A VOC removal apparatus that includes: a VOC adsorption rotor including a cellular structure, the cellular structure being made of metal and supporting an adsorbent to adsorb a VOC, wherein the VOC adsorption rotor has: an adsorption zone through which a process gas is passed for adsorption of a VOC contained in the process gas, a desorption zone in which the VOC adsorbed in the adsorption zone is desorbed, and a cooling zone in which the cellular structure is cooled; a pair of electrodes each respectively disposed at opposed outer side portions of the VOC adsorption rotor in a direction in which a rotational axis of the VOC adsorption rotor extends, the pair of electrodes being positioned in contact with the VOC adsorption rotor in the desorption zone; and a voltage application device constructed to apply a voltage to the pair of electrodes.
B01D 53/06 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with moving adsorbents
A stretchable device including: a stretchable substrate having a first main surface and a second main surface; stretchable wiring adjacent the first main surface; a first cover layer covering the first main surface and the stretchable wiring; and a second cover layer covering the second main surface, wherein at least the stretchable substrate includes a discontinuous region, and the first cover layer and the second cover layer are connected to each other in the discontinuous region.
A metal magnetic particle provided with an oxide layer on a surface of an alloy particle containing Fe and Si, wherein the oxide layer has a first oxide layer, a second oxide layer, and a third oxide layer from the alloy particle side. Also, in line analysis of element content by using a scanning transmission electron microscope-energy dispersive X-ray spectroscopy, the first oxide layer is a layer where Si content takes a local maximum value, the second oxide layer is a layer where Fe content takes a local maximum value, and the third oxide layer is a layer where Si content takes a local maximum value.
H01F 1/147 - Alloys characterised by their composition
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
A capacitor array that includes: a capacitor layer including a plurality of capacitor elements; a first through slit extending in a first direction and arranged in a plane direction orthogonal to a thickness direction; and a second through slit extending in a second direction intersecting the first direction and arranged in the plane direction orthogonal to the thickness direction, wherein the first through slit and the second through slit separate the plurality of capacitor elements from each other, and when an intersection region of the first through slit and the second through slit is viewed in the thickness direction, intersection points of a first imaginary slit obtained by extending the first through slit to the intersection region and a second imaginary slit obtained by extending the second through slit to the intersection region are located inside the intersection region.
H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
H01G 9/048 - Electrodes characterised by their structure
A stretchable device including: a stretchable substrate; and a first electrode, a second electrode, and a third electrode on the stretchable substrate. A first ionization tendency of a conductive material as a main component of the third electrode is smaller than a second ionization tendency of a conductive material as a main component of the first electrode and a third ionization tendency of a conductive material as a main component of the second electrode, and a shortest distance between the first electrode and the third electrode is smaller than a shortest distance between the first electrode and the second electrode.
A capacitor array that includes: a capacitor part including a plurality of capacitor elements disposed in a planar arrangement in an in-plane direction orthogonal to a thickness direction, the plurality of capacitor elements including mutually adjacent capacitor elements that are separated from each other, wherein the plurality of capacitor elements each include a first electrode layer and a second electrode layer that face each other in the thickness direction with a dielectric layer interposed between the first electrode layer and the second electrode layer; a built-in member disposed at an outer periphery of the capacitor part in the in-plane direction; and a sealing layer that seals the capacitor part and the built-in member, wherein the built-in member has a higher melting temperature than the sealing layer.
A cathode electrode sheet, a preparation method thereof, and a lithium-ion battery are provided. The cathode electrode sheet comprises a cathode active material, a cathode conductive agent, a cathode binder, and a lithium organic acid, wherein based on the total weight of the cathode active material, the cathode conductive agent, the cathode binder, and the lithium organic acid, the content of the lithium organic acid is 0.14 wt % to 11.99 wt %.
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
A yarn that contains at least one potential-generating filament constructed to generate an electric potential in response to energy from the outside of the at least one potential-generating filament, the yarn having a total linear density of 90 dtex or more.
A capacitor array that includes: a plurality of capacitor portions arranged in a plane direction or plane directions orthogonal to a thickness direction; and a sealing portion enclosing the plurality of capacitor portions so as to cover opposed main surfaces of the plurality of capacitor portions, the sealing portion including a plurality of sealing layers laminated in the thickness direction, and the plurality of sealing layers including: a first sealing layer proximal to the capacitor portions in the thickness direction, and containing a first insulating material; and second sealing layers on opposite respective sides of the first sealing layer relative to the capacitor portions in the thickness direction and forming two main surfaces of the sealing portion opposed to each other in the thickness direction, and containing a second insulating material.
H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
An electronic module includes a substrate or a lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or the lead frame; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, a first terminal that is on or embedded in the resin body and that is connected to the primary conductive pattern, and a second terminal that is on or embedded in the resin body and that is connected to the secondary conductive pattern; and an electronic component located on the substrate or the lead frame.
An electronic module includes a substrate or a lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above the substrate or the lead frame; a material located between the substrate and the magnetic core; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, a first terminal that is on or embedded in the resin body and that is connected to the primary conductive pattern, and a second terminal that is on or embedded in the resin body and that is connected to the secondary conductive pattern; and an electronic component located on the substrate or the lead frame.
A filter device (100) comprises: an insulator (10) that includes a first external electrode (11) and a second external electrode (12); an inductor (L1) that is connected to the first external electrode; and a resonant circuit (RS) that includes an inductor (L2) and a capacitor (C1). The inductor (L1) is connected to the second external electrode (12) and is connected to the resonant circuit (RS). The inductor (L1) and the inductor (L2) are laminated in the insulator (10). At least one of the inductor (L1) and the inductor (L2) includes a plurality of inductor patterns. The inductor (L1) and the inductor (L2) are disposed alternately in the lamination direction and are magnetically coupled.
A filter device (100) comprises: an insulator (10) including a first external electrode (11) and a second external electrode (12); an inductor (L1) connected to the first external electrode; a resonance circuit (RS) including an inductor (L2) and a capacitor (C1); and an inductor (L3). The inductor (L1) is connected to the second external electrode (12) and is connected to the resonance circuit (RS). The inductor (L3) includes an inductor (L3a) connected to both ends of the resonance circuit (RS). The inductor (L1) and the inductor (L2) are magnetically coupled with demagnetizing polarity.
A VR device (1) comprises a housing, blower devices (12R, 12L), speakers (11R, 11L), and a VR control unit (20). The housing has a first opening that can communicate with an ear hole (910) of a user (90). The blower devices (12R, 12L) are provided to the housing and generate wind to be sent from the first opening to the outside of the housing. The speakers (11R, 11L) are provided to the housing and generate sound to be transmitted from the first opening to the outside of the housing. The VR control unit (20) temporally synchronizes the generation timing of the sound and the generation timing of the wind on the basis of virtual reality imparted to the user (90), outputs a blowing control signal to the blower devices (12R, 12L), and outputs a sound emission control signal to the speakers (11R, 11L).
A blower apparatus (10) comprises: a housing (101) having a first opening that can be in communication with an earhole (910) of a user (90); a blower device (12) that is provided to the housing (101) and that generates gas to be sent out from the first opening to the outside of the housing (101); and a loudspeaker (11) that is provided to the housing (101) and that generates sound to be sent out from the first opening to the outside of the housing (101). When viewed from the outside of the first opening, a discharge port of the blower device (12) is disposed at a position overlapping the first opening. When viewed from the outside of the first opening, the loudspeaker (11) is disposed at a position not overlapping the discharge port, on the first opening side relative to the blower device (12). The main sound emission direction of the loudspeaker (11) is different from the direction connecting the first opening and the position of the loudspeaker (11).
A solid electrolytic capacitor element 20 comprises: a valve-acting metal substrate 4 having a dielectric layer 5 on at least one main surface; a solid electrolyte layer 7a provided on the dielectric layer 5; and a cathode foil 7e which is in direct contact with the solid electrolyte layer 7a. The cathode foil 7e comprises a copper foil 7c having a passivation film 7d formed on a surface thereof, and the thickness of the passivation film 7d is 1 nm to 1 μm.
