the housing 11 toward the top part 11b; and wireless power supply by the power transmitter 20 is performed in a resonance mode in which an electric field or a magnetic field rotates about the central axis CA of the housing 11 or the central axis CA of the conductive part 16 inside the housing 11 or the conductive part 16.
Provided is a multilayer ceramic capacitor in which the possibility of tombstoning and deterioration of insulation resistance is reduced. A multilayer ceramic capacitor 1 comprises: a layered body 2 that has a first surface A1 and a second surface A2 on opposite sides from each other in a stacking direction T, a third surface C1 and a fourth surface C2 on opposite sides from each other in a first direction L, and a fifth surface B1 and a sixth surface B2 on opposite sides from each other in a second direction W; a first external electrode 3A that is positioned on the third, first, second, fifth, and sixth surfaces; and a second external electrode 3B that is positioned on the fourth, first, second, fifth, and sixth surfaces. The dimension in the first direction is 0.15–0.17 mm, the dimension in the second direction is 0.075–0.085 mm, and the dimension in the stacking direction is 0.05–0.10 mm or less. When a value that is obtained by adding a dimension e11 in the first direction of the first external electrode and a dimension e12 in the first direction of the second external electrode at a second direction position where the distance in the first direction between the first external electrode and the second external electrode becomes a minimum distance g1 on the first surface side, and dividing the total of said dimensions by 2, is defined as e1, the following relationship is satisfied: 0.31 ≤ g1/e1 ≤ 2.00.
Provided is a sputtering stage comprising at least three side walls arranged in a circumferential direction along an annular track. The at least three side walls include a first side wall and two second side walls disposed on both sides of the first side wall so as to be adjacent to the first side wall. Each of the first side wall and the second side walls is provided with a pair of magnets disposed to face each other in the central axis direction of the annular track. The pair of magnets disposed on the first side wall and the pair of magnets disposed on the second side walls are disposed side by side along the circumferential direction. The first side wall is provided with a holding portion positioned between the pair of magnets. The holding portion is configured to hold an object to be processed.
In this ethyl cellulose derivative, some of hydroxy groups of ethyl cellulose are substituted with one or more groups selected from an acetyl group, a propionyl group, and a butyryl group. A value obtained by dividing the Young's modulus MPa of the ethyl cellulose derivative by the specific surface area m2/g is 50.0 or less.
This thermally conductive composition comprises a cellulose derivative in which at least some hydroxy groups of alkyl cellulose are independently substituted with a group selected from an acryloyl group and a methacryloyl group, and at least some other hydroxy groups of the alkyl cellulose are independently substituted with a group selected from a cycloalkane group and an aryl group.
This switching power supply module is configured using a plurality of power conversion circuits each including a power inductor and a power semiconductor package. The switching power supply module comprises: a first circuit board having a first surface and a second surface; and a second circuit board having a third surface and a fourth surface. The second circuit board is mounted on the first surface of the first circuit board such that the third surface and the fourth surface are orthogonal to the first surface. The power semiconductor package comprises a power supply input terminal, a switching output terminal, a ground terminal, and a switching control signal input terminal to which a control signal is input. The power inductor comprises a first inductor terminal connected to the power semiconductor package, and a second inductor terminal connected to an output terminal of the switching power supply module. The power semiconductor package is mounted on the third surface. The first inductor terminal is electrically connected to the fourth surface, and the second inductor terminal is mounted on the first surface. The switching output terminal is located at a position overlapping the first inductor terminal, when viewed in a direction orthogonal to the third surface and the fourth surface, and is electrically connected over a short distance to the first inductor terminal via a via conductor inside the second circuit board. The power supply input terminal is electrically connected over a short distance to a module input terminal on the second surface via a first current path formed in the second circuit board and the first circuit board. The ground terminal is electrically connected over a short distance to a module-input-side ground terminal on the second surface via a second current path formed in the second circuit board and the first circuit board. The ground terminal is electrically connected over a short distance to a module-output-side ground terminal on the second surface via a third current path formed in the second circuit board and the first circuit board. The impedance of the second current path is greater than the impedance of the third current path. The switching control signal input terminal is electrically connected to a module control signal input terminal on the second surface via a control signal transmission path formed in the second circuit board and the first circuit board. The control signal transmission path is disposed so as to avoid the first current path, the second current path and the third current path.
H02M 3/155 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
A filter circuit (1) comprises: a first terminal (P1) and a second terminal (P2) that are input/output terminals for a high-frequency signal to be filtered; a third terminal (P3) for connection to a reference potential; and a first inductor, a second inductor, and a capacitor. The first inductor and the second inductor are connected in series between the first terminal and the second terminal in a state in which inductive coupling in the forward direction is possible. The capacitor is connected between the first terminal and the second terminal. A connection node of the first inductor and the second inductor is connected to the third terminal. The first terminal, the second terminal, the third terminal, the first inductor, the second inductor, and the capacitor are configured from electrode patterns formed on a substrate (90) where a plurality of insulator layers are stacked. A first inductor electrode pattern forming the first inductor and a second inductor electrode pattern forming the second inductor have parallel portions that run in parallel when viewed in the stacking direction. The filter circuit (1) comprises an auxiliary electrode (60) that overlaps an electrode non-formation region (RE12) between the first inductor electrode pattern and the second inductor electrode pattern in the parallel portion when viewed in the stacking direction.
A human body tracking device and a human body tracking method capable of improving the accuracy in tracking of a human body are implemented. The device includes a transmitter/receiver that transmits a radio wave and receives a reflected wave of the transmitted radio wave, and a processor that estimates a location of a human body on the basis of an intermediate frequency (IF) signal output from the transmitter/receiver. The processor is configured to execute a first detection process that detects coordinates of a moving object as first coordinates, a second detection process that detects coordinates of at least the human body in a stationary state as second coordinates, and a tracking process that tracks the human body on the basis of the first coordinates and the second coordinates.
G01S 13/72 - Radar-tracking systemsAnalogous systems for two-dimensional tracking, e.g. combination of angle and range tracking, track-while-scan radar
A61B 5/00 - Measuring for diagnostic purposes Identification of persons
A61B 5/05 - Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fieldsMeasuring using microwaves or radio waves
A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
G01S 7/41 - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisationTarget signatureTarget cross-section
G01S 13/56 - Discriminating between fixed and moving objects or between objects moving at different speeds for presence detection
31.
MEASUREMENT SYSTEM, MEASUREMENT APPARATUS, AND ANALYSIS APPARATUS
A measurement system includes a first measurement apparatus and a second measurement apparatus. Each apparatus includes a sensor that outputs a measurement signal, a wireless communication circuit that receives a trigger signal, and a synchronous sampling circuit. Each synchronous sampling circuit is configured to sample a both the trigger signal received and the measurement signal in synchronization with each other and output a synchronous trigger signal and a synchronous measurement signal. The wireless communication unit of each apparatus then transmits a signal pair including the synchronous trigger signal and the synchronous measurement signal.
