Abstract

A camera module includes a base; a first carrier supported by the base and configured to move in a direction perpendicular to an optical axis direction; a second carrier supported by the first carrier and configured to move in the optical axis direction; and an optical member disposed in the second carrier, wherein a first support member that supports a movement of the second carrier in the optical axis direction is disposed between the first carrier and the second carrier, the first support member is disposed between a first corner portion that is disposed at an edge at which two adjacent side surfaces of the second carrier meet and a second corner portion disposed at an edge at which two adjacent side surfaces of the first carrier meet, and wherein the second corner portion faces the first corner portion in the direction perpendicular to the optical axis direction.

IPC Classes  ?

• H04N 23/51 - Housings
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A multilayer electronic component includes a body having a dielectric layer containing dielectric grains, internal electrodes, and a capacitance‑forming portion in which the dielectric layer and the internal electrodes are alternately stacked. External electrodes are disposed on the body and electrically connected to the internal electrodes. The dielectric grains include first grains having an aspect ratio of less than 1:5 and second grains having an aspect ratio of 1:5 or greater. An area ratio of the second grains relative to the total dielectric grain area in the capacitance‑forming portion is between 0.07 and 0.99.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/224 - HousingEncapsulation
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps

Abstract

A camera module includes a first lens group and a second lens group sequentially disposed along an optical axis; a lens barrel configured to accommodate the first lens group and the second lens group; and a moisture-absorbing member disposed in a groove in the lens barrel. The lens barrel includes a first vent through which the groove is connected to a space between the first lens group and the second lens group, and a second vent through which the groove is connected to an outer space of the lens barrel.

IPC Classes  ?

• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements

Abstract

A camera module includes a lens barrel; a wiper disposed in a region in which light is incident toward the lens barrel; a supporter connected to the wiper; and a driving module configured to provide power to rotate the supporter, wherein the driving module includes a driving member having a magnetic property and including a part inserted into the supporter and being slidingly movable relative to the supporter; and a coil configured to generate a magnetic field to move the driving member.

IPC Classes  ?

• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

A camera module including a housing; a reflective module including a guide member disposed in the housing and configured to be rotatable relative to the housing about a first axis extending in a first axial direction; a holder disposed on the guide member and configured to be rotatable relative to the guide member about a second axis extending in a second axial direction; and a reflective member disposed on the holder and configured to change a path of light incident in a third axial direction to the second axial direction; and a first driving unit configured to rotate the guide member and the holder and including a first magnet disposed on opposite side surfaces of the holder in the first axial direction; a first coil facing the first magnet in the first axial direction; and a pushing magnet facing the first magnet in the third axial direction.

IPC Classes  ?

• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers

Abstract

A multilayer electronic component includes a body having a capacitance forming portion in which a dielectric layer and internal electrodes overlap in a first direction, cover portions disposed on opposite surfaces of the capacitance forming portion in the first direction, and side margin portions disposed on opposite surfaces of the capacitance forming portion in a third direction perpendicular to the first direction. External electrodes are disposed on opposite surfaces of the body in a second direction and are electrically connected to the internal electrodes. When an average thickness of the cover portions in the first direction is Tc and an average width of the side margin portions in the third direction is Wm, Wm is 18 μm or more and less than 200 μm, and Wm/Tc is 0.86 or more and 1.71 or less.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis from an object side of the optical imaging system toward an imaging plane of an image sensor, wherein TTL/(2*IMG HT)≤0.67 is satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging plane of the image sensor, and IMG HT is one half of a diagonal length of the imaging plane of the image sensor, and 15

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; an external electrode disposed on the body; and a coating layer disposed on the first and second surfaces, and when an average thickness of a coating layer disposed on the first surface, among the coating layer, is referred to as TCL1 and an average thickness of a remaining coating layer excluding the coating layer disposed on the first surface is referred to as TCL2, TCL2

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/224 - HousingEncapsulation
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H05K 1/181 -

Abstract

An imaging lens system includes a lens group including a plurality of lenses, and an optical path folding member disposed on an image side of the lens group, wherein −1.2

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only

Abstract

An optical imaging system includes a first lens having a positive refractive power, a second lens having a negative refractive power, a third lens having a refractive power, a fourth lens having a positive refractive power, a fifth lens having a negative refractive power, a sixth lens having a refractive power, a seventh lens having a refractive power, an eighth lens having a refractive power, and a ninth lens having a refractive power, wherein the first to ninth lenses are sequentially disposed along an optical axis from an object side, and the optical imaging system satisfies 0.9<(TTL/(2×IMG HT))×Fno≤0.95, where TTL is a distance along the optical axis from an object-side surface of the first lens to an imaging plane, IMG HT is one half of a diagonal length of the imaging plane, and Fno is an F-number of the optical imaging system.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

An optical imaging system includes a plurality of lenses disposed along an optical axis, and a reflection member disposed to be closer to an object than all of the plurality of lenses and having a reflection surface configured to change a path of light. The plurality of lenses are spaced apart from each other by preset distances along the optical axis, and the condition 0.8

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length

Abstract

An electronic component includes a capacitor including a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body, a connection terminal disposed on the external electrode, and a bonding layer disposed between the capacitor and the connection terminal, the bonding layer including Au. The external electrode includes an electrode layer connected to the internal electrode, a Ni plating layer disposed on the electrode layer, and a Sn plating layer disposed on the Ni plating layer. When an average thickness of the bonding layer is defined as T1 and an average thickness of the Sn plating layer is defined as T2, T2>T1 is satisfied.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens group, an optical path conversion member, and a second lens group, arranged sequentially from an object side, wherein the first lens group includes a plurality of lenses arranged along a first optical axis, and the second lens group includes a plurality of lenses arranged along a second optical axis, and wherein the optical imaging system satisfies conditional expression 3.0≤fG1/f≤4.0, where fG1 is a focal length of the first lens group and f is a focal length of the optical imaging system.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

An optical imaging system according to an embodiment of the present disclosure includes a first lens, a second lens, and a third lens, sequentially arranged from an object side. In the optical imaging system according to the present embodiment, an air gap between the first lens and the second lens is greater than an air gap between the second lens and the third lens. In addition, in the optical imaging system according to the present embodiment, the first lens is formed of a glass material, and a length of the first lens in a first direction, intersecting an optical axis, is different from a length of the first lens in a second direction intersecting the optical axis.

IPC Classes  ?

