An apparatus for processing a substrate, comprises a plurality of processing modules, each configured to perform processing of a substrate; a transfer machine configured to transfer the substrate; and a controller configured to create a transfer time table, which causes the substrate to be transferred between the plurality of processing modules and to be processed, and to control the transfer of the substrate by the transfer machine and control the processing of the substrate in each of the plurality of processing modules, based on the transfer time table, wherein when it is determined that a retry or an extension of a cleaning process is expected to occur or occurs in a first processing module out of the plurality of processing modules, the controller sets the first processing module to be non-usable and updates the transfer time table, such that a subsequent substrate does not pass through the first processing module.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.
METHOD FOR RELEASING SUBSTRATE, METHOD FOR POLISHING SUBSTRATE, SUBSTRATE POLISHING APPARATUS, SUBSTRATE PROCESSING APPARATUS, CONTROL APPARATUS, CONTROL METHOD, AND CONTROL PROGRAM
Provided is a method for releasing a substrate adsorbed to a first surface of an elastic film included in a substrate holding apparatus of a substrate polishing apparatus,
a plurality of concentric pressure chambers being formed between a top ring body included in the substrate holding apparatus and a second surface of the elastic film, the method including:
a first step of supplying fixed-amount gas to two or more pressure chambers among the plurality of pressure chambers to pressurize the elastic film; and
a second step of sequentially depressurizing the plurality of pressure chambers from outer pressure chambers.
A substrate processing apparatus capable of determining a shape abnormality of a wafer is disclosed. The substrate processing apparatus includes: a shape detection module for detecting a signal corresponding to a surface shape of a substrate; and a controller for determining a shape abnormality of the substrate.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
This heat source system comprises: a plurality of heat source machines (1, 2) including a variable-speed turbo heat source machine (1); and an operation number control device (3) for controlling the number of the plurality of heat source machines (1, 2) that are being operated. The operation number control device (3) is configured so as to: calculate a load index value of the variable-speed turbo heat source machine (1) by multiplying a relative value of the opening degree of an intake guide vane (16) in the variable-speed turbo heat source machine (1) by a relative value of the rotation speed of a compressor (11) in the variable-speed turbo heat source machine (1); increase the number of the heat source machines that are being operated when the load index value exceeds a first reference value; and reduce the number of the heat source machines that are being operated when the load index value falls below a second reference value.
The present invention enables easy setting of an industrial machine such as a standard pump even after delivery thereof. Provided is an information processing program that causes a terminal device to function as a first means for receiving first identification information for identifying a rotary machine by radio communication with a radio communication substrate mounted on the rotary machine, a second means for transmitting the first identification information to a server capable of accessing a storage part in which the first identification information and order information of the rotary machine are stored in association with each other, a third means for receiving control information necessary for performing setting of the rotary machine in accordance with the order information associated with the first identification information from the server, and a fourth means for transmitting setting information for setting the rotary machine to the rotary machine on the basis of the control information.
A substrate gripping apparatus includes: a support member having a follower pin and a substrate support surface; a movable rod movable relatively with respect to the support member; and a chuck for gripping an edge of a substrate. The chuck has an elongated guide hole in a bent shape, and the follower pin is disposed within the elongated guide hole and is movable relatively with respect to the elongated guide hole. The elongated guide hole includes a first section, a second section, and a connecting section, the first section extends upward from the connecting section, and the second section extends in a direction different from the first section.
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
An exhaust gas treatment apparatus capable of eliminating an adverse effect of a processing gas is disclosed. The exhaust gas treatment apparatus includes a gas treatment reactor having a flow-path forming wall, and a double-pipe structure. The double-pipe structure includes an inner cylinder into which at least a part of the flow-path forming wall is inserted, and an outer cylinder disposed outside the inner cylinder.
B01D 47/02 - Séparation de particules dispersées dans l'air, des gaz ou des vapeurs en utilisant un liquide comme agent de séparation par passage de l'air, du gaz ou de la vapeur sur ou à travers un bain liquide
To suppress a central portion of a paddle from hanging down in a cup type plating apparatus.
To suppress a central portion of a paddle from hanging down in a cup type plating apparatus.
A plating apparatus includes a plating tank 410 for housing a plating solution, an anode disposed inside the plating tank 410, a substrate holder configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, a paddle 460 disposed between the anode and the substrate Wf, a driving mechanism 462 configured to support a base end portion 460A of the paddle 460 and reciprocate the paddle 460 along the surface to be plated Wf-a of the substrate Wf, a first magnet 464 disposed in the paddle 460, and a second magnet 468 disposed to be opposed to the first magnet 464. The first magnet 464 and the second magnet 468 are configured to exert a magnetic force on one another so as to cause a central portion 460C between the base end portion 460A and a distal end portion 460B of the paddle 460 to approach the surface to be plated Wf-a of the substrate Wf.
Provided is a fluid supply device. The fluid supply device includes: a first nozzle that supplies a first fluid toward an object; a light sensor that includes a light-emitting part that emits light for detection, and a light-receiving part that receives the light; a first light-blocking member capable of being positioned in a first non-light-blocking position that does not block light and a first light-blocking position that blocks light; and a sensing part that detects displacement of the first nozzle based on a light reception amount of the light-receiving part. The first light-blocking member is capable of switching between the first light-blocking position and the first non-light-blocking position by displacing in conjunction with the displacement of the first nozzle.
B05B 12/12 - Aménagements de commande de la distributionAménagements de réglage de l’aire de pulvérisation sensibles à l'état du liquide ou d'un autre matériau fluide expulsé, du milieu ambiant ou de la cible sensibles à l'état du milieu ambiant ou de la cible, p. ex. à l'humidité, à la température
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
The present invention provides a technology with which it is possible to suppress splash of a plating solution. This plating apparatus 1000 is provided with: a plating tank 10 which retains a plating solution Ps and in which an anode 11 is placed; a substrate holder 30 which holds a substrate Wf so as to face the anode, the substrate Wf serving as a cathode; a paddle 70 which is placed in a region that is above the anode and below the substrate within the plating tank, and which is configured so as to agitate the plating solution; a liquid splash suppression plate 60 which is placed in a region that is above the paddle and below the liquid surface Ls of the plating solution within the plating tank, and is placed in a region between an outer peripheral wall 10b of the plating tank and the substrate holder; and a support member 82 which is configured so as to support the liquid splash suppression plate in such a manner that the liquid splash suppression plate is movable in the vertical direction.
The present invention provides a technique for evenly supplying powder used as a material to a DED nozzle.
The present invention provides a technique for evenly supplying powder used as a material to a DED nozzle.
According to one aspect, an AM apparatus for manufacturing a fabrication object is provided. This AM apparatus includes a DED nozzle. The DED nozzle includes a powder port provided at a distal end of a main body of the DED nozzle and configured to eject a powder material therefrom, and a powder passage provided in communication with the powder port and configured to allow the powder material to pass through inside the main body of the DED nozzle. The AM apparatus further includes a first pipe, a separation wall extending from an end portion of the first pipe toward an upstream side inside the first pipe, and a plurality of second pipes connected to the end portion of the first pipe. The separation wall divides the end portion of the first pipe into a plurality of regions, and the plurality of second pipes is connected to the plurality of regions of the first pipe, respectively. The second pipes are connected to the powder passage of the DED nozzle.
The present invention relates to a substrate polishing apparatus for polishing a substrate, such as a wafer, and more particularly to a substrate polishing apparatus for polishing a notch of a substrate, a bevel portion of the substrate, a device surface of the substrate, and a back surface of the substrate. The substrate polishing apparatus includes: a first polishing module; a second polishing module; and a third polishing module; wherein the first polishing module, the second polishing module, and the third polishing module are configured to polish different regions of a substrate.
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
14.
METHOD FOR DETERMINING HEALTH INDEX OF SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
In a substrate processing apparatus comprising multiple modules, the state of health of the whole substrate processing apparatus is grasped. A method for determining a health index of a substrate processing apparatus is provided. The substrate processing apparatus comprises multiple module groups, and each module group comprises a single module or multiple modules. The method comprises steps for obtaining multiple operation parameter values relating to each of the modules in the substrate processing apparatus; determining a module state of each of the modules, based on the multiple operation parameter values; and determining a health index of the substrate processing apparatus, based on the module states of the modules and weight coefficients for the modules.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
15.