The present invention comprises at least one parametric speaker (300) and a display (400). The at least one parametric speaker (300) reproduces an audible sound by means of modulation driving of an ultrasonic transducer in which a plurality of ultrasonic vibrators having a longitudinal direction following a horizontal direction are arranged so as to be aligned along the vertical direction. The display (400) has a display surface (410). The at least one parametric speaker (300) can reproduce an audible sound in a given region on the display-surface (410) side of the display (400). The vertical-direction range of the given region is wider than the horizontal-direction range thereof.
H04R 1/34 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
18.
SOLID ELECTROLYTIC CAPACITOR, METHOD FOR MANUFACTURING SOLID ELECTROLYTIC CAPACITOR, AND CONNECTION ELEMENT FOR SOLID ELECTROLYTIC CAPACITOR
A solid electrolytic capacitor according to the present invention comprises a capacitor element, a sealing body, a first external electrode, and a second external electrode. The capacitor element has: a flat film-like body which includes a valve-acting metal and which has a porous layer having a plurality of holes on the surface of the valve-acting metal; a dielectric layer which is formed on a cathode formation region; and a solid electrolyte layer which is formed on the dielectric layer. Furthermore, the capacitor element has an anode terminal region in which the solid electrolyte layer is not formed on the body and the cathode formation region in which the solid electrolyte layer is formed. The sealing body has a configuration in which a laminate obtained by layering a plurality of the capacitor elements is sealed by an insulating resin. The first external electrode has a blade plate member and a terminal electrode, which is linked to the blade plate member, and is connected to the anode terminal region. The second external electrode is connected to the cathode formation region. The laminate has a first main surface parallel to the capacitor elements and a second main surface facing the first main surface. At least part of the anode terminal region is formed such that the area thereof changes in a stepwise manner in a first direction, which is parallel to the direction of the second main surface, from the first main surface in a plan view of the capacitor element. The anode terminal region and the blade plate member are joined via a melted part of the anode terminal region or the blade plate member.
A passive electronic component 1A is provided with: a substrate 10 having a first principal surface 10a and a second principal surface 10b that oppose one another in a first direction D1; and a capacitor 20 provided to the substrate 10 on the first principal surface 10a side. The capacitor 20 includes a capacitance forming section 21 in which an internal electrode layer and a dielectric layer are alternately stacked in the first direction D1. The capacitance forming section 21 has three or more internal electrode layers. All of the internal electrode layers are counted in order from the substrate 10 side in the first direction D1 to establish a first group G1 to which internal electrode layers located at odd numbers belong and a second group G2 to which internal electrode layers located at even numbers belong; all of the internal electrode layers are counted in order from the substrate 10 side in the first direction D1 to establish, with N being an odd number 3 or greater, an N-th internal electrode layer that is located N-th and belongs to the first group G1 and an N-1-th internal electrode layer that is located N-1-th and belongs to the second group G2; and a second direction D2 is established, which is perpendicular to an average direction of current flowing through the capacitance forming section 21 when voltage is applied to the capacitance forming section 21, in plan view from the first direction D1. Then, in a cross-section running along the first direction D1 and the second direction D2, two ends of the N-th internal electrode layer of the first group G1 in the second direction D2 are located further outward in the second direction D2 than two ends of the N-1-th internal electrode layer of the second group G2 in the second direction D2.
A passive electronic component 1A comprises: a substrate 10 having a first main surface 10a and a second main surface 10b facing each other in a first direction D1; and a plurality of capacitors 20 provided on the first main surface 10a side with respect to the substrate 10. The plurality of capacitors 20 include a first capacitor 20a and a second capacitor 20b separated from the first capacitor 20a in a second direction D2 perpendicular to the first direction D1. The first capacitor 20a includes a first capacitance formation part 21a including a first internal electrode layer 22a, a first dielectric layer 23a, and a second internal electrode layer 22b which are stacked in order from the substrate 10 side in the first direction D1. The second capacitor 20b has a second capacitance formation part 21b including a third internal electrode layer 22c, a second dielectric layer 23b, and a fourth internal electrode layer 22d which are stacked in order from the substrate 10 side in the first direction D1. At least a part of the second internal electrode layer 22b and at least a part of the third internal electrode layer 22c are in contact with the surface on the opposite side of the first dielectric layer 23a to the substrate 10.
H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
This connector set comprises a first connector and a second connector. The first connector includes a plurality of first connection terminals arranged on a first straight line parallel to a second direction. The first connection terminal has a first wide part having a larger width in the second direction than the other part of the first connection terminal. The second connector includes a plurality of third connection terminals. The third connection terminal has a second wide part having a larger width in the second direction than the other part of the third terminal. On the first straight line, the third connection terminal is positioned next to the first connection terminal. The position of the first wide part is misaligned with the position of the second wide part in the first direction.
Provided is a multilayer ceramic electronic component that can handle a larger current. A multilayer ceramic electronic component 100 according to the present invention comprises: a multilayer ceramic capacitor provided with a laminate and at least four or more external electrodes 30, the laminate having a first main surface 12a and a second main surface 12b opposing each other in a lamination direction, a first surface 12c and a second surface 12d opposing each other in a first direction orthogonal to the lamination direction, and a third surface 12e and a fourth surface 12f opposing each other in a second direction orthogonal to the lamination direction and the first direction, and the at least four or more external electrodes 30 being disposed on any of the first surface 12c, the second surface 12d, the third surface 12e, and the fourth surface 12f; and a junction electrode 40 disposed on the first main surface 12a or the second main surface 12b and electrically connecting at least two or more external electrodes of the same potential among the external electrodes 30. The present invention is characterized by satisfying, when the DC resistance of the multilayer ceramic capacitor 10 is denoted by Rdc1 and the DC resistance of the junction electrode 40 is denoted by Rdc3, Rdc1 ≤ Rdc3.
A receiver includes a quadrature mixer to perform frequency conversion to convert a radio-frequency signal into an I signal and a Q signal that have a 90° phase difference from each other and a surface acoustic wave (SAW) device to perform phase conversion on the I signal and the Q signal that are output from the quadrature mixer. In the SAW device, when α° represents a phase rotation amount of the I signal, β° represents a phase rotation amount of the Q signal, and n is an integer, (α+90±n×360−35.1)≤β≤(α+90+n×360+35.1) or (α−90+n×360−35.1)≤β≤(α−90+n×360+35.1).
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
H03H 9/145 - Driving means, e.g. electrodes, coils for networks using surface acoustic waves
A bulk acoustic resonator is provided that includes a substrate having a surface; a piezoelectric layer attached to the surface of the substrate via a bonding oxide (BOX) layer over the surface of the substrate; a conductor pattern including an interdigital transducer (IDT) that has interleaved fingers on a surface of the piezoelectric layer; at least one contact pad disposed at a selected location over the surface of the substrate and that is electrically connected to the IDT; and an electrically isolating layer between the at least one contact pad and the surface of the substrate. Moreover, at least a portion of the piezoelectric layer is absent between the at least one contact pad and the surface of the substrate.
H10N 30/05 - Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
H10N 30/06 - Forming electrodes or interconnections, e.g. leads or terminals
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
A coil component includes a drum core including a winding core portion and first and second flange portions, and first and second wires. A portion of the first wire that first comes into contact with an outer peripheral surface of the winding core portion when the first wire is traced from a first wire end to a second wire end is defined as a 1.0 turn portion of the first wire. A portion of the second wire where an angular position thereof about a central axis first coincides with an angular position of the 1.0 turn portion of the first wire, on a side of a second negative direction with respect to the central axis, when the second wire is traced from a first wire end to a second wire end is defined as a 1.0 turn portion of the second wire.
