The present invention provides a technique for evenly supplying powder used as a material to a DED nozzle.
The present invention provides a technique for evenly supplying powder used as a material to a DED nozzle.
According to one aspect, an AM apparatus for manufacturing a fabrication object is provided. This AM apparatus includes a DED nozzle. The DED nozzle includes a powder port provided at a distal end of a main body of the DED nozzle and configured to eject a powder material therefrom, and a powder passage provided in communication with the powder port and configured to allow the powder material to pass through inside the main body of the DED nozzle. The AM apparatus further includes a first pipe, a separation wall extending from an end portion of the first pipe toward an upstream side inside the first pipe, and a plurality of second pipes connected to the end portion of the first pipe. The separation wall divides the end portion of the first pipe into a plurality of regions, and the plurality of second pipes is connected to the plurality of regions of the first pipe, respectively. The second pipes are connected to the powder passage of the DED nozzle.
The present invention relates to a substrate polishing apparatus for polishing a substrate, such as a wafer, and more particularly to a substrate polishing apparatus for polishing a notch of a substrate, a bevel portion of the substrate, a device surface of the substrate, and a back surface of the substrate. The substrate polishing apparatus includes: a first polishing module; a second polishing module; and a third polishing module; wherein the first polishing module, the second polishing module, and the third polishing module are configured to polish different regions of a substrate.
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
3.
METHOD FOR DETERMINING HEALTH INDEX OF SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
In a substrate processing apparatus comprising multiple modules, the state of health of the whole substrate processing apparatus is grasped. A method for determining a health index of a substrate processing apparatus is provided. The substrate processing apparatus comprises multiple module groups, and each module group comprises a single module or multiple modules. The method comprises steps for obtaining multiple operation parameter values relating to each of the modules in the substrate processing apparatus; determining a module state of each of the modules, based on the multiple operation parameter values; and determining a health index of the substrate processing apparatus, based on the module states of the modules and weight coefficients for the modules.
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer. A substrate processing apparatus (1) comprises: a substrate-holding part (5); a processing head (10); a tape winding reel (22); a winding reel rotation mechanism (32); a tape outside diameter acquisition mechanism (70) for acquiring the outside diameter of a wound body (36) of the processing tape (2) wound around the tape winding reel (22); a rotation torque calculation unit (72) for calculating, on the basis of the outside diameter, the rotation torque necessary for the tape winding reel (22) to wind the processing tape (2) with a predetermined tape tensile force; and an operation control unit (60) for controlling the operation of the winding reel rotation mechanism (32). The operation control unit (60) is configured to cause the winding reel rotation mechanism (32) to rotate the tape winding reel (22) with the calculated rotation torque.
B24B 21/20 - Accessories for controlling or adjusting the tracking or the tension of the grinding belt
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
Provided is a top ring or a substrate polishing device capable of making a polishing profile more uniform between the center of a square substrate and the outer edge side of the substrate. This top ring, which is for holding a polygonal substrate, comprises: a base member connected to a rotary shaft; a substrate suction member that includes a substrate suction body having a substrate suction surface for suctioning the substrate, and communicates with a pressure-reduction module, a shielding member configured to shield a surface on the opposite side to the substrate suction surface of the substrate suction body, and a frame member connected to the shielding member so as to surround at least a part of the periphery of the base member; and a biasing mechanism that has a first end part in contact with the base member and a second end part in contact with the frame member, and applies a biasing force in a direction in which the base member and the frame member approaches or separates from each other.
B24B 37/30 - Work carriers for single side lapping of plane surfaces
B24B 37/005 - Control means for lapping machines or devices
B24B 37/12 - Lapping plates for working plane surfaces
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
6.
INFORMATION PROCESSING PROGRAM, TERMINAL DEVICE, INFORMATION PROCESSING METHOD, SERVER, ROTARY MACHINE, WIRELESS COMMUNICATION BOARD, AND INFORMATION PROCESSING SYSTEM
The present invention makes it easy to identify a communication target. Provided is an information processing program that causes a terminal device to function as: a first means for receiving, through wireless communication with a wireless communication board mounted on a rotary machine, identification information for identifying the wireless communication board; a second means for transmitting the identification information to a server capable of accessing a storage unit in which the identification information and rotary machine information are stored in association with each other; a third means for receiving, from the server, the rotary machine information associated with the identification information; and a fourth means for displaying the received rotary machine information on a display.
H04M 1/72412 - User interfaces specially adapted for cordless or mobile telephones with means for local support of applications that increase the functionality by interfacing with external accessories using two-way short-range wireless interfaces
H04M 11/00 - Telephonic communication systems specially adapted for combination with other electrical systems
H04W 4/30 - Services specially adapted for particular environments, situations or purposes
H04W 84/10 - Small scale networksFlat hierarchical networks
The present invention relates to a substrate polishing method of polishing a substrate, such as a wafer. The substrate polishing method includes: rotating a substrate (W) about its own axis, while causing the substrate (W) and a polishing head (10C) to make a circular motion relative to each other; and pressing a polishing tape (2B) against a surface (5a) of the substrate (W) by the polishing head (10C) while feeding the polishing tape (2B) in a longitudinal direction thereof to thereby polish a central region including a center (O1) of the substrate (W) and an outer region adjacent to the central region. A process of polishing the central region and the outer region includes at least two polishing processes performed under different polishing conditions. The at least two polishing processes include: a low polishing-rate process performed under a polishing condition such that a polishing rate in the central region is lower than a polishing rate in the outer region; and a high polishing-rate process performed under a polishing condition such that a polishing rate in the central region is higher than a polishing rate in the outer region.
B24B 21/06 - Machines or devices using grinding or polishing beltsAccessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
8.
POLISHING DEVICE AND METHOD FOR DETECTING POLISHING END POINT IN POLISHING DEVICE
The present invention accurately detects the end point of polishing. This polishing device comprises: a polishing table for holding a polishing pad; a holder for holding an object to be polished so as to face the polishing pad; at least one of a motor for rotationally driving the polishing table, a motor for rotating the holder holding the object, and a motor for rocking the holder holding the object; one or more drivers that are configured so as to supply drive current to the at least one motor and further output a digital signal according to the load of the at least one motor; and an end point detection unit that detects a polishing end point, which indicates the end of polishing of the object, on the basis of the digital signal output from the drivers.
A first dressing of dressing a polishing member is performed under a plurality of preset set dress conditions, a first cut rate of the polishing member is measured based on a measurement value of a surface height of the polishing member for each set dress condition, and the set dress condition and the first cut rate are associated with each other and stored as relationship data. The substrate is polished by applying a first dress condition corresponding to a target cut rate based on the relationship data, and a second cut rate of the polishing member is measured based on the measurement value of the surface height of polishing member. A second dress condition corresponding to the target cut rate is acquired based on a change of the second cut rate from the target cut rate and the relationship data, and substrate is polished by applying the second dress condition.
B24B 49/18 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
10.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus (2) is provided with: a substrate holding unit (11) that holds and rotates a substrate (W); an inert gas nozzle (14) that faces the inside of the substrate holding unit (11); an inert gas supply line (41) that is connected to the inert gas nozzle (14) and supplies an inert gas to the inert gas nozzle (14); an inert gas saturated water nozzle (15) that faces the inside of the substrate holding unit (11); and an inert gas saturated water supply line (48) that is connected to the inert gas saturated water nozzle (15) and supplies an inert gas saturated water, in which the inert gas is saturated, to the inert gas saturated water nozzle (15).
The present invention relates to a substrate processing device and a substrate processing method which are for polishing a substrate, e.g., a wafer. The substrate processing device includes: a polishing part (4) for polishing a peripheral portion of a substrate (W); a residual-film detection part (9) for detecting a residual film on the peripheral portion of the substrate (W) which has been polished by the polishing part (4); and a control unit (20) which assesses whether repolishing of the peripheral portion of the substrate (W) is necessary or not, on the basis of the results of the residual-film detection by the residual-film detection part (9), and which, when having assessed that repolishing is necessary, determines polishing conditions for the repolishing on the basis of the results of the residual-film detection. The polishing part (4) is configured so as to repolish the peripheral portion of the substrate (W) under the determined polishing conditions.
