- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Patent holdings for IPC class H01L 23/538
Total number of patents in this class: 11348
10-year publication summary
|
615
|
621
|
816
|
1020
|
1178
|
1115
|
1151
|
1071
|
1327
|
1364
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 45590 |
2297 |
| Intel Corporation | 46455 |
1151 |
| Samsung Electronics Co., Ltd. | 148765 |
1038 |
| Qualcomm Incorporated | 87362 |
313 |
| Advanced Semiconductor Engineering, Inc. | 1673 |
262 |
| Micron Technology, Inc. | 26461 |
237 |
| STATS ChipPAC Pte. Lte. | 1548 |
183 |
| Infineon Technologies AG | 8277 |
131 |
| International Business Machines Corporation | 61738 |
129 |
| Amkor Technology Singapore Holding Pte. Ltd | 433 |
129 |
| Murata Manufacturing Co., Ltd. | 24950 |
117 |
| Mediatek Inc. | 5215 |
114 |
| Apple Inc. | 56170 |
113 |
| Samsung Electro-mechanics Co., Ltd. | 5685 |
101 |
| Invensas Corporation | 613 |
90 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 361 |
89 |
| Siliconware Precision Industries Co., Ltd. | 620 |
87 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 516 |
83 |
| Fuji Electric Co., Ltd. | 5242 |
81 |
| Shinko Electric Industries Co., Ltd. | 1216 |
80 |
| Other owners | 4523 |