The ceramic electronic component includes a main body made of ceramic as a main material and having a first surface and a second surface facing each other, a dummy conductor disposed to cover at least a portion of an outer edge of a specific surface selected as at least one of the first surface and the second surface and electrically isolated therefrom, and land electrodes disposed on the second surface, and a ridge of an outer periphery of the specific surface of the main body is rounded.
At least one of transistors is in a device layer. A plurality of bumps are on one surface of the device layer. An insulating layer is on a surface of the device layer opposite to the surface having the plurality of bumps. The heat transfer layer is in contact with a surface of the insulating layer opposite to a surface on which the device layer is disposed. The heat transfer layer is formed of an insulating material having a thermal conductivity higher than a thermal conductivity of the insulating layer. When the device layer is viewed in plan view, one first transistor of the transistors includes a non-overlapping portion which is a portion not overlapping with the plurality of bumps, and the heat transfer layer is continuous from a portion overlapping with the non-overlapping portion to a portion overlapping with at least one of the plurality of bumps.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
A multilayer substrate that includes: a first thermoplastic resin layer including a first main surface, a second main surface opposite to the first main surface, and a via hole penetrating from the first main surface to the second main surface; a ceramic layer in contact with the first main surface; a second thermoplastic resin layer in contact with the second main surface; a first electrode on a surface of the ceramic layer in contact with the first main surface; a protective layer covering at least part of an outline of the first electrode; a second electrode on a surface of the second thermoplastic resin layer in contact with the second main surface; an interlayer connection conductor in the via hole and connecting the first electrode and the second electrode; and an intermetallic compound between the interlayer connection conductor and the first electrode.
An inductor component includes an element having a first main surface, a first interlayer insulator layer, an inter-wire insulator layer, and an inductor wire that extends in an area defined by the inter-wire insulator layer. The first interlayer insulator layer extends in the element to be parallel to the first main surface. The inter-wire insulator layer extends from the first interlayer insulator layer in a first positive direction orthogonal to the first main surface. In a cross section orthogonal to a center line of the inductor wire, portions of the inter-wire insulator layer are discontinuously arranged in a direction along the first main surface. One of the portions of the inter-wire insulator layer with a surface facing in the direction parallel to the first main surface being in contact with the element is an outer insulator layer in contact with an end surface of the first interlayer insulator layer.
An amplifier circuit includes a high frequency input terminal and a high frequency output terminal, amplifiers, an output transformer having an input-side coil and an output-side coil, inductors, and a bypass capacitor. An output end of the amplifier is connected to one end of the input-side coil and one end of the inductor. An output end of the amplifier is connected to the other end of the input-side coil and one end of the inductor. The other end of the inductor, the other end of the inductor, and one end of the bypass capacitor are connected to a midpoint of the input-side coil. One end of the output-side coil is connected to the high frequency output terminal.
A VOC adsorption rotor capable of desorbing an adsorbed VOC with high energy efficiency. The VOC adsorption rotor includes a cellular structure constructed to support an adsorbent to adsorb a VOC. The cellular structure is made of metal.
B01D 53/06 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with moving adsorbents
A multilayer substrate that includes: a first thermoplastic resin layer including a first main surface, a second main surface opposite to the first main surface, and a via hole penetrating from the first main surface to the second main surface; a ceramic layer in contact with the first main surface; an interlayer connection conductor in the via hole; a conductor portion on the ceramic layer and connected to the interlayer connection conductor; an intermetallic compound between the interlayer connection conductor and the conductor portion; and ceramic particles in the intermetallic compound, wherein the ceramic particles include first ceramic particles in contact with both the intermetallic compound and the conductor portion.
A VOC removal method that includes: adsorbing a VOC contained in a process gas by passing the process gas through an adsorption zone of a VOC adsorption rotor that includes a cellular structure supporting an adsorbent to adsorb a VOC, wherein the cellular structure is made of metal; desorbing the VOC adsorbed in the adsorption zone by heating the cellular structure by passing current through the cellular structure in a desorption zone of the VOC adsorption rotor and passing a gaseous substance through the desorption zone of the VOC adsorption rotor; and cooling the cellular structure heated in the desorption zone in a cooling zone of the VOC adsorption rotor.
B01D 53/06 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with moving adsorbents
The purpose of the present invention is to provide a multilayer inductor in which a decrease in magnetic permeability is further reduced while ensuring insulation characteristics. A multilayer inductor according to the present disclosure comprises an element body 10 having: a magnetic body M in which metal magnetic body layers ML containing metal magnetic body particles MP are laminated; a coil disposed inside the magnetic body M and around which coil conductors CD are wound; and an insulator I disposed between the coil conductors CD in the lamination direction. The insulator I has: a contact part I1 with the coil conductor CD extending along a direction intersecting the lamination direction; and a protrusion part I2 provided at both ends in a direction orthogonal to the lamination direction of the contact part I1 and extending toward the outside on both sides in a direction orthogonal to the lamination direction in the coil conductor CD. The thickness of the protrusion part I2 is thinner than the thickness of the contact part I1.
The present invention provides a laminated inductor and a laminated inductor array in each of which an element area is reduced and DC superimposition characteristics are further improved. A laminated inductor according to the present disclosure comprises: an element body 10 to which a magnetic layer is laminated, and the bottom surface of which is quadrangular; a first external electrode E1, second external electrode E2, third external electrode E3, and fourth external electrode E4 which are provided to the four corners of the bottom surface of the element body 10; a first winding part W1 to which a plurality of conductor layers that are disposed inside the element body are connected in the lamination direction, and which has a winding axis P in the lamination direction; a second winding part which is provided higher in the lamination direction than the first winding part W1, to which a plurality of conductor layers that are disposed in the element body are connected in the lamination direction, and which has a winding axis P in the lamination direction; a first through hole T1 which electrically connects the first external electrode E1 and one end of the first winding part W1, and which extends in the lamination direction; a second through hole T2 which electrically connects the second external electrode E2 and the other end of the first winding part W1, and which extends in the lamination direction; a third through hole T3 which electrically connects the third external electrode E3 and one end of the second winding part W2, and which extends in the lamination direction; and a fourth through hole T4 which electrically connects the fourth external electrode E4 and the other end of the second winding part W2, and which extends in the lamination direction, wherein the first winding part W1 and the second winding part W2 have an elliptical shape in plan view, and the first winding part W1 and/or the second winding part W2 are/is provided with an avoidance part A that avoids one through hole among the first through hole T1 to the fourth through hole T4.
This connector comprises a first insulating main body member, a first signal terminal, and a contact terminal. When the connector and a second connector are connected, a direction from the connector toward the second connector is defined as a first direction. The first main body member includes a protrusion having an end surface facing the first direction and a side surface connected to the end surface. The contact terminal includes a frame part having an annular shape surrounding the periphery of the first signal terminal when viewed in the first direction. The first signal terminal includes a first support part extending in the first direction and having a shape along the side surface, the first support part being supported by the side surface. When the connector and the second connector are connected, the first support part contacts a second signal terminal of the second connector. The end surface is positioned in the first direction with respect to the first support part.
The objective of the present invention is to assist a pilot in achieving a state suitable for flight. A flight assistance device (10) comprises a flight state detecting unit and a flight assistance unit (50). The flight state detecting unit detects a flight state of a pilot (90) who is flying by means of a flying device attached to the pilot. The flight assistance unit (50) is attached to the pilot (90) and assists the flight of the pilot (90) in accordance with the detected flight state from the flight state detecting unit. The flight assistance unit (50) assists the flight of the pilot (90) by causing a force to act on a necessary part of the pilot (90) to change the attitude of the pilot (90).
A filter according to the present disclosure disrupts a cell membrane, the filter being equipped with a filter base part that has a first main surface having a projection part and a second main surface on the opposite side from the first main surface, and that defines a plurality of through-holes that allow the first main surface and the second main surface to communicate. The projection part is positioned between adjacent through-holes, and projects in a first direction away from the filter base part. In a cross-section cut in a second direction in which the through-holes are adjacent to each other, the projection part is positioned inside the end part of the filter base part positioned between the through-holes adjacent to each other, and the thickness of the projection part in the second direction decreases toward the top part of the projection part.