B24B 9/00 - Machines or devices designed for grinding edges or bevels on work or for removing burrsAccessories therefor
B24B 21/00 - Machines or devices using grinding or polishing beltsAccessories therefor
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japan)
Inventor
Heya, Akira
Inoue, Tsuyoshi
Ayuzawa, Hayate
Amanuma, Mitsuhiro
Fujihashi, Tatsuro
Suzuki, Koji
Abstract
This magnetic bearing apparatus is provided with a stator core (15) that accommodates axial coils (10A, 10B) and radial coils (12A-12D). The stator core (15) is provided with: second axial stator cores (17A, 17B) positioned on both sides of a second disk (8) and between the second disk (8) and the axial coils (10A, 10B); a plurality of radial stator cores (18) around which the radial coils (12A-12D) are wound; and first axial stator cores (19A, 19B) positioned on both sides of a first disk (7).
F16C 32/04 - Bearings not otherwise provided for using magnetic or electric supporting means
13.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
An information processing apparatus includes: an information acquisition section (500) configured to acquire finishing conditions including substrate-holder state information indicating a state of a substrate holder and a finishing-fluid-supply-structure state information indicating a state of a finishing-fluid supply structure in a finishing process of a substrate performed by a substrate processing apparatus including the substrate holder configured to hold the substrate and the finishing-fluid supply structure configured to supply a substrate finishing fluid onto the substrate; and a state prediction section (501) configured to predict substrate state information for the substrate on which the finishing process is performed under the finishing conditions by inputting the finishing conditions acquired by the information acquisition section (500) to a learning model (10A, 10B) that has been generated by machine learning that causes the learning model to learn a correlation between the finishing conditions and substrate state information indicating a state of the substrate on which the finishing process is performed under the finishing conditions.
The present invention relates to a polishing head for pressing a polishing tape against a substrate, such as a wafer. The present invention further relates to a polishing apparatus for polishing a substrate with such a polishing head. The polishing head (10) includes: a pressing member (12) configured to press a polishing tape (2) against the substrate (W); an actuator (15) configured to move the pressing member (12) in a predetermined pressing direction (CL) and apply a pressing force to the pressing member (12); and a tilt adjustment mechanism (40) configured to adjust tilt of the pressing member (12) with respect to the pressing direction (CL). The tilt adjustment mechanism (40) is configured to tilt the pressing member (12) with respect to the pressing direction (CL) and maintain an angle of the tilted pressing member (12).
There is provided method and a plating apparatus capable of improving uniformity of a plating film formed on a substrate. There is proposed a method for, in a computer, setting a forward/backward movement recipe for a shielding body in a plating apparatus, the plating apparatus including the shielding body, the shielding body being movable to a shielding position interposed between a plating target surface of a substrate and an anode and to a retracted position retracted from between the plating target surface of the substrate and the anode; and the method includes steps of: acquiring a resist pattern of the substrate, calculating a plating growth coefficient for each certain-angle area of the substrate based on the acquired resist pattern, and setting the forward/backward movement recipe for the shielding body based on the calculated plating growth coefficient for each certain-angle area.
The present invention detects disturbance of an electric field formed between an anode and a substrate. A plating device 10 includes: a plating tank 50 for storing a plating solution Q; an anode 21 disposed in the plating tank 50; a substrate holder 40 for holding a substrate WF such that a surface WF1 to be plated faces the anode 21; an anode mask 70 disposed between the anode 21 and the substrate holder 40, the anode mask 70 having an anode opening 70a penetrating the anode 21 side and the substrate holder 40 side, and being configured to be capable of adjusting the size of the anode opening 70a; a regulation plate 30 disposed between the anode mask 70 and the substrate holder 40; a measurement electrode 74 disposed between the anode mask 70 and the regulation plate 30; a reference electrode 75 disposed in the plating solution Q stored in the plating tank 50; and a measuring instrument 76 for measuring a voltage between the reference electrode 75 and the measurement electrode 74.
This heat medium supply device (1) comprises: a cooling-side outlet pipe (17) that transfers a heat medium from a cooling-side tank (16) to a cooling device (8); a cooling-side bypass pipe (44) that extends from a cooling-side return pipe (26) to the cooling-side outlet pipe (17) while bypassing the cooling-side tank (16); a cooling-side bypass valve (45) provided to the cooling-side bypass pipe (44); and an operation control unit (35) that controls the operation of the cooling-side bypass valve (45). The operation control unit (35) is configured to open the cooling-side bypass valve (45) when the temperature of the heat medium in the cooling-side return pipe (26) measured by a cooling-side temperature measurement device (41) is within a preset allowable low-temperature range, and to close the cooling-side bypass valve (45) when the temperature of the heat medium in the cooling-side return pipe (26) measured by the cooling-side temperature measurement device (41) is outside the allowable low-temperature range.
A substrate support device includes: a plurality of rollers that is arranged inside a housing and holds an outer edge of a substrate; a rotation drive unit that rotates the substrate by rotationally driving the plurality of rollers; a vibration transmission mechanism that is installed in such a manner as to extend from any of the rollers or the rotation drive unit up to the housing and transmits vibrations to the housing, the vibrations occurring due to a notch or an orientation flat on the outer edge of the substrate hitting the roller; a detection sensor that is arranged outside the housing, detects at least one of sound, vibration, and strain occurring from the housing, and outputs a signal corresponding thereto; and a rotation speed calculation section that calculates a rotation speed of the substrate, based on the signal outputted from the detection sensor.
G05B 19/418 - Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
This heat medium supply device (1) is provided with: a precooling heat medium supply pipe (41) that branches from a heating-side return pipe (25) and extends to a precooling heat exchanger (40); and a precooling heat medium return pipe (42) that extends from the pre-cooling heat exchanger (40) and is connected to the heating-side return pipe (25). A branch point (B1) at which the precooling heat medium supply pipe (41) branches from the heating-side return pipe (25) is positioned on the upstream side of a heating device (7) and supplies a heating medium before being heated by the heating device (7) to the precooling heat exchanger (40). A connection point (C1) between the precooling heat medium return pipe (42) and the heating-side return pipe (25) is positioned on the upstream side of the heating device (7) and supplies the heating medium that has passed through the precooling heat exchanger (40) to the heating device (7) through the heating-side return pipe (25).
This metallic joined structure (100) comprises: metal plates (110, 130) (first metal plates); a metal plate (120) (second metal plate) that is butted against the metal plates (110, 130) in a T-shape; and joining parts (140) that join the metal plates (110, 130) and the metal plate (120). The joining parts (140) comprise: first joining parts (141) that are disposed on one surface (121) side of the metal plate (120); and second joining parts (142) that are disposed on the other surface (122) side of the metal plate (120) and that are smaller than the first joining parts (141).
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
F04D 29/62 - MountingAssemblingDisassembling of radial or helico-centrifugal pumps
This absorption water cooler/heater with a cover comprises: an absorption water cooler/heater that transfers heat by using the heat of combustion of a fuel having the specific gravity lighter than that of air to thereby carry out a cycle of a refrigerant that undergoes a phase change and an absorption liquid in which the refrigerant is mixed; and a cover that covers the absorption water cooler/heater. The cover is provided with a discharge flow path at an upper part. The discharge flow path is for discharging a gas containing fuel when there is a fuel F outside the absorption water cooler/heater and inside the cover.