INFORMATION PROCESSING PROGRAM, TERMINAL DEVICE, INFORMATION PROCESSING METHOD, SERVER, ROTARY MACHINE, WIRELESS COMMUNICATION BOARD, AND INFORMATION PROCESSING SYSTEM
The present invention makes it easy to identify a communication target. Provided is an information processing program that causes a terminal device to function as: a first means for receiving, through wireless communication with a wireless communication board mounted on a rotary machine, identification information for identifying the wireless communication board; a second means for transmitting the identification information to a server capable of accessing a storage unit in which the identification information and rotary machine information are stored in association with each other; a third means for receiving, from the server, the rotary machine information associated with the identification information; and a fourth means for displaying the received rotary machine information on a display.
H04M 1/72412 - Interfaces utilisateur spécialement adaptées aux téléphones sans fil ou mobiles avec des moyens de soutien local des applications accroissant la fonctionnalité par interfaçage avec des accessoires externes utilisant des interfaces sans fil bidirectionnelles à courte portée
H04M 11/00 - Systèmes de communication téléphonique spécialement adaptés pour être combinés avec d'autres systèmes électriques
H04W 4/30 - Services spécialement adaptés à des environnements, à des situations ou à des fins spécifiques
H04W 84/10 - Réseaux à petite échelleRéseaux faiblement hiérarchisés
16.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer. A substrate processing apparatus (1) comprises: a substrate-holding part (5); a processing head (10); a tape winding reel (22); a winding reel rotation mechanism (32); a tape outside diameter acquisition mechanism (70) for acquiring the outside diameter of a wound body (36) of the processing tape (2) wound around the tape winding reel (22); a rotation torque calculation unit (72) for calculating, on the basis of the outside diameter, the rotation torque necessary for the tape winding reel (22) to wind the processing tape (2) with a predetermined tape tensile force; and an operation control unit (60) for controlling the operation of the winding reel rotation mechanism (32). The operation control unit (60) is configured to cause the winding reel rotation mechanism (32) to rotate the tape winding reel (22) with the calculated rotation torque.
B24B 21/20 - Accessoires pour commander ou ajuster le mouvement ou la tension de la courroie abrasive
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
Provided is a top ring or a substrate polishing device capable of making a polishing profile more uniform between the center of a square substrate and the outer edge side of the substrate. This top ring, which is for holding a polygonal substrate, comprises: a base member connected to a rotary shaft; a substrate suction member that includes a substrate suction body having a substrate suction surface for suctioning the substrate, and communicates with a pressure-reduction module, a shielding member configured to shield a surface on the opposite side to the substrate suction surface of the substrate suction body, and a frame member connected to the shielding member so as to surround at least a part of the periphery of the base member; and a biasing mechanism that has a first end part in contact with the base member and a second end part in contact with the frame member, and applies a biasing force in a direction in which the base member and the frame member approaches or separates from each other.
The present invention accurately detects the end point of polishing. This polishing device comprises: a polishing table for holding a polishing pad; a holder for holding an object to be polished so as to face the polishing pad; at least one of a motor for rotationally driving the polishing table, a motor for rotating the holder holding the object, and a motor for rocking the holder holding the object; one or more drivers that are configured so as to supply drive current to the at least one motor and further output a digital signal according to the load of the at least one motor; and an end point detection unit that detects a polishing end point, which indicates the end of polishing of the object, on the basis of the digital signal output from the drivers.
The present invention relates to a substrate polishing method of polishing a substrate, such as a wafer. The substrate polishing method includes: rotating a substrate (W) about its own axis, while causing the substrate (W) and a polishing head (10C) to make a circular motion relative to each other; and pressing a polishing tape (2B) against a surface (5a) of the substrate (W) by the polishing head (10C) while feeding the polishing tape (2B) in a longitudinal direction thereof to thereby polish a central region including a center (O1) of the substrate (W) and an outer region adjacent to the central region. A process of polishing the central region and the outer region includes at least two polishing processes performed under different polishing conditions. The at least two polishing processes include: a low polishing-rate process performed under a polishing condition such that a polishing rate in the central region is lower than a polishing rate in the outer region; and a high polishing-rate process performed under a polishing condition such that a polishing rate in the central region is higher than a polishing rate in the outer region.
B24B 21/06 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet pour meuler des surfaces planes munis d'organes à surface de contact limitée pour pousser la courroie contre la pièce à travailler, p. ex. munis de sabots qui balaient complètement la surface à meuler
20.
SUBSTRATE POLISHING METHOD AND SUBSTRATE POLISHING APPARATUS
A first dressing of dressing a polishing member is performed under a plurality of preset set dress conditions, a first cut rate of the polishing member is measured based on a measurement value of a surface height of the polishing member for each set dress condition, and the set dress condition and the first cut rate are associated with each other and stored as relationship data. The substrate is polished by applying a first dress condition corresponding to a target cut rate based on the relationship data, and a second cut rate of the polishing member is measured based on the measurement value of the surface height of polishing member. A second dress condition corresponding to the target cut rate is acquired based on a change of the second cut rate from the target cut rate and the relationship data, and substrate is polished by applying the second dress condition.
B24B 49/18 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la présence d'outils à dresser
B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
21.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus (2) is provided with: a substrate holding unit (11) that holds and rotates a substrate (W); an inert gas nozzle (14) that faces the inside of the substrate holding unit (11); an inert gas supply line (41) that is connected to the inert gas nozzle (14) and supplies an inert gas to the inert gas nozzle (14); an inert gas saturated water nozzle (15) that faces the inside of the substrate holding unit (11); and an inert gas saturated water supply line (48) that is connected to the inert gas saturated water nozzle (15) and supplies an inert gas saturated water, in which the inert gas is saturated, to the inert gas saturated water nozzle (15).
The present invention relates to a substrate processing device and a substrate processing method which are for polishing a substrate, e.g., a wafer. The substrate processing device includes: a polishing part (4) for polishing a peripheral portion of a substrate (W); a residual-film detection part (9) for detecting a residual film on the peripheral portion of the substrate (W) which has been polished by the polishing part (4); and a control unit (20) which assesses whether repolishing of the peripheral portion of the substrate (W) is necessary or not, on the basis of the results of the residual-film detection by the residual-film detection part (9), and which, when having assessed that repolishing is necessary, determines polishing conditions for the repolishing on the basis of the results of the residual-film detection. The polishing part (4) is configured so as to repolish the peripheral portion of the substrate (W) under the determined polishing conditions.
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japon)
Inventeur(s)
Heya, Akira
Inoue, Tsuyoshi
Ayuzawa, Hayate
Amanuma, Mitsuhiro
Fujihashi, Tatsuro
Suzuki, Koji
Abrégé
This magnetic bearing apparatus is provided with a stator core (15) that accommodates axial coils (10A, 10B) and radial coils (12A-12D). The stator core (15) is provided with: second axial stator cores (17A, 17B) positioned on both sides of a second disk (8) and between the second disk (8) and the axial coils (10A, 10B); a plurality of radial stator cores (18) around which the radial coils (12A-12D) are wound; and first axial stator cores (19A, 19B) positioned on both sides of a first disk (7).
F16C 32/04 - Paliers non prévus ailleurs faisant usage de moyens de support magnétiques ou électriques
24.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
An information processing apparatus includes: an information acquisition section (500) configured to acquire finishing conditions including substrate-holder state information indicating a state of a substrate holder and a finishing-fluid-supply-structure state information indicating a state of a finishing-fluid supply structure in a finishing process of a substrate performed by a substrate processing apparatus including the substrate holder configured to hold the substrate and the finishing-fluid supply structure configured to supply a substrate finishing fluid onto the substrate; and a state prediction section (501) configured to predict substrate state information for the substrate on which the finishing process is performed under the finishing conditions by inputting the finishing conditions acquired by the information acquisition section (500) to a learning model (10A, 10B) that has been generated by machine learning that causes the learning model to learn a correlation between the finishing conditions and substrate state information indicating a state of the substrate on which the finishing process is performed under the finishing conditions.
The present invention relates to a polishing head for pressing a polishing tape against a substrate, such as a wafer. The present invention further relates to a polishing apparatus for polishing a substrate with such a polishing head. The polishing head (10) includes: a pressing member (12) configured to press a polishing tape (2) against the substrate (W); an actuator (15) configured to move the pressing member (12) in a predetermined pressing direction (CL) and apply a pressing force to the pressing member (12); and a tilt adjustment mechanism (40) configured to adjust tilt of the pressing member (12) with respect to the pressing direction (CL). The tilt adjustment mechanism (40) is configured to tilt the pressing member (12) with respect to the pressing direction (CL) and maintain an angle of the tilted pressing member (12).
There is provided method and a plating apparatus capable of improving uniformity of a plating film formed on a substrate. There is proposed a method for, in a computer, setting a forward/backward movement recipe for a shielding body in a plating apparatus, the plating apparatus including the shielding body, the shielding body being movable to a shielding position interposed between a plating target surface of a substrate and an anode and to a retracted position retracted from between the plating target surface of the substrate and the anode; and the method includes steps of: acquiring a resist pattern of the substrate, calculating a plating growth coefficient for each certain-angle area of the substrate based on the acquired resist pattern, and setting the forward/backward movement recipe for the shielding body based on the calculated plating growth coefficient for each certain-angle area.