C12Q 1/00 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions
Provided is a vibration device that makes it possible for foreign matter adhered to a translucent body to be removed. A vibration device according to the present invention comprises a substantially cylindrical internal vibration body that can amplify vibration and extends in a first direction, a piezoelectric element that is connected to one end in the first direction of the internal vibration body and can generate vibration, a translucent body that is connected to the other end in the first direction of the internal vibration body and has an optical axis that extends along the first direction, and a substantially cylindrical external vibration body that is provided to surround the internal vibration body and extends in the first direction. The external vibration body has a first connection part that is connected to the translucent body, an attenuator part that extends from the first connection part to the outside of the translucent body along a second direction that intersects the first direction and is configured to dampen vibration, and a cylinder part that is connected to the first connection part and the attenuator part and extends along the first direction. The cylinder part is provided at a gap from the internal vibration body in the second direction, and at least one of the attenuator part and the cylinder part is non-axisymmetric with respect to the optical axis.
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
The present invention improves cycle characteristics. A secondary battery according to the present invention comprises a positive electrode, a negative electrode, a separator that is between a principal surface of the positive electrode and a principal surface of the negative electrode, and an electrolyte solution. The positive electrode includes a positive electrode active material layer. The positive electrode active material layer includes a positive electrode active material and a first polymer compound. The negative electrode includes a negative electrode active material layer. The negative electrode active material layer includes a negative electrode active material and a second polymer compound. The negative electrode active material includes a first negative electrode active material that includes silicon. The second polymer compound includes an NVA polymer that includes N-vinylacetamide as a monomer. The separator includes a base material, a positive electrode–side coating layer that is on the positive electrode side of the base material, and a negative electrode–side coating layer that is on the negative electrode side of the base material. The positive electrode–side coating layer includes the first polymer compound. The negative electrode–side coating layer includes the NVA polymer.
This connector is connected to a second connector, and comprises: a body member having insulating properties; a signal terminal; and a first contact terminal connected to a ground potential or a power supply potential. When the connector is connected to the second connector, the direction from the connector toward the second connector is defined as a first direction. The body member includes a protrusion having an end surface facing the first direction, and a side surface connected to the end surface. When viewed in the first direction, the first contact terminal includes: a ring-shaped frame part surrounding the periphery of the signal terminal; and a terminal part. The protrusion is sandwiched between the signal terminal and the terminal part in a second direction that is orthogonal to the first direction.
A filter (10) comprises a piezoelectric substrate (50) and an IDT electrode (54) disposed on the piezoelectric substrate (50). The IDT electrode (54) has N (N is an integer greater than or equal to 4) electrode fingers arranged in parallel with one another. Where M1 is one of integers greater than or equal to an integer obtained by rounding off the first decimal place of 0.2 N and less than or equal to an integer obtained by rounding off the first decimal place of 0.3 N, M2 is one of integers greater than or equal to an integer obtained by rounding off the first decimal place of 0.45 N and less than or equal to an integer obtained by rounding off the first decimal place of 0.55 N, and M3 is one of integers greater than or equal to an integer obtained by rounding off the first decimal place of 0.7 N and less than or equal to an integer obtained by rounding off the first decimal place of 0.8 N, the M1-th electrode finger pitch, the M2-th electrode finger pitch and the M3-th electrode finger pitch are all larger than any of the electrode finger pitches, excluding the M1-th, M2-th and M3-th electrode finger pitches.
A simulation apparatus (10) comprises a computation device (11), and a storage device (13) for storing a program executed by the computation device (11). The computation device (11) defines a lattice-form space representing a powder material, generates state data indicating the phase state of cells constituting the space, and outputs the state data to an Ising machine (20), thereby optimizing the state data using a QUBO model (210) of the Ising machine (20) and acquiring a simulation result indicating the binding state between a plurality of particles after a change.
This elastic wave device has: a resonator that comprises a piezoelectric layer having a first main surface and a second main surface on the opposite side of the first main surface, an upper electrode provided on the first main surface of the piezoelectric layer, and a lower electrode provided on the second main surface of the piezoelectric layer; and a capacitive element that comprises an upper interdigital transducer (IDT) electrode provided on the first main surface of the piezoelectric layer, and a lower IDT electrode provided on the second main surface of the piezoelectric layer. The capacitive element is connected in parallel with the resonator, and the upper IDT electrode and the lower IDT electrode of the capacitive element are electrically connected to each other.
An acoustic wave device includes first and second acoustic wave resonators with first and second IDT electrodes on a common piezoelectric substrate. A first apodization area in the first IDT electrode includes first and second edge areas with a first center area therebetween. A second apodization area in the second IDT electrode includes third and fourth edge areas with a second center area therebetween. At least one first mass-adding film is located in at least one of the first and second edge areas and overlaps the electrode fingers of the first IDT electrode, and at least one second mass-adding film is located in at least one of the third and fourth edge areas and overlaps the electrode fingers of the second IDT electrode. A thickness of the at least one first mass-adding film is equal to a thickness of the at least one second mass-adding film.
A high frequency module includes a first reception filter, a second reception filter, a first low noise amplifier, a first inductor, a second inductor, and a mounting substrate. The first reception filter, the second reception filter, the first inductor, and the second inductor are disposed on a first main surface of the mounting substrate. When seen in plan view from a thickness direction of the mounting substrate, an outer size of the first inductor is larger than an outer size of the second inductor. The first inductor includes a first part around which part of a wire is closely wound and a second part around which a remaining part of the wire is sparsely wound. In an orthogonal direction that is orthogonal to the thickness direction, the first part of the first inductor and the first reception filter do not overlap.
A power factor corrector (PFC) is used to receive input power and supply power to a load via a DC/DC converter. A method of controlling a PFC is executed by a PFC controller used to control the PFC, where the PFC controller includes a voltage controller. The method includes receiving a first signal transmitted from a DC/DC controller used to control the DC/DC converter, where the first signal indicates the load, deriving a second signal based on the first signal, where the second signal is an expected output control signal of the voltage controller under the load indicated by the first signal, and configuring the voltage controller according to the second signal so as to keep an output voltage Vbulk of the PFC to the DC/DC converter stable.
H02M 1/42 - Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
A power supply system includes: a first module including a first power amplifier; a first power line supplying power to the first module; a second power line supplying power to the first module; a first capacitance connected at one end to the first power line; a second capacitance connected at one end to the second power line; a first switch that switches between a state in which the first power line is electrically connected to the first module and a state in which the second power line is electrically connected to the first module; a second switch that can connect the second capacitance to a reference potential when the first power line is connected to the first module; and a third switch that can connect the first capacitance to a reference potential when the second power line is connected to the first module.
An acoustic wave device includes a support, a piezoelectric layer including first and second main surfaces, and an IDT electrode including first and second busbar portions, and first and second electrode fingers connected to the first and second busbar portions and being interdigitated with each other. A region in which first and second electrode fingers adjacent to each other overlap each other is an intersection region. A cavity portion is provided in the support and overlaps the intersection region. At least one of the first and second busbar portions includes an outer busbar not overlapping the cavity portion, and at least one of protruding electrodes extending from the outer busbar toward the intersection region. The at least one protruding electrode overlaps an outer peripheral edge of the cavity portion.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/13 - Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
50.
PULSE WAVE SIGNAL PROCESSOR, PHYSIOLOGICAL INFORMATION MEASUREMENT DEVICE, AND CONTACT-PRESSURE ABNORMALITY DETERMINATION METHOD
A pulse wave feature calculator is provided that calculates a value of a pulse wave feature based on a steepness of a rise of a pulse wave measured with a photoplethysmographic sensor. Based on the value of the pulse wave feature calculated by the pulse wave feature calculator, a contact pressure determinator determines whether a contact pressure, which is a pressure with which the photoplethysmographic sensor is pressed against a measurement site, is within a range, such as an appropriate range.