• G02B 9/34 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having four components only
• G02B 9/12 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having three components only
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length

Abstract

An electrode including a composite conductor, a solid oxide cell including the electrode, and a method of preparing a solid oxide cell are disclosed. The composite conductor includes a first mixed conductor including a first metal oxide having a perovskite structure, and a second mixed conductor including a second metal oxide having a perovskite structure. The ionic conductivity of the first mixed conductor is greater than that of the second mixed conductor, and electronic conductivity of the second mixed conductor is greater than that of the first mixed conductor.

IPC Classes  ?

• C01G 51/66 - Complex oxides containing cobalt and at least one other metal element containing alkaline earth metals, e.g. SrCoO3
• C01G 49/00 - Compounds of iron
• C25B 1/04 - Hydrogen or oxygen by electrolysis of water
• C25B 11/031 - Porous electrodes
• C25B 11/077 - Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalysts material consisting of a single catalytic element or catalytic compound the compound being a non-noble metal oxide
• C25B 13/05 - DiaphragmsSpacing elements characterised by the material based on inorganic materials
• H01M 4/86 - Inert electrodes with catalytic activity, e.g. for fuel cells
• H01M 4/88 - Processes of manufacture
• H01M 4/90 - Selection of catalytic material
• H01M 8/10 - Fuel cells with solid electrolytes
• H01M 8/12 - Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte

Abstract

A circuit board includes a first insulating layer and a lower pad exposed from the first insulating layer, with the exposed surface recessed below the surface of the first insulating layer. A second insulating layer is formed on the first insulating layer, and an upper pad is disposed on the second insulating layer. A via penetrates the second insulating layer and electrically connects the lower pad and the upper pad. A plating layer, such as a nickel and gold layer, is disposed on the upper pad. The circuit board structure may enable reliable electroplating without requiring a separate bus line by utilizing a seed copper layer from a detachable core.

IPC Classes  ?

• H05K 3/24 - Reinforcing of the conductive pattern
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A multilayer electronic component includes a body including a laminate in which a dielectric layer and an internal electrode are stacked in a first direction, and a cover portion disposed on each of a plurality of surfaces of the laminate opposing each other in the first direction, the body including first and second surfaces opposing in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing in a second direction, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces and opposing in a third direction, and an external electrode disposed on the third and fourth surfaces and connected to the internal electrode. The cover portion includes second regions adjacent to the third or fourth surfaces, and a first region disposed between the second regions, and an average hardness of the second regions is greater than the first region.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A multilayer ceramic capacitor may include a ceramic main body including a dielectric layer, a first internal electrode and a second internal electrode stacked with the dielectric layer therebetween, and a cover layer on the first internal electrode and the second internal electrode; and a first external electrode disposed outside the ceramic main body and connected to the first internal electrode, wherein internal electrode connectivity to the first internal electrode and the second internal electrode is 85% or higher, respectively, and the ceramic main body may include an active region in which the first internal electrode and the second internal electrode overlap, and a first margin region; the ceramic main body satisfies the following Condition Equation 1 and Condition Equation 2. The Condition Equation 1 is 8.6%≤(LM3+LM4)/WC≤10%, and the Condition Equation 2 is 30°≤θ≤45°.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A printed circuit board according to an embodiment may comprise an insulating layer, a wiring layer embedded in the insulating layer, a solder resist layer positioned on the insulating layer, a cavity penetrating the solder resist layer and a portion of the insulating layer, and a blocking pattern positioned on the insulating layer, surrounding an edge of the cavity, and covered by the solder resist layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details

Abstract

A multilayer electronic component includes a body and first to fourth external electrodes spaced apart from each other on the body. The body may include a dielectric layer and first and second internal electrode layers alternately disposed in the thickness direction with the dielectric layer interposed therebetween. The body may include first and second surfaces opposing each other in the thickness direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a width direction. The first internal electrode layer may include first to fourth internal electrodes connecting to the first to fourth external electrodes and spaced apart from each other. The second internal electrode layer may be a fifth internal electrode not connecting to the first to fourth external electrodes.

IPC Classes  ?

• H01G 4/005 - Electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

A camera module includes a housing, a reflective member disposed on the housing, and configured to rotate about a first rotation axis and a second rotation axis perpendicular to the first rotation axis, a first ball member including a plurality of ball members disposed to be spaced apart from each other in a direction of the first rotation axis, and a second ball member including a plurality of ball members disposed to be spaced apart from each other in a direction of the second rotation axis. The first ball member and the second ball member are disposed between the reflective member and the housing. When viewed in a direction perpendicular to both the first rotation axis and the second rotation axis, the second ball member overlaps the reflective member.

IPC Classes  ?

• G03B 17/17 - Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera

Abstract

A camera module includes a housing having an internal space, and a first lens module and a second lens module disposed in the internal space and each configured to be movable in an optical axis direction, wherein a first shaft and a first ball member are disposed between the first lens module and the housing, wherein a second shaft and a second ball member are disposed between the second lens module and the housing, and wherein, when moving in the optical axis direction, rolling friction occurs on one of both sides of each lens module, and sliding friction occurs on the other of both sides.

IPC Classes  ?

• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• H04N 23/51 - Housings
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• H04N 23/67 - Focus control based on electronic image sensor signals
• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
• H04N 23/69 - Control of means for changing angle of the field of view, e.g. optical zoom objectives or electronic zooming

Abstract

An optical imaging system is provided. The optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens disposed in order from an object side to an imaging side. The first lens has positive refractive power, while the second lens has negative refractive power. TTL>10.2 mm, and TTL/(2×IMG HT)≤1.7, where TTL is a distance from an object-side surface of the first lens to an imaging plane on an optical axis, and IMG HT is equal to half a diagonal length of the imaging plane.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only

Abstract

A circularity-dependent frequency of existence of a plurality of nanodomains BD and LD in a capacitance formation portion Ac is adjusted to have a maximum value in a range of circularity of 0.85 or more and 1.00 or less or the frequency of existence of the bubble domain BD having a circularity in a range of 0.85 or more and 1.00 or less is adjusted to 0.2 or more, thereby improving the capacitance per unit volume of a multilayer electronic component 100.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/12 - Ceramic dielectrics

Abstract

A camera module is provided. The camera module includes a housing; a carrier, accommodated in the housing, and configured to move in an optical axis direction; and a first guide portion and a second guide portion respectively disposed between the housing and the carrier, and spaced apart from each other in a diagonal direction of the carrier, wherein the first guide portion is disposed on any one of the carrier and the housing and includes a plurality of first protrusions that are spaced apart from each other in the optical axis direction, wherein the second guide portion includes at least one second protrusion that is disposed on any one of the carrier and the housing, and wherein sliding friction occurs on the plurality of first protrusions based on a movement of the carrier.

