- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
Patent holdings for IPC class H01L 25/00
Total number of patents in this class: 9904
10-year publication summary
|
853
|
907
|
928
|
875
|
942
|
884
|
917
|
846
|
953
|
619
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43158 |
2281 |
| Samsung Electronics Co., Ltd. | 147334 |
605 |
| Intel Corporation | 47093 |
563 |
| Micron Technology, Inc. | 26164 |
491 |
| Murata Manufacturing Co., Ltd. | 24684 |
192 |
| Kioxia Corporation | 10346 |
170 |
| Yangtze Memory Technologies Co., Ltd. | 2704 |
167 |
| International Business Machines Corporation | 61402 |
165 |
| Qualcomm Incorporated | 86153 |
131 |
| Invensas Corporation | 613 |
113 |
| STATS ChipPAC Pte. Lte. | 1557 |
113 |
| Sandisk Technologies Inc. | 4825 |
107 |
| SK Hynix Inc. | 11438 |
106 |
| Nanya Technology Corporation | 2522 |
100 |
| Infineon Technologies AG | 8247 |
99 |
| Monolithic 3D Inc. | 308 |
98 |
| Advanced Semiconductor Engineering, Inc. | 1662 |
95 |
| Texas Instruments Incorporated | 19454 |
93 |
| Semiconductor Components Industries, L.L.C. | 5266 |
92 |
| Xilinx, Inc. | 3985 |
83 |
| Other owners | 4040 |