F25B 15/00 - Sorption machines, plants or systems, operating continuously, e.g. absorption type
22.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
An information processing apparatus (5) includes: an information acquisition section (500) configured to acquire polishing condition information including top-ring vibration information indicating vibration of a top ring in chemical mechanical polishing of the substrate and top-ring sound information indicating sound generated from the top ring in the chemical mechanical polishing of the substrate performed by a substrate processing apparatus including a polishing table rotatably supporting the polishing pad and the top ring configured to press the substrate against the polishing pad; and a state prediction section (501) configured to predict substrate slip-out information for the polishing condition information by inputting the polishing condition information acquired by the information acquisition section (500) to a learning model (10A) that has been generated by machine learning that causes the learning model to learn a correlation between the polishing condition information and the substrate slip-out information indicating occurrence of slip out of the substrate on which the chemical mechanical polishing is performed.
There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member. The substrate cleaning apparatus also includes a controller which controls pressing force for the cleaning tool against the self-cleaning member such that self-cleaning torque, with which the rotation mechanism rotates the cleaning tool at the time of self-cleaning of the cleaning tool, is prescribed torque equal to or more than substrate cleaning torque, with which the rotation mechanism rotates the cleaning tool when the cleaning tool cleans the substrate.
B08B 1/32 - Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
B08B 1/50 - Cleaning by methods involving the use of tools involving cleaning of the cleaning members
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
Proposed is a plating apparatus capable of detecting a film thickness of a plating film formed on a substrate during a plating process. The plating apparatus includes a plating tank, a substrate holder configured to hold a substrate, an anode disposed in the plating tank to oppose the substrate held by the substrate holder, a resistor disposed between the substrate and the anode to adjust an electric field, a first detection electrode disposed in a region between a surface to be plated of the substrate and the anode and having an electrode end disposed at a first position inside the resistor, a second detection electrode disposed at a second position where there is less change in potential as compared with the first position in the plating tank, and a controller that measures a potential difference between the first detection electrode and the second detection electrode, to estimate a thickness of a plating film on the substrate based on the potential difference.
C25D 21/10 - Agitating of electrolytesMoving of racks
25.
DATA PROCESSING SYSTEM, DATA PROCESSING DEVICE, DATA PROCESSING METHOD, OPERATION STATE EVALUATION SYSTEM, OPERATION STATE EVALUATION METHOD, DATA COLLECTION DEVICE, PROGRAM PROVIDING METHOD, MAINTENANCE PLANNING METHOD, MAINTENANCE PLAN PROVIDING METHOD, AND CHARGING METHOD
[Problem] To provide a data processing system capable of easily managing a plurality of load control devices. [Solution] This data processing system comprises a plurality of load control devices 2 and a data processing device 3 configured to be able to communicate with the plurality of load control devices 2. The plurality of load control devices 2 each comprise: a load-side communication unit configured to be able to communicate with the data processing device 3 and an inverter for driving a motor connected to a load device; a load-side storage unit capable of storing operation information D2 on a time when operating the load device; and a load-side control unit for storing the operation information D2 in the load-side storage unit and transmitting the operation information D2 stored in the load-side storage unit to the data processing device 3. The data processing device 3 comprises: a management-side communication unit 30 configured to be able to communicate with the plurality of load control devices 2; a management-side storage unit 31 having a larger storage capacity than the load-side storage unit and capable of storing the operation information D2; and a management-side control unit 32 for storing the operation information D2 received from each of the plurality of load control devices 2 in the management-side storage unit 31.
H02P 5/74 - Arrangements specially adapted for regulating or controlling the speed or torque of two or more electric motors controlling two or more AC dynamo-electric motors
F04B 51/00 - Testing machines, pumps, or pumping installations
There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member. The substrate cleaning apparatus also includes a controller which controls pressing force for the cleaning tool against the self-cleaning member such that self-cleaning torque, with which the rotation mechanism rotates the cleaning tool at the time of self-cleaning of the cleaning tool, is prescribed torque equal to or more than substrate cleaning torque, with which the rotation mechanism rotates the cleaning tool when the cleaning tool cleans the substrate.
B08B 1/32 - Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
B08B 1/50 - Cleaning by methods involving the use of tools involving cleaning of the cleaning members
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
27.
SUBSTRATE STATE MEASUREMENT DEVICE, PLATING APPARATUS, AND SUBSTRATE STATE MEASUREMENT METHOD
A state of a substrate as a plating target is measured. A substrate state measurement device includes: a stage configured to support a substrate such that the stage rotates the substrate, the substrate including a seed layer and a resist layer formed on the seed layer; at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage; and a state measurement module adapted to measure a state of a power supply member contact area on the basis of detection performed by the white confocal sensor on the power supply member contact area, the power supply member contact area being an area on the substrate which comes into contact with a power supply member.
SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD, SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, METHOD OF REMOVING LIQUID FROM UPPER SURFACE OF WAFER TO BE POLISHED, ELASTIC FILM FOR PRESSING WAFER AGAINST POLISHING PAD, SUBSTRATE RELEASE METHOD, AND CONSTANT AMOUNT GAS SUPPLY APPARATUS
A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B24B 37/005 - Control means for lapping machines or devices
B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
B24B 37/30 - Work carriers for single side lapping of plane surfaces
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
There is provided an apparatus for plating, comprising: a plating tank configured to store a plating solution therein; an anode placed in the plating tank and provided with a plurality of through holes; a substrate holder provided to hold a substrate to be opposed to the anode; a barrier membrane placed to be brought into close contact with a first face on a substrate side of the anode; and a rear face plate placed to be opposed to a second face of the anode that is on an opposite side to the first face and to be separated from the second face by a predetermined distance and configured to regulate an amount of bubbles generated from the anode and accumulated on the second face.
The present application relates to a substrate processing method and a substrate processing apparatus for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: measuring surface shapes of an edge portion of a first substrate and an edge portion of a second substrate; determining an applying condition for the filler to be applied to the laminated substrate based on results of the measuring of the surface shapes; and applying the filler to a gap between the edge portion of the first substrate and the edge portion of the second substrate of the laminated substrate under the determined applying condition.
B32B 37/24 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
B32B 38/00 - Ancillary operations in connection with laminating processes
B32B 41/00 - Arrangements for controlling or monitoring lamination processesSafety arrangements
The present application relates to a substrate processing method of suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The substrate processing method includes: applying a first filler to the gap between an edge portion of a first substrate and an edge portion of a second substrate; and applying a second filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate after applying of the first filler. A viscosity of the first filler is lower than a viscosity of the second filler.
EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO., LTD. (Japan)
Inventor
Aoyama, Jun
Yamamoto, Kensuke
Suzuki, Tatsuya
Abstract
This absorption water cooling/heating machine that performs heat transfer in a cycle of a refrigerant and an absorption liquid comprises: a regenerator that has a burner; a medium cooling mechanism that cools a temperature-adjustment target medium; a cooling water flow passage that allows cooling water to flow therethrough; a fuel supply mechanism; an air supply mechanism; a storage unit that stores a relationship for defining the flow rate of air relative to the flow rate of fuel being supplied to the burner; a control unit that controls a fuel flow rate adjustment mechanism in the fuel supply mechanism and an air flow rate adjustment mechanism in the air supply mechanism; and a temperature-related physical quantity detector for the temperature-adjustment target medium. The control unit compares an actual measurement temperature detected by the temperature-related physical quantity detector with the theoretical temperature of the temperature-adjustment target medium, and controls the air flow rate adjustment mechanism so as to reduce the flow rate of the air when the actual measurement temperature is higher than the theoretical temperature and to increase the flow rate of the air when the actual measurement temperature is lower.
EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO., LTD. (Japan)
Inventor
Aoyama, Jun
Suzuki, Tatsuya
Yamamoto, Kensuke
Abstract
This combustion device is provided with: a storage unit in which a first relationship that defines a flow rate-related value of air corresponding to a flow rate-related value of a first fuel supplied to a burner, and a similar second relationship pertaining to a second fuel are stored; and a control unit that controls an air flow rate adjustment mechanism so as to supply, to the burner, a supply air flow rate obtained on the basis of a value obtained by summing the flow rate-related values of the air obtained from the first relationship and the second relationship, respectively. An absorption cold/hot water machine includes a combustion device, a regenerator having at least a burner of the combustion device, a condenser, and an evaporator. The control unit operates the combustion device with a smaller combustion amount between a combustion amount in the burner for setting a cooling target medium to a target temperature and an upper limit combustion amount for maintaining proper operation of the absorption cold/hot water machine.