An acoustic wave device includes a piezoelectric layer including first and second main surfaces, an IDT electrode on one of the first and second main surfaces, and including electrode fingers, a support facing the second main surface, and including an acoustic reflection portion at a portion closer to the second main surface of the piezoelectric layer, and a load film extending over a region that overlaps, when viewed in plan in the first direction, at least electrode fingers from a fourth one of the electrode fingers from a first outer end in an arrangement direction to a fourth one of the electrode fingers from a second outer end in the arrangement direction. d/p is less than or equal to about 0.5 where d denotes a thickness of the piezoelectric layer, and p denotes a center-to-center distance between adjacent two of the electrode fingers.
An oxide material comprising: one or more selected from the group consisting of a nanofiber, a two-dimensional substance, or an amorphous substance of a material represented by: MQaOb wherein M is one or more elements selected from the group consisting of Groups 3, 4, 5, 6, and 7, Q is one or more elements selected from the group consisting of Groups 12, 13, 14, 15, and 16, and excluding O, a is 0 to 2, and b is more than 0 and 2 or less, wherein in a Raman spectrum, an average intensity of the oxide material at 745 to 765 cm−1 is smaller than an average intensity at 735 to 745 cm−1, and wherein a pore volume of the oxide material is 0.060 cc/g or more.
A measuring instrument is provided for inserting into an oral cavity with a narrow opening and that enables intraoral measurement in such a way as to relieve stress exerted on a probe part of the measuring instrument. The measuring device is configured to ensure that the probe part is accurately pressed against the oral mucosa of a person subjected to measurement. The measuring instrument includes a grip and a probe. The probe includes a measurement section and a joint forming a connection between the measurement section and grip. The measurement section is a tip region of the probe and provided with the sensor having an exposed measurement surface. A circuit board is disposed in the joint. The circuit board is an oscillation circuit board on which members forming an oscillation circuit are mounted. The oscillation circuit outputs an oscillatory signal corresponding to an electrical signal transmitted from the sensor.
This MEMS device (1) comprises a first lid substrate (40), device substrates (10, 20), and a second lid substrate (30) laminated in this order, and detects the capacitance formed by the device substrates (10, 20), wherein: the first lid substrate (40) includes a conductive part (Q10), and an insulating part (Q11) that electrically insulates the conductive part (Q10); the first lid substrate (40) includes a first metal layer (E1) and a second metal layer (E2) provided on the surface facing the device substrates (10, 20); the first metal layer (E1) is provided from the conductive part (Q10) to the insulating part (Q11); and the second metal layer (E2) is provided in at least a part of a region covering a boundary part (QB) between the conductive part (Q10) and the insulating part (Q11), at the device substrate (10, 20) side of the first metal layer (E1).
G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
Provided is a high-frequency module with which it is possible to reduce the deterioration of the characteristics of an inductor provided inside a mounting substrate. A high-frequency module (1) comprises a mounting substrate (2), an electronic component (3), a resin layer (5), external connection terminals (6), an inductor (L1), and a partial shield electrode (7). The mounting substrate (2) includes a first main surface (2a) and a second main surface (2b) that oppose each other. The electronic component (3) is disposed on the first main surface (2a) of the mounting substrate (2). The resin layer (5) is provided on the first main surface (2a) of the mounting substrate (2) so as to cover at least a part of the electronic component (3). The plurality of external connection terminals (6) are provided to a main surface (5a) of the resin layer (5) on the side thereof that is opposite the mounting substrate (2) side. The inductor (L1) is provided inside the mounting substrate (2). The partial shield electrode (7) is provided inside or on the second main surface (2b) of the mounting substrate (2). In plan view from the thickness direction (D1) of the mounting substrate (2), the partial shield electrode (7) does not overlap the inductor (L1).
H03H 9/25 - Constructional features of resonators using surface acoustic waves
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
Unnecessary waves are suppressed while suppressing deterioration in the resonance characteristics of a main wave. A piezoelectric device disclosed herein comprises: a piezoelectric laminate having a thickness in a first direction and having an upper surface that is a surface on one side in the first direction and a lower surface that is a surface on the other side in the first direction; a support member provided on the lower surface side of the piezoelectric laminate; an upper electrode provided on the upper surface side of the piezoelectric laminate; and a lower electrode provided on the lower surface side of the piezoelectric laminate. The piezoelectric laminate has a plurality of piezoelectric layers including a single crystal. Each of the plurality of piezoelectric layers is different from the other piezoelectric layers adjacent in the first direction in terms of at least one of material, crystal structure, or polarization direction. The plurality of piezoelectric layers include at least one set of piezoelectric layers having the same material and crystal structure. In at least one of the sets of piezoelectric layers, the crystal orientation of one of the piezoelectric layers is different from the crystal orientation of the other piezoelectric layers.
This filter is provided with a filter body which is provided with a first end face on the upstream side of the flow of a fluid and a second end face on the downstream side of the flow of the fluid, and which has a plurality of through-holes that allow the first end face and the second end face to connect with each other. The plurality of through-holes each have a narrowed portion having an opening diameter smaller than the opening diameter of a first opening formed in the first end face and the opening diameter of a second opening formed in the second end face. The narrowed portion is disposed at a position closer to the first end surface than to the second end surface.
NATIONAL UNIVERSITY CORPORATION TOYOHASHI UNIVERSITY OF TECHNOLOGY (Japan)
Inventor
Saeki, Hiromasa
Katsumura, Kenji
Tamura, Masaya
Matsumoto, Kenjiro
Abstract
An antenna module (30) is provided with a transmission port (T1) and a reception port (T2), antenna elements (ANT1, ANT2) having the same resonant frequency, transmission lines (21, 22), a resistive circuit (R1), and a reactance circuit (LC1). The transmission line (21) is connected between the transmission port (T1) and the antenna element (ANT1). The transmission line (22) is connected between the reception port (T2) and the antenna element (ANT2). The resistive circuit (R1) is connected between the transmission line (21) and the transmission line (22). The reactance circuit (LC1) is connected in parallel to the resistive circuit (R1). A resistance value of the resistive circuit (R1) and a reactance value of the reactance circuit (LC1) are set so that a real part and an imaginary part of admittance between the transmission port (T1) and the reception port (T2) are cancelled out at the resonant frequency or in the vicinity of the resonant frequency.
In the present invention, a component region R is defined as a region where electronic components 20, which are built into a cavity 35 of a substrate 1 with a built-in electronic component, are enveloped by a line segment parallel to the X axis of a core material 30 and a line segment parallel to the Y axis of the core material 30. Where the length from one end of the main surface of the core material 30 to the component region R is X1, the length within the component region R is X2, and the length from the other end of the main surface of the core material 30 to the component region R is X3 in a straight line A-A' parallel to the X axis, in which the overlap with the component region R is longest and the sum of overlaps with the electronic components 20 is largest, and where the length from one end of the main surface of the core material 30 to the component region R is Y1, the length within the component region R is Y2, and the length from the other end of the main surface of the core material 30 to the component region R is Y3 in a straight line B-B' parallel to the Y axis, in which the overlap with the component region R is longest and the sum of overlaps with the electronic components 20 is largest, X2 < Y2 and X1 + X3 > Y1 + Y3 are satisfied or X2 > Y2 and X1 + X3 < Y1 + Y3 are satisfied.
