- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Patent holdings for IPC class H01L 23/538
Total number of patents in this class: 10953
10-year publication summary
|
615
|
621
|
816
|
1020
|
1177
|
1115
|
1150
|
1064
|
1318
|
999
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
2185 |
| Intel Corporation | 47062 |
1155 |
| Samsung Electronics Co., Ltd. | 147131 |
995 |
| Qualcomm Incorporated | 86023 |
293 |
| Advanced Semiconductor Engineering, Inc. | 1660 |
260 |
| Micron Technology, Inc. | 26138 |
219 |
| STATS ChipPAC Pte. Lte. | 1558 |
180 |
| Infineon Technologies AG | 8244 |
130 |
| International Business Machines Corporation | 61353 |
126 |
| Amkor Technology Singapore Holding Pte. Ltd | 416 |
123 |
| Murata Manufacturing Co., Ltd. | 24650 |
117 |
| Mediatek Inc. | 5146 |
114 |
| Apple Inc. | 55287 |
110 |
| Samsung Electro-mechanics Co., Ltd. | 5634 |
101 |
| Invensas Corporation | 613 |
90 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 362 |
89 |
| Siliconware Precision Industries Co., Ltd. | 598 |
84 |
| SK Hynix Inc. | 11428 |
79 |
| Shinko Electric Industries Co., Ltd. | 1211 |
79 |
| Fuji Electric Co., Ltd. | 5168 |
78 |
| Other owners | 4346 |