The present invention detects disturbance of an electric field formed between an anode and a substrate. A plating device 10 includes: a plating tank 50 for storing a plating solution Q; an anode 21 disposed in the plating tank 50; a substrate holder 40 for holding a substrate WF such that a surface WF1 to be plated faces the anode 21; an anode mask 70 disposed between the anode 21 and the substrate holder 40, the anode mask 70 having an anode opening 70a penetrating the anode 21 side and the substrate holder 40 side, and being configured to be capable of adjusting the size of the anode opening 70a; a regulation plate 30 disposed between the anode mask 70 and the substrate holder 40; a measurement electrode 74 disposed between the anode mask 70 and the regulation plate 30; a reference electrode 75 disposed in the plating solution Q stored in the plating tank 50; and a measuring instrument 76 for measuring a voltage between the reference electrode 75 and the measurement electrode 74.
This heat medium supply device (1) comprises: a cooling-side outlet pipe (17) that transfers a heat medium from a cooling-side tank (16) to a cooling device (8); a cooling-side bypass pipe (44) that extends from a cooling-side return pipe (26) to the cooling-side outlet pipe (17) while bypassing the cooling-side tank (16); a cooling-side bypass valve (45) provided to the cooling-side bypass pipe (44); and an operation control unit (35) that controls the operation of the cooling-side bypass valve (45). The operation control unit (35) is configured to open the cooling-side bypass valve (45) when the temperature of the heat medium in the cooling-side return pipe (26) measured by a cooling-side temperature measurement device (41) is within a preset allowable low-temperature range, and to close the cooling-side bypass valve (45) when the temperature of the heat medium in the cooling-side return pipe (26) measured by the cooling-side temperature measurement device (41) is outside the allowable low-temperature range.
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
G05D 23/13 - Commande de la température sans source d'énergie auxiliaire en faisant varier le rapport du mélange de deux fluides ayant des températures différentes
29.
SUBSTRATE SUPPORT DEVICE, CLEANING DEVICE, DEVICE AND METHOD FOR CALCULATING ROTATION SPEED OF SUBSTRATE, AND MACHINE LEARNING DEVICE
A substrate support device includes: a plurality of rollers that is arranged inside a housing and holds an outer edge of a substrate; a rotation drive unit that rotates the substrate by rotationally driving the plurality of rollers; a vibration transmission mechanism that is installed in such a manner as to extend from any of the rollers or the rotation drive unit up to the housing and transmits vibrations to the housing, the vibrations occurring due to a notch or an orientation flat on the outer edge of the substrate hitting the roller; a detection sensor that is arranged outside the housing, detects at least one of sound, vibration, and strain occurring from the housing, and outputs a signal corresponding thereto; and a rotation speed calculation section that calculates a rotation speed of the substrate, based on the signal outputted from the detection sensor.
This heat medium supply device (1) is provided with: a precooling heat medium supply pipe (41) that branches from a heating-side return pipe (25) and extends to a precooling heat exchanger (40); and a precooling heat medium return pipe (42) that extends from the pre-cooling heat exchanger (40) and is connected to the heating-side return pipe (25). A branch point (B1) at which the precooling heat medium supply pipe (41) branches from the heating-side return pipe (25) is positioned on the upstream side of a heating device (7) and supplies a heating medium before being heated by the heating device (7) to the precooling heat exchanger (40). A connection point (C1) between the precooling heat medium return pipe (42) and the heating-side return pipe (25) is positioned on the upstream side of the heating device (7) and supplies the heating medium that has passed through the precooling heat exchanger (40) to the heating device (7) through the heating-side return pipe (25).
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
G05D 23/13 - Commande de la température sans source d'énergie auxiliaire en faisant varier le rapport du mélange de deux fluides ayant des températures différentes
31.
METALLIC JOINED STRUCTURE, IMPELLER, PUMP, AND METHOD FOR PRODUCING METALLIC JOINED STRUCTURE
This metallic joined structure (100) comprises: metal plates (110, 130) (first metal plates); a metal plate (120) (second metal plate) that is butted against the metal plates (110, 130) in a T-shape; and joining parts (140) that join the metal plates (110, 130) and the metal plate (120). The joining parts (140) comprise: first joining parts (141) that are disposed on one surface (121) side of the metal plate (120); and second joining parts (142) that are disposed on the other surface (122) side of the metal plate (120) and that are smaller than the first joining parts (141).
B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
F04D 29/62 - MontageAssemblageDémontage des pompes radiales ou hélicocentrifuges
This absorption water cooler/heater with a cover comprises: an absorption water cooler/heater that transfers heat by using the heat of combustion of a fuel having the specific gravity lighter than that of air to thereby carry out a cycle of a refrigerant that undergoes a phase change and an absorption liquid in which the refrigerant is mixed; and a cover that covers the absorption water cooler/heater. The cover is provided with a discharge flow path at an upper part. The discharge flow path is for discharging a gas containing fuel when there is a fuel F outside the absorption water cooler/heater and inside the cover.
F25B 15/00 - Machines, installations ou systèmes à sorption, à marche continue, p. ex. à absorption
33.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
An information processing apparatus (5) includes: an information acquisition section (500) configured to acquire polishing condition information including top-ring vibration information indicating vibration of a top ring in chemical mechanical polishing of the substrate and top-ring sound information indicating sound generated from the top ring in the chemical mechanical polishing of the substrate performed by a substrate processing apparatus including a polishing table rotatably supporting the polishing pad and the top ring configured to press the substrate against the polishing pad; and a state prediction section (501) configured to predict substrate slip-out information for the polishing condition information by inputting the polishing condition information acquired by the information acquisition section (500) to a learning model (10A) that has been generated by machine learning that causes the learning model to learn a correlation between the polishing condition information and the substrate slip-out information indicating occurrence of slip out of the substrate on which the chemical mechanical polishing is performed.
Proposed is a plating apparatus capable of detecting a film thickness of a plating film formed on a substrate during a plating process. The plating apparatus includes a plating tank, a substrate holder configured to hold a substrate, an anode disposed in the plating tank to oppose the substrate held by the substrate holder, a resistor disposed between the substrate and the anode to adjust an electric field, a first detection electrode disposed in a region between a surface to be plated of the substrate and the anode and having an electrode end disposed at a first position inside the resistor, a second detection electrode disposed at a second position where there is less change in potential as compared with the first position in the plating tank, and a controller that measures a potential difference between the first detection electrode and the second detection electrode, to estimate a thickness of a plating film on the substrate based on the potential difference.
There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member. The substrate cleaning apparatus also includes a controller which controls pressing force for the cleaning tool against the self-cleaning member such that self-cleaning torque, with which the rotation mechanism rotates the cleaning tool at the time of self-cleaning of the cleaning tool, is prescribed torque equal to or more than substrate cleaning torque, with which the rotation mechanism rotates the cleaning tool when the cleaning tool cleans the substrate.
B08B 1/32 - Nettoyage par des procédés impliquant l'utilisation d'outils par le mouvement d’éléments de nettoyage sur une surface utilisant des éléments de nettoyage rotatifs
B08B 1/50 - Nettoyage par des procédés impliquant l'utilisation d'outils impliquant le nettoyage des éléments de nettoyage
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B08B 3/12 - Nettoyage impliquant le contact avec un liquide avec traitement supplémentaire du liquide ou de l'objet en cours de nettoyage, p. ex. par la chaleur, par l'électricité ou par des vibrations par des vibrations soniques ou ultrasoniques
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
36.
DATA PROCESSING SYSTEM, DATA PROCESSING DEVICE, DATA PROCESSING METHOD, OPERATION STATE EVALUATION SYSTEM, OPERATION STATE EVALUATION METHOD, DATA COLLECTION DEVICE, PROGRAM PROVIDING METHOD, MAINTENANCE PLANNING METHOD, MAINTENANCE PLAN PROVIDING METHOD, AND CHARGING METHOD
[Problem] To provide a data processing system capable of easily managing a plurality of load control devices. [Solution] This data processing system comprises a plurality of load control devices 2 and a data processing device 3 configured to be able to communicate with the plurality of load control devices 2. The plurality of load control devices 2 each comprise: a load-side communication unit configured to be able to communicate with the data processing device 3 and an inverter for driving a motor connected to a load device; a load-side storage unit capable of storing operation information D2 on a time when operating the load device; and a load-side control unit for storing the operation information D2 in the load-side storage unit and transmitting the operation information D2 stored in the load-side storage unit to the data processing device 3. The data processing device 3 comprises: a management-side communication unit 30 configured to be able to communicate with the plurality of load control devices 2; a management-side storage unit 31 having a larger storage capacity than the load-side storage unit and capable of storing the operation information D2; and a management-side control unit 32 for storing the operation information D2 received from each of the plurality of load control devices 2 in the management-side storage unit 31.