IPC Classes  ?

• H02K 41/035 - DC motorsUnipolar motors
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A multilayer electronic component may include: a body including a stack body in which a dielectric layer and an internal electrode are stacked in a first direction, and a cover portion disposed on both surfaces of the stack body opposing each other in the first direction and having a corner having a rounded shape; and an external electrode. The external electrode may include: a first electrode layer in contact with both surfaces of the stack body opposing each other in a second direction, and having an end having a rounded shape; a second electrode layer disposed on the first electrode layer; and a plating layer disposed on the second electrode layer. T2

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens having positive refractive power, a second lens having negative refractive power, a third lens having refractive power, a fourth lens having refractive power, a fifth lens having refractive power, a sixth lens having positive refractive power, and a seventh lens having negative refractive power, disposed in order from an object side, wherein 0.9<1.2×f/(2×IMG HT)<1.1 is satisfied, where f is a total focal length of the first lens to the seventh lens, and IMG HT is half a diagonal length of an imaging plane.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

A camera module includes a housing, a first lens module disposed in the housing and movable relative to the housing in an optical-axis direction, and a plurality of guide parts configured to support movement of the first lens module, wherein one or more guide parts among the plurality of guide parts includes an accommodating groove, a guide protrusion disposed in the accommodating groove and extending in a first-axis direction perpendicular to the optical-axis direction, and a plurality of balls disposed to surround the guide protrusion.

IPC Classes  ?

• G03B 3/10 - Power-operated focusing
• G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
• G03B 13/34 - Power focusing
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
• H02K 33/18 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with coil systems moving upon intermittent or reversed energisation thereof by interaction with a fixed field system, e.g. permanent magnets

Abstract

An optical imaging system includes a first lens having a positive refractive power, a second lens having a negative refractive power, a third lens having a negative refractive power, a fourth lens having a negative refractive power, and a fifth lens having a positive refractive power. The first to fifth lenses are sequentially disposed from an object side to an imaging plane. One or more lenses among the first to fifth lenses are formed using a glass material.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only

Abstract

A multilayer ceramic capacitor includes: a capacitor body comprising a dielectric layer and an internal electrode layer; and an external electrode disposed on an outside surface of the capacitor body, wherein the capacitor body includes an active portion where the dielectric layer and the internal electrode layer are alternately disposed, side margin portions disposed at both side end portions of the active portion facing each other, and bonding portions disposed between the active portion and the side margin portions, and at least one of the active portion or the side margin portions includes a barium titanate-based main ingredient including barium (Ba) and titanium (Ti), and gallium (Ga).

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• C04B 35/468 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/224 - HousingEncapsulation

Abstract

Provided is a coil component comprising: a body having a first surface, a second surface opposing the first surface in a first direction, and a third surface connecting the first surface to the second surface, and including a first metallic magnetic particle; a coil disposed in the body and having one end extending to the third surface of the body; a connection portion connected to the one end of the coil and extending to the first surface of the body; and a shielding layer disposed on the third surface of the body and on the connection portion, and including a second metallic magnetic particle, wherein at least a portion of the first metallic magnetic particle extends to the third surface of the body, and at least a portion of the first metallic magnetic particle extending to the third surface of the body includes a cut surface.

IPC Classes  ?

• H01F 17/00 - Fixed inductances of the signal type

Abstract

An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens sequentially disposed from an object side. At least one of the first to fifth lenses is a metalens.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer interposed therebetween in a thickness direction; an external electrode disposed on the body in a length direction; and a connection terminal disposed on one surface of the external electrode, and including a recess portion in a region recessed from the outside to the inside thereof in the length direction, wherein a round portion is provided on at least one corner of the connection terminal, and a radius of the round portion is 30 μm or more and 196 μm or less.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A multilayer electronic component includes a body and an external electrode. The body includes a dielectric layer and an internal electrode. The external electrode includes a metal layer in contact with one end of the internal electrode, and an electrode layer disposed on the metal layer, the electrode layer including a conductive metal and glass. The body includes a groove portion in which the one end of the internal electrode is spaced from one surface of the body. The metal layer includes a first region disposed in the groove portion and a second region disposed on the one surface of the body. In a cross-section of the body, a length along which the first region and the one end of the internal electrode are in contact with each other, is less than a length along which the first region and the second region are in contact with each other.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens having a negative refractive power, a second lens, a third lens having a positive refractive power, a fourth lens, a fifth lens, a sixth lens, a seventh lens having a negative refractive power, and an eighth lens, the first lens, the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, and the eighth lens being sequentially arranged in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the optical imaging system satisfies a conditional expression 2.5

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

A lens driving apparatus includes a lens holder configured to accommodate a lens; a carrier configured to accommodate the lens holder; a first optical image stabilization (OIS) driver, disposed outside of the lens holder, configured to drive the lens holder in a first direction perpendicular to an optical axis; and a second OIS driver, disposed outside of the carrier to oppose the first OIS driver and having the lens holder interposed therebetween, configured to drive the carrier in a second direction perpendicular to the optical axis and the first direction.

IPC Classes  ?

• G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G03B 5/04 - Vertical adjustment of lensRising fronts
• G03B 13/36 - Autofocus systems

Abstract

An optical image stabilization actuator includes a fixed frame having an internal space, a moving frame accommodated in the fixed frame and being movable relative to the fixed frame, a first ball member disposed between the fixed frame and the moving frame, a first driving unit including a plurality of magnets disposed in the fixed frame and a plurality of coils disposed in the moving frame and moved together with the moving frame, a sensor substrate partially coupled to the moving frame to move together with the moving frame, a plurality of yokes disposed in the moving frame and generating attractive force with respect to the plurality of magnets, and an image sensor disposed in a portion of the sensor substrate.

IPC Classes  ?

• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• H02K 41/035 - DC motorsUnipolar motors
• H04N 23/51 - Housings
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A lens module includes first to seventh lenses each having refractive power and sequentially disposed in numerical order from the first lens to the seventh lens starting from an object side of the lens module, wherein each of the first and second lenses has a meniscus shape and an image-side surface that is convex, and the seventh lens has one or more inflection points on an image-side surface thereof.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

An electronic component-embedded substrate includes a glass layer, a through-cavity penetrating between an upper surface and a lower surface of the glass layer, a blind member at least partially disposed within the through-cavity, an electronic component at least partially disposed within the through-cavity and attached to an upper surface of the blind member, and an insulating material covering respective at least portions of the glass layer, the blind member, and the electronic component, and filling at least a portion of the through-cavity.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/03 - Use of materials for the substrate
• H05K 1/185 -

Abstract

A circuit board includes an insulating layer having a via hole, a via filling the via hole, a circuit layer disposed on the insulating layer and including a pad connected to the via and a circuit wiring spaced apart from the pad, and a carbon pattern layer disposed between the circuit layer and a surface of the insulating layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A multilayer ceramic capacitor includes a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode located on the outside of the capacitor body, wherein the dielectric layer includes a plurality of dielectric grains, at least one of the plurality of dielectric grains includes Ca, Sr, Zr, and Ti, at least one of the plurality of dielectric grains has a core-shell structure including a core portion and a shell portion disposed on at least a portion of the core portion, a content of Ti included in the shell is 5 mol % to 10 mol % based on a total amount of Zr and Ti included in the shell portion, and a content of Sr included in the shell portion is 32 mol % to 65 mol % based on a total amount of Ca and Sr included in the shell portion.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/12 - Ceramic dielectrics

Abstract

A multilayer ceramic capacitor may include a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed on an outer side of the capacitor body, where the dielectric layer may include a grain boundary disposed between a plurality of dielectric grains and the plurality of dielectric grains, the dielectric layer may include Sn and a transition metal, at least one among the plurality of dielectric grains has a core-shell structure including a core portion, a first shell portion disposed on at least a portion of the core portion, and a second shell portion disposed on at least a portion of the first shell portion, and a content of the Sn and a content of the transition metal are largest in the first shell portion among the core portion, the first shell portion, the second shell portion, and the grain boundary.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/30 - Stacked capacitors

Abstract

A lens system includes a first lens having a negative refractive power, a second lens having a refractive power and a concave object-side surface in a paraxial region thereof, a third lens having a refractive power, a fourth lens having a negative refractive power, a fifth lens having a refractive power, a sixth lens having a positive refractive power, a seventh lens having a refractive power, and an eighth lens having a positive refractive power, wherein the first to eighth lenses are sequentially arranged in ascending numerical order along an optical axis of the lens system away from a light source toward an imaging plane of the lens system.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/14 - Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
• G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration

Abstract

A multilayer electronic component includes a body, an external electrode, and a connection terminal. The body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a thickness direction. The external electrode is disposed in a length direction of the body. The connection terminal is disposed on one surface of the external electrode and includes a recess portion in a region recessed on the outside thereof in the length direction. A maximum length of the recess portion in the length direction is 100 μm or more.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body and an external electrode. The body includes a dielectric layer and an internal electrode alternately disposed with the dielectric layer. The external electrode includes a metal layer in contact with one end of the internal electrode, and an electrode layer disposed on the metal layer, the electrode layer including a conductive metal and glass. The body includes a groove portion in which the one end of the internal electrode is spaced apart from one surface of the body. The metal layer includes a first region disposed in the groove portion and a second region disposed on the one surface of the body. In a cross-section of the body, a length along which the first region and the one end of the internal electrode contact each other, is less than a length along which the first region and the second region contact each other.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

An optical imaging system includes first to ninth lenses, wherein the first lens has a positive refractive power, the second lens has a negative refractive power, the fourth lens has a positive refractive power, a refractive index of the second lens is greater than a refractive index of the first lens and a refractive index of the third lens, each of at least two lenses including the second lens has a refractive index equal to or greater than 1.67, and TTL/(2×IMG HT)<0.69 and 25

IPC Classes  ?

• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

An imaging lens system includes: a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens, sequentially disposed from an object side. The third lens has a refractive index temperature coefficient of 2.2 to 3.5 [10−6/° C.], and 0

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

A circuit board according to an embodiment may include a first insulating layer, a first circuit wiring disposed inside a first area of the first insulating layer, a plurality of vias connected to the first circuit wiring, a second circuit wiring disposed on a second area of the first insulating layer, a bridge substrate disposed on the first area and having a plurality of first conductive pads, a plurality of conductive adhesive members electrically connecting the plurality of vias to the plurality of first conductive pads, and a second insulating layer covering the second circuit wiring and the bridge substrate on the first insulating layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/42 - Plated through-holes

Abstract

A camera module includes a first lens module including at least one lens disposed in a first optical axis direction and refracting light; a first reflective member disposed to be spaced apart from the first lens module in the first optical axis direction and configured to change a propagation direction of the light; and an image sensor disposed to receive the light. As the first lens module moves upward along the first optical axis direction, a reflective surface of the first reflective member transitions from a first state of being perpendicular to the first optical axis direction to a second state of being oblique to the first optical axis direction.

IPC Classes  ?

• G02B 7/182 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors for mirrors
• G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
• G02B 7/18 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
• G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

Abstract

A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer, an internal electrode layer and a floating electrode layer. The internal electrode layer is a first internal electrode connected to the first external electrode, and a second internal electrode connected to the second external electrode and spaced apart from the first internal electrode. The floating electrode layer includes a third internal electrode. The third internal electrode has a main portion overlapping the first and second internal electrodes in the thickness direction, and a connecting portion not overlapping the first and second internal electrodes in the thickness direction. A ratio (FCW/FMW) of a size (FCW) of the connecting portion in the width direction to a size (FMW) of the main portion in the width direction satisfies 1/4≤FCW/FMW≤1/2.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A multilayer electronic component according to an embodiment of the present disclosure includes a dielectric layer, the dielectric layer comprises core-shell grains and rare-earth elements. The central region of the core includes a first core and second core. The maximum strains of the crystal lattice a-axis lattice constants of the second core in Eaa directions, with respect to the crystal lattice a-axis lattice constants in the central region of the first core, are defined as ba1 and ba2, respectively. The maximum strains of the crystal lattice c-axis lattice constant of the second core in Ecc directions, with respect to the crystal lattice c-axis lattice constant in the central region of the first core, are defined as bc1 and bc2, respectively. At least three of the ba1, ba2, bc1 and bc2 values may satisfy 0.5% to 1.5%.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A camera module includes a first barrel configured to accommodate a first lens group; and a second barrel configured to accommodate a second lens group and accommodated within the first barrel. A first inner surface of the first barrel and a second outer surface of the second barrel are configured to contact each other at a first connection point or a second connection point.