A filter circuit includes an inductor formed by serially connecting wiring line groups formed on a plurality of conductive layers of the board through a via and a capacitor in which a first wiring line having one end of the inductor of the wiring line groups overlaps, as viewed in a direction orthogonal to a main surface of the board, a third wiring line that is formed on one of the conductive layers that is adjacent, in the direction orthogonal to the main surface of the board, to another of the conductive layers on which the first wiring line is formed and has one end electrically connected, through a via, to a second wiring line having another end of the inductor of the wiring line groups.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
A first slave device and a second slave device to which different slave identifiers are added are connected to a serial bus. The second slave device includes a second storage unit including multiple registers and a second serial interface unit that receives a command in which the slave identifier of the second slave device is set via the serial bus and that sets a result of a process corresponding to the received command in at least one register in the second storage unit.
A semiconductor device that includes: a substrate; an insulating layer on the substrate; a first electrode layer on the insulating layer; a dielectric film on the first electrode layer; a second electrode layer on the dielectric film; a moisture-resistant film covering the first electrode layer and the second electrode layer; a first outer electrode passing through the moisture-resistant film and connected to the first electrode layer; and a second outer electrode passing through the moisture-resistant film and connected to the second electrode layer. The first electrode layer and the second electrode layer each comprise Al or an Al alloy. The outer electrodes each include a seed layer formed of Cu/Ti, Cu/Cr, or Cu/nichrome and a plating layer on the seed layer. The seed layer has a horizontal crystal grain size of 500 nm or less, and the plating layer has a horizontal crystal grain size of 500 nm or less.
A multilayer ceramic capacitor includes a multilayer body and an outer electrode. The multilayer body includes dielectric layers and inner electrode layers alternately stacked with the dielectric layers. Ni in one of first and second inner electrode layers forms a solid solution with Pt, and Ni in the other of the first and second inner electrode layers forms no solid solution with Pt. The one of the first and second inner electrode layers in which Ni forms a solid solution with Pt are coupled to a cathode when the multilayer ceramic capacitor is mounted.
An acoustic wave device includes a piezoelectric layer including first and second main surfaces, an upper electrode on the first main surface, a lower electrode on the second main surface, and a support facing the second main surface of the piezoelectric layer. The piezoelectric layer includes an opening extending through the piezoelectric layer in a thickness direction in a region overlapping the lower electrode and not overlapping the upper electrode. The acoustic wave device further includes an overlapping electrode on the lower electrode in a region overlapping the opening and made of the same material as the upper electrode.
Provided is a multilayer ceramic capacitor that can achieve both an improved high-temperature reliability and prevention of deterioration in capacitance. A multilayer ceramic capacitor according to the present invention comprises: a first outer layer part 121 disposed at the side of one first surface F1 in a stacking direction for an inner layer part 11; and a third outer layer part 123 disposed at the side of one third surface F3 in a first direction that is orthogonal to the stacking direction for the inner layer part 11. The first outer layer part 121 contains Mn, and the third outer layer part contains Mg. In cross sections parallel to the stacking direction and the first direction, the Mn content in inner dielectric layers decreases from the first surface F1 side toward the center in the stacking direction of the inner layer part 11, and the Mg content in internal dielectric layers decreases from the third surface side toward the center in the first direction of the inner layer part 11.
Provided is a wire-wound coil component in which, when a terminal electrode made of a metal plate is fixed to a flange of a core using an adhesive, a protruding part of the adhesive can be clearly distinguished from the flange in appearance, thereby making it difficult to cause erroneous recognition in an appearance inspection. A flange (5) has an outer end surface (14) that extends in a direction orthogonal to an axial direction and that faces outward. A terminal electrode (9) includes a mounting piece (22) extending along the outer end surface (14). The terminal electrode (9) is fixed to the flange (5) by an adhesive (25) applied between the mounting piece (22) and the outer end surface (14). As viewed from the axial direction, the adhesive (25) has a protruding portion (26) that protrudes from the mounting piece (22) on the outer end surface (14), but the protruding portion (26) has a higher gloss than the outer end surface (14).
A metal layer embedded substrate 1 includes: a core part 10 having a first main surface 10a and a second main surface 10b facing each other in a thickness direction and including a metal layer 20; a first insulating layer 60A provided on the first main surface 10a of the core part 10; a second insulating layer 60B provided on the second main surface 10b of the core part 10; and a through conductor 70 provided at least on an inner wall surface of a through hole 71 penetrating the core part 10, the first insulating layer 60A, and the second insulating layer 60B in the thickness direction. In the through hole 71, a diameter P of a portion penetrating the metal layer 20 is larger than a diameter Q of a portion penetrating the first insulating layer 60A and a diameter R of a portion penetrating the second insulating layer 60B.
This vibration motor comprises a mover magnet, a first stator magnet and a second stator magnet, a cylindrical holder, a drive winding, and a case. The cylindrical holder has a through-hole that communicates between a first end surface and a second end surface, and opens to the first end surface and the second end surface. The cylindrical holder is provided with a first flange part, a second flange part, a first opening part, and a second opening part. The mover magnet is accommodated in the through-hole in a state of being capable of vibrating in a first direction parallel to the axis of the through-hole. The first stator magnet and the second stator magnet are disposed so as to sandwich the mover magnet therebetween in the first direction, and the magnetic poles thereof are positioned so as to repel the mover magnet. The center of the first stator magnet fitted into the first opening and the center of the second stator magnet fitted into the second opening are offset in the same direction from the center of the through-hole.
B06B 1/04 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with electromagnetism
abb wherein M is one or more elements selected from the group consisting of Groups 3, 4, 5, 6, and 7, Q is one or more elements (except for O) selected from the group consisting of Groups 12, 13, 14, 15, and 16, a is 0 or more and 2 or less, and b is more than 0 and 2 or less; and a metal organic framework portion, wherein a pore volume with a pore size of 2.0 to 10 nm is 0.2 cm3/g or more, and a specific surface area is 210 m2/g or more.
H01G 11/24 - Electrodes characterised by structural features of the materials making up or comprised in the electrodes, e.g. form, surface area or porosityElectrodes characterised by the structural features of powders or particles used therefor
H01G 11/30 - Electrodes characterised by their material
H01G 11/36 - Nanostructures, e.g. nanofibres, nanotubes or fullerenes
An acoustic wave filter includes a longitudinally coupled resonator acoustic wave filter including n IDT electrodes, and first and second reference-potential wiring lines each connected to a reference potential. The longitudinally coupled resonator acoustic wave filter includes first and second areas. The first area includes a first-end-positioned IDT electrode to a center-positioned IDT electrode in a direction in which the IDT electrodes are arranged side by side. The second area includes the center-positioned IDT electrode to a second-end-positioned IDT electrode in the direction in which the IDT electrodes are arranged side by side. Each of the IDT electrodes includes a first comb-shaped electrode and a second comb-shaped electrode interdigitated with each other. In each of the IDT electrodes, one of the first comb-shaped electrode and the second comb-shaped electrode is connected to the signal potential, and the other is connected to the reference potential.