F23N 1/02 - Regulating fuel supply conjointly with air supply
F23C 1/00 - Combustion apparatus specially adapted for combustion of two or more kinds of fuel simultaneously or alternately, at least one kind of fuel being either a fluid fuel or a solid fuel suspended in air
F23N 1/10 - Regulating fuel supply conjointly with another medium, e.g. boiler water and with air supply or draught
A machine-learning apparatus includes: a learning-data storage section that stores plural sets of learning data including input data and output data, the input data including shape parameters of a pump section having an impeller and a flow passage section in which the impeller is accommodated, the output data including pump performance of a pump having the pump section defined by the shape parameters; a machine-learning section configured to cause a learning model to learn a correlation between the input data and the output data by inputting the plural sets of the learning data to the learning model; and a learned-model storage section configured to store the learning model that has been caused to learn the correlation by the machine-learning section.
G06F 30/28 - Design optimisation, verification or simulation using fluid dynamics, e.g. using Navier-Stokes equations or computational fluid dynamics [CFD]
G06F 30/27 - Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
The present invention relates to a pump unit. The pump unit (PU) includes a connector (400) configured to connect a plurality of motor pumps (MP). The connector (400) connects a front-stage side discharge casing (22) and a rear-stage side suction casing (21).
A technology that can clean a bottom surface of a dresser while inhibiting a cleaning solution discharged from a cleaning nozzle from splashing in a direction of a polishing pad. A polishing apparatus 1 includes a polishing table 2, a top ring 3, a dresser 10, at least one cleaning nozzle 20, and a dresser rotation mechanism 32. The at least one cleaning nozzle discharges a cleaning solution Lq in a fan shape and in a direction away from a polishing pad Pd, and an intersection point IP where a discharge central axis XL2 of the cleaning solution intersects with a bottom surface 11 of the dresser is positioned closer to the at least one cleaning nozzle than a center line CL1 of the bottom surface of the dresser. The at least one cleaning nozzle discharges the cleaning solution such that a part of the cleaning solution discharged from the cleaning nozzle and contacting the bottom surface of the dresser moves and passes through the center C1 of the bottom surface of the dresser.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
The information processing apparatus (5) includes an information acquisition section (500) configured to acquire operating condition information including operation conditions of a substrate processing apparatus (2) including a substrate holder (241); and a state prediction section (501) configured to predict substrate-holding-mechanism state information corresponding to the operating condition information by inputting the operating condition information to a learning model that has been generated by machine learning that causes the learning model to learn a correlation between the operating condition information and the substrate-holding-mechanism state information indicating a state of the substrate holding mechanism (241a, 241c, 241e) when the substrate processing device (2) operates under the operating conditions indicated by the operating condition information.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductor manufacturing machines; plating apparatus for
manufacturing semiconductors; electric cleaning apparatus
for manufacturing semiconductors; semiconductor
manufacturing machines and apparatus and their parts;
electric cleaning apparatus for use in manufacturing
semiconductor substrates [parts of machines]; electric
semiconductor wafer cleaning apparatus for use in the
manufacture of semiconductors; electroplating machines;
plating apparatus; liquid tanks for use in processing
plating [parts of machines]. Measuring or testing machines and instruments; apparatus for
automatically measuring plating solution concentration;
machines and apparatus for automatically adjusting component
concentration, pH value and replenishment amount of plating
solution; apparatus for measuring film thickness on the
substrate during plating in real time, and controlling the
film by partial mask that covers (part of) the periphery of
the substrate for a predetermined time, thereby enhancing
the uniformity of the plating film.
Provided is a technique capable of improving the stirring force of a plating solution by a paddle. A plating apparatus 1000 includes a paddle 70 disposed between an anode 11 and a substrate Wf. The paddle is configured to reciprocate parallel to the anode in a first direction and a second direction to stir a plating solution Ps. The paddle includes a honeycomb-structure portion 71 provided with a plurality of polygonal through-holes 74. The honeycomb-structure portion has a shape in which a paddle width at a center portion in a third direction which is a direction perpendicular to a reciprocation direction of the paddle is wider than a paddle width at an end portion in the third direction. The honeycomb-structure portion includes a first outer peripheral wall 75 oriented in the first direction. The first outer peripheral wall includes a first center wall 77 disposed at a center portion in the third direction of the first outer peripheral wall, and the first center wall extends in the third direction.
C25D 21/10 - Agitating of electrolytesMoving of racks
B01F 31/44 - Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
B01F 31/441 - Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
Semiconductor manufacturing machines; plating apparatus for
manufacturing semiconductors; electric cleaning apparatus
for manufacturing semiconductors; semiconductor
manufacturing machines and apparatus and their parts;
electric cleaning apparatus for use in manufacturing
semiconductor substrates [parts of machines]; electric
semiconductor wafer cleaning apparatus for use in the
manufacture of semiconductors; plating apparatus for
manufacturing semiconductors for plating while covering the
substrate and electric contact with conductivity-controlled
pure water; honeycomb-structured paddles for stirring
plating solution with high efficiency during plating [parts
of machines].
Semiconductor manufacturing machines; plating apparatus for
manufacturing semiconductors; electric cleaning apparatus
for manufacturing semiconductors; semiconductor
manufacturing machines and apparatus and their parts;
electric cleaning apparatus for use in manufacturing
semiconductor substrates [parts of machines]; electric
semiconductor wafer cleaning apparatus for use in the
manufacture of semiconductors; plating apparatus for
manufacturing semiconductors for plating while covering the
substrate and electric contact with conductivity-controlled
pure water; honeycomb-structured paddles for stirring
plating solution with high efficiency during plating [parts
of machines].
42.
PLATING APPARATUS AND OPERATION METHOD OF PLATING APPARATUS
To efficiently remove gas bubbles from an entire ionically resistive element. A plating apparatus includes a plating tank (410), a substrate holder (440), an anode (430), an ionically resistive element (450), an agitating member (480), and a driving mechanism (482). The plating tank (410) is configured to contain a plating solution. The substrate holder (440) is configured to hold a substrate (Wf) with a surface to be plated facing downward. The anode (430) is disposed in the plating tank (410). The ionically resistive element (450) is disposed between the substrate (Wf) and the anode (430). The agitating member (480) is disposed between the substrate (Wf) and the ionically resistive element (450). The driving mechanism (482) is configured to reciprocate the agitating member (480) along the surface to be plated of the substrate (Wf). The driving mechanism (482) is configured to perform a first gas-bubble removal operation to reciprocate the agitating member (480) around a first position and a second gas-bubble removal operation to reciprocate the agitating member (480) around a second position different from the first position, during a bubble removing process for removing gas bubbles attached to the ionically resistive element (450).
To planarize a substrate having irregularities on its surface. Provided is a method of chemical mechanical polishing of a substrate. The method includes the step of polishing the substrate using a processing solution, and the step of changing concentration of an effective component in the processing solution, which contributes to the polishing of the substrate.
The present invention relates to a pump apparatus for pressurizing liquid hydrogen, and more particularly to a pump apparatus equipped with a thrust balance mechanism for canceling axial thrust acting on an impeller. The pump apparatus includes a rotation shaft (1), a plurality of impellers (2a to 2h) fixed to the rotation shaft (1), bearings (5, 6) for rotatably supporting the rotation shaft (1), a pump casing (7) for housing the plurality of impellers (2a to 2h), and a first thrust balance mechanism (20) and a second thrust balance mechanism (40) for canceling the weight of a rotor including the rotation shaft (1) and the plurality of impellers (2a to 2h) and the axial thrust acting on the plurality of impellers (2a to 2h).