An electrode including a film having two-dimensional particles, the two-dimensional particles containing at least a metal cation and one or a plurality of layers, the layers including a layer body represented by: MmXn, wherein M is at least one Group 3 to 7 metal and contains at least a Ti atom, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, m is more than n and 5 or less; and a modifier or terminal T is present on a surface of the layer body, wherein T is at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom, the metal cation contains a Li cation, and a content of the Li cation in the two-dimensional particles is 5.4 mol or more with respect to 100 mol of the Ti atom.
A solid electrolytic capacitor that includes: an anode plate including a core portion, a porous layer having pores on at least one main surface of the core portion, and a dielectric layer on a surface of the porous layer and extending into the pores of the porous layer; and a cathode layer that includes a solid electrolyte layer on a surface of the dielectric layer. The solid electrolyte layer includes a conductive polymer layer inside the pores of the porous layer, the conductive polymer layer comprising a mixture of a conductive polymer and an insulating material. The insulating material is a material which contains an OH group, a COOH group, a CO group, or an NH2 group in a molecule, has hygroscopicity, and does not have a function as a dopant for the above-described conductive polymer.
A resin composition that includes: a resin component having a liquid crystal polymer as a primary component thereof; and an inorganic filler, wherein a specific surface area of the inorganic filler is 30 m2/cm3 or less, a maximum diameter of the inorganic filler is 100 μm or less, and a content of the inorganic filler is 0.1% by volume to 60% by volume.
C08G 63/06 - Polyesters derived from hydroxy carboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxy carboxylic acids
A method for detecting an amine compound, the method including: bringing a specimen into contact with an isothiocyanate compound having a phenanthrenequinone skeleton; and detecting a thiazole derivative formed from an amine compound contained in the specimen and the isothiocyanate compound.
G01N 31/22 - Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroupsApparatus specially adapted for such methods using chemical indicators
G01N 21/33 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
G01N 27/48 - Systems using polarography, i.e. measuring changes in current under a slowly-varying voltage
A signal processing circuit is provided that includes a capacitor coupled to a signal line to be coupled to a sensor, and coupled in series with the sensor, and a variable resistance circuit coupled in parallel with the capacitor. The variable resistance circuit and the capacitor form a high-pass filter that allows a signal having a cutoff frequency or higher to pass through the high-pass filter. In the variable resistance circuit, a resistance value is set to a first resistance value when a target signal having a peak component on a time axis is allowed to pass through the high-pass filter, and the cutoff frequency at the first resistance value is 1/10 or less of a frequency of the peak component.
A module includes a core substrate provided with a first surface and a second surface that define front and rear surfaces, respectively, the core substrate being provided with a through hole that connects the first surface and the second surface to each other, a redistribution layer arranged to cover the first surface and the through hole of the core substrate, a first component at least partially arranged in the inside of the through hole, and a second component mounted on a side of the second surface of the core substrate as partially being superimposed on the through hole. The first component is electrically connected to the redistribution layer. The first component is electrically directly connected to the second component in a portion where the second component is superimposed on the through hole.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.
Provided is a multilayer ceramic electronic component for which it is not necessary to design the internal structure per capacitance, while suppressing an increase in capacitance and an increase in DC resistance. A multilayer ceramic electronic component 100 according to the present invention includes a multilayer ceramic capacitor and a conductor section. The multilayer ceramic capacitor is provided with: a laminate including a plurality of dielectric layers stacked on one another and including a first principal face and a second principal face that are opposite to each other in the stacking direction, a first side face and a second side face that are opposite to each other in the width direction, which is perpendicular to the stacking direction, and a first end face and a second end face that are opposite to each other in the length direction, which is perpendicular to the stacking direction and the width direction, the laminate including a first internal electrode layer exposed at the first end face and the second end face, as well as a second internal electrode layer exposed at the first side face and the second side face; a first external electrode and a second external electrode connected to the first internal electrode layer; and a third external electrode and a fourth external electrode connected to the second internal electrode layer. The conductor section is electrically connected to the first external electrode and the second external electrode and is electrically connected to neither the third external electrode nor the fourth external electrode. The DC resistance RdcA of the conductor section is smaller than the DC resistance RdcB of the multilayer ceramic capacitor, and the conductor section is a lead frame.
In the present invention, an annular member with a closed or slitted ring shape has a first opening. A wiring substrate is arranged along the outer peripheral surface of the annular member so as to overlap with the first opening. A first light-emitting element and a light-receiving element are mounted in a position on the wiring substrate that overlaps with the first opening. The first light-emitting element emits light toward a space encompassed by the annular member. The light-receiving element receives light arriving from the space encompassed by the annular member. A transparent resin member continuously covers the inner peripheral surface of the annular member, the first light-emitting element, and the light-receiving element in a circumferential direction.
A61B 5/107 - Measuring physical dimensions, e.g. size of the entire body or parts thereof
A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
A61B 5/1455 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value using optical sensors, e.g. spectral photometrical oximeters
A61B 5/16 - Devices for psychotechnicsTesting reaction times
A61B 5/22 - ErgometryMeasuring muscular strength or the force of a muscular blow
Provided is a composite substrate in which delamination at a bonding interface between a ceramic substrate and a resin substrate and the occurrence of cracks in the resin substrate are reduced. This composite substrate comprises a resin substrate 20 and a low-temperature fired ceramic 10 bonded to the resin substrate 20 in a thickness direction. The low-temperature fired ceramic 10 is a substantially rectangular parallelepiped having a first main surface 10a, a second main surface 10b facing the first main surface 10a, and side surfaces 10c connecting the first main surface 10a and the second main surface 10b. The first main surface 10a is directly bonded to the resin substrate 20, the corners from the first main surface 10a to the side surfaces 10c are rounded with a radius R1, the corners of the adjacent side surfaces 10c are rounded with a radius R2, and the radius R2 is larger than the radius R1.
The present disclosure provides: a coil component that, with a simple structure, can constitute a coil having two or more turns when mounted on a substrate; and a circuit device including the coil component. A coil component (1) according to the present disclosure comprises a housing (4), a coil (L1) having a coil part (2a) that is disposed inside the housing (4) and is disposed substantially parallel to a main surface (40A), and a coil (L2) having a coil part (3a) that is disposed inside the housing (4) so that the opening of the coil (L2) overlaps the opening of the coil (L1) when viewed from the direction of the main surface (40A). The coil (L1) has a lead wire (2b) and a lead wire (2d) that are connected to the coil part (2a), the lead wires (2b, 2d) being led out from the side-surface (41) side of the housing (4) and being bent along the side-surface (41) side. The coil (L2) has a lead wire (3b) and a lead wire (3d) that are connected to the coil part (3a), the lead wires (3b, 3d) being led out from the side-surface (44) side adjacent to the side surface (41) and being bent along the side-surface (44) side.
Provided is a multilayer ceramic capacitor 1 in which distortion in the vicinity of an interface of a terminal electrode 19 of a ceramic layer 28 is reduced. An external electrode 22 of the multilayer ceramic capacitor 1 includes a first metal grain 40. In a cross section parallel to a height direction T and a length direction L, two or more grain boundaries 46 of the first metal grain 40 are present at a junction 50 between an internal electrode 27 and the external electrode 22, and the grain size of the first metal grain 40 in which the grain boundary 46 is present in the junction 50 is 1.2 times or less of a thickness 67 in the height direction T of the internal electrode 27.
This solid electrolyte has: a first crystallite which is formed into a primary particle and has a first crystal structure; a second crystallite which is formed into the same primary particle as the first crystallite and has a second crystal structure that is different from the first crystal structure; and an amorphous phase. The first crystallite and the second crystallite each contain lithium, the first crystal structure is a hexagonal crystal structure, the second crystal structure is an orthorhombic crystal structure, and the crystallite size of the first crystallite and the crystallite size of the second crystallite are both 50 nm or less.