An acoustic wave device includes a piezoelectric layer including a first main surface and a second main surface facing the first main surface in a first direction, an IDT electrode on at least one of the first main surface and the second main surface of the piezoelectric layer and including electrode fingers arranged in an arrangement direction, a reflector adjacent to the IDT electrode in the arrangement direction of the electrode fingers, a support that faces the second main surface of the piezoelectric layer and includes an acoustic reflection portion on a side of the second main surface of the piezoelectric layer, and a load film provided in a region overlapping with the reflector in a plan view from the first direction. When a thickness of the piezoelectric layer is d and a distance between centers of the adjacent electrode fingers is p, d/p is about 0.5 or less.
In a multilayer ceramic capacitor, a first internal electrode layer includes a first end surface-side exposed portion exposed to a first end surface side, a second internal electrode layer includes a second end surface-side exposed portion exposed to a second end surface side, and oxide films in the first and second end surface-side exposed portions. The oxide films include first and second oxide films respectively in the first and second end surface-side exposed portions. The first oxide films are provided at both ends in a width direction of the first end surface-side exposed portion, and the second oxide films are provided at both ends in the width direction of the second end surface-side exposed portion.
A multilayer electronic component includes a multilayer ceramic capacitor and an interposer. End portions of an interposer substrate in a width or length direction and end portions of joint electrodes in the width or length direction are located at a same or substantially a same position in the width direction. The joint electrodes have a plane-symmetric shape centered about an interposer symmetry plane which, in a middle of the width direction or the length direction, extend in the length or width direction and in the stacking direction. The multilayer ceramic capacitor has a plane-symmetric shape centered about a capacitor symmetry plane which, in the middle of the width direction or the length direction, extends in the length or width direction and in the stacking direction. The interposer symmetry plane and the capacitor symmetry plane are on the same or substantially the same plane.
A multilayer ceramic capacitor includes a multilayer body including first and second external electrodes respectively on third and fourth surfaces thereof. A dimension of the multilayer body in a first direction is shorter than a dimension of the multilayer body in a second direction. The multilayer body includes first and second internal electrodes respectively exposed on the third and fourth surfaces, and inner dielectric layers. The inner dielectric layers include at least Ca, Sr or Zr, and Li as main components. Li segregation exists in at least one of the first and second external electrodes, and a size of Li segregation in the at least one of the first and second external electrodes is larger than a size of Li segregation in the inner dielectric layers.
C04B 35/48 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates
H01G 4/012 - Form of non-self-supporting electrodes
A laminated film that includes: a porous resin layer having a first molded body of first liquid crystal polymer fibers; a first adhesive layer on the porous resin layer; a metal layer on the first adhesive layer on a side thereof opposite to the porous resin layer as viewed from the first adhesive layer; and a second adhesive layer on the porous resin layer on a side thereof opposite to the first adhesive layer as viewed from the porous resin layer.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 38/00 - Ancillary operations in connection with laminating processes
57.
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic circuit device is provided that includes a chip component, a circuit board, and a coating resin. The chip component is mounted on the circuit board, and a mounting surface of the circuit board is coated with the coating resin. A surface of an element substrate, a surface of an insulator layer, and a surface of the coating resin form a continuous surface. The electronic circuit device includes an insulator exposed portion where there is no element substrate due to exposure of the insulator layer when viewed in a stacking direction of the element substrate and the insulator layer. At least a part of a coil opening by a coil conductor is in a region of the insulator exposed portion.
An acoustic wave device includes a piezoelectric layer including first and second major surfaces, an IDT electrode on one of the first and second major surfaces, and including electrode fingers arranged in an arrangement direction, and a support facing the second major surface, and including an acoustic reflection portion facing the second major surface. The electrode fingers include a first electrode finger at an outermost position in the arrangement direction and a second electrode finger adjacent thereto. A product of a width, height, and density of one of the first and second electrode fingers is greater than a product of a width, height, and density of a central electrode finger. When the thickness of the piezoelectric layer is denoted by d and a center-to-center distance between adjacent electrode fingers is denoted by p, d/p is less than or equal to about 0.5.
In this multilayer ceramic capacitor (1), a first external electrode (40A) is disposed on a first end surface (LS1). A second external electrode (40B) is disposed on a second end surface (LS2). Each of the first external electrode (40A) and the second external electrode (40B) has a Ni-plated layer (61A, 61B) and a Sn-plated layer (62A, 62B) positioned on the Ni-plated layer (61A, 61B). Each of the first external electrode (40A) and the second external electrode (40B) has a groove (63) extending in the lamination direction (T). A metal containing Ni is exposed on the bottom surface of the groove (63).
The present disclosure provides a vibration device and an imaging device capable of suppressing local application of a large vibration stress to a light-transmitting body if foreign matter adhering to a surface of the light-transmitting body is removed by vibrating the light-transmitting body. A vibration device (10) comprises: a light-transmitting body that transmits light of a prescribed wavelength; an internal vibration body (3) that contacts the light-transmitting body and vibrates the light-transmitting body; a piezoelectric element (5) provided to the internal vibration body (3); and an external vibration body (2) in which a holding part that holds the light-transmitting body has a cylindrical shape, and which covers the internal vibration body (3). In the portion of the internal vibration body (3) that contacts the light-transmitting body, the percentage of a value obtained by subtracting 1 from a ratio of a displacement amount of a second portion on an outer side to a displacement amount of a first portion on an inner side is 2.5% or less.
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
Provided is an inductor in which the binding strength in the vicinity of a boundary between a metal magnetic body and an internal conductor is increased. An inductor 1 according to the present disclosure comprises an element body 10 in which a metal magnetic layer ML containing metal magnetic particles DP and an internal conductor CL are laminated, wherein: the metal magnetic particles DP contain iron as a main component; a boundary vicinity region BR is provided toward the metal magnetic layer including a boundary between the metal magnetic layer ML and the internal conductor CL; and in the boundary vicinity region BR, the content ratio of a main component of the internal conductor CL to iron is 0.01-1.0.
Provided are a composite metal magnetic body having favorable insulation properties and a favorable L-value, an inductor, and a method of manufacturing an inductor. A composite metal magnetic body CP according to the present disclosure comprises metallic magnetic particles DP containing Fe and Si, and an oxide film OL coating the metallic magnetic particles DP, a plurality of metallic magnetic particles DP being bonded by the oxide film OL, wherein the metallic magnetic particles DP contain 511 to 1493 ppm of phosphorus, 23 to 4747 ppm of chromium, and 7 to 95 ppm of sodium with respect to the Fe and Si content in the metallic magnetic particles DP.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
63.
POWDER PROCESSING DEVICE AND POWDER PROCESSING SYSTEM
The present invention is capable of reducing a remaining amount of unprocessed powder and shortening powder processing time. This powder processing device comprises: a mesh part to which powder after processing is discharged; a wall part other than the mesh part; a rotary body which rotates around a shaft; and a spatula which is attached to the rotary body and rotates while in contact with the mesh part and the wall part. The shaft of the rotary body extends horizontally, and the spatula slides on the mesh part to press the powder against the mesh part.