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens sequentially disposed along an optical axis from an object-side surface of the first lens toward an imaging plane of an image sensor, wherein 3.5≤TTL/IMG HT, f1+f2|<2.0 mm, and 0.7≤L1S1es/L1S1el<1.0 are satisfied, where TTL is a distance along the optical axis from the object-side surface of the first lens to the imaging plane of the image sensor, IMG HT is one-half of a diagonal length of the imaging plane of the image sensor, f1 is a focal length of the first lens, f2 is a focal length of the second lens, L1S1el is a maximum effective radius of the object-side surface of the first lens, and L1S1es is a minimum effective radius of the object-side surface of the first lens.

IPC Classes  ?

• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
• G02B 3/04 - Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere
• G02B 5/20 - Filters
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

An all-solid-state battery includes a laminate including a negative electrode layer, a solid electrolyte layer, and a negative electrode layer, and an exterior member covering the laminate, wherein the exterior member may include a first resin layer disposed on the laminate, and a first metal layer in contact with the first resin layer.

IPC Classes  ?

• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 10/0562 - Solid materials
• H01M 10/052 - Li-accumulators
• H01M 50/119 - Metals
• H01M 50/121 - Organic material
• H01M 50/124 - Primary casingsJackets or wrappings characterised by the material having a layered structure
• H01M 10/058 - Construction or manufacture

Abstract

A camera module includes a housing in which a reflective member is disposed, a lens module disposed on an object-side of the reflective member, a carrier disposed to surround the reflective member, and an image sensor on which light emitted from the reflective member is incident, wherein the carrier includes an opening portion on one side so that the reflective member and the image sensor directly face each other, and wherein a reinforcing member is disposed on at least one surface of the carrier and is formed of a material having higher rigidity than that of the carrier.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G03B 5/02 - Lateral adjustment of lens
• G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
• H04N 23/51 - Housings
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

A multilayer electronic component includes a body, an external electrode, a bump electrode, a conductive bonding portion, and a plating layer. The body may include a dielectric layer and an internal electrode alternately disposed with the dielectric layer. The external electrode may be disposed on the body. The bump electrode may be disposed on a lower side of the external electrode. The conductive bonding portion may be disposed between the external electrode and the bump electrode. The conductive bonding portion may be in direct contact with the external electrode and the bump electrode. The conductive bonding portion may include a plurality of first metal particles and a first resin. The plating layer may be disposed to cover an external surface of an external terminal including the external electrode, the bump electrode, and the conductive bonding portion.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer, first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a length direction, and fifth and sixth surfaces opposing each other in a width direction, an external electrode disposed on the third or fourth surface and extending to a portion of the first and second surfaces, and a metal terminal disposed on the first or second surface and connected to the external electrode, a recess portion is disposed on an external side surface of the metal terminal in the length direction, and an upper hole and a lower hole are disposed on the upper and lower surfaces of the metal terminal, respectively, and the upper hole may not overlap the lower hole in the thickness direction.

IPC Classes  ?

• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system includes a first lens group, an optical path conversion member, and a second lens group, arranged sequentially from an object side, wherein the first lens group includes a plurality of lenses arranged along a first optical axis, and the second lens group includes a plurality of lenses arranged along a second optical axis, and wherein the optical imaging system satisfies conditional expression 1.5≤fG1/f≤3.0, where fG1 is a focal length of the first lens group and f is a focal length of the optical imaging system.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only

Abstract

A camera module includes a housing; a carrier, disposed in the housing, movable in an optical axis direction with respect to the housing, and including a protrusion; a holder, disposed on the carrier, movable in a direction perpendicular to an optical axis with respect to the carrier, the holder being configured to support a lens module; a first magnet disposed on one side surface of the holder; and a first yoke disposed in the protrusion to oppose the first magnet in the optical axis direction, wherein the protrusion protrudes from a lower surface of the carrier toward a bottom surface of the housing.

IPC Classes  ?

• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers

Abstract

A multilayer electronic component includes a body including a dielectric layer, a first internal electrode and a second internal electrode alternately arranged with the dielectric layer interposed therebetween; and external electrodes disposed on the body and connected to the first internal electrode and the second internal electrode, wherein the body further includes a first dummy electrode disposed between the first internal electrode and a surface of the body and a second dummy electrode disposed between the second internal electrode and the surface of the body and spaced apart from the first dummy electrode, the first dummy electrode is disposed closer to a surface of the body than the first internal electrode, and the second dummy electrode is disposed closer to a surface of the body than the second internal electrode.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes

Abstract

An all-solid-state battery includes: a solid electrolyte layer, a positive electrode layer and a negative electrode layer facing each other with the solid electrolyte layer therebetween, a first external electrode connected to the positive electrode layer, a second external electrode connected to the negative electrode layer, and a positive electrode margin unit disposed between the positive electrode layer and the second external electrode. The positive electrode margin unit includes a main layer and an auxiliary layer having a shrinkage rate lower than that of the main layer.

IPC Classes  ?

• H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
• H01M 4/02 - Electrodes composed of, or comprising, active material
• H01M 4/36 - Selection of substances as active materials, active masses, active liquids
• H01M 4/66 - Selection of materials
• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators

Abstract

An all-solid-state battery including an all-solid-state battery element includes a laminate including a plurality of solid electrolyte layers, a plurality of positive electrode layers, and a plurality of negative electrode layers stacked in a first direction, a first external electrode disposed outside of the laminate and connected to the plurality of positive electrode layers, and a second external electrode disposed outside of the laminate and connected to the plurality of negative electrode layers; and a resin sealing body covering the all-solid-state battery element and exposing a portion of the first external electrode and a portion of the second external electrode. The resin sealing body includes a first resin sealing body and a second resin sealing body, and an elastic modulus of the first resin sealing body is different from an elastic modulus of the second resin sealing body.

IPC Classes  ?

