- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Patent holdings for IPC class H01L 23/538
Total number of patents in this class: 10372
10-year publication summary
|
617
|
624
|
817
|
1023
|
1178
|
1112
|
1143
|
1059
|
1304
|
456
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 41550 |
2099 |
| Intel Corporation | 46597 |
1091 |
| Samsung Electronics Co., Ltd. | 142124 |
912 |
| Qualcomm Incorporated | 83550 |
263 |
| Advanced Semiconductor Engineering, Inc. | 1622 |
251 |
| Micron Technology, Inc. | 26085 |
210 |
| STATS ChipPAC Pte. Lte. | 1543 |
175 |
| International Business Machines Corporation | 60597 |
122 |
| Infineon Technologies AG | 8181 |
120 |
| Amkor Technology Singapore Holding Pte. Ltd | 394 |
115 |
| Mediatek Inc. | 4910 |
113 |
| Murata Manufacturing Co., Ltd. | 24137 |
111 |
| Apple Inc. | 53955 |
105 |
| Samsung Electro-mechanics Co., Ltd. | 5362 |
101 |
| Invensas Corporation | 614 |
91 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 364 |
89 |
| SK Hynix Inc. | 11072 |
78 |
| Siliconware Precision Industries Co., Ltd. | 562 |
76 |
| Shinko Electric Industries Co., Ltd. | 1201 |
75 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 476 |
74 |
| Other owners | 4101 |