The present invention achieves a planar array antenna having increased flexural strength. Provided is a planar array antenna 110 in which a plurality of radiating elements are arranged along one direction on a dielectric substrate. The planar array antenna 110 comprises a common ground conductor plate 113 which is provided so as to be shared by the plurality of radiating elements. Planar antenna regions 110a, which respectively correspond to the radiating elements 111, have a common ground conductor plate 113 that is provided in parallel in the arrangement direction of the plurality of radiating elements 111 and a pair of ground conductor patterns 112a, 112b that are connected via a via conductor VI. A first dummy pattern DP1a, DP1b is provided between ground conductor patterns 112a, 112b which are adjacent to each other in the arrangement direction.
H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
65.
COMPOSITE METAL MAGNETIC BODY, INDUCTOR, AND METHOD FOR MANUFACTURING COMPOSITE METAL MAGNETIC BODY
The present disclosure provides a composite metal magnetic body that further reduces deterioration of oxide films covering metal magnetic particles, an inductor, and a method for manufacturing the composite metal magnetic body. According to the present disclosure, composite metal magnetic bodies CP1-CP3 have metal magnetic particles DP and oxide films OL that cover the metal magnetic particles DP, and in each of the composite metal magnetic bodies CP1-CP3, a plurality of the metal magnetic particles DP are bonded to each other via the oxide films OL. Each oxide film OL comprises: an inner oxide film OLi that is in contact with the metal magnetic particle DP and has Si as a main component; and an outer oxide film OLo that is located outside the inner oxide film OLi, has an element that is more easily oxidized than Fe as a main component, and is an oxide containing Si.
H01F 1/24 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/16 - Metallic particles coated with a non-metal
H01F 17/04 - Fixed inductances of the signal type with magnetic core
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
66.
COMPOSITE METAL MAGNETIC BODY, INDUCTOR, AND METHOD OF PRODUCING COMPOSITE METAL MAGNETIC BODY
Provided are a composite metal magnetic body, an inductor, and a method of producing a composite metal magnetic body that further reduce degradation of an oxide film covering metallic magnetic particles. A composite metal magnetic body CP1, CP2 of the present disclosure comprises metallic magnetic particles DP and an oxide film OL covering the metallic magnetic particles DP, a plurality of metallic magnetic particles DP being bonded together via the oxide film OL, wherein the oxide film OL comprises an inside oxide film OLi that is in contact with the metallic magnetic particles DP and composed mainly of Si, and an outside oxide film OLo that is located on the outside of the inside oxide film OLi and contains either Al or Ti, and Zr.
H01F 1/24 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/16 - Metallic particles coated with a non-metal
H01F 17/04 - Fixed inductances of the signal type with magnetic core
H01F 37/00 - Fixed inductances not covered by group
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
According to the present disclosure, a first diode circuit includes one diode or a plurality of diodes connected in series, and an anode-side end is connected to an input node or an output node of a power amplifier or an inter-stage node of a cascode connection circuit of a power amplifier including a plurality of cascode-connected transistors. A drain of a first transistor, which is an NMOSFET, is connected to a cathode-side end of the first diode circuit, and a power supply voltage is applied to the drain via a first resistance element. A first feedback voltage and a first reference voltage generated on the basis of the power supply voltage of the first transistor and the voltage of the cathode-side end of the first diode circuit are input to a first operational amplifier, and a first control voltage generated on the basis of the difference between the first feedback voltage and the first reference voltage is applied to a gate of the first transistor. A control circuit is configured to change the first reference voltage input to the first operational amplifier.
H03F 1/52 - Circuit arrangements for protecting such amplifiers
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
In the present invention, a high-frequency signal is input into a first transistor. A plurality of second transistors are cascode-connected to the first transistor. A bias circuit supplies a bias to each of the plurality of second transistors. A power supply wiring applies a voltage-variable power supply voltage to a cascode connection circuit including the first transistor and the plurality of second transistors. The bias circuit includes at least one voltage regulator, and supplies a bias voltage, which is generated on the basis of the voltage of the power supply wiring and the voltage of a voltage control node of which the voltage is controlled by the voltage regulator, to at least one of the plurality of second transistors.
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
H03F 1/52 - Circuit arrangements for protecting such amplifiers
This film capacitor comprises a capacitor element 10 which includes an element body 20 having a first end surface 21 and a second end surface 22 positioned at both ends in a length direction and a side surface 23 connecting the first end surface 21 and the second end surface 22, a first external electrode 31 provided on the first end surface 21 of the element body 20, and a second external electrode 32 provided on the second end surface 22 of the element body 20, a first lead-out terminal 61 which comprises a first resin member 71 disposed so as to surround a part of the outer periphery of the first lead-out terminal 61, and which is connected to the first external electrode 31, a second lead-out terminal 62 which comprises a second resin member 72 disposed so as to surround a part of the outer periphery of the second lead-out terminal 62, is connected to the second external electrode 32, and is routed to the first external electrode 31 side along the side surface 23 of the element body 20, and an exterior body 40 which is made of a laminate film 40 including a resin layer, seals the capacitor element 10 such that the resin layer is disposed around the capacitor element 10, and has a welded portion 42 where a first part 42 and a second part 42, which are parts of the resin layer located in opposing positions, are welded together, wherein: the welded portion includes a first lead-out port 51, which is a part where the first part and the second part are welded to each other with the first resin member 71 interposed therebetween, and a second lead-out port 52, which is a part where the first part and the second part are welded to each other with the second resin member 72 interposed therebetween; the first external electrode 31 and the second lead-out terminal 62 are insulated from each other by the second resin member 72; and the tip end of the first lead-out terminal 61 and the tip end of the second lead-out terminal 62 project from the same side edge of the exterior body 40.
Disclosed is a carbon dioxide adsorption material which internally contains an amine compound in pores of a porous material. The carbon dioxide adsorption material has a peak pore diameter of not less than 0.4 nm but less than 10 nm, a peak pore volume of 0.003 cm3/g/nm or more, and an average pore diameter of 1 nm to 30 nm inclusive.
B01J 20/22 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising organic material
B01D 53/14 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
B01J 20/30 - Processes for preparing, regenerating or reactivating
Provided is a multilayer ceramic capacitor that makes it possible to improve high-temperature load reliability by suppressing insulation deterioration due to dielectric layers. A multilayer ceramic capacitor 10 according to the present invention comprises: a multilayer body that includes a plurality of dielectric layers and a plurality of internal electrode layers; and an external electrode that is provided on an outer surface of the multilayer body, and is electrically connected to the plurality of internal electrode layers at a portion in which the plurality of internal electrode layers are exposed in the multilayer body. The internal electrode layers include a plurality of first internal electrode layers and a plurality of second internal electrode layers that are exposed on different surfaces of the multilayer body, and the external electrode includes a first external electrode that is electrically connected to the first internal electrode layers and a second external electrode that is electrically connected to the second internal electrode layers. The internal electrode layers contain Ni as a main component, and an interface region that contains at least one oxide of Zn, Fe, Sb, In, Mn, Ge, Sn, Mo, W, Ga, Cr, or V is disposed in the vicinity of the interface between a first internal electrode layer and a dielectric layer and in the vicinity of the interface between a second internal electrode layer and a dielectric layer.