• H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
• H01M 10/0562 - Solid materials

Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the dielectric layer includes a central portion spaced apart from the internal electrode and including a first dielectric grain, and interfacial portions disposed between the internal electrode and the central portion and including a second dielectric grain, and wherein an average size of the first dielectric grain is Gs1, an average size of the second dielectric grain is Gs2, the number of moles of Gd based on 100 moles of Ti in the central portion is defined as Mgd1, and the number of moles of Gd based on 100 moles of Ti in the interfacial portion is Mgd2, Gs2/Gs1<1, Mgd1/Mgd2<1, and 4.0≤Mgd2≤25.0 are satisfied.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in ascending numerical order along an optical axis from an object side of the optical imaging system toward an imaging plane of the optical imaging system. Four or more lenses among the first to seventh lenses have a refractive index greater than 1.6.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
• G02B 13/02 - Telephoto objectives, i.e. systems of the type + – in which the distance from the front vertex to the image plane is less than the equivalent focal length

Abstract

A printed circuit board according to an embodiment may include an insulating layer, a first circuit pattern buried in the insulating layer such that one surface thereof is exposed on one surface of the insulating layer, a second circuit pattern disposed on the other surface, which is opposite to the one surface of the insulating layer, the second circuit pattern protruding from the other surface, a surface conductive layer disposed on at least a portion of the first circuit pattern, the surface conductive layer being made of a material different from that of the first circuit pattern, a surface treatment layer on the surface conductive layer, and a solder resist layer disposed on the one surface to expose the surface treatment layer.

IPC Classes  ?

• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

A camera module includes a housing; a reflective member disposed within the housing and configured to change an optical path; a lens module including a carrier movable along an optical axis direction, the carrier including a concave portion on a side surface and at least one lens disposed therein; a case coupled to the housing to cover the reflective member and the lens module; and a first damper disposed on an inner surface of the housing or the case and having at least a portion accommodated within the concave portion.

IPC Classes  ?

• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers

Abstract

A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the dielectric layer includes a plurality of first protrusions having a hemispherical shape protruding only from one of the first and second surfaces and include a first opening portion, and at least a portion of the plurality of first protrusions are spaced apart from each other in a second direction perpendicular to the first direction, and when the radius of the first opening portion is R1 and the distance between the adjacent first protrusions in the second direction is G1, R1 and G1 may satisfy 0.3 μm≤R1≤3.0 μm and 0.5×R1≤G1≤3.0×R1.

IPC Classes  ?

• H01G 4/12 - Ceramic dielectrics
• H01G 4/005 - Electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A printed circuit board includes a first insulating layer with a through-hole and a capacitor disposed along a side surface of the through-hole. The capacitor has first and second electrode layers arranged with a dielectric layer between them. A first interconnection layer is positioned on an upper side of the through-hole and includes first and second metal layers respectively contacting the first and second electrode layers. Portions of the first and second metal layers are removed to form cut-out regions that facilitate electrical routing while maintaining the layered capacitor structure within the through-hole.

IPC Classes  ?

• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A printed circuit board includes a first insulating layer, a first wiring layer disposed on the first insulating layer, and a first insulating film disposed on the first insulating layer, the first insulating film covering at least a portion of each of an upper surface and a side surface of the first wiring layer conforming to a shape of the first wiring layer. The first insulating layer has a first recess portion around the first wiring layer. A depth of the first recess portion is greater than 0 μm and less than 1.0 μm.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A printed circuit board includes a plurality of insulating layers, a dielectric via disposed in at least one of the plurality of insulating layers, a first electrode layer and a second electrode layer disposed to oppose each other with the dielectric via interposed therebetween, a first through-via passing through at least one of the plurality of insulating layers, the first through-via connected to the first electrode layer, and a second through-via passing through at least one of the plurality of insulating layers, the second through-via connected to the second electrode layer.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details

Abstract

A printed circuit board includes a plurality of first insulating layers, a plurality of first wiring layers respectively disposed in the plurality of first insulating layers, a first glass layer disposed on an upper side of the plurality of first insulating layers, the first glass layer having a thickness less than that of one of the plurality of first insulating layers, a second glass layer disposed on a lower side of the plurality of first insulating layers, the second glass layer having a thickness less than that of the one of the plurality of first insulating layers, a second wiring layer disposed on an upper side of the first glass layer, and a third wiring layer disposed on a lower side of the second glass layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A method for manufacturing a multilayer electronic component includes applying a dielectric slurry onto a film and drying the dielectric slurry to form a ceramic green sheet; performing an HRP process on the ceramic green sheet to form a compressed ceramic green sheet; forming an internal electrode pattern on the compressed ceramic green sheet; forming a laminate by laminating the compressed ceramic green sheet having the internal electrode pattern formed thereon; forming a body including a dielectric layer and an internal electrode by sintering the laminate; and forming an external electrode on the body, wherein the HRP process applies a temperature of 50°C to 70°C and a pressure of 10 MPa to 20 MPa.

IPC Classes  ?

• H01G 4/012 - Form of non-self-supporting electrodes
• B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
• C04B 35/64 - Burning or sintering processes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A camera module includes a housing, first, second, and third optical modules sequentially arranged in an internal space of the housing along a propagation path of light, and a fourth optical module disposed in the housing to receive light passing through the third optical module. The first through third optical modules are arranged to overlap in a first direction, and the first through fourth optical modules are arranged to satisfy the conditional expression d1 > d2, where d1 is a distance in a second direction perpendicular to the first direction from a center of an optical member in the first optical module to an outermost end of the optical member in the first optical module, and d2 is a distance in the second direction from a center of an optical member in the fourth optical module to the outermost end of the optical member included in the first optical module.

IPC Classes  ?

• G03B 17/17 - Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera
• G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
• G02B 7/18 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors
• G03B 3/10 - Power-operated focusing
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Abstract

An optical imaging system includes a fixed-focus lens group and a variable-focus lens group disposed in this order from an object side, wherein the fixed-focus lens group includes a first lens, a second lens, and a third lens disposed in this order from an object side, wherein the first lens has positive refractive power, and wherein the second lens has negative refractive power.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

A method for manufacturing a multilayer electronic component includes: preparing a multilayer ceramic green sheet by stacking the ceramic green sheet in a first direction; preparing a green body by cutting the multilayer ceramic green sheet so that the internal electrode pattern is exposed in a third direction,; attaching a margin portion green sheet to the green body in the third direction under first process condition; and performing a punching process on the green body to which the margin portion green sheet is attached under second process condition, wherein, after the performing the punching process, the margin portion green sheet has a structure extending onto at least one of both surfaces of the green body in the first direction and both surfaces of the green body in the second direction.

IPC Classes  ?

• H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
• H01G 4/224 - HousingEncapsulation
• H01G 4/30 - Stacked capacitors
• H01G 4/005 - Electrodes
• H01G 4/12 - Ceramic dielectrics

Abstract

A camera module includes a lens barrel having a first space extending from an end surface of the lens barrel, and a second space different from the first space, wherein the first space is configured to accommodate a lens having an optical axis; and a cover member coupled to the lens barrel and configured to prevent separation of the lens accommodated in the lens barrel. The second space has a thermal conductivity different from thermal conductivities of the lens and the lens barrel.