H02P 5/74 - Dispositions spécialement adaptées à la régulation ou la commande de la vitesse ou du couple d’au moins deux moteurs électriques pour commander au moins deux moteurs dynamo-électriques à courant alternatif
F04B 51/00 - Tests des "machines", pompes ou installations de pompage
A state of a substrate as a plating target is measured. A substrate state measurement device includes: a stage configured to support a substrate such that the stage rotates the substrate, the substrate including a seed layer and a resist layer formed on the seed layer; at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage; and a state measurement module adapted to measure a state of a power supply member contact area on the basis of detection performed by the white confocal sensor on the power supply member contact area, the power supply member contact area being an area on the substrate which comes into contact with a power supply member.
There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member. The substrate cleaning apparatus also includes a controller which controls pressing force for the cleaning tool against the self-cleaning member such that self-cleaning torque, with which the rotation mechanism rotates the cleaning tool at the time of self-cleaning of the cleaning tool, is prescribed torque equal to or more than substrate cleaning torque, with which the rotation mechanism rotates the cleaning tool when the cleaning tool cleans the substrate.
B08B 1/32 - Nettoyage par des procédés impliquant l'utilisation d'outils par le mouvement d’éléments de nettoyage sur une surface utilisant des éléments de nettoyage rotatifs
B08B 1/50 - Nettoyage par des procédés impliquant l'utilisation d'outils impliquant le nettoyage des éléments de nettoyage
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B08B 3/12 - Nettoyage impliquant le contact avec un liquide avec traitement supplémentaire du liquide ou de l'objet en cours de nettoyage, p. ex. par la chaleur, par l'électricité ou par des vibrations par des vibrations soniques ou ultrasoniques
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
39.
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD, SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, METHOD OF REMOVING LIQUID FROM UPPER SURFACE OF WAFER TO BE POLISHED, ELASTIC FILM FOR PRESSING WAFER AGAINST POLISHING PAD, SUBSTRATE RELEASE METHOD, AND CONSTANT AMOUNT GAS SUPPLY APPARATUS
A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 37/04 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes
B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/306 - Traitement chimique ou électrique, p. ex. gravure électrolytique
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
There is provided an apparatus for plating, comprising: a plating tank configured to store a plating solution therein; an anode placed in the plating tank and provided with a plurality of through holes; a substrate holder provided to hold a substrate to be opposed to the anode; a barrier membrane placed to be brought into close contact with a first face on a substrate side of the anode; and a rear face plate placed to be opposed to a second face of the anode that is on an opposite side to the first face and to be separated from the second face by a predetermined distance and configured to regulate an amount of bubbles generated from the anode and accumulated on the second face.
The present application relates to a substrate processing method and a substrate processing apparatus for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: measuring surface shapes of an edge portion of a first substrate and an edge portion of a second substrate; determining an applying condition for the filler to be applied to the laminated substrate based on results of the measuring of the surface shapes; and applying the filler to a gap between the edge portion of the first substrate and the edge portion of the second substrate of the laminated substrate under the determined applying condition.
B32B 37/24 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches avec au moins une couche qui ne présente pas de cohésion avant la stratification, p. ex. constituée de matériau granulaire projeté sur un substrat
B32B 38/00 - Opérations auxiliaires liées aux procédés de stratification
B32B 41/00 - Dispositions pour le contrôle ou la commande des procédés de stratificationDispositions de sécurité
The present application relates to a substrate processing method of suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The substrate processing method includes: applying a first filler to the gap between an edge portion of a first substrate and an edge portion of a second substrate; and applying a second filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate after applying of the first filler. A viscosity of the first filler is lower than a viscosity of the second filler.
EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO., LTD. (Japon)
Inventeur(s)
Aoyama, Jun
Yamamoto, Kensuke
Suzuki, Tatsuya
Abrégé
This absorption water cooling/heating machine that performs heat transfer in a cycle of a refrigerant and an absorption liquid comprises: a regenerator that has a burner; a medium cooling mechanism that cools a temperature-adjustment target medium; a cooling water flow passage that allows cooling water to flow therethrough; a fuel supply mechanism; an air supply mechanism; a storage unit that stores a relationship for defining the flow rate of air relative to the flow rate of fuel being supplied to the burner; a control unit that controls a fuel flow rate adjustment mechanism in the fuel supply mechanism and an air flow rate adjustment mechanism in the air supply mechanism; and a temperature-related physical quantity detector for the temperature-adjustment target medium. The control unit compares an actual measurement temperature detected by the temperature-related physical quantity detector with the theoretical temperature of the temperature-adjustment target medium, and controls the air flow rate adjustment mechanism so as to reduce the flow rate of the air when the actual measurement temperature is higher than the theoretical temperature and to increase the flow rate of the air when the actual measurement temperature is lower.
EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO., LTD. (Japon)
Inventeur(s)
Aoyama, Jun
Suzuki, Tatsuya
Yamamoto, Kensuke
Abrégé
This combustion device is provided with: a storage unit in which a first relationship that defines a flow rate-related value of air corresponding to a flow rate-related value of a first fuel supplied to a burner, and a similar second relationship pertaining to a second fuel are stored; and a control unit that controls an air flow rate adjustment mechanism so as to supply, to the burner, a supply air flow rate obtained on the basis of a value obtained by summing the flow rate-related values of the air obtained from the first relationship and the second relationship, respectively. An absorption cold/hot water machine includes a combustion device, a regenerator having at least a burner of the combustion device, a condenser, and an evaporator. The control unit operates the combustion device with a smaller combustion amount between a combustion amount in the burner for setting a cooling target medium to a target temperature and an upper limit combustion amount for maintaining proper operation of the absorption cold/hot water machine.
F23N 1/02 - Régulation de l'alimentation en combustible conjointement au réglage de l'amenée d'air
F23C 1/00 - Appareils à combustion spécialement adaptés à la combustion de plusieurs sortes de combustibles simultanément ou alternativement, au moins un des combustibles étant fluide ou étant un combustible solide en suspension dans l’air
F23N 1/10 - Régulation de l'alimentation en combustible conjointement au réglage d'un autre agent, p. ex. l'eau de la chaudière et de l'amenée d'air ou du tirage
A machine-learning apparatus includes: a learning-data storage section that stores plural sets of learning data including input data and output data, the input data including shape parameters of a pump section having an impeller and a flow passage section in which the impeller is accommodated, the output data including pump performance of a pump having the pump section defined by the shape parameters; a machine-learning section configured to cause a learning model to learn a correlation between the input data and the output data by inputting the plural sets of the learning data to the learning model; and a learned-model storage section configured to store the learning model that has been caused to learn the correlation by the machine-learning section.
G06F 30/28 - Optimisation, vérification ou simulation de l’objet conçu utilisant la dynamique des fluides, p. ex. les équations de Navier-Stokes ou la dynamique des fluides numérique [DFN]
G06F 30/27 - Optimisation, vérification ou simulation de l’objet conçu utilisant l’apprentissage automatique, p. ex. l’intelligence artificielle, les réseaux neuronaux, les machines à support de vecteur [MSV] ou l’apprentissage d’un modèle
The present invention relates to a pump unit. The pump unit (PU) includes a connector (400) configured to connect a plurality of motor pumps (MP). The connector (400) connects a front-stage side discharge casing (22) and a rear-stage side suction casing (21).