Provided is a rotation speed calculation apparatus including: a first vibration sensor configured to detect a vibration generated when a notch in a peripheral edge portion of a substrate to be cleaned hits a roller holding the peripheral edge portion of the substrate when the substrate is rotated by driving the roller to rotate; a second vibration sensor configured to detect a vibration of a housing defining a space in which the substrate is cleaned; and a rotation speed calculator configured to calculate a rotation speed of the substrate based on the vibration detected by the first vibration sensor and the vibration detected by the second vibration sensor.
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
B08B 1/34 - Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
In this cool-down method, liquefied gas is simultaneously introduced into suction containers (2A, 2B) through introduction lines (121, 122) extending from a liquefied gas storage tank (105), the liquefied gas is passed through a flow path switching device (5A) in the suction container (2A) while bypassing a submerged pump (1A) in the suction container (2A), the liquefied gas is passed through a flow path switching device (5B) in the suction container (2B) while bypassing a submerged pump (1B) in the suction container (2B), and the liquefied gas is discharged from the suction container (2A) and the suction container (2B) through the flow path switching device (5A) and the flow path switching device (5B).
To suppress the occurrence of defective plating due to air bubbles generated from an anode, and to simplify a structure related to the supply of a plating solution. This plating module 400 includes: a plating tank 410 for storing a plating solution; an anode 430 disposed in the plating tank 410; a substrate holder 440 configured to hold the substrate Wf with the to-be-plated surface Wf-a facing downward; a membrane 420 for partitioning an anode region 424 in which the anode 430 is disposed and a cathode region 422 in which the substrate Wf is disposed during the plating process, the membrane 420 having an inclined surface 423a facing the anode 430; a supply port 412 for supplying the plating solution to the anode region 424; gas-liquid piping 470 having a first end part 472 that opens in the vicinity of the upper edge of the inclined surface 423a of the membrane 420 and a second end part 474 that opens above the to-be-plated surface of the substrate while undergoing plating, the gas-liquid piping 470 being configured so as to supply the plating solution supplied from the supply port 412 to the anode region 424 to the cathode region 422 via the second end part 474.
The present invention relates to a technology for determining a dressing condition for dressing a polishing pad that is used for polishing a workpiece such as a wafer, a substrate, or a panel. A dressing condition determination device (60) comprises: a storage device (60a) storing an estimation model (62) constructed by machine learning; and a processor (60b) that executes calculation in accordance with an algorithm of the estimation model (62). The estimation model (62) is configured to output, upon input of a target trajectory image showing a target trajectory of a plurality of abrasive grains, which constitute a dressing surface (51a), on a polishing pad (2), a dressing condition for achieving the target trajectory.
Provided is a container capable of raising a temperature of a liquid hydrogen pump during maintenance and a system including such a container. Provided is a maintenance system used for maintenance of a liquid hydrogen pump, the maintenance system including: a hollow container main body that allows a liquid hydrogen pump to pass through during maintenance, the container main body having one or more inlets and one outlet; a circulation flow path that connects the outlet and the one or more inlets; a blower that is provided on the circulation flow path and guides helium gas from the outlet to the one or more inlets to circulate the helium gas in the circulation flow path; and a heat exchanger that raises a temperature of the helium gas passing through the circulation flow path by atmosphere.
The present invention relates to a polishing head for pressing a polishing tape against a substrate, such as a wafer. The present invention further relates to a polishing apparatus for polishing a substrate with such a polishing head. The polishing head (10) includes a pressing mechanism (12) configured to press a polishing tape (2) against a substrate W, and a tape hook (40) configured to restrict movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape positioning surface (47) that faces a polishing surface of the edge of the polishing tape (2).
B24B 41/00 - Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
51.
ELASTIC MEMBRANE, POLISHING HEAD, AND POLISHING METHOD
An elastic membrane that can improve elasticity is disclosed. The elastic membrane has a pressing portion and a partition wall having a bulging structure.
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 37/10 - Lapping machines or devicesAccessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
52.
NOZZLE POSITION ADJUSTING DEVICE, NOZZLE POSITION ADJUSTING METHOD, AND NOZZLE POSITION ADJUSTING HOLDER
A nozzle position adjusting device is used for a substrate cleaning device including a substrate support portion that supports a substrate and a nozzle that jets a cleaning liquid toward the substrate. The nozzle position adjusting device includes a position confirmation plate in which a position display is formed and which is installed in the substrate support portion, and a positioning mechanism configured to extend from the nozzle toward the position confirmation plate. The positioning mechanism determines the position of the nozzle with respect to the position confirmation plate by using the position display.
B08B 3/02 - Cleaning by the force of jets or sprays
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
53.
SUBSTRATE PROCESSING MODULE AND SUBSTRATE PROCESSING METHOD
A substrate processing module capable of improving a cleaning efficiency of an object to be cleaned is disclosed. The substrate processing module includes a gas supply device configured to supply a gas to a gap between a cleaning member and a surface to be cleaned. The gas supply device is configured to generate a fine bubble through the cleaning member.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/00 - Cleaning by methods involving the use or presence of liquid or steam
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
54.
TRANSFER APPARATUS AND SUBSTRATE PROCESSING APPARATUS
To improve a transfer rate of substrates and suppress particles from adhering to the surfaces to be processed of the substrates.
To improve a transfer rate of substrates and suppress particles from adhering to the surfaces to be processed of the substrates.
A transfer apparatus configured to transfer a substrate in an elevating direction and a traveling direction perpendicular to the elevating direction includes an attachment member 710-1. The attachment member 710-1 is fixed to a side surface of a module frame 402A for installing a plating module including a substrate loading/unloading port 404-1 to 404-8. The attachment member 710-1 includes a plurality of traveling rails 714-1 to 714-3 extending in a traveling direction disposed on both sides of the substrate loading/unloading port 404-1 to 404-8 in the elevating direction. The transfer apparatus includes an elevating rail 716 extending in the elevating direction across the plurality of traveling rails 714-1 to 714-3 and being movable along the plurality of traveling rails 714-1 to 714-3, and a transfer robot 718 configured to be movable vertically along the elevating rail 716 and including a hand for holding a substrate.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
An abrasion detection device is provided, including: one or more sensors, outputting a measurement value in accordance with abrasion of a substrate cleaning tool; a pressing mechanism, pressing the substrate cleaning tool against the sensor; and a determination part, performing a determination on whether it is necessary to replace the substrate cleaning tool in accordance with the measurement value from the sensor.
B08B 13/00 - Accessories or details of general applicability for machines or apparatus for cleaning
B08B 1/34 - Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
Provided are a pump device and a pump system capable of properly detecting deterioration of a bearing even in a pump device for pumping up a liquid fuel material having corrosiveness. A pump device 3 is installed inside a tank 2 in which a corrosive liquid fuel material is stored, and pumps up the liquid fuel material. The pump device 3 comprises: a pump casing 4 constituted of a material having corrosion resistance to the liquid fuel material; a motor 6 installed in the pump casing 4 and generating driving force of the pump device 3; a rotary shaft 7 installed in the pump casing 5 and rotated by the driving force of the motor 6; a bearing 8 installed in the pump casing 5 and rotatably journaling the rotary shaft 7; a first sensor 9 provided outside the pump casing 5 and capable of detecting deterioration of the bearing 8; and a protection member 15 covering the first sensor 9.
F04D 7/06 - Pumps adapted for handling specific fluids, e.g. by selection of specific materials for pumps or pump parts of centrifugal type the fluids being hot or corrosive, e.g. liquid metal
F04B 53/00 - Component parts, details or accessories not provided for in, or of interest apart from, groups or
F04B 53/16 - CasingsCylindersCylinder liners or headsFluid connections
F04D 13/08 - Units comprising pumps and their driving means the pump being electrically driven for submerged use
F04D 29/00 - Details, component parts, or accessories
57.