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
C01B 17/20 - Methods for preparing sulfides or polysulfides, in general
This power amplification circuit (100) comprises: an input terminal (T1) and an output terminal (T2); a distributor (120); amplifiers (141A, 142A); a phase adjuster (143A); a substrate (241); and a substrate (242) mounted on the substrate (241). The distributor (120) is connected to the input terminal (T1) and distributes an input signal from the input terminal (T1) to a first path and a second path. The amplifier (141A) is connected to the first path of the distributor (120). The amplifier (142A) is connected to the second path of the distributor (120). The phase adjuster (143A) is connected between the output of the amplifier (141A) and the output of the amplifier (142A). The amplifiers (141A, 142A) constitute a Doherty amplifier. The output terminal (T2) is electrically connected to a connection node of the second amplifier (142A) and the phase adjuster (143A). The amplifier (141A) is a carrier amplifier and is formed on the substrate (241). The amplifier (142A) is a peak amplifier and is formed on the substrate (242). The substrate (241) is a semiconductor substrate containing a material having a Si-based base material as a main component. The substrate (242) is a semiconductor substrate containing a material having a compound of a group III element and a group V element as a main component.
This electronic component is provided with an electronic component element body, a first external electrode, and a second external electrode. The electronic component element body is provided with a plurality of internal electrodes. The first external electrode comprises a metal film that does not contain a glass component, the metal film having a surface roughness maximum value of 1.0 μm. The second external electrode is formed so as to cover the first external electrode, and includes a conductor and a resin. The electronic component element body has a first end surface and a second end surface at which the internal electrodes are exposed, and a side surface connecting the first end surface and the second end surface. The first external electrode is formed on at least the internal electrode-exposed portion and the first end surface and the second end surface to a thickness in the range of 0.5 μm to 20 μm. The first external electrode has a covering part overlapping the side surface. The length of the covering part is 50 μm or less.
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
This acoustic wave device includes: a piezoelectric layer which has a first main surface and a second main surface on the side opposite to the first main surface; an upper electrode which is provided on the first main surface of the piezoelectric layer; a lower electrode which is provided on the second main surface of the piezoelectric layer; a support member which is disposed facing the second main surface of the piezoelectric layer and which is provided with a cavity portion in a region where at least the upper electrode and the lower electrode overlap; a counter electrode which is provided inside the cavity portion and which is disposed facing the lower electrode; and a lead-out structure which is connected to the counter electrode and which is led out to the first main surface side of the piezoelectric layer.
This acoustic wave filter device includes: a series arm resonator that is connected between an input terminal and an output terminal; a parallel arm resonator that is connected between a node, which is on a path connecting the input terminal and the output terminal, and a ground terminal; and a capacitive element that is connected between the input terminal and the output terminal, and that is connected in parallel with the series arm resonator. The acoustic wave filter device includes a plurality of series arm resonators. The capacitive element is connected in parallel to, among the plurality of series arm resonators, a series arm resonator that is connected to the input terminal.
A vehicle robot R includes: a vehicle (10) including wheels (12); an angular velocity sensor; a flywheel (43); a motor (44); an auxiliary part (20) for supporting the vehicle (10) so that an inclination angle (A2) of the vehicle (10) with respect to a gravity axis (GA) is a predetermined initial inclination angle (A1); and a control device. The control device can execute standing control and fall prevention control. The standing control includes: a step in which by performing a comparison with a torque command value in an initial state, outputs a torque command value of a reverse rotation direction side; and a step for bringing the torque command value close to zero when the angular velocity is greater than or equal to a predetermined positive threshold value. The control device ends the standing control when, after the start of the standing control, the angular velocity becomes zero or less, and starts the fall prevention control.
Methods and devices for enhancing performance of a power splitter are presented. According to one aspect, the power splitter is realized via lumped elements that include inductively coupled coils. Values of the lumped elements are based on an equivalent circuit of the power splitter that includes a star topology provided by a mutual inductance connected to a first port of the power splitter and respective inductances of the inductively coupled coils modified by the mutual inductance connected between the mutual inductance and respective second and third ports of the power splitter. A coupling factor of the inductively coupled coils has a magnitude that is in a range from 0.15 to 0.45. The coupling factor is negative. Respective capacitors are connected to the ports of the power splitter. The respective capacitors include switchable capacitors.
This connector comprises a first signal terminal that includes: a mounting part at least a portion of which extends in a second direction orthogonal to a first direction; a back surface part that is continuous with the mounting part and extends in a third direction orthogonal to the first direction and the second direction; a top surface part that is continuous with the back surface part and has a first portion extending in the second direction; and a contact part that is continuous with the top surface part, is located at a position different from the back surface part in the second direction, and overlaps the back surface part when viewed in the second direction. The back surface part has a widened portion having a width in the first direction that is wider than the width of the first portion in the first direction. At least a portion of the contact part has a width in the first direction that is wider than the width of the first portion in the first direction, or at least a portion of the contact part has a length in the second direction that is longer than the thickness of the first portion in the third direction.
A capacitor 1 comprises: a capacitor element 10 having an element body 11 and an external electrode 12a provided on an end surface of the element body 11; a lead-out terminal 20 electrically connected to the external electrode 12a; and an exterior case 30 in which the capacitor element 10 is housed. The exterior case 30 has a bottomed cylindrical shape having an opening part 31, and includes a bottom part 32 facing the opening part 31 in a first direction D1, and a side wall part 33 extending in the first direction D1 from the bottom part 32 toward the opening part 31. The lead-out terminal 20 is led out of the opening part 31 onto an outer surface 33a of the side wall part 33 while being bent, and extends from the opening part 31 side toward the bottom part 32 side in the first direction D1. The lead-out terminal 20 has a first surface 20a facing the outer surface 33a of the side wall part 33 in a second direction D2 perpendicular to the outer surface 33a of the side wall part 33, and a second surface 20b opposite the first surface 20a in the second direction D2. The outer surface 33a of the side wall part 33 is provided with a guard part 50 facing the second surface 20b of the lead-out terminal 20 in the second direction D2.
A capacitor module 1 comprises: a capacitor element 10 having an element body 11, a first external electrode 12a provided on a surface of the element body 11, and a second external electrode 12b provided at a position separated from the first external electrode 12a on the surface of the element body 11; a first bus bar 20a electrically connected to the first external electrode 12a; a second bus bar 20b electrically connected to the second external electrode 12b; and an insulation sheet 30 which is sandwiched between the first bus bar 20a and the second bus bar 20b and forms a laminated structure together with the first bus bar 20a and the second bus bar 20b. The first bus bar 20a has a first through-hole 21aa, and the insulation sheet 30 has a first projection part 31aa projecting on the first bus bar 20a side. The first projection part 31aa is locked in the first through-hole 21aa.
Methods and devices for enhancing performance of a power splitter are presented. According to one aspect, the power splitter is realized via lumped elements that include inductively coupled coils. Values of the lumped elements are based on an equivalent circuit of the power splitter that includes a star topology provided by a mutual inductance connected to a first port of the power splitter and respective inductances of the inductively coupled coils modified by the mutual inductance connected between the mutual inductance and respective second and third ports of the power splitter. A coupling factor of the inductively coupled coils has a magnitude that is in a range from 0.15 to 0.45. The coupling factor is negative. Respective capacitors are connected to the ports of the power splitter. The respective capacitors include switchable capacitors.