A technology that can clean a bottom surface of a dresser while inhibiting a cleaning solution discharged from a cleaning nozzle from splashing in a direction of a polishing pad. A polishing apparatus 1 includes a polishing table 2, a top ring 3, a dresser 10, at least one cleaning nozzle 20, and a dresser rotation mechanism 32. The at least one cleaning nozzle discharges a cleaning solution Lq in a fan shape and in a direction away from a polishing pad Pd, and an intersection point IP where a discharge central axis XL2 of the cleaning solution intersects with a bottom surface 11 of the dresser is positioned closer to the at least one cleaning nozzle than a center line CL1 of the bottom surface of the dresser. The at least one cleaning nozzle discharges the cleaning solution such that a part of the cleaning solution discharged from the cleaning nozzle and contacting the bottom surface of the dresser moves and passes through the center C1 of the bottom surface of the dresser.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
The information processing apparatus (5) includes an information acquisition section (500) configured to acquire operating condition information including operation conditions of a substrate processing apparatus (2) including a substrate holder (241); and a state prediction section (501) configured to predict substrate-holding-mechanism state information corresponding to the operating condition information by inputting the operating condition information to a learning model that has been generated by machine learning that causes the learning model to learn a correlation between the operating condition information and the substrate-holding-mechanism state information indicating a state of the substrate holding mechanism (241a, 241c, 241e) when the substrate processing device (2) operates under the operating conditions indicated by the operating condition information.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
09 - Appareils et instruments scientifiques et électriques
Produits et services
Semiconductor manufacturing machines; plating apparatus for
manufacturing semiconductors; electric cleaning apparatus
for manufacturing semiconductors; semiconductor
manufacturing machines and apparatus and their parts;
electric cleaning apparatus for use in manufacturing
semiconductor substrates [parts of machines]; electric
semiconductor wafer cleaning apparatus for use in the
manufacture of semiconductors; electroplating machines;
plating apparatus; liquid tanks for use in processing
plating [parts of machines]. Measuring or testing machines and instruments; apparatus for
automatically measuring plating solution concentration;
machines and apparatus for automatically adjusting component
concentration, pH value and replenishment amount of plating
solution; apparatus for measuring film thickness on the
substrate during plating in real time, and controlling the
film by partial mask that covers (part of) the periphery of
the substrate for a predetermined time, thereby enhancing
the uniformity of the plating film.
Provided is a technique capable of improving the stirring force of a plating solution by a paddle. A plating apparatus 1000 includes a paddle 70 disposed between an anode 11 and a substrate Wf. The paddle is configured to reciprocate parallel to the anode in a first direction and a second direction to stir a plating solution Ps. The paddle includes a honeycomb-structure portion 71 provided with a plurality of polygonal through-holes 74. The honeycomb-structure portion has a shape in which a paddle width at a center portion in a third direction which is a direction perpendicular to a reciprocation direction of the paddle is wider than a paddle width at an end portion in the third direction. The honeycomb-structure portion includes a first outer peripheral wall 75 oriented in the first direction. The first outer peripheral wall includes a first center wall 77 disposed at a center portion in the third direction of the first outer peripheral wall, and the first center wall extends in the third direction.
C25D 21/10 - Agitation des électrolytesDéplacement des claies
B01F 31/44 - Mélangeurs avec mécanismes à secousses, oscillants ou vibrants avec des agitateurs effectuant un mouvement oscillatoire, vibratoire ou de secousses
B01F 31/441 - Mélangeurs avec mécanismes à secousses, oscillants ou vibrants avec des agitateurs effectuant un mouvement oscillatoire, vibratoire ou de secousses effectuant un mouvement rectiligne de va-et-vient
Semiconductor manufacturing machines; plating apparatus for
manufacturing semiconductors; electric cleaning apparatus
for manufacturing semiconductors; semiconductor
manufacturing machines and apparatus and their parts;
electric cleaning apparatus for use in manufacturing
semiconductor substrates [parts of machines]; electric
semiconductor wafer cleaning apparatus for use in the
manufacture of semiconductors; plating apparatus for
manufacturing semiconductors for plating while covering the
substrate and electric contact with conductivity-controlled
pure water; honeycomb-structured paddles for stirring
plating solution with high efficiency during plating [parts
of machines].
Semiconductor manufacturing machines; plating apparatus for
manufacturing semiconductors; electric cleaning apparatus
for manufacturing semiconductors; semiconductor
manufacturing machines and apparatus and their parts;
electric cleaning apparatus for use in manufacturing
semiconductor substrates [parts of machines]; electric
semiconductor wafer cleaning apparatus for use in the
manufacture of semiconductors; plating apparatus for
manufacturing semiconductors for plating while covering the
substrate and electric contact with conductivity-controlled
pure water; honeycomb-structured paddles for stirring
plating solution with high efficiency during plating [parts
of machines].
53.
PLATING APPARATUS AND OPERATION METHOD OF PLATING APPARATUS
To efficiently remove gas bubbles from an entire ionically resistive element. A plating apparatus includes a plating tank (410), a substrate holder (440), an anode (430), an ionically resistive element (450), an agitating member (480), and a driving mechanism (482). The plating tank (410) is configured to contain a plating solution. The substrate holder (440) is configured to hold a substrate (Wf) with a surface to be plated facing downward. The anode (430) is disposed in the plating tank (410). The ionically resistive element (450) is disposed between the substrate (Wf) and the anode (430). The agitating member (480) is disposed between the substrate (Wf) and the ionically resistive element (450). The driving mechanism (482) is configured to reciprocate the agitating member (480) along the surface to be plated of the substrate (Wf). The driving mechanism (482) is configured to perform a first gas-bubble removal operation to reciprocate the agitating member (480) around a first position and a second gas-bubble removal operation to reciprocate the agitating member (480) around a second position different from the first position, during a bubble removing process for removing gas bubbles attached to the ionically resistive element (450).
To planarize a substrate having irregularities on its surface. Provided is a method of chemical mechanical polishing of a substrate. The method includes the step of polishing the substrate using a processing solution, and the step of changing concentration of an effective component in the processing solution, which contributes to the polishing of the substrate.
The present invention relates to a pump apparatus for pressurizing liquid hydrogen, and more particularly to a pump apparatus equipped with a thrust balance mechanism for canceling axial thrust acting on an impeller. The pump apparatus includes a rotation shaft (1), a plurality of impellers (2a to 2h) fixed to the rotation shaft (1), bearings (5, 6) for rotatably supporting the rotation shaft (1), a pump casing (7) for housing the plurality of impellers (2a to 2h), and a first thrust balance mechanism (20) and a second thrust balance mechanism (40) for canceling the weight of a rotor including the rotation shaft (1) and the plurality of impellers (2a to 2h) and the axial thrust acting on the plurality of impellers (2a to 2h).
Provided is a rotation speed calculation apparatus including: a first vibration sensor configured to detect a vibration generated when a notch in a peripheral edge portion of a substrate to be cleaned hits a roller holding the peripheral edge portion of the substrate when the substrate is rotated by driving the roller to rotate; a second vibration sensor configured to detect a vibration of a housing defining a space in which the substrate is cleaned; and a rotation speed calculator configured to calculate a rotation speed of the substrate based on the vibration detected by the first vibration sensor and the vibration detected by the second vibration sensor.
B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
B08B 1/34 - Nettoyage par des procédés impliquant l'utilisation d'outils par le mouvement d’éléments de nettoyage sur une surface utilisant des éléments de nettoyage rotatifs en rotation autour d'un axe parallèle à la surface
In this cool-down method, liquefied gas is simultaneously introduced into suction containers (2A, 2B) through introduction lines (121, 122) extending from a liquefied gas storage tank (105), the liquefied gas is passed through a flow path switching device (5A) in the suction container (2A) while bypassing a submerged pump (1A) in the suction container (2A), the liquefied gas is passed through a flow path switching device (5B) in the suction container (2B) while bypassing a submerged pump (1B) in the suction container (2B), and the liquefied gas is discharged from the suction container (2A) and the suction container (2B) through the flow path switching device (5A) and the flow path switching device (5B).
To suppress the occurrence of defective plating due to air bubbles generated from an anode, and to simplify a structure related to the supply of a plating solution. This plating module 400 includes: a plating tank 410 for storing a plating solution; an anode 430 disposed in the plating tank 410; a substrate holder 440 configured to hold the substrate Wf with the to-be-plated surface Wf-a facing downward; a membrane 420 for partitioning an anode region 424 in which the anode 430 is disposed and a cathode region 422 in which the substrate Wf is disposed during the plating process, the membrane 420 having an inclined surface 423a facing the anode 430; a supply port 412 for supplying the plating solution to the anode region 424; gas-liquid piping 470 having a first end part 472 that opens in the vicinity of the upper edge of the inclined surface 423a of the membrane 420 and a second end part 474 that opens above the to-be-plated surface of the substrate while undergoing plating, the gas-liquid piping 470 being configured so as to supply the plating solution supplied from the supply port 412 to the anode region 424 to the cathode region 422 via the second end part 474.
The present invention relates to a technology for determining a dressing condition for dressing a polishing pad that is used for polishing a workpiece such as a wafer, a substrate, or a panel. A dressing condition determination device (60) comprises: a storage device (60a) storing an estimation model (62) constructed by machine learning; and a processor (60b) that executes calculation in accordance with an algorithm of the estimation model (62). The estimation model (62) is configured to output, upon input of a target trajectory image showing a target trajectory of a plurality of abrasive grains, which constitute a dressing surface (51a), on a polishing pad (2), a dressing condition for achieving the target trajectory.