PASSAGE SYSTEM FOR EXHAUST GAS TO ABATEMENT APPARATUS
A passage system that can prevent leakage of exhaust gas delivered to an abatement reactor and can ensure safety is disclosed. The passage system includes: an exhaust-gas transfer pipe configured to deliver exhaust gas to an abatement reactor; a first two-way valve attached to the exhaust-gas transfer pipe; a bypass pipe that branches off from the exhaust-gas transfer pipe at a position upstream of the first two-way valve and bypasses the abatement reactor, and a second two-way valve attached to the bypass pipe. The first two-way valve and the second two-way valve are vertically positioned and have flow passages for the exhaust gas extending in a vertical direction.
F16K 1/14 - Lift valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with ball-shaped valve members
F16K 27/02 - Construction of housingsUse of materials therefor of lift valves
There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; and an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein the auxiliary anode has an area that is not greater than ⅕ of an area of the anode.
A cleaning apparatus for performs a cleaning process on a washing tool for substrate washing by supplying a washing liquid to the washing tool and bringing the washing tool into contact with a cleaning member. The cleaning apparatus includes: a liquid extraction part that extracts a washing liquid remaining inside the washing tool or a washing liquid flowing out from the washing tool during the cleaning process; a fluorescence analysis part that performs fluorescence analysis on the washing liquid extracted by the liquid extraction part and measures a fluorescence intensity of the washing liquid for an excitation light of a predetermined wavelength; and a judgement part that judges, based on the measured fluorescence intensity, whether or not the cleaning of the washing tool has been completed.
B08B 1/14 - WipesAbsorbent members, e.g. swabs or sponges
B08B 1/52 - Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
B08B 1/54 - Cleaning by methods involving the use of tools involving cleaning of the cleaning members using mechanical tools
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
60.
FREE JOINT STRUCTURE, PUSH-PULL DEVICE, AND SUBSTRATE PROCESSING MODULE
A free joint structure capable of absorbing a misalignment between a piston rod and a shaft is disclosed. The free joint structure includes a push-pull force generating portion and a target load portion.
Abnormality is determined with respect to delivery of a substrate to a transfer stage from a substrate holding device for a substrate polishing process. A substrate processing apparatus includes an abnormality determiner that determines abnormal delivery of the substrate to the transfer stage from the substrate holding device, based on a time difference between a first timing at which a first sensor detects that the substrate is placed on a placement surface of the transfer stage, and a second timing at which a second sensor detects that the substrate is placed on the placement surface.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
62.
INFORMATION PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND INFORMATION PROCESSING METHOD
A state of an elastic film in a substrate holding device for a substrate polishing process is properly or easily determined. An information processing apparatus includes an information acquirer that acquires apparatus operation information including polishing process information showing a state of a polishing process of a substrate, and transfer process information showing a state of a transfer process of the substrate, as an operation state at a time of a substrate processing apparatus being operated, and a state determiner that determines elastic film state information with respect to the apparatus operation information by inputting the apparatus operation information acquired by the information acquirer to a learning model that is caused to learn, by machine learning, a correlation between the apparatus operation information, and the elastic film state information showing a state of the elastic film in a top ring at a time of the polishing process and/or the transfer process shown by the apparatus operation information being performed.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
63.
FILM THICKNESS SIGNAL PROCESSING APPARATUS, POLISHING APPARATUS, AND FILM THICKNESS SIGNAL PROCESSING METHOD
Provided is a film thickness signal processing apparatus that improves in accuracy of a film-thickness distribution within a measurement range. The film thickness signal processing apparatus includes a receiver and a corrector. The receiver receives sensor data output from an eddy current sensor and generates first film thickness data 168 and second film thickness data 172. The corrector corrects the first film thickness data 168 and the second film thickness data 172 generated by the receiver. The corrector obtains corrected film thickness data 166 based on a size of the measurement range 174, 176 on the polishing object as a measurement target in a single measurement by the eddy current sensor, the first film thickness data 168 measured at a first measurement point 146 on the polishing object, and the second film thickness data 172 measured at a second measurement point 148 on the polishing object. A distance between the first measurement point 146 and the second measurement point 148 is equal to or less than the size of the measurement range 174, 176.
B24B 49/02 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
A substrate is efficiently cleaned.
A substrate is efficiently cleaned.
A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder 440. The substrate cleaning member 472 is configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanism 446 from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism 447.
One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.
Provided is a container capable of raising a temperature of a liquid hydrogen pump during maintenance and a system including such a container. Provided is a maintenance system used for maintenance of a liquid hydrogen pump, the maintenance system including: a hollow container main body that allows a liquid hydrogen pump to pass through during maintenance, the container main body having one or more inlets and one outlet; a circulation flow path that connects the outlet and the one or more inlets; a blower that is provided on the circulation flow path and guides helium gas from the outlet to the one or more inlets to circulate the helium gas in the circulation flow path; and a heat exchanger that raises a temperature of the helium gas passing through the circulation flow path by atmosphere.
In the present invention, a plating apparatus includes: a substrate transfer chamber 701; a fan filter unit 408 disposed above the substrate transfer chamber 701; a plating chamber 401 disposed lateral to the substrate transfer chamber 701; an exhaust chamber 702 disposed below the substrate transfer chamber 701; a partition member 720 for partitioning between the substrate transfer chamber 701 and the exhaust chamber 702; and a bypass flow path 730 for connecting the substrate transfer chamber 701 and the exhaust chamber 702 by bypassing the partition member 720. The plating chamber 401 has: a supply port 404 for supplying, to the plating chamber 401, gas having been supplied to the substrate transfer chamber 701 by means of the fan filter unit 408; and a discharge port 405 for discharging, to the outside, the gas having been supplied to the plating chamber 401. The exhaust chamber 702 has an exhaust port 703 for discharging, to the outside, the gas having been supplied to the exhaust chamber 702 via the bypass flow path 730.
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japan)
Inventor
Fujikata, Jumpei
Togawa, Tetsuji
Hori, Masaru
Miyashita, Naoto
Sekine, Makoto
Abstract
The present invention is provided to maintain the state of an outer peripheral part of a substrate so as not to cause inconvenience in manufacturing through a manufacturing process in a semiconductor manufacturing process. This method for forming a protective film on an outer peripheral part including a bevel part of a substrate includes: a step for performing trim processing over the entire periphery of the outer peripheral part on at least one surface of a front surface and a rear surface of the substrate; and a step for forming a protective film on the outer peripheral part, the protective film being formed on the surface subjected to the trim processing such that the surface of the protective film becomes a surface flush with or recessed, with respect to the surface of the substrate.
H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layersSelection of materials for these layers
The present invention relates to a pump for delivering liquid, and more particularly to a pump for delivering liquid containing foreign object, such as string, fiber, or cloth. The pump includes an impeller (1) and an impeller casing (5) housing the impeller (1) therein. The impeller (1) has a hub (13), a single swept-back blade (2) coupled to the hub (13), and a shroud (25) to which the hub (13) and the swept-back blade (2) are coupled.
A hollow container is provided above a hollow column around a liquefied gas pump. The container includes: an openable and closable lower plate members at a lower part of the container; manual opening/closing devices to be operated to open and close the lower plate members inside the container; glove boxes configured to allow a user to insert his or her hands from outside the container in order to operate the manual opening/closing devices inside the container; and work windows arranged near the glove boxes and the manual opening/closing devices so that the glove boxes and manual opening/closing devices are visible from outside the container.
There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.
C25D 21/10 - Agitating of electrolytesMoving of racks
73.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
An information processing apparatus (5) includes: an information acquisition section (500) configured to acquire polishing conditions including top-ring state information, polishing-table state information, and polishing-fluid-supply-nozzle state information in the chemical mechanical polishing in chemical mechanical polishing of a substrate performed by a substrate processing apparatus including a polishing table configured to rotatably support a polishing pad, a top ring configured to press the substrate against the polishing pad, and a polishing-fluid supply nozzle configured to supply a polishing fluid onto the polishing pad; and a state prediction section (501) configured to predict substrate state information for the substrate on which the chemical mechanical polishing is performed under the polishing conditions by inputting the polishing conditions acquired by the information acquisition section (500) to a learning model (10A) having been generated by machine learning that causes the learning model (10A) to learn a correlation between the polishing conditions and the substrate state information indicating a state of the substrate on which the chemical mechanical polishing is performed under the polishing conditions.