A radio frequency module includes a switch, first and second filters. The switch includes a common terminal and two selection terminals. A first communication path is connected to a first selection terminal. A second communication path is connected to a second selection terminal. The first filter is in the first communication path and includes first and second communication bands. The second filter is in the second communication path and includes third and fourth communication bands. At least a part of the third communication band overlaps the first communication band, but not the second communication band. The switch is switchable between first and second connections. In the first connection, the common terminal is connected to the first selection terminal. In the second connection, the common terminal is connected to the first selection terminal, and the common terminal is connected to the second the selection terminal.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
An inductor element includes an inductor wiring having an interruption portion in at least one place, a pair of external terminals that are connected to each of one side part and the other side part, which are located on both sides of the interruption portion, of the inductor wiring and that are exposed to an outside, at least one inductor variable resistance portion that is provided at the interruption portion, and at least one variable resistance terminal that is connected to the inductor variable resistance portion and that is exposed to the outside. The inductor variable resistance portion connects the one side part and the other side part, and changes a resistance value between the one side part and the other side part.
H01F 17/04 - Fixed inductances of the signal type with magnetic core
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
77.
SYSTEMS, DEVICES, AND METHODS FOR INTEGRATED VOLTAGE REGULATORS
Disclosed embodiments may include systems, devices and methods for fabricating high-density charge-storage devices and power conversion devices. In one embodiment, a device is disclosed, comprising an inductor. The inductor includes a first inductor surface and a second inductor surface opposite the first inductor surface. The inductor further includes a first inductor substrate including a cavity. A seed layer is formed on a bottom surface of the cavity, and a magnetic layer is formed on the seed layer. The magnetic layer includes a plurality of stacked magnetic layers separated from each other by an insulating material layer.
A power supply module including a substrate, an electronic component provided on an upper surface of the substrate, a lower board electrically connected with the electronic component through the substrate, and an upper board electrically connected another end of the at least one pillar opposing an end of the at least one pillar that is electrically connected with the at least one lower board, the at least one upper board being electrically connected with the substrate. A pillar extends between the lower board and the upper board. The pillar includes a first end electrically connected with the lower board and a second end electrically connected with the upper board. A magnetic material is provided around a periphery of the pillar.
A high frequency module includes a low noise amplifier, a switch, a first inductor, a second inductor, a first filter, and a second filter. The first inductor is connected between the low noise amplifier and an output terminal of the switch. The second inductor is connected between a path between the first inductor and the output terminal of the switch, and an input/output terminal of the switch. The switch is configured to switch between a first state where a first input terminal connected to the first filter and the output terminal are connected, and the input/output terminal and a ground terminal are connected, and a second state where a second input terminal connected to the second filter and the input/output terminal are connected.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
A semiconductor device includes: a first semiconductor element in which a plurality of transistors arranged in one direction are electrically connected in parallel, and a second semiconductor element provided in both end portions in the arrangement direction of the transistors, wherein the lower an ambient temperature is, the greater a current flowing through the second semiconductor element relatively increases.
A bias circuit includes: a first transistor having an emitter or source from which a bias is supplied to a first amplifier; a first terminal electrically connected to a circuit that controls a bias of a predetermined amplifier; and a first inverting amplifier having a first input terminal electrically connected to the emitter or source of the first transistor and a first output terminal electrically connected to a base or gate of the first transistor and the first terminal, the first inverting amplifier inverting and amplifying a voltage supplied to the first input terminal.
An N-path filter includes N-number signal paths connected in parallel to each other between first and second input-output terminals. Each N-number signal path includes a first switch connected to the first input-output terminal to modulate an input signal, a second switch connected to the second input-output terminal to modulate the input signal in a same phase as that of the switch, and a base filter connected between the first and second switches. The first and second switches are operable to modulate the input signal in a phase of one period including different phases of the different signal paths. The base filter is a band pass filter including only passive elements.
A circuit assembly includes a first printed circuit board (PCB), a switching device located on a first side of the first PCB, a heatsink attached to a second side surface of the first PCB opposite to the first side, and an L-shaped metal plate attached to the heatsink and to the first PCB.
Provided is a multilayer ceramic electronic component that is configured to handle squeaking and makes it easy to distinguish a mounting surface side and a non-mounting surface side. This multilayer ceramic electronic component 10 comprises: a multilayer ceramic capacitor 10 that comprises a layered body 12 and two external electrodes 30a, 30b; a first spacer 52 that is connected to one external electrode 30a; a second spacer 54 that is connected to the other external electrode 30b; and a third spacer 56 that is provided between the first spacer 52 and the second spacer 54. The layered body 12 has a first surface 12a that is on a non-mounting surface side, and the first surface 12a is a different color from the third spacer 56.
The present invention provides a multilayer band-pass filter that includes at least one LC resonator inside a laminate in which a plurality of dielectric layers are stacked. The LC resonator includes a capacitor conductor pattern, a line conductor pattern, and a GND conductor pattern disposed on the surface of one of the plurality of dielectric layers, and first and second interlayer connecting conductors extending in the stacking direction. The capacitor conductor pattern and the line conductor pattern are connected by the first interlayer connecting conductor. The line conductor pattern and the GND conductor pattern are connected by the second interlayer connecting conductor. Provided that the "via length" is defined to be the length of the first interlayer connecting conductor in relation to the stacking direction and the "line length" is defined to be the length of the gap between the first interlayer connecting conductor and the second interlayer connecting conductor, the via length is greater than the line length.
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
33, and contains a perovskite compound in which the A site is Ba. The barrier film 28 includes Ba and at least one of S and C. The barrier film 28 covers both principal surfaces 12a and 12b and both side surfaces 12c and 12d, and covers both end surfaces 12e and 12f except for an exposed surface 29 where the internal electrode layer 16 is exposed. The external electrode 24 is in contact with the internal electrode layer 16 at the exposed surface 29.
Provided is a multilayer ceramic capacitor having higher moisture resistance reliability. In the multilayer ceramic capacitor 1, a difference between a first silicon concentration at an outer layer position A and a first silicon concentration at a side margin position B is 0.2-2.5 mol%, and a first silicon concentration at an origin O is from equal to or greater than the first silicon concentration at the outer layer position A to equal to or less than the first silicon concentration at the side margin position B, or is from equal to or greater than the first silicon concentration at the side margin position B to equal to or less than the first silicon concentration at the outer layer position A.
An azimuth measurement device (1) comprises a first angular velocity sensor (11) that has a first detection axis (11D) extending along the horizontal direction and detects a first angular velocity with the first detection axis (11D) as the center of rotation, a rotation mechanism (13) that has a rotation axis (13R) extending along the vertical direction and rotates the first detection axis (11D) of the first angular velocity sensor (11) with a rotation axis (13R) as the center of rotation, and a second angular velocity sensor (12) that is used to correct the rotation angle (alpha) of the first detection axis (11D) in the rotation mechanism (13), the second angular velocity sensor (12) having a second detection axis (12D) extending along the vertical direction and detecting a second angular velocity having the second detection axis (12D) as the center of rotation.
A capacitor module 1 comprises: a plurality of capacitor elements 10 each having an element body 11, a first external electrode 12a provided on one end surface of the element body 11, and a second external electrode 12b provided on the other end surface facing the one end surface of the element body 11 in a first direction D1; and a plurality of connection terminals 20 electrically connected to the plurality of capacitor elements 10. The plurality of capacitor elements 10 include a first capacitor element 10a and a second capacitor element 10b which are adjacent to each other in the first direction D1 so that the first external electrodes 12a having the same polarity face each other apart from each other. The plurality of connection terminals 20 include: a first main connection terminal 21a that is electrically connected to the first external electrode 12a of the first capacitor element 10a and the second capacitor element 10b at a position separated from the first capacitor element 10a and the second capacitor element 10b; a first sub connection terminal 22a that is electrically connected to the first main connection terminal 21a at one end side, and that is electrically connected to the first external electrode 12a of the first capacitor element 10a at the other end side; and a second sub connection terminal 22b that is electrically connected to the first main connection terminal 21a at one end side, and that is electrically connected to the first external electrode 12a of the second capacitor element 10b at the other end side. A first through hole 31a is provided at the first main connection terminal 21a. A dimension P1 of the first through hole 31a in the first direction D1 is smaller than the maximum distance Q1 in the first direction D1 between a surface 22aa on a side opposite to the second sub connection terminal 22b in the first sub connection terminal 22a and a surface 22ba on a side opposite to the first sub connection terminal 22a in the second sub connection terminal 22b, and the first sub connection terminal 22a and the second sub connection terminal 22b pass through the first through hole 31a in a state in which one end of each are in contact with each other and the other ends are separated from each other.