Provided is a container capable of raising a temperature of a liquid hydrogen pump during maintenance and a system including such a container. Provided is a maintenance system used for maintenance of a liquid hydrogen pump, the maintenance system including: a hollow container main body that allows a liquid hydrogen pump to pass through during maintenance, the container main body having one or more inlets and one outlet; a circulation flow path that connects the outlet and the one or more inlets; a blower that is provided on the circulation flow path and guides helium gas from the outlet to the one or more inlets to circulate the helium gas in the circulation flow path; and a heat exchanger that raises a temperature of the helium gas passing through the circulation flow path by atmosphere.
The present invention relates to a polishing head for pressing a polishing tape against a substrate, such as a wafer. The present invention further relates to a polishing apparatus for polishing a substrate with such a polishing head. The polishing head (10) includes a pressing mechanism (12) configured to press a polishing tape (2) against a substrate W, and a tape hook (40) configured to restrict movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape positioning surface (47) that faces a polishing surface of the edge of the polishing tape (2).
B24B 41/00 - Éléments constitutifs des machines ou dispositifs à meuler, tels que bâtis, bancs, chariots ou poupées
B24B 7/22 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière des objets non métalliques à meuler pour meuler de la matière inorganique, p. ex. de la pierre, des céramiques, de la porcelaine
62.
ELASTIC MEMBRANE, POLISHING HEAD, AND POLISHING METHOD
An elastic membrane that can improve elasticity is disclosed. The elastic membrane has a pressing portion and a partition wall having a bulging structure.
B24B 41/06 - Supports de pièces, p. ex. lunettes réglables
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
63.
NOZZLE POSITION ADJUSTING DEVICE, NOZZLE POSITION ADJUSTING METHOD, AND NOZZLE POSITION ADJUSTING HOLDER
A nozzle position adjusting device is used for a substrate cleaning device including a substrate support portion that supports a substrate and a nozzle that jets a cleaning liquid toward the substrate. The nozzle position adjusting device includes a position confirmation plate in which a position display is formed and which is installed in the substrate support portion, and a positioning mechanism configured to extend from the nozzle toward the position confirmation plate. The positioning mechanism determines the position of the nozzle with respect to the position confirmation plate by using the position display.
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
64.
SUBSTRATE PROCESSING MODULE AND SUBSTRATE PROCESSING METHOD
A substrate processing module capable of improving a cleaning efficiency of an object to be cleaned is disclosed. The substrate processing module includes a gas supply device configured to supply a gas to a gap between a cleaning member and a surface to be cleaned. The gas supply device is configured to generate a fine bubble through the cleaning member.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
B08B 3/00 - Nettoyage par des procédés impliquant l'utilisation ou la présence d'un liquide ou de vapeur d'eau
B08B 3/12 - Nettoyage impliquant le contact avec un liquide avec traitement supplémentaire du liquide ou de l'objet en cours de nettoyage, p. ex. par la chaleur, par l'électricité ou par des vibrations par des vibrations soniques ou ultrasoniques
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
65.
TRANSFER APPARATUS AND SUBSTRATE PROCESSING APPARATUS
To improve a transfer rate of substrates and suppress particles from adhering to the surfaces to be processed of the substrates.
To improve a transfer rate of substrates and suppress particles from adhering to the surfaces to be processed of the substrates.
A transfer apparatus configured to transfer a substrate in an elevating direction and a traveling direction perpendicular to the elevating direction includes an attachment member 710-1. The attachment member 710-1 is fixed to a side surface of a module frame 402A for installing a plating module including a substrate loading/unloading port 404-1 to 404-8. The attachment member 710-1 includes a plurality of traveling rails 714-1 to 714-3 extending in a traveling direction disposed on both sides of the substrate loading/unloading port 404-1 to 404-8 in the elevating direction. The transfer apparatus includes an elevating rail 716 extending in the elevating direction across the plurality of traveling rails 714-1 to 714-3 and being movable along the plurality of traveling rails 714-1 to 714-3, and a transfer robot 718 configured to be movable vertically along the elevating rail 716 and including a hand for holding a substrate.
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
An abrasion detection device is provided, including: one or more sensors, outputting a measurement value in accordance with abrasion of a substrate cleaning tool; a pressing mechanism, pressing the substrate cleaning tool against the sensor; and a determination part, performing a determination on whether it is necessary to replace the substrate cleaning tool in accordance with the measurement value from the sensor.
B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
B08B 1/34 - Nettoyage par des procédés impliquant l'utilisation d'outils par le mouvement d’éléments de nettoyage sur une surface utilisant des éléments de nettoyage rotatifs en rotation autour d'un axe parallèle à la surface
Provided are a pump device and a pump system capable of properly detecting deterioration of a bearing even in a pump device for pumping up a liquid fuel material having corrosiveness. A pump device 3 is installed inside a tank 2 in which a corrosive liquid fuel material is stored, and pumps up the liquid fuel material. The pump device 3 comprises: a pump casing 4 constituted of a material having corrosion resistance to the liquid fuel material; a motor 6 installed in the pump casing 4 and generating driving force of the pump device 3; a rotary shaft 7 installed in the pump casing 5 and rotated by the driving force of the motor 6; a bearing 8 installed in the pump casing 5 and rotatably journaling the rotary shaft 7; a first sensor 9 provided outside the pump casing 5 and capable of detecting deterioration of the bearing 8; and a protection member 15 covering the first sensor 9.
F04D 7/06 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge les fluides étant chauds ou corrosifs, p. ex. du métal liquide
F04B 53/00 - Parties constitutives, détails ou accessoires non prévus dans les groupes ou ou présentant un intérêt autre que celui visé par ces groupes
F04B 53/16 - Carcasses d'enveloppeCylindresChemises de cylindre ou culassesConnexions des tubulures pour fluide
F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
F04D 29/00 - Parties constitutives, détails ou accessoires
68.
PASSAGE SYSTEM FOR EXHAUST GAS TO ABATEMENT APPARATUS
A passage system that can prevent leakage of exhaust gas delivered to an abatement reactor and can ensure safety is disclosed. The passage system includes: an exhaust-gas transfer pipe configured to deliver exhaust gas to an abatement reactor; a first two-way valve attached to the exhaust-gas transfer pipe; a bypass pipe that branches off from the exhaust-gas transfer pipe at a position upstream of the first two-way valve and bypasses the abatement reactor, and a second two-way valve attached to the bypass pipe. The first two-way valve and the second two-way valve are vertically positioned and have flow passages for the exhaust gas extending in a vertical direction.
F16K 1/14 - Soupapes ou clapets, c.-à-d. dispositifs obturateurs dont l'élément de fermeture possède au moins une composante du mouvement d'ouverture ou de fermeture perpendiculaire à la surface d'obturation à corps de soupape en forme de sphère
F16K 27/02 - Structures des logementsMatériaux utilisés à cet effet des soupapes de levage
There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; and an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein the auxiliary anode has an area that is not greater than ⅕ of an area of the anode.
A substrate is efficiently cleaned.
A substrate is efficiently cleaned.
A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder 440. The substrate cleaning member 472 is configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanism 446 from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism 447.
C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir
B05B 13/02 - Moyens pour supporter l'ouvrageDisposition ou assemblage des têtes de pulvérisationAdaptation ou disposition des moyens pour entraîner des pièces
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.
A cleaning apparatus for performs a cleaning process on a washing tool for substrate washing by supplying a washing liquid to the washing tool and bringing the washing tool into contact with a cleaning member. The cleaning apparatus includes: a liquid extraction part that extracts a washing liquid remaining inside the washing tool or a washing liquid flowing out from the washing tool during the cleaning process; a fluorescence analysis part that performs fluorescence analysis on the washing liquid extracted by the liquid extraction part and measures a fluorescence intensity of the washing liquid for an excitation light of a predetermined wavelength; and a judgement part that judges, based on the measured fluorescence intensity, whether or not the cleaning of the washing tool has been completed.
B08B 1/14 - LingettesÉléments absorbants, p. ex. écouvillons ou éponges
B08B 1/52 - Nettoyage par des procédés impliquant l'utilisation d'outils impliquant le nettoyage des éléments de nettoyage utilisant des fluides
B08B 1/54 - Nettoyage par des procédés impliquant l'utilisation d'outils impliquant le nettoyage des éléments de nettoyage utilisant des outils mécaniques
B08B 3/10 - Nettoyage impliquant le contact avec un liquide avec traitement supplémentaire du liquide ou de l'objet en cours de nettoyage, p. ex. par la chaleur, par l'électricité ou par des vibrations
73.