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G03B 11/04 - Hoods or caps for eliminating unwanted light from lenses, viewfinders, or focusing aids
• G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

Abstract

A multilayer electronic component includes a body having a capacitance formation portion with dielectric layers and internal electrodes, first and second cover portions on opposite thickness surfaces, and first to sixth surfaces. Margin portions are disposed on the first, second, fifth, and sixth surfaces in a spiral arrangement. External electrodes are provided on the third and fourth surfaces.

IPC Classes  ?

• H01G 4/224 - HousingEncapsulation
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a thickness direction; a body including first and second surfaces opposing each other in the thickness direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction; a first external electrode disposed on the third surface; and a second external electrode disposed on the fourth surface, wherein a central external electrode spaced apart from the first external electrode, the second external electrode, and the internal electrode is disposed on one or more of the first and second surfaces of the body, and wherein, when a length of the multilayer electronic component is defined as L and a length of the central external electrode is defined as CL, CL/L is 0.10 or more and 0.35 or less.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A multilayer electronic component that includes a body having a dielectric layer and internal electrodes alternately arranged in a thickness direction. The body defines first and second surfaces opposing each other in the thickness direction, third and fourth surfaces opposing each other in a length direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a width direction and connected to the first through fourth surfaces. A pattern is provided on the second surface and includes a first side portion positioned at one end of the second surface in the length direction, a second side portion positioned at the opposite end, and a connection portion extending between the first and second side portions. External electrodes are disposed on the third and fourth surfaces. The widths of the first and second side portions are greater than the width of the connection portion, and the lengths of the first and second side portions are shorter than the length of the connection portion.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Abstract

A camera module includes a housing having an internal space, a carrier disposed in the internal space and accommodating a lens barrel having a lens mounted therein, and a piezoelectric actuator disposed in the housing, supporting the carrier, and configured to apply a driving force to the carrier in an optical axis direction, wherein the piezoelectric actuator includes a driving rod extending in the optical axis direction and supporting the carrier, a bracket including an upper frame comprising a supporting surface supporting one end of the driving rod, a lower frame comprising at least a pair of holding surfaces facing each other in a direction crossing the supporting surface and spaced apart from each other, and a middle frame connecting the upper frame and the lower frame to each other, and a piezoelectric element fixed between the pair of holding surfaces and spaced apart from the upper frame.

IPC Classes  ?

• H10N 30/88 - MountsSupportsEnclosuresCasings
• G03B 3/10 - Power-operated focusing
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Abstract

A printed circuit board includes a main portion including a plurality of insulating layers and a plurality of conductor layers laminated in a first direction, a margin portion disposed on an outside of the main portion in a second direction, and including an insulator connected to the insulating layers of the main portion, and at least one pad disposed on the main portion, wherein, when a portion of an upper surface of the main portion, covered by the pad is referred to as a cover surface, and a portion of the upper surface, not covered by the pad is referred to as an open surface, at least a portion of the upper surface of the margin portion is located above the cover surface based on the first direction.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body; wherein the dielectric layer may include a plurality of dielectric particles and a polyvinylidene fluoride (PVDF)-based polymer. The dielectric layer may include the PVDF-based polymer in an amount of more than 0 and less than 42.86 parts by weight based on 100 parts by weight of the dielectric particles.

IPC Classes  ?

• H01G 4/20 - Dielectrics using combinations of dielectrics from more than one of groups
• H01G 4/008 - Selection of materials
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/18 - Organic dielectrics of synthetic material, e.g. derivatives of cellulose
• H01G 4/30 - Stacked capacitors

Abstract

An aperture module includes a plurality of blades disposed on a lens barrel, the plurality of blades forming an incident hole, a driving link on which a magnet is disposed, the driving link configured to be rotatable, and a coil disposed to oppose the magnet. The lens barrel has a first outer diameter and a second outer diameter, and a rotation axis of the driving link is disposed between the first outer diameter and the second outer diameter of the lens barrel.

IPC Classes  ?

• G03B 9/06 - Two or more co-operating pivoted blades e.g. iris type
• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Abstract

A camera module includes: a housing including a window through which light is incident and disposed on one surface of the housing, wherein a length of the housing in a first direction intersecting an optical axis is greater than a length of the housing in a second direction intersecting the optical axis; a filter member disposed on the window; an adhesive member configured to contact one side of the filter member; and a protrusion configured to surround another side of the filter member not in contact with the adhesive member.

IPC Classes  ?

• H04N 23/58 - Means for changing the camera field of view without moving the camera body, e.g. nutating or panning of optics or image sensors
• G03B 11/00 - Filters or other obturators specially adapted for photographic purposes
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
• G02B 23/24 - Instruments for viewing the inside of hollow bodies, e.g. fibrescopes

Abstract

A lens module includes a first lens having positive refractive power, a second lens having positive refractive power, a third lens having negative refractive power, a fourth lens having positive refractive power, a fifth lens having positive or negative refractive power, and a sixth lens having negative refractive power. One or more inflection points may be formed on an image-side surface of the sixth lens.

IPC Classes  ?

• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 13/00 - Optical objectives specially designed for the purposes specified below

Abstract

A multilayer ceramic capacitor is disclosed that includes a body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction intersecting the first direction, and a fifth surface and a sixth surface opposing each other in a third direction intersecting both the first and second directions. The body includes a plurality of dielectric layers and a plurality of internal electrodes stacked in the first direction. An external electrode is disposed outside the body and includes a connection portion connected to the internal electrodes, a band portion connected to the connection portion and covering portions of the first, second, fifth, and sixth surfaces, and a protruding portion spaced apart from the connection portion and disposed on the band portion on each of the first, second, fifth, and sixth surfaces. The configuration reduces coating spread and suppresses a mooning phenomenon.

IPC Classes  ?

• H01G 4/248 - Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, the body including first and second surfaces opposing each other, third and fourth surfaces opposing each other, and fifth and sixth surfaces opposing each other, a first external electrode disposed on the third and fourth surfaces, a second external electrode disposed on at least one of the fifth and sixth surfaces. t3 > t1 > t2 where t1 is a distance from a center portion of the third or fourth surface to a surface of the first external electrode, t2 is a distance from an end portion of a first internal electrode closest to the first surface to the surface of the first external electrode, t3 is a distance from an end portion of a first internal electrode closest to the second surface to the surface of the first external electrode.

