- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
Patent holdings for IPC class H01L 27/02
Total number of patents in this class: 8958
10-year publication summary
|
921
|
984
|
967
|
1011
|
883
|
729
|
640
|
632
|
577
|
244
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43015 |
1389 |
| Samsung Electronics Co., Ltd. | 147003 |
643 |
| Qualcomm Incorporated | 85914 |
274 |
| Texas Instruments Incorporated | 19456 |
259 |
| Boe Technology Group Co., Ltd. | 41346 |
255 |
| Intel Corporation | 47051 |
231 |
| GLOBALFOUNDRIES U.S. Inc. | 6425 |
191 |
| Renesas Electronics Corporation | 6001 |
182 |
| Micron Technology, Inc. | 26251 |
181 |
| United Microelectronics Corp. | 4242 |
180 |
| International Business Machines Corporation | 61344 |
150 |
| Infineon Technologies AG | 8235 |
146 |
| Socionext Inc. | 1557 |
134 |
| Rohm Co., Ltd. | 6468 |
103 |
| Changxin Memory Technologies, Inc. | 4927 |
100 |
| Semiconductor Components Industries, L.L.C. | 5259 |
97 |
| Monolithic 3D Inc. | 308 |
91 |
| Semiconductor Energy Laboratory Co., Ltd. | 11448 |
90 |
| NXP USA, Inc. | 4306 |
90 |
| SK Hynix Inc. | 11421 |
83 |
| Other owners | 4089 |