FREE JOINT STRUCTURE, PUSH-PULL DEVICE, AND SUBSTRATE PROCESSING MODULE
A free joint structure capable of absorbing a misalignment between a piston rod and a shaft is disclosed. The free joint structure includes a push-pull force generating portion and a target load portion.
Abnormality is determined with respect to delivery of a substrate to a transfer stage from a substrate holding device for a substrate polishing process. A substrate processing apparatus includes an abnormality determiner that determines abnormal delivery of the substrate to the transfer stage from the substrate holding device, based on a time difference between a first timing at which a first sensor detects that the substrate is placed on a placement surface of the transfer stage, and a second timing at which a second sensor detects that the substrate is placed on the placement surface.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
75.
INFORMATION PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND INFORMATION PROCESSING METHOD
A state of an elastic film in a substrate holding device for a substrate polishing process is properly or easily determined. An information processing apparatus includes an information acquirer that acquires apparatus operation information including polishing process information showing a state of a polishing process of a substrate, and transfer process information showing a state of a transfer process of the substrate, as an operation state at a time of a substrate processing apparatus being operated, and a state determiner that determines elastic film state information with respect to the apparatus operation information by inputting the apparatus operation information acquired by the information acquirer to a learning model that is caused to learn, by machine learning, a correlation between the apparatus operation information, and the elastic film state information showing a state of the elastic film in a top ring at a time of the polishing process and/or the transfer process shown by the apparatus operation information being performed.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
76.
FILM THICKNESS SIGNAL PROCESSING APPARATUS, POLISHING APPARATUS, AND FILM THICKNESS SIGNAL PROCESSING METHOD
Provided is a film thickness signal processing apparatus that improves in accuracy of a film-thickness distribution within a measurement range. The film thickness signal processing apparatus includes a receiver and a corrector. The receiver receives sensor data output from an eddy current sensor and generates first film thickness data 168 and second film thickness data 172. The corrector corrects the first film thickness data 168 and the second film thickness data 172 generated by the receiver. The corrector obtains corrected film thickness data 166 based on a size of the measurement range 174, 176 on the polishing object as a measurement target in a single measurement by the eddy current sensor, the first film thickness data 168 measured at a first measurement point 146 on the polishing object, and the second film thickness data 172 measured at a second measurement point 148 on the polishing object. A distance between the first measurement point 146 and the second measurement point 148 is equal to or less than the size of the measurement range 174, 176.
B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
G01B 7/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
77.
CONTAINER, CONTAINER SYSTEM, MAINTENANCE SYSTEM, AND MAINTENANCE METHOD FOR LIQUID HYDROGEN PUMP
Provided is a container capable of raising a temperature of a liquid hydrogen pump during maintenance and a system including such a container. Provided is a maintenance system used for maintenance of a liquid hydrogen pump, the maintenance system including: a hollow container main body that allows a liquid hydrogen pump to pass through during maintenance, the container main body having one or more inlets and one outlet; a circulation flow path that connects the outlet and the one or more inlets; a blower that is provided on the circulation flow path and guides helium gas from the outlet to the one or more inlets to circulate the helium gas in the circulation flow path; and a heat exchanger that raises a temperature of the helium gas passing through the circulation flow path by atmosphere.
In the present invention, a plating apparatus includes: a substrate transfer chamber 701; a fan filter unit 408 disposed above the substrate transfer chamber 701; a plating chamber 401 disposed lateral to the substrate transfer chamber 701; an exhaust chamber 702 disposed below the substrate transfer chamber 701; a partition member 720 for partitioning between the substrate transfer chamber 701 and the exhaust chamber 702; and a bypass flow path 730 for connecting the substrate transfer chamber 701 and the exhaust chamber 702 by bypassing the partition member 720. The plating chamber 401 has: a supply port 404 for supplying, to the plating chamber 401, gas having been supplied to the substrate transfer chamber 701 by means of the fan filter unit 408; and a discharge port 405 for discharging, to the outside, the gas having been supplied to the plating chamber 401. The exhaust chamber 702 has an exhaust port 703 for discharging, to the outside, the gas having been supplied to the exhaust chamber 702 via the bypass flow path 730.
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japon)
Inventeur(s)
Fujikata, Jumpei
Togawa, Tetsuji
Hori, Masaru
Miyashita, Naoto
Sekine, Makoto
Abrégé
The present invention is provided to maintain the state of an outer peripheral part of a substrate so as not to cause inconvenience in manufacturing through a manufacturing process in a semiconductor manufacturing process. This method for forming a protective film on an outer peripheral part including a bevel part of a substrate includes: a step for performing trim processing over the entire periphery of the outer peripheral part on at least one surface of a front surface and a rear surface of the substrate; and a step for forming a protective film on the outer peripheral part, the protective film being formed on the surface subjected to the trim processing such that the surface of the protective film becomes a surface flush with or recessed, with respect to the surface of the substrate.
H01L 21/31 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couchesEmploi de matériaux spécifiés pour ces couches
The present invention relates to a pump for delivering liquid, and more particularly to a pump for delivering liquid containing foreign object, such as string, fiber, or cloth. The pump includes an impeller (1) and an impeller casing (5) housing the impeller (1) therein. The impeller (1) has a hub (13), a single swept-back blade (2) coupled to the hub (13), and a shroud (25) to which the hub (13) and the swept-back blade (2) are coupled.
A hollow container is provided above a hollow column around a liquefied gas pump. The container includes: an openable and closable lower plate members at a lower part of the container; manual opening/closing devices to be operated to open and close the lower plate members inside the container; glove boxes configured to allow a user to insert his or her hands from outside the container in order to operate the manual opening/closing devices inside the container; and work windows arranged near the glove boxes and the manual opening/closing devices so that the glove boxes and manual opening/closing devices are visible from outside the container.
There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
B24B 37/04 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes
There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.
C25D 21/10 - Agitation des électrolytesDéplacement des claies
84.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
An information processing apparatus (5) includes: an information acquisition section (500) configured to acquire polishing conditions including top-ring state information, polishing-table state information, and polishing-fluid-supply-nozzle state information in the chemical mechanical polishing in chemical mechanical polishing of a substrate performed by a substrate processing apparatus including a polishing table configured to rotatably support a polishing pad, a top ring configured to press the substrate against the polishing pad, and a polishing-fluid supply nozzle configured to supply a polishing fluid onto the polishing pad; and a state prediction section (501) configured to predict substrate state information for the substrate on which the chemical mechanical polishing is performed under the polishing conditions by inputting the polishing conditions acquired by the information acquisition section (500) to a learning model (10A) having been generated by machine learning that causes the learning model (10A) to learn a correlation between the polishing conditions and the substrate state information indicating a state of the substrate on which the chemical mechanical polishing is performed under the polishing conditions.
The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate, such as a wafer. In the substrate processing method, rollers (11a, 11b) secured to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b) are brought into contact with the periphery of a substrate (W) having a notch (Nw), and further the rollers (11a, 11b) are moved in a circular motion, thereby rotating and circularly moving the substrate (W), and further, processing the substrate (W) by bringing a processing tool (201) into contact with the substrate (W). During processing of the substrate (W), a rotational speed of the substrate (W) is calculated based on measured values of a notch detection sensor (77) which is capable of detecting that the notch (Nw) has passed the movable shaft (13b), and an alarm is issued when the rotational speed of the substrate (W) is out of an allowable range which is set with respect to a theoretical rotational speed of the substrate (W).
B24B 49/00 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet comportant une table porte-pièce rotative
B24B 27/033 - Autres machines ou dispositifs à meuler pour le meulage d'une surface à des fins de nettoyage, p. ex. pour décalaminer ou corriger par meulage des défauts de la surface
B24B 41/06 - Supports de pièces, p. ex. lunettes réglables
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
The present invention pertains to a polishing device for polishing the surface of a substrate such as a wafer. The polishing device is provided with: an acoustic sensor (30) that is inserted into a first through-hole (15) formed in a polishing table (3), detects a polishing sound during polishing of the substrate, and outputs a signal representing the polishing sound; a support jig (43) that at least includes an elastic member (45) for supporting the acoustic sensor (30) on the polishing table (3), while inhibiting the transmission of the polishing sound from the polishing table (3); and a controller (9) that monitors the polishing state of the substrate, on the basis of the signal outputted from the acoustic sensor (30). A polishing pad (2) has formed therein at least one second through-hole (17) that is in communication with the first through-hole (15), and is filled with liquid, and the acoustic sensor (30) faces the second through-hole (17).
