Samsung Electro-mechanics Co., Ltd.

Republic of Korea


 
Total IP 5,346
Total IP incl. subs 5,349 (+ 3 for subs)
Total IP Rank # 203
IP Activity Score 4.2/5.0    4,242
IP Activity Rank # 142
Stock Symbol
ISIN KR7009150004
Market Cap. 8.6T  (KRW)
Industry Electronic Components
Sector Technology
Dominant Nice Class Scientific and electric apparatu...

Patents

Trademarks

5,268 1
0 0
76 0
1
 
Last Patent 2025 - Multilayer electronic component
First Patent 1987 - Film speaker using a piezo-elect...
Last Trademark 2006 - Ecoparts
First Trademark 2005 - SLIC

Subsidiaries

2 subsidiaries with IP (3 patents, 0 trademarks)

8 subsidiaries without IP

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2024 Invention Optical imaging system. An optical imaging system includes a first lens, a second lens, a third ...
Invention Coil component. A coil component includes an insulating substrate; a coil portion including a co...
Invention Multilayer capacitor. A multilayer capacitor includes a body including a dielectric layer and fi...
Invention Optical imaging system. An optical imaging system includes a first lens having an object-side su...
Invention Multilayer ceramic capacitor and method of manufacturing the same. A multilayer ceramic capacito...
Invention Coil component. A coil component includes a body; a first wound coil including a first coil port...
Invention Multilayer electronic component. A multilayer electronic component may include: a body including...
Invention Coil component. A coil component includes a body, a support member disposed within the body, a c...
Invention Magnetic component. A magnetic component includes a magnetic body, wherein the magnetic body inc...
Invention Printed circuit board. A printed circuit board includes an insulating layer and a wiring pattern...
Invention Coil component. A coil component includes a body, a first coil including a first coil portion ha...
Invention Coil component. A coil component includes a body including a first surface, a second surface fac...
Invention Multilayer electronic component. A multilayer electronic component of the present disclosure may...
Invention Multilayer electronic component. A multilayer electronic component includes a body containing a ...
Invention Multilayer electronic component. A multilayer electronic component includes a body having first ...
Invention Printed circuit board. A printed circuit board includes a wiring portion including one or more i...
Invention Coil component. A coil component includes a body including a first surface and a second surface ...
Invention Printed circuit board. A printed circuit board includes a substrate; first and second through-po...
Invention Multilayer electronic component and method for manufacturing the same. A multilayer electronic c...
Invention Multilayer electronic component. A multilayer electronic component includes a body including a d...
Invention Multilayer electronic component. A multilayer electronic component according to an example embod...
Invention Multilayered capacitor. A multilayered capacitor according to the present disclosure includes a ...
Invention Printed circuit board and manufacturing method thereof. A printed circuit board according to an ...
Invention Printed circuit board. A printed circuit board includes a first substrate including a first ante...
Invention Printed circuit board. A printed circuit board includes a core layer, a plurality of first wirin...
Invention Printed circuit board and method of manufacturing the same. A printed circuit board includes an ...
Invention Release film and method for manufacturing multilayer electronic component using the same. A rele...
Invention Printed circuit board. A printed circuit board includes a substrate with first through-portion; ...
Invention Circuit board and method of fabricating circuit board. A circuit board including a substrate hav...
Invention Printed circuit board and manufacturing method thereof. The present disclosure relates to a prin...
Invention Optical imaging system. An optical imaging system includes a first lens group, including at leas...
Invention Printed circuit board. A printed circuit board includes a first substrate including a first wiri...
Invention Circuit board and electronic component package. An embodiment of the present disclosure provides...
Invention Circuit board and electronic device package. A circuit board according to the present disclosure...
Invention Multi-layer ceramic electronic component. A multi-layer ceramic electronic component includes: a...
Invention All-solid-state battery. xxM1yyM21-x-y22.
Invention Radio frequency switch and method for operating thereof. A radio frequency (RF) switch circuit a...
Invention Circuit board and method of fabricating circuit board. A disclosed circuit board includes: a fir...
Invention Multilayer ceramic capacitor and method of preparing the same. A multilayer ceramic capacitor in...
Invention Charge pump system and operation method thereof. A charge pump system and method of operating th...
Invention All-solid-state battery. An all-solid-state battery according to an embodiment includes: a solid ...
2023 Invention All-solid-state battery and manufacturing method thereof. An all-solid-state battery includes: a...
Invention Multilayer ceramic capacitor and method of manufacturing the same. Provided is a multilayer cera...
Invention Lithium ion conductor and all-solid-state battery comprising the same. A lithium ion conductor a...
Invention Semiconductor package. A semiconductor package includes a first substrate including a first insu...
2006 G/S Electric inverters, electric switches, electromagnetic switches, electric resistances, capacitors...
2005 G/S multi-layer ceramic capacitors