Provided are a multilayer ceramic capacitor and a method for using the multilayer ceramic capacitor that make it possible to improve high-temperature load reliability by suppressing insulation deterioration due to dielectric layers. A multilayer ceramic capacitor 10 according to the present invention comprises: a multilayer body that includes a plurality of dielectric layers and a plurality of internal electrode layers; and an external electrode that is provided on an outer surface of the multilayer body and is electrically connected to the plurality of internal electrode layers at a portion in which the plurality of internal electrode layers are exposed in the multilayer body. The internal electrode layers include a plurality of first internal electrode layers and a plurality of second internal electrode layers that are exposed on different surfaces of the multilayer body, and the external electrode includes a first external electrode that is electrically connected to the first internal electrode layers and a second external electrode that is electrically connected to the second internal electrode layers. The internal electrode layers have Ni as a main component, and a polarity based on an application direction of a voltage that is applied between the first external electrode and the second external electrode is determined so that the first internal electrode layers are positive electrodes and the second internal electrode layers are negative electrodes. An interface region that contains at least one metal of Pd, Os, Sb, Pt, Ir, Au, and Zn is disposed in the vicinity of the interface between a first internal electrode layer and a dielectric layer.
Provided are a multilayer ceramic capacitor that achieves an increase in high-temperature load reliability through a reduction in insulation deterioration due to dielectric layers, and a method for using the multilayer ceramic capacitor. A multilayer ceramic capacitor 10 according to the present invention comprises: a multilayer body including a plurality of dielectric layers and a plurality of internal electrode layers; and external electrodes provided on outer surfaces of the multilayer body and electrically connected to the plurality of internal electrode layers at portions where the plurality of internal electrode layers are exposed on the multilayer body. The internal electrode layers include a plurality of first internal electrode layers and a plurality of second internal electrode layers that are exposed on different surfaces of the multilayer body, and the external electrodes include a first external electrode electrically connected to the first internal electrode layers and a second external electrode electrically connected to the second internal electrode layers. The internal electrode layers contain Ni as a main component, and have polarities defined on the basis of the direction in which voltage is applied between the first external electrode and the second external electrode, such that the first internal electrode layers serve as positive electrodes and the second internal electrode layers serve as negative electrodes. First interface regions containing at least one metal selected from Pd, Os, Sb, Pt, Ir, Au, and Zn are provided in the vicinity of interfaces between the first internal electrode layers and the dielectric layers. Second interface regions containing at least one metal selected from Ge, Cu, and Ag are provided in the vicinity of interfaces between the second internal electrode layers and the dielectric layers.
Provided is a solid-state battery that comprises a positive electrode part that includes a positive electrode active material, a negative electrode part that includes a negative electrode active material, and a solid electrolyte part. At least one of the positive electrode part and the solid electrolyte part includes a first solid electrolyte. The solid-state battery also comprises an interposing layer that is interposed between the positive electrode active material and the first solid electrolyte and contacts both the positive electrode active material and the first solid electrolyte. The first solid electrolyte includes Li, M, S, and O and has at least a crystal phase that has a tetragonal crystal structure. M is one or more elements that are selected from group 14 and group 15 and include at least Sn. The molar ratio of O to M is 0.1–3.0. The thickness of the interposing layer is less than 500 nm.
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
C01B 17/98 - Other compounds containing sulfur and oxygen
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
H01M 4/36 - Selection of substances as active materials, active masses, active liquids
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
A solid-state battery according to one embodiment of the present disclosure provides a sulfide solid electrolyte that contains at least Li, Sn, S, and O, and has a tetragonal crystal structure.
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
H01B 1/10 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances sulfides
The present disclosure provides a solid electrolyte having higher ion conductivity both before and after exposure to the atmosphere. The present disclosure relates to a solid electrolyte containing, in a portion thereof, a glassy substance having an NZSP composition containing Na, Zr, Si, P, and O.
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
C03C 10/04 - Silicate or polysilicate crystalline phase, e.g. mullite, diopside, sphene, plagioclase
C04B 35/447 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on phosphates
H01B 1/08 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances oxides
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 10/054 - Accumulators with insertion or intercalation of metals other than lithium, e.g. with magnesium or aluminium
Provided is a multilayer ceramic capacitor which has further improved reliability. When the crystal particles (50) included in a dielectric layer of a multilayer ceramic capacitor (1) are divided into a first region (51) in which the rare earth element concentration is less than a first value and a second region (52) in which said concentration is equal to or greater than the first value, the first region (51) is surrounded by the second region (52), a rare earth element-concentrated region (53) is present in the second region (52), and the second region (52) is present between the rare earth element-concentrated region (53) and a grain boundary (30) of the crystal particles (50).
A transport device (10) is provided with a transport body (20), a supply unit, a drive unit, a discharge unit, a downstream guide unit (110), and a removal unit (120). The discharge unit is located on the downstream side (C2) with respect to the supply unit on a circulation path (CR) and is capable of discharging an object being transported to the outside on the positive direction (R1) side of a placement surface (21). The downstream guide unit (110) is arranged so as to face the placement surface (21), and is located, on the circulation path (CR), on the downstream side (C2) with respect to the discharge unit and on the upstream side (C1) with respect to the supply unit. If the placement surface (21) is viewed in plan view, a downstream guide edge unit (DE) intersects the circulation path (CR) and extends so as to face farther towards the negative direction (R2) side the farther it moves in the traveling direction of the circulation path (CR). The removal unit (120) is capable of collecting the object being transported located at the end of the downstream guide edge unit (DE) on the negative direction (R2) side.