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/12 - Plateaux de rodage pour travailler les surfaces planes
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
A polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; an optical film-thickness measuring system having an optical sensor head mounted to the polishing table; a transparent-liquid inlet passage configured to supply a transparent liquid to the through-hole; and a light-emitting-side transparent-liquid outlet passage and a light-receiving-side transparent-liquid outlet passage communicating with the through-hole. The optical sensor head has a light-emitting surface configured to emit light obliquely upward and a light-receiving surface configured to receive reflected light from the workpiece, and the light-emitting surface faces the light-emitting-side transparent-liquid outlet passage, and the light-receiving surface faces the light-receiving-side transparent-liquid outlet passage.
A polishing apparatus capable of preventing abrasive grains in a polishing liquid and polishing debris of a workpiece from adhering to an optical sensor head and capable of improving a measuring accuracy of a film thickness of a workpiece is disclosed. The polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; a polishing head configured to press a workpiece against the polishing pad; an optical film-thickness measuring system having an optical sensor head disposed below the polishing pad; and a sensor-head cleaning nozzle configured to emit a cleaning liquid to the optical sensor head. The sensor-head cleaning nozzle is disposed in the polishing table and points at the optical sensor head.
B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
89.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the inert gas in the liquid by depressurizing the liquid in which the inert gas is dissolved; and processing the substrate while supplying the liquid containing the bubbles to the surface of the substrate.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
A substrate processing apparatus includes: a substrate holder (5) having a suction holding surface (5a) configured to hold a first surface (2a) of a substrate (W); a processing head (7) arranged to process an outer circumferential portion of the substrate (W); a hydrostatic plate (9) having a fluid support surface (9a) facing the suction holding surface (5a); and a fluid supply line (10) coupled to the hydrostatic plate (9) and configured to supply fluid to a space between the fluid support surface (9a) and a second surface (2b) of the substrate (W). The second surface (2b) is an opposite side of the substrate (W) from the first surface (2a). The fluid support surface (9a) is larger than the suction holding surface (5a).
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet
B24B 21/04 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet pour meuler des surfaces planes
B24B 41/06 - Supports de pièces, p. ex. lunettes réglables
B24B 55/06 - Équipement d'enlèvement des poussières sur les machines à meuler ou à polir
92.
RESISTOR FOR PLATING APPARATUS, AND PLATING APPARATUS
A resistor and the like capable of enhancing uniformity of a plating film formed on a substrate are provided. A resistor for a plating apparatus, for adjusting an electric field, the resistor being disposed between an anode and a holder holding a target object to be plated in the plating apparatus, is provided. The resistor for the plating apparatus includes a first resistance member having a first surface and including a plurality of first through holes formed open on the first surface, and a second resistance member having a second surface and including a plurality of second through holes formed open on the second surface, the first resistance member and the second resistance member are arranged with the first surface and the second surface facing each other, and a size of overlap between the plurality of first through holes and the plurality of second through holes is variable.
A plating apparatus includes a plating tank configured to store a plating solution, a substrate holder configured to hold a substrate as a target on which a plating process is performed, a rotation mechanism that rotates the substrate holder, an elevating/lowering mechanism that elevates and lowers the substrate holder, and a control device, and the substrate holder includes a contact member configured to contact the substrate to be able to supply power to the substrate, a sealing member configured to seal a gap between the substrate holder and the substrate, a liquid holding portion including the contact member inside, and being configured to be able to hold liquid when the gap between the substrate holder and the substrate is sealed with the sealing member, and a spout port that is configured to open into the liquid holding portion or a space communicating with the liquid holding portion inside the substrate holder, or that can be disposed on a side of the substrate holder, to spout the liquid.
To achieve a small-sized pre-wet module that can perform different pre-processes.
To achieve a small-sized pre-wet module that can perform different pre-processes.
A pre-wet module 200 includes a stage 220, a rotation mechanism 224, a cleaning liquid supply member 260, and a deaerated liquid supply member 250. The stage 220 is configured to hold a back surface of a substrate WF with a surface to be processed WF-a facing upward. The rotation mechanism 224 is configured to rotate the stage 220. The cleaning liquid supply member 260 has a nozzle 262 arranged above the stage 220. The cleaning liquid supply member 260 is configured to supply a cleaning liquid in a direction to the stage 220 via the nozzle 262. The deaerated liquid supply member 250 is configured to supply a deaerated liquid to a surface to be processed WF-a of a substrate WF held onto the stage 220. The deaerated liquid supply member 250 is configured to be movable between a supply position and a retracted position. The supply position is located between the nozzle 262 and the surface to be processed WF-a of the substrate WF, and the retracted position is retracted from between the nozzle 262 and the surface to be processed WF-a of the substrate WF.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
95.
WATER-DISCHARGE PUMP APPARATUS, WATER-DISCHARGE PUMP MANAGEMENT SYSTEM, WATER-DISCHARGE PUMP SUPPORT PLAN CREATING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, WATER-DISCHARGE PUMP SUPPORT PLAN CREATING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
A water-discharge pump apparatus includes: a pump controller configured to control operation of a pump based on a water level detected by a water level detector. The pump controller includes: a weather information acquisition section configured to acquire weather information on the monitoring site; an abnormality determining section configured to determine whether an abnormality has occurred in the water level detector or the pump; a water-level-detector abnormality processing section configured to control operation of the pump based on the weather information when it is determined that an abnormality has occurred in the water level detector; and a pump abnormality processing section configured to output support request information requesting support for water-discharge operation by at least one of the pump vehicle and the worker based on at least one of the water level detected by the water level detector and the weather information when it is determined that an abnormality has occurred in the pump.
The present invention relates to a substrate polishing method of polishing a substrate, such as a wafer, by pressing a polishing tape against the substrate. The substrate polishing method includes: storing an actual polishing condition for a substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition in a database (21a), with the actual polishing condition and the actual amount of use associated with each other, searching the database (21a) for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate, determining a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition; comparing a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use; and when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, polishing the polishing-target substrate by a polishing module (4A, 4B).
B24B 49/05 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage comportant la mesure d'une première pièce déjà travaillée et d'une autre pièce qui est en train d'être travaillée et la comparant avec la première
B24B 7/02 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet comportant une table porte-pièce se déplaçant suivant un mouvement de va-et-vient
The present invention pertains to a slide bearing used for a rotary machine such as a pump and a turbine, and particularly to a slide bearing used in an extremely low temperature environment. The slide bearing is provided with: a sliding contact pad (1) having a shaft support surface (1a) for supporting the outer peripheral surface of a rotating shaft (100); a shell (2) disposed on the radially outer side of the sliding contact pad (1); and a pad pressing mechanism (3) for pressing the sliding contact pad (1) against a pad support surface (2a) of the shell (2) when the sliding contact pad (1) contracts.
F16C 17/02 - Paliers à contact lisse pour mouvement de rotation exclusivement pour charges radiales uniquement
F16B 5/02 - Jonction de feuilles ou de plaques soit entre elles soit à des bandes ou barres parallèles à elles par organes de fixation utilisant un filetage
98.
Tilt Pad Journal Bearing with Lubrication Arrangement
A tilt pad journal bearing for supporting a rotating shaft includes an annular support ring and a plurality of arcuate pads tiltably mounted in the annular support ring and circumferentially spaced apart from each other. The tilt pad journal bearing further has a lubrication arrangement disposed between each pair of the plurality of arcuate pads. The lubrication arrangement includes a lubrication manifold connected to the annular support ring and recessed relative to a shaft support surface of adjacent arcuate pads to define an oil mixing cavity, and a plurality of lubrication nozzles protruding from the lubrication manifold into the oil mixing cavity. A cross-sectional flow area of at least one of the plurality of lubrication nozzles positioned toward a center of the lubrication manifold is larger than a cross-sectional flow area of a remainder of the plurality of nozzles.
F16C 17/03 - Paliers à contact lisse pour mouvement de rotation exclusivement pour charges radiales uniquement avec segments supportés obliquement, p. ex. paliers Michell
F16C 33/10 - Structures relatives à la lubrification
99.
METAL JOINED BODY AND METHOD FOR MANUFACTURING METAL JOINED BODY
This metal joined body comprises: a first plate member made of metal and having a first main surface and a second main surface facing the side opposite the first main surface; and a second plate member made of metal and having a third main surface and a fourth main surface facing the side opposite the third main surface. The first plate member has an embossed part in which the first main surface side forms a protruding section and the second main surface side forms a recessed section. The plate thickness from the third main surface to the fourth main surface of the second plate member is less than that of the embossed part in the plate thickness direction (X-axis direction) of the second plate member, and an end surface of the second plate member, which connects the peripheral edges of the third main surface and the fourth main surface, is joined to the protruding section of the embossed part.
A substrate holding device capable of eliminating a variation in a film thickness of a substrate is disclosed. The substrate holding device includes an offset mechanism configured to offset a carrier with respect to a retaining ring.
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