Provided is a multilayer ceramic capacitor in which occurrence of "singing" is suppressed and which is reduced in size and increased in capacity. This multilayer ceramic capacitor comprises a plurality of dielectric layers 20 and a plurality of inner electrode layers 30 which are alternately layered in a layering direction T, and a first side face WS1 and a second side face WS2 which face each other in a width direction W, wherein the distance L1 between the first side face WS1 and an end E1L which is the closest to the first side face WS1 of the ends of the plurality of inner electrode layers 30 on the first side face WS1 side is smaller than the distance L2 between the second side face WS2 and an end E2L which is the closest to the second side face WS2 of the ends of the plurality of inner electrode layers 30 on the second side face WS2 side, and a distance L3 which is the maximum of the distances in the width direction W between the ends of the plurality of inner electrode layers 30 in the width direction W that are side by side on the first side face WS1 side is smaller than a distance L4 which is the maximum of the distances in the width direction W between the ends of the plurality of inner electrode layers 30 in the width direction W that are side by side on the second side face WS2.
A power amplification circuit (100) is provided with an input terminal (T1), an output terminal (T2), amplifiers (110, 120), a balun (140), and semiconductor substrates (241, 242). The amplifier (110) amplifies a high-frequency signal received by the input terminal (T1). The amplifier (120) further amplifies the high-frequency signal amplified by the amplifier (110). The balun (140) is connected to the amplifier (120) and converts an unbalanced line into two balanced lines. The amplifier (110) and the amplifier (120) are formed on the semiconductor substrates. One balanced line is connected to a terminal (T21) of the output terminal (T2). The other balanced line is connected to a terminal (T22) of the output terminal (T2). The frequency of the high-frequency signal to be transmitted is 100 GHz or higher. The balun (140) is formed on the semiconductor substrate (241).
H03F 1/56 - Modifications of input or output impedances, not otherwise provided for
H01P 5/10 - Coupling devices of the waveguide type for linking lines or devices of different kinds for coupling balanced lines or devices with unbalanced lines or devices
H03F 3/19 - High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
H03H 7/42 - Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
This magnetic core comprises a core back part and a tooth part, said core back part having a front surface facing a first direction toward the rotation axis of a rotary electric machine when the magnetic core is incorporated in the rotary electric machine. The tooth part includes a tooth body part extending from the front surface in the first direction and a tooth tip part provided at the tip of the tooth body part. The tooth tip part has a back surface facing the reverse direction of the first direction. The tooth body part has an end surface that faces a second direction along the rotation axis when the magnetic core is incorporated in the rotary electric machine. The end surface has a recessed curved surface that smoothly connects the end surface to the front surface of the core back part or the back surface of the tooth tip part, and the curved surface is formed by a first curved surface formation part that is a part of the tooth body part.
Provided are a lens unit, a camera module, an imaging system, and a mobile object, the lens unit having a vibration mechanism and achieving a higher degree of freedom in the mounting position to a mounting part of a vehicle. A lens unit (20) comprises: a first housing (23) in which a first lens (31) is provided; a lens barrel (22) in which lenses (32)-(36) located further toward the image side than the first lens (31) are provided, and which is provided radially inward of the first housing (23) and further toward the image side than the first lens (31); and a vibration mechanism (60) which is provided between the first housing (23) and the lens barrel (22). The first lens (31) is inserted into an opening (150a) formed in a vehicle-side mounting part (150) to which the lens unit is mounted, from the back surface side of the mounting part (150), and protrudes from the front surface of the mounting part (150). A top plate part (23b) of the first housing (23) is disposed inside the back surface of the mounting part (150).
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
B60R 1/20 - Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
95.
MULTILAYER CERAMIC CAPACITOR, PRODUCTION METHOD FOR MULTILAYER CERAMIC CAPACITOR, AND PRODUCTION METHOD FOR MOUNTING STRUCTURE FOR MULTILAYER CERAMIC CAPACITOR
A multilayer ceramic capacitor (1) according to the present invention comprises a capacitor body (10), a first external electrode (20A), and a second external electrode (20B). A first principal surface (101) is on one side in the layering direction (DS) of the capacitor body (10). The first external electrode (20A) includes a first base electrode layer (21A) and a first surface electrode layer (22A). The first base electrode layer (21A) is provided on the first surface (101) so as to cover a first via conductor (13A). The first surface electrode layer (22A) directly covers the first base electrode layer (21A). The second external electrode (20B) is provided on the first principal surface (101) at a gap from the first external electrode (20A) so as to cover a second via conductor (13B). An outer surface (221A) of the first surface electrode layer (22A) extends away from the first principal surface (101) from an end edge (21AE) of the first base electrode layer (21A) on the first principal surface (101).
The present invention comprises: a dielectric substrate (Sb1); a ground electrode (GND), an unbalanced terminal (TU1), and a pair of balanced terminals including a first balanced terminal (TB1) that are provided on the dielectric substrate; a main line (ML1) in which one end (Es1) is connected to the unbalanced terminal and the other end (Ee1) is open; a first sub line (SL1) in which one end (Ee2) is connected to the first balanced terminal and the other end (Es2) is connected to the ground electrode; a first line (CL1) in which one end (Ee2) is connected to the first balanced terminal and the other end (Ec1) is open; and a second line (CL2) in which one end (Es2) is connected to the ground electrode and the other end (Ec2) is open, wherein the first sub line (SL1) is positioned between the first line (CL1) and the main line (ML1) and between the second line (CL2) and the main line (ML1), and the other end (Ec1) of the first line faces the other end (Ec2) of the second line.
H01P 5/10 - Coupling devices of the waveguide type for linking lines or devices of different kinds for coupling balanced lines or devices with unbalanced lines or devices
H03H 7/42 - Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
A filter includes a series arm resonator, parallel arm resonators, a multilayer substrate including main surfaces, a piezoelectric substrate, and a bump electrode on the piezoelectric substrate. Each of the parallel arm resonators include an IDT electrode on the piezoelectric substrate. The bump electrode is connected to the IDT electrode. The multilayer substrate includes a first planar electrode on a first of the main surfaces and bonded to the bump electrode, a second planar electrode on a second of the main surfaces and connected to a ground, and via conductors that connect the first and second planar electrodes. In a plan view of the first main surface, the bump electrode is between via conductors connected to the first planar electrode.
A method of performing a failure detection on an AC input voltage includes comparing the AC input voltage with first and second reference voltages, determining that the AC input voltage is normal, if an absolute value of the AC input voltage is greater than the first reference voltage, determining that the AC input voltage has failed, if a duration of the absolute value of the AC input voltage being less than the second reference voltage is greater than a threshold duration, and determining that the AC input voltage has failed, if the absolute value of the AC input voltage is not less than the second reference voltage and not greater than the first reference voltage, and a duration of an absolute value of a change rate of the AC input voltage being less than a voltage change rate threshold is greater than a predetermined time delay.
FET designs that exhibit low leakage in the presence of the edge transistor phenomenon. Embodiments includes nFET designs in which the work function ΦMF of the gate structure overlying the edge transistors of the nFET is increased by forming extra P+ implant regions within at least a portion of the gate structure, thereby increasing the Vt of the edge transistors to a level that may exceed the Vt of the central conduction channel of the nFET. In some embodiments, the gate structure of the nFET is modified to increase or “flare” the effective channel length of the edge transistors relative to the length of the central conduction channel of the FET. Other methods of changing the work function ΦMF of the gate structure overlying the edge transistors are also disclosed. The methods may be adapted to fabricating pFETs by reversing or substituting material types.
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
H01L 29/36 - Semiconductor bodies characterised by the concentration or distribution of impurities
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
