- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 29/30 - Semiconductor bodies having polished or roughened surface
Patent holdings for IPC class H01L 29/30
Total number of patents in this class: 77
10-year publication summary
|
9
|
6
|
1
|
5
|
1
|
6
|
1
|
3
|
2
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Globalwafers Co., Ltd. | 723 |
5 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47319 |
4 |
| Semiconductor Components Industries, L.L.C. | 5260 |
3 |
| Fuji Electric Co., Ltd. | 5390 |
3 |
| AXT, Inc. | 22 |
3 |
| Sumco Corporation | 1114 |
3 |
| SLT Technologies, Inc. | 128 |
3 |
| Denso Corporation | 25183 |
2 |
| Sumitomo Chemical Company, Limited | 9045 |
2 |
| Beijing Tongmei Xtal Technology Co., Ltd. | 25 |
2 |
| Enkris Semiconductor, Inc. | 402 |
2 |
| Unist (ulsan National Institute of Science and Technology) | 405 |
2 |
| SK Siltron Co., Ltd. | 167 |
2 |
| Samsung Electronics Co., Ltd. | 153845 |
1 |
| Toshiba Corporation | 12691 |
1 |
| Sumitomo Electric Industries, Ltd. | 16091 |
1 |
| Robert Bosch GmbH | 43587 |
1 |
| Mitsubishi Electric Corporation | 47602 |
1 |
| Tokyo Electron Limited | 13523 |
1 |
| United Microelectronics Corp. | 4450 |
1 |
| Other owners | 34 |