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a thickness direction, and including first and second surfaces opposing each other in the thickness direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction; protrusions disposed on the first and second surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively, and extending to the protrusions, wherein the external electrode includes an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal and resin, and wherein the electrode layer is spaced apart from the protrusion, and the conductive resin layer is disposed to be in contact with the protrusion.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/12 - Ceramic dielectrics

Abstract

A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a first portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions, the insulating layer including a first glass and a first oxide including aluminum (Al).

IPC Classes  ?

• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

An optical imaging system is provided. The optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens sequentially disposed from an object side to an imaging side. In the optical imaging system, the first lens has positive refractive power and has a concave object-side surface, the fourth lens has negative refractive power, and the fifth lens has a convex image-side surface. Additionally, the optical imaging system satisfies the following conditional expressions: f number<1.90 and 1.90

IPC Classes  ?

• G02B 9/62 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having six components only
• G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration

Abstract

A camera module is provided. The camera module includes an upper housing comprising an upper wall and an upper side wall and in which at least one guide protrusion is disposed at a lower end portion of the upper side wall; a substrate disposed at a lower portion of the upper side wall, and a fastening groove is disposed in an edge region of the substrate; and an image sensor mounted on the substrate. The substrate includes a conductive pad disposed to adjoin the fastening groove, and the guide portion is inserted into the fastening groove. The substrate is fixed to the upper housing through a substrate fixing layer respectively coupled to the conductive pad and the guide protrusion.

IPC Classes  ?

• H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays

Goods & Services

Semiconductors; Electronic components in the nature of semiconductors; Semiconductor devices; Semi-conductor memories; Semiconductor power elements; Printed circuit boards; Printed electronic circuits; module for electronic element in the nature of integrated circuit modules; Electronic integrated circuits; Electronic circuits; Integrated circuits; Integrated circuit module; Electronic chips for the manufacture of integrated circuits; Chipsets; Printed circuits; Circuit boards; Network servers; Tablet computers; Smartglasses; Smartphones; Smartphones in the shape of a watch; Televisions; Computer networking hardware; Wearable computers in the nature of smartwatches; Wearable computers in the nature of smartglasses; Computer network hubs; Sound reproduction apparatus; Wireless communication devices for voice, data or image transmission; Laptop computers

Abstract

A multilayer electronic component includes a body having first and second surfaces opposing each other in a thickness direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a width direction. The body includes a dielectric layer and multiple internal electrodes alternately arranged with the dielectric layer in the width direction. Each internal electrode includes a main portion and a lead-out portion extending from the main portion and exposed at the first surface. A slot is formed on the first surface and extends in the width direction, and a connection electrode is disposed within the slot and electrically connected to the lead-out portions to reduce overall thickness and improve connection stability when mounted on a circuit board.

IPC Classes  ?

• H01G 2/06 - Mountings specially adapted for mounting on a printed-circuit support
• H01G 4/012 - Form of non-self-supporting electrodes
• H01G 4/12 - Ceramic dielectrics
• H01G 4/232 - Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• H01G 4/30 - Stacked capacitors

Abstract

A camera module is provided. The camera module includes a housing; a carrier, disposed in the housing, and configured to move in an optical axis direction with respect to the housing; a first damper fixed to the carrier; and a first frame, disposed in the carrier, and configured to move in a direction perpendicular to an optical axis direction with respect to the carrier, and having a concave portion formed on a surface that faces the carrier, wherein the first damper protrudes toward the first frame in the optical axis direction, and at least a portion of the concave portion is disposed to face the first damper in the direction perpendicular to the optical axis.

IPC Classes  ?

• G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets

Abstract

A camera module includes a prism module including a prism configured to reflect light incident along a first optical axis in a second optical axis direction and a prism holder configured to support the prism, and a lens module configured to focus light emitted from the prism onto an image sensor. In the camera module, a first space and a second space having different sizes are disposed between an edge of the prism and an inner surface of the prism holder.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
• G02B 7/18 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors
• G02B 7/20 - Light-tight connections for movable optical elements
• H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof

Abstract

A camera module includes a housing, a lens module accommodated in the housing and including a plurality of lenses arranged in an optical axis direction, and an image stabilization actuator including a magnet and a coil disposed to face each other and configured to provide driving force to move the lens module in a direction perpendicular to an optical axis. The magnet includes a first sub-magnet, a second sub-magnet, and a third sub-magnet disposed in sequence in a short axis direction of the coil and having different magnetization directions.

IPC Classes  ?

• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• H01F 7/08 - ElectromagnetsActuators including electromagnets with armatures

Abstract

A printed circuit board according to an embodiment may include an inner insulating layer interposed between a first outer insulating layer and a second outer insulating layer, a connection pad and a circuit wiring on the first outer insulating layer, the second outer insulating layer, and the inner insulating layer, a connection via penetrating one of the second outer insulating layer and the inner insulating layer to connect the connection pads on different insulating layers, and a bump via penetrating the first outer insulating layer. The first outer insulating layer may include a cavity in which a portion of a surface thereof is recessed, and an end surface of the bump via may be exposed through the bottom surface of the cavity.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

The present disclosure relates to a printed circuit board including: a glass layer; a first wiring portion disposed on the glass layer; and a second wiring portion disposed on the first wiring portion. The first wiring portion includes one or more inorganic insulating layers, one or more first wiring layers respectively disposed on or within the one or more inorganic insulating layers, and one or more first wiring vias respectively disposed within the one or more inorganic insulating layers. The second wiring portion includes one or more first organic insulating layers, one or more second wiring layers respectively disposed on or within the one or more first organic insulating layers, and one or more second wiring vias respectively disposed within the one or more first organic insulating layers. The second wiring portion has a cavity penetrating through at least a portion of the one or more first organic insulating layers.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/183 -

Abstract

An optical imaging system includes a first lens group including a first lens, a second lens, and a third lens, a second lens group including a fourth lens, a fifth lens, a sixth lens, and a seventh lens, and an optical path folding element disposed between the first lens group and the second lens group, wherein the first to seventh lenses are sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an image plane of the optical imaging system, and the first lens has a positive refractive power.

IPC Classes  ?

• G02B 13/00 - Optical objectives specially designed for the purposes specified below
• G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components

Abstract

A lens module includes a lens formed of a first material, and a lens barrel formed of a second material, different from the first material, and including an accommodation space accommodating the lens. A protrusion protruding toward an outer circumferential surface of the lens is disposed in the accommodation space, and conditional expression 0.3

IPC Classes  ?

• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
• G02B 1/04 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of organic materials, e.g. plastics