A multilayer ceramic capacitor 1 is provided with: an element body 10 that comprises a plurality of dielectric ceramic layers 20 and a plurality of internal electrode layers 30 which are stacked in the thickness direction T; and external electrodes 11, 12 that are provided on a surface of the element body 10 and are electrically connected to the internal electrode layers 30. The dielectric ceramic layers 20 contain a perovskite oxide as a main component. The perovskite oxide contains at least one of barium (Ba), calcium (Ca), and strontium (Sr), at least one of titanium (Ti) and zirconium (Zr), and at least one of rare earth elements (Re). With respect to Re/(Ti + Zr) ratio of each pixel of an element mapping image in terms of atom% of the dielectric ceramic layer 20 obtained by scanning transmission electron microscopy-energy dispersive X-ray spectroscopy analysis (STEM-EDS analysis), if the range of 0 ≤ Re/(Ti + Zr) < 2 is divided by a section width of 0.002, the number of pixels belonging to each section is counted, and the frequency of the number of pixels is converted to a relative frequency so that the cumulative frequency of the range of 0 ≤ Re/(Ti + Zr) < 2 becomes 1, the concentration ratio variation of the Re/(Ti + Zr) ratio is defined by the following a1 to a4. a1: The section to which the arithmetic mean of the Re/(Ti + Zr) ratios in the dielectric ceramic layer (hereinafter referred to as the concentration ratio arithmetic mean of Re/(Ti + Zr) ratios) belongs is defined as the mean concentration ratio belonging section of Re/(Ti + Zr) ratio. a2: The relative frequency corresponding to a half of the relative frequency of the mean concentration ratio belonging section of Re/(Ti + Zr) ratio is defined as the half value of the Re/(Ti + Zr) ratio. a3: The value obtained by multiplying the number of successive sections (excluding the section of 0 ≤ Re/(Ti + Zr) < 0.002) extending to the right and left with the mean concentration ratio belonging section of Re/(Ti + Zr) ratio as the point of origin among the sections in which the relative frequency is not less than the half value of the Re/(Ti + Zr) ratio by the section width of 0.002 is defined as the half-value width of the Re/(Ti + Zr) ratio. a4: The value obtained by dividing the half-value width of the Re/(Ti + Zr) ratio by the concentration ratio arithmetic mean of Re/(Ti + Zr) ratios is defined as the concentration ratio variation of the Re/(Ti + Zr) ratio. In addition, with respect to (Ba + Ca + Sr)/(Ti + Zr) ratio of each pixel of an element mapping image in terms of atom% of the dielectric ceramic layer obtained by STEM-EDS analysis, if the range of 0.3 ≤ (Ba + Ca + Sr)/(Ti + Zr) < 2.3 is divided by a section width of 0.02, the number of pixels belonging to each section is counted, and the frequency of the number of pixels is converted to a relative frequency so that the cumulative frequency of the range of 0.3 ≤ Re/(Ti + Zr) < 2.3 becomes 1, the concentration ratio variation of the (Ba + Ca + Sr)/(Ti + Zr) ratio is defined by the following b1 to b4. b1: The section to which the arithmetic mean of the (Ba + Ca + Sr)/(Ti + Zr) ratios in the dielectric ceramic layer (hereinafter referred to as the concentration ratio arithmetic mean of (Ba + Ca + Sr)/(Ti + Zr) ratios) belongs is defined as the mean concentration ratio belonging section of (Ba + Ca + Sr)/(Ti + Zr) ratio. b2: The relative frequency corresponding to a half of the relative frequency of the mean concentration ratio belonging section of (Ba + Ca + Sr)/(Ti + Zr) ratio is defined as the half value of the (Ba + Ca + Sr)/(Ti + Zr) ratio. b3: The value obtained by multiplying the number of successive sections extending to the right and left with the mean concentration ratio belonging section of (Ba + Ca + Sr)/(Ti + Zr) ratio as the point of origin among the sections in which the relative frequency is not less than the half value of the (Ba + Ca + Sr)/(Ti + Zr) ratio
CERAMIC POWDER FOR MULTILAYER CERAMIC CAPACITOR, METHOD FOR PRODUCING CERAMIC POWDER FOR MULTILAYER CERAMIC CAPACITOR, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR
This ceramic powder for a multilayer ceramic capacitor is composed of a perovskite-type oxide. The perovskite-type oxide contains barium (Ba), titanium (Ti), and a rare earth (Re) element, and may additionally contain at least one of calcium (Ca) and strontium (Sr). The ceramic powder for a multilayer ceramic capacitor has a BET specific surface area of 4.0 m2/g to 21.0 m2/g, and has a Re/Ti weight concentration ratio distribution in which the arithmetic mean value μ is 0.02-0.08 wt% and the variation σ is 0.15 or less.
Provided is a multilayer ceramic capacitor having further improved reliability. A multilayer ceramic capacitor 1 comprises: a laminate 2 including a dielectric layer 5 and an internal electrode layer 6; and a plurality of external electrodes provided on the surface of the laminate 2 and connected to a part of the internal electrode layer 6, wherein the titanium concentration at an interface 50 between the dielectric layer 5 and the internal electrode layer 6 is higher than the titanium concentration of the dielectric layer 5.
The present invention comprises a part (110) to be vibrated, and at least one vibrator (120). The at least one vibrator (120) is bonded to the part (110) to be vibrated and vibrates the part (110) to be vibrated. The at least one vibrator (120) is configured by laminating a piezoelectric element (121), a pair of resin layers (125, 126) that sandwich the piezoelectric element (121) therebetween, and a pair of metal layers (127, 128) that sandwich the piezoelectric element (121) and the pair of resin layers (125, 126) therebetween. The at least one vibrator (120) vibrates the part (110) to be vibrated in a resonance mode.
Provided is a solid electrolyte having a NASICON-type crystal structure and containing sodium (Na), zirconium (Zr), silicon (Si), phosphorus (P), and oxygen (O). A portion of Zr is substituted by one or more elements selected from the group consisting of vanadium (V), niobium (Nb), tantalum (Ta), bismuth (Bi), tungsten (W), and molybdenum (Mo).
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
C04B 35/447 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on phosphates
H01B 1/08 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances oxides
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 10/054 - Accumulators with insertion or intercalation of metals other than lithium, e.g. with magnesium or aluminium
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
C04B 35/447 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on phosphates
H01B 1/08 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances oxides
H01M 4/131 - Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 10/054 - Accumulators with insertion or intercalation of metals other than lithium, e.g. with magnesium or aluminium
A sensor device is provided that includes an object; a metamaterial on the object to enhance transmission of acoustic waves through the object; a transducer that emits acoustic waves to the object and the metamaterial; and a receiver that receives the acoustic waves through the object and the metamaterial.
A plated metal film is formed on a wire placement surface of a terminal electrode. The plated metal film includes a nickel layer serving as a base and a tin layer as a surface layer. The wire extends along the wire placement surface and is bonded to the wire placement surface, in a connection portion between the wire and the wire placement surface, by a bonding member that contains a metal, such as tin, derived from the plated metal film. A fillet that contains a metal, such as tin, derived from the plated metal film is formed so as to fill in the gap between the wire and the wire placement surface at the end of the wire placement surface from which the wire extends toward a winding core portion.
A filter device is provided that includes a acoustic resonator having a substrate; a piezoelectric layer coupled to the substrate by one or more intermediate layers; and a conductor pattern on a surface of the piezoelectric layer, the conductor pattern including a pair of busbars having a plurality of interleaved fingers extending therefrom to form an interdigital transducer (IDT). The filter device further includes a dielectric capacitor electrically coupled in series to the acoustic resonator. The dielectric capacitor includes a dielectric layer on a surface of a first busbar of the pair of busbars and at least one metal layer on a surface of the dielectric layer, such that the dielectric layer is between the first busbar and the at least one metal layer to form the dielectric capacitor.
An electrical device having a capacitor including: a bottom electrode; a dielectric structure extending conformally on the bottom electrode and comprising dielectric layers, wherein the dielectric structure extends only within a central region of the bottom electrode; a top electrode extending conformally on the dielectric structure; and a passivation layer extending on the bottom electrode within a peripheral region of the bottom electrode, the peripheral region surrounding the dielectric structure and extending up to lateral edges of the electrical device, and wherein: the lateral edges of each of the dielectric layers are covered at least by the passivation layer.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
An electronic stethoscope includes a casing, a sound sensor that is provided at the casing and that obtains a sound of an organism and converts the sound of the organism into an electrical signal, light-emitting elements that are provided in the casing and that have respective light-emitting surfaces that emit light beams; and a light-guiding member that guides the light beams of the light-emitting elements to outside of the casing. The light-guiding member has an inner surface that includes light-receiving portions that face the light-emitting surfaces and upon which the light beams L of the light-emitting elements are incident, and an outer surface that is exposed to the outside of the casing by extending along an outer peripheral surface of the casing, and that radiates to the outside of the casing the light beams that are incident upon the outer surface through the light-receiving portions.
A61B 90/00 - Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups , e.g. for luxation treatment or for protecting wound edges
A multiplexer includes a common connection terminal, and transmitting and receiving filters commonly connected to the common connection terminal. The transmitting and receiving filters each include a resonator. The resonators of the transmitting and receiving filters share a piezoelectric substrate. The resonator located closest to the common connection terminal in terms of a circuit configuration of the transmitting filter defines a series-arm resonator. The resonator located closest to the common connection terminal in terms of a circuit configuration of the receiving filter defines a longitudinally coupled resonator acoustic wave filter. The series-arm resonator of the transmitting filter includes an IDT electrode including a plurality of electrode fingers. The first longitudinally coupled resonator acoustic wave filter of the receiving filter includes a plurality of IDT electrodes each including a plurality of electrode fingers.
A radio-frequency circuit includes first filter having a pass band including the transmit band of communication band A and a second filter having a pass band including the receive band of communication band B. The communication bands A and B are usable for simultaneous communication. The transmit band of the communication band A includes a sub-band X that overlaps the receive band of the communication band B and a sub-band Y that does not overlap the receive band of the communication band B. The receive band of the communication band B includes the sub-band X and a sub-band Z that does not overlap the transmit band of the communication band A. The pass band of the first filter is switchable between a first pass band including the sub-band X and the sub-band Y and a second pass band, narrower than the first pass band, including the sub-band Y.
An acoustic wave device includes a piezoelectric layer including first and second main surfaces facing in a first direction, an IDT electrode on at least one of the first or second main surface and including electrode fingers arranged in an arrangement direction, a support facing the second main surface and including an acoustic reflection portion, and a protective film on at least one of the first or second main surface. In a region that overlaps, in plan view in the first direction, a first of the electrode fingers outermost in the arrangement direction, the protective film includes a surface of a first step where a side surface of the protective film is exposed in a direction intersecting an extending direction of the first electrode finger. When d is a thickness of the piezoelectric layer and p is a center-to-center distance between adjacent electrode fingers, d/p is about 0.5 or less.
A capacitor mounting board includes a substrate, (M×N) power lands, and (M−1)×(N−1) capacitors each in a region surrounded by (2×2) adjacent power lands. Each of the capacitors includes first and second main surfaces, first and third side surfaces, and second and fourth side surfaces. Each of the capacitors is at least on the first main surface, includes electrode terminals, has a rectangular or substantially rectangular shape at the first and second main surfaces, and is arranged such that an edge of the first capacitor main surface on the first capacitor side surface side and an edge of the first capacitor main surface on the third capacitor side surface side are inclined at about 45±5 degrees with respect to a straight line extending in a first direction on the second main surface of the substrate.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
95.
MAGNETIC MATERIAL, MAGNETIC MATERIAL MANUFACTURING METHOD, AND INDUCTOR
A magnetic material has magnetic powder containing a first magnetic particle and a second magnetic particle smaller in particle diameter than the first magnetic particle, and a resin. At least part of an outer peripheral surface of the first magnetic particle has a binding layer that contains a silane coupling agent.
H01F 1/147 - Alloys characterised by their composition
H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
H01F 3/08 - Cores, yokes or armatures made from powder
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
In a secondary battery, a first end face of an electrode wound body and a first electrode current collector plate are joined to each other by one or more first joint parts. The one or more first joint parts each have a meander shape in a plan view. The meander shape includes multiple first linear parts and multiple first turning parts. In each of the one or more first joint parts, a length in a winding direction of the electrode wound body from an a-th one to an (a+1)th one of the first turning parts counted from a winding center of the electrode wound body is longer than a length in the winding direction from a first one to a second one of the first turning parts, of corresponding one of the first joint parts, counted from the winding center.
A multilayer ceramic capacitor (1), wherein a first external electrode (40A) and a second external electrode (40B) have first grooves (72A3, 72B3) extending in a layer stacking direction (T). In the first grooves (72A3, 72B3), a first base electrode layer (50A) and a second base electrode layer (50B) are directly connected to a first plating layer (70A) and to a second plating layer (70B). One end of each of the first grooves (72A3, 72B3) is open on a first main surface (TS1) side, and the other end of each of the first grooves (72A3, 72B3) terminates within a first end face (LS1) or within a second end face (LS2).
The present invention provides a composite metal magnetic body having insulation characteristics and an L value that are suitable, an inductor, and a method for manufacturing the inductor. A composite metal magnetic body CP according to the present disclosure comprises metal magnetic particles DP containing Fe and Si, and an oxide film OL covering the metal magnetic particles DP, wherein a plurality of the metal magnetic particles DP are bonded to one another via the oxide film OL. In relation to the content of Fe and Si in the metal magnetic particles DP, the metal magnetic particles DP contain phosphorus in the range of 23-392 ppm, chromium in the range of 24-4739 ppm, and calcium in the range of 22-968 ppm.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
The purpose of the present invention is to provide an active clamp circuit of a power amplifier including a bias circuit. A first diode circuit includes a plurality of diodes connected in multiple stages, and an anode-side end thereof is connected to an output node of the power amplifier. A base or a gate of a clamp transistor is connected to a cathode-side end of the first diode circuit, and a collector or a drain is connected to a bias circuit, such that a bias current of the power amplifier is suppressed. A control circuit generates a reference voltage having a variable voltage value. A voltage regulator is connected to an emitter or a source of the clamp transistor and maintains the voltage of the emitter or the source of the clamp transistor at a voltage based on the reference voltage.
An antenna module (100) comprises: a first substrate (131) having a first main surface (11) and a second main surface (12) facing each other; a second substrate (132) disposed on the second main surface (12) side; a third substrate (133) disposed between the first substrate (131) and the second substrate (132); a patch antenna (141) disposed on the first substrate (131) along the first main surface (11); a first dipole antenna (151) disposed so as to intersect the first main surface (11); and a second dipole antenna disposed on the third substrate (133) along the surface of the third substrate (133) facing the second main surface (12). The first dipole antenna (151) has a first element (1511) and a second element (1512). The first element (1511) is disposed across the first substrate (131) and the third substrate (133), and the second element (1512) is disposed across the second substrate (132) and the third substrate (133).
H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
H01P 5/10 - Coupling devices of the waveguide type for linking lines or devices of different kinds for coupling balanced lines or devices with unbalanced lines or devices
H01Q 9/16 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
H01Q 21/29 - Combinations of different interacting antenna units for giving a desired directional characteristic