The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate, such as a wafer. In the substrate processing method, rollers (11a, 11b) secured to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b) are brought into contact with the periphery of a substrate (W) having a notch (Nw), and further the rollers (11a, 11b) are moved in a circular motion, thereby rotating and circularly moving the substrate (W), and further, processing the substrate (W) by bringing a processing tool (201) into contact with the substrate (W). During processing of the substrate (W), a rotational speed of the substrate (W) is calculated based on measured values of a notch detection sensor (77) which is capable of detecting that the notch (Nw) has passed the movable shaft (13b), and an alarm is issued when the rotational speed of the substrate (W) is out of an allowable range which is set with respect to a theoretical rotational speed of the substrate (W).
B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a rotary work-table
B24B 27/033 - Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
The present invention pertains to a polishing device for polishing the surface of a substrate such as a wafer. The polishing device is provided with: an acoustic sensor (30) that is inserted into a first through-hole (15) formed in a polishing table (3), detects a polishing sound during polishing of the substrate, and outputs a signal representing the polishing sound; a support jig (43) that at least includes an elastic member (45) for supporting the acoustic sensor (30) on the polishing table (3), while inhibiting the transmission of the polishing sound from the polishing table (3); and a controller (9) that monitors the polishing state of the substrate, on the basis of the signal outputted from the acoustic sensor (30). A polishing pad (2) has formed therein at least one second through-hole (17) that is in communication with the first through-hole (15), and is filled with liquid, and the acoustic sensor (30) faces the second through-hole (17).
B24B 37/013 - Devices or means for detecting lapping completion
B24B 37/10 - Lapping machines or devicesAccessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
B24B 37/12 - Lapping plates for working plane surfaces
B24B 49/10 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
A polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; an optical film-thickness measuring system having an optical sensor head mounted to the polishing table; a transparent-liquid inlet passage configured to supply a transparent liquid to the through-hole; and a light-emitting-side transparent-liquid outlet passage and a light-receiving-side transparent-liquid outlet passage communicating with the through-hole. The optical sensor head has a light-emitting surface configured to emit light obliquely upward and a light-receiving surface configured to receive reflected light from the workpiece, and the light-emitting surface faces the light-emitting-side transparent-liquid outlet passage, and the light-receiving surface faces the light-receiving-side transparent-liquid outlet passage.
A polishing apparatus capable of preventing abrasive grains in a polishing liquid and polishing debris of a workpiece from adhering to an optical sensor head and capable of improving a measuring accuracy of a film thickness of a workpiece is disclosed. The polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; a polishing head configured to press a workpiece against the polishing pad; an optical film-thickness measuring system having an optical sensor head disposed below the polishing pad; and a sensor-head cleaning nozzle configured to emit a cleaning liquid to the optical sensor head. The sensor-head cleaning nozzle is disposed in the polishing table and points at the optical sensor head.
B24B 53/017 - Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
78.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the inert gas in the liquid by depressurizing the liquid in which the inert gas is dissolved; and processing the substrate while supplying the liquid containing the bubbles to the surface of the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A substrate processing apparatus includes: a substrate holder (5) having a suction holding surface (5a) configured to hold a first surface (2a) of a substrate (W); a processing head (7) arranged to process an outer circumferential portion of the substrate (W); a hydrostatic plate (9) having a fluid support surface (9a) facing the suction holding surface (5a); and a fluid supply line (10) coupled to the hydrostatic plate (9) and configured to supply fluid to a space between the fluid support surface (9a) and a second surface (2b) of the substrate (W). The second surface (2b) is an opposite side of the substrate (W) from the first surface (2a). The fluid support surface (9a) is larger than the suction holding surface (5a).
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 21/00 - Machines or devices using grinding or polishing beltsAccessories therefor
B24B 21/04 - Machines or devices using grinding or polishing beltsAccessories therefor for grinding plane surfaces
B24B 41/06 - Work supports, e.g. adjustable steadies
B24B 55/06 - Dust extraction equipment on grinding or polishing machines
81.
RESISTOR FOR PLATING APPARATUS, AND PLATING APPARATUS
A resistor and the like capable of enhancing uniformity of a plating film formed on a substrate are provided. A resistor for a plating apparatus, for adjusting an electric field, the resistor being disposed between an anode and a holder holding a target object to be plated in the plating apparatus, is provided. The resistor for the plating apparatus includes a first resistance member having a first surface and including a plurality of first through holes formed open on the first surface, and a second resistance member having a second surface and including a plurality of second through holes formed open on the second surface, the first resistance member and the second resistance member are arranged with the first surface and the second surface facing each other, and a size of overlap between the plurality of first through holes and the plurality of second through holes is variable.
A plating apparatus includes a plating tank configured to store a plating solution, a substrate holder configured to hold a substrate as a target on which a plating process is performed, a rotation mechanism that rotates the substrate holder, an elevating/lowering mechanism that elevates and lowers the substrate holder, and a control device, and the substrate holder includes a contact member configured to contact the substrate to be able to supply power to the substrate, a sealing member configured to seal a gap between the substrate holder and the substrate, a liquid holding portion including the contact member inside, and being configured to be able to hold liquid when the gap between the substrate holder and the substrate is sealed with the sealing member, and a spout port that is configured to open into the liquid holding portion or a space communicating with the liquid holding portion inside the substrate holder, or that can be disposed on a side of the substrate holder, to spout the liquid.
A water-discharge pump apparatus includes: a pump controller configured to control operation of a pump based on a water level detected by a water level detector. The pump controller includes: a weather information acquisition section configured to acquire weather information on the monitoring site; an abnormality determining section configured to determine whether an abnormality has occurred in the water level detector or the pump; a water-level-detector abnormality processing section configured to control operation of the pump based on the weather information when it is determined that an abnormality has occurred in the water level detector; and a pump abnormality processing section configured to output support request information requesting support for water-discharge operation by at least one of the pump vehicle and the worker based on at least one of the water level detected by the water level detector and the weather information when it is determined that an abnormality has occurred in the pump.
To achieve a small-sized pre-wet module that can perform different pre-processes.
To achieve a small-sized pre-wet module that can perform different pre-processes.
A pre-wet module 200 includes a stage 220, a rotation mechanism 224, a cleaning liquid supply member 260, and a deaerated liquid supply member 250. The stage 220 is configured to hold a back surface of a substrate WF with a surface to be processed WF-a facing upward. The rotation mechanism 224 is configured to rotate the stage 220. The cleaning liquid supply member 260 has a nozzle 262 arranged above the stage 220. The cleaning liquid supply member 260 is configured to supply a cleaning liquid in a direction to the stage 220 via the nozzle 262. The deaerated liquid supply member 250 is configured to supply a deaerated liquid to a surface to be processed WF-a of a substrate WF held onto the stage 220. The deaerated liquid supply member 250 is configured to be movable between a supply position and a retracted position. The supply position is located between the nozzle 262 and the surface to be processed WF-a of the substrate WF, and the retracted position is retracted from between the nozzle 262 and the surface to be processed WF-a of the substrate WF.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
85.
SUBSTRATE POLISHING METHOD, SUBSTRATE POLISHING APPARATUS, AND COMPUTER-READABLE STORAGE MEDIUM STORING PROGRAM
The present invention relates to a substrate polishing method of polishing a substrate, such as a wafer, by pressing a polishing tape against the substrate. The substrate polishing method includes: storing an actual polishing condition for a substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition in a database (21a), with the actual polishing condition and the actual amount of use associated with each other, searching the database (21a) for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate, determining a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition; comparing a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use; and when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, polishing the polishing-target substrate by a polishing module (4A, 4B).
B24B 49/05 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
B24B 7/02 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a reciprocatingly-moved work-table
The present invention pertains to a slide bearing used for a rotary machine such as a pump and a turbine, and particularly to a slide bearing used in an extremely low temperature environment. The slide bearing is provided with: a sliding contact pad (1) having a shaft support surface (1a) for supporting the outer peripheral surface of a rotating shaft (100); a shell (2) disposed on the radially outer side of the sliding contact pad (1); and a pad pressing mechanism (3) for pressing the sliding contact pad (1) against a pad support surface (2a) of the shell (2) when the sliding contact pad (1) contracts.
A tilt pad journal bearing for supporting a rotating shaft includes an annular support ring and a plurality of arcuate pads tiltably mounted in the annular support ring and circumferentially spaced apart from each other. The tilt pad journal bearing further has a lubrication arrangement disposed between each pair of the plurality of arcuate pads. The lubrication arrangement includes a lubrication manifold connected to the annular support ring and recessed relative to a shaft support surface of adjacent arcuate pads to define an oil mixing cavity, and a plurality of lubrication nozzles protruding from the lubrication manifold into the oil mixing cavity. A cross-sectional flow area of at least one of the plurality of lubrication nozzles positioned toward a center of the lubrication manifold is larger than a cross-sectional flow area of a remainder of the plurality of nozzles.
This metal joined body comprises: a first plate member made of metal and having a first main surface and a second main surface facing the side opposite the first main surface; and a second plate member made of metal and having a third main surface and a fourth main surface facing the side opposite the third main surface. The first plate member has an embossed part in which the first main surface side forms a protruding section and the second main surface side forms a recessed section. The plate thickness from the third main surface to the fourth main surface of the second plate member is less than that of the embossed part in the plate thickness direction (X-axis direction) of the second plate member, and an end surface of the second plate member, which connects the peripheral edges of the third main surface and the fourth main surface, is joined to the protruding section of the embossed part.
A substrate holding device capable of eliminating a variation in a film thickness of a substrate is disclosed. The substrate holding device includes an offset mechanism configured to offset a carrier with respect to a retaining ring.
B24B 49/04 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
A load adjusting system includes: a bevel grinding device including a grinding head configured to grind a bevel part of a substrate; and a control device, the control device is configured to: acquire, from a load measuring device that performs measurement of a pressing load applied from the grinding head, measurement data acquired by performing the measurement; calculate, based on the measurement data and based on a set parameter set for the grinding head, an adjustment value used for adjusting the pressing load; and control a pressing operation of the grinding head based on the adjustment value.
The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, and more particularly to a substrate processing method and a substrate processing apparatus for polishing a bevel portion of the substrate and performing CMP processing of a flat portion of the substrate. The substrate processing method includes: polishing a bevel portion (B) of each of the plurality of substrates (W) by a polishing tool such that slope surfaces(S) of bevel portions (B) of the plurality of substrates (W) have the same slope angles (α); and performing CMP processing of a flat portion (P) of each of the plurality of substrates (W) whose bevel portions (B) have been polished.
B24B 9/02 - Machines or devices designed for grinding edges or bevels on work or for removing burrsAccessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
The disclosure provides a polishing apparatus capable of removing a polishing liquid or polishing debris from a light passing portion of a polishing pad. A polishing apparatus 1 includes a polishing table 3 supporting a polishing pad 2 that has a light passing portion 33; a polishing head 5 pressing a substrate W against a polishing surface 2a of the polishing pad 2; an optical sensor 21 disposed in the polishing table 3, irradiating light to the substrate W through the light passing portion 33, and receiving reflected light from the substrate W through the light passing portion 33; and a cleaning portion 12 forming a cleaning space CS that covers the light passing portion 33 above the light passing portion 33 and supplying a cleaning fluid to the light passing portion 33 through the cleaning space CS.
B24B 49/12 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 7/02 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
B24D 7/12 - Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front faceBushings or mountings therefor with apertures for inspecting the surface to be abraded
93.
POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD
A polishing apparatus is disclosed. The polishing apparatus can stabilize an optical path in a space between a transparent window of a polishing pad and an optical sensor head, thereby achieving accurate measuring of a film thickness of a workpiece. polishing apparatus includes: a polishing pad having a transparent window configured to allow light to pass therethrough; a polishing table supporting the polishing pad; a polishing head configured to press a workpiece against the polishing pad; and an optical film-thickness measuring system having an optical sensor head disposed below the transparent window, a space formed between the transparent window and the optical sensor head being filled with a transparent liquid.
A substrate processing system capable of supplying a gas-dissolved liquid having a supersaturated amount of dissolved gas without generating large bubbles in a middle of a supply line is disclosed. The substrate processing system includes a control device configured to control an operation of a bubble generation device. The control device is configured to control at least one of a pressure regulator and a boost pump so that a pressure of a gas supplied to a gas-dissolved liquid generation device is smaller than a pressure of a liquid supplied to the gas-dissolved liquid generation device.
B05B 12/14 - Arrangements for controlling deliveryArrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials to a single spray outlet
B05B 1/06 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops in annular, tubular or hollow conical form
B05B 7/26 - Apparatus in which liquids or other fluent materials from different sources are brought together before entering the discharge device
A plating method is a plating method for performing a plating process of a substrate with a plating apparatus including a substrate holder including a contact member that conductively contacts the substrate, and includes a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted, a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member, a step of stopping the discharging of the liquid, a step of starting decrease of tilt of the substrate holder to a horizontal position concurrently with or within a predetermined time before or after stopping the discharging of the liquid, a step of rotating the substrate holder at a second rotation speed higher than the first rotation speed while the substrate holder is at the horizontal position, and a step of performing the plating process on the substrate after the substrate is attached to the substrate holder.
Hollow containers (3, 4) are provided above a hollow column (2) provided around a liquefied gas pump (P), and a cable (8) for installing and removing the liquefied gas pump (P) is passed through the center of the containers (3, 4) from the bottom towards the top. The containers (3, 4) include: lower plate members (5, 6) having, at the center, cable through-holes (9, 10) allowing the cable (8) to pass; and stuffing box members (12) provided around the cable through-holes (9, 10) at the center of the lower plate members (5, 6), and having, at the center, cable insertion holes (13) through which the cable (8) is inserted. The stuffing box members (12) include opening diameter adjustment mechanisms (14, 20) that adjust the sizes of the opening diameters of the cable insertion holes (13).
Provided is a technique capable of easily controlling the shape of a three-dimensional object. A shaping nozzle 20 is configured to supply powder to be a material of a three-dimensional object to a shaping area 2 in which a three-dimensional object is shaped, and to melt the powder by irradiating the supplied powder with a beam. The shaping nozzle includes an inner cylinder 23 having a beam passage 25 through which a beam Bm passes, an outer cylinder 24 disposed outside the inner cylinder and having a powder passage 26 through which a powder Pd passes between the outer surface of the inner cylinder and the inner surface of the outer cylinder, and a plate member 40 disposed between a tip 29 of the inner cylinder and a tip 30 of the outer cylinder and the shaping area, and having hole 41 configured so that the beam that has passed through the beam passage and the powder that has passed through the powder passage pass therethrough.
B22F 10/25 - Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
B29C 64/153 - Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
A polishing method includes: detecting, by an acoustic sensor, an environmental sound including a sound arising from a polishing environment of a substrate to output an environmental sound signal representing the environmental sound from the acoustic sensor; generating an environmental sound spectrum indicating a relationship between a frequency and a sound pressure level from the environmental sound signal; detecting, by the acoustic sensor, a polishing sound of the substrate while pressing the substrate against a polishing pad to polish the substrate, to output a polishing sound signal representing the polishing sound from the acoustic sensor; generating a polishing sound spectrum indicating a relationship between a frequency and a sound pressure level from the polishing sound signal; calculating a difference between the polishing sound spectrum and the environmental sound spectrum to generate a differential spectrum; and monitoring a polishing progress of the substrate based on the